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Effective July 1st, Photodigm is reducing the retail price of its Distributed Bragg Reflector (DBR) semiconductor laser diodes by 25% and showcasing a new product strategy to deliver savings and simplicity to its global customer base.

JUNE 26, 2023 (RICHARDSON, TX) –– Photodigm is thrilled to announce that as of July 1st, its entire product portfolio of Distributed Bragg Reflector (DBR) laser diodes will receive a historic 25% price reduction and new strategic approach to deliver savings and simplicity to its global customer base.

The semiconductor manufacturer announced a progressive tiered pricing strategy earlier this year to provide discounts on higher-volume orders of 100 units or more. As customer demand continued to increase, Photodigm intentionally invested in R&D projects partnering with the Office of Naval Research (ONR) to raise yields and overall volume of their fab, evolving from the company’s early years of on-demand production where it operated much like a university research lab.

“As we continue our journey to ever-improving laser lifetimes with better quality, higher yields, and gains in our overall production process, we are intentionally leveraging every opportunity to drive value to our customers,” said Bill Stuart, President and CEO of Photodigm.

Photodigm’s product portfolio now boasts thirty-two wavelengths of DBR laser diodes including Spectroscopy Certified devices tuned to unique elements like Rubidium which is often used in biomedical sensing applications or atomic clocks in GPS-denied environments for military applications.

To empower its customers, Photodigm restructured its product line around four simple decisions –– application (wavelength), functionality (chip architecture), added customization, and device packaging all with transparent pricing to provide a clear understanding of the added value in each selection.

“We’re putting our customers in the driver's seat by providing them with greater insight into our product capabilities and pricing than ever before,” says Mandy Eaton, VP of Sales & Marketing at Photodigm. “One of our core tenets at Photodigm is to foster innovation through collaboration and our new strategic approach to our product [portfolio] invites customers to shop, but also prompts them to ask themselves what they really need our technology to provide, which helps us evolve together.”

Photodigm, Inc. is the only 100% U.S.-based commercial manufacturer of semiconductor DBR laser diodes 730–1090nm with a global clientele of corporations, government entities, space programs, research labs, and universities. View the new catalog offering and updated pricing at www.photodigm.com/DBR.

About Photodigm, Inc.
For over 20 years Photodigm, Inc. has been the only 100% U.S.-based semiconductor manufacturer of single spatial and longitudinal mode Distributed Bragg Reflector (DBR) laser diodes. DBR lasers are essential to quantum sensing and atomic clock manufacturers, optical metrology and sensing, and laser spectroscopy. Headquartered in Richardson, Texas, they design and produce fixed wavelength diode lasers best known for their accuracy and reliability. Learn more at Photodigm.com.

Dresden, 21 June 2023. On 19 June, Masao Hodai, Chief Operating Officer of EBARA Precision Machinery Company Tokyo, visited EBARA’s German site in Dresden-Weixdorf. After a welcome by Dr Reinhart Richter, Managing Director of EBARA Precision Machinery Europe, an informative tour followed, during which Masao Hodai inspected the Overhaul Centre for vacuum pumps, built in 2021, the warehouse, the training facilities currently being built, and representatives from the most important product divisions. A joint lunch with members of Dresden’s staff rounded off his visit.

Strong signal for the Dresden location
“The visit of COO Masao Hodai reinforces our location within the Silicon Saxony region and shows the significant status of the semiconductor industry in Dresden for EBARA’s headquarters in Japan. Our progress in terms of safety, quality, CO2 reduction and market acquisition has made a deep impression. All EBARA employees in Dresden feel very honoured by this visit from Japan”, said Dr Reinhart Richter, happily. In the afternoon, in-depth client meetings were on the agenda at the Dresden site before Masao Hodai returned home to Tokyo.

About EBARA
EBARA Precision Machinery Europe (EPME) GmbH, headquartered in Sauerlach near Munich, is the European sales and service company of EBARA Corporation Tokyo. EBARA is a leading global manufacturer of vacuum and semiconductor systems used to produce wafers, liquid crystals, solar cells and other high-tech products. EBARA Corporation was founded in 1912 by Issey Hatakeyama and employs over 19,000 people worldwide. With an annual turnover of 4.7 billion euros, EBARA is one of the largest companies in the industry. EBARA supplies 16 of the top 20 manufacturers in the chip industry.

About EBARA Precision Machinery Europe
The EPME portfolio includes dry and turbomolecular vacuum pumps as well as modern gas abatement systems for the chemical industry, for example. In addition, EPME distributes state-of-the-art CMP tools, wafer bevel polishing and substrate coating systems for chip manufacturing. In 2021 EBARA opened its second modern overhaul centre for vacuum pumps in Dresden. EPME has been operating a vacuum pump overhaul centre in Livingston (UK) since 1993. EPME employs over 250 people in Europe and Israel.
Photo: EBARA / Tommy Halfter

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With the focus on Smart Data-AI and Smart Manufacturing, this conference will delve into 4 tracks:

Track 1: AI Market Trends and Future AI Potential

Track 2: AI Adoption and Deployment in Manufacturing

Track 3: Cybersecurity Threats and Solutions Associated with AI

Who Should Attend:

  • Leadership and professionals in the semiconductor and electronics industry
  • Companies utilizing Artificial Intelligence Solutions in their product offerings
  • MNCs and SMEs seeking AI solutions or big data analytics in their workplace
  • Smart manufacturing practitioners, advocates and consultants
  • Academics and higher learning research institutions

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*Above rates are quoted in Singapore Dollars (SGD) and are subjected to 8% GST.
*Above rates are inclusive of coffee/tea breaks and luncheon for both days of the conference.
*Student rate is only applicable with a valid student pass.

 

 

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Andaz Singapore
The Glasshouse @ Level 3
5 Fraser Street
189354
Singapore

12:30 pm

Registration and Lunch

1:30 pm
Image of Mr. Travers Lim
Mr. Travers Lim

Welcome Speech

Mr. Travers Lim | Director, Program and Business Development, SEMI Southeast Asia

1:35 pm
MarvinLee
Dr. Marvin Lee

Opening Keynote: Harnessing opportunities at the convergence of Semiconductors and Emerging Digital Tech

Dr. Marvin Lee | Director, Smart Nation and Digital Economy, National Research Foundation (NRF)

1:55 pm
ChinKokPoh_deloitte
Mr. Chin Kok Poh

Generative AI – It’s time to get on-board

Mr. Chin Kok Poh | Director, AI & Data, Deloitte Consulting

2:15 pm
LiXiaoli
Dr. Li Xiaoli

Revolutionizing Semiconductors: The Transformative Power of AI

Dr. Li Xiaoli | Department Head (Machine Intellection), A*STAR Institute of Infocomm Research (I2R)

2:35 pm
RandeepKapur
Mr. Randeep Kapur

Unlocking Innovation in Manufacturing with Emerging Technologies

Mr. Randeep Kapur | Chief Technology Officer Ambassador and Field Director, Global Industries, APJ & China, DELL Technologies

2:55 pm

Break and Networking

3:10 pm
SajKumar_Microsoft
Mr. Saj Kumar

The Future of Manufacturing with the AI Revolution

Mr. Saj Kumar | Regional Business Lead, Microsoft

3:30 pm
EhsanulIslam_Qualcomm
Mr. Ehsanul Islam

Harmonizing Precision and Intelligence – The Artistry of AI in Manufacturing

Mr. Ehsanul Islam | VP Engineering and Regional Head of SEA, Qualcomm

3:50 pm
Massimo Alioto
Prof. Massimo Bruno Alioto

Enabling Next-Generation Attentive & Intelligent AI Systems - At the Edge, at Scale

Prof. Massimo Bruno Alioto | Area Director, Integrated Circuits & Embedded Systems, National University of Singapore

4:10 pm

Panel Discussion: Impact and Future Potential of AI

Moderator: Mr. Chin Kok Poh | Director, AI & Data, Deloitte Consulting

Panelists:
Mr. Saj Kumar, Mr. Randeep Kapur, Dr. Li Xiaoli, Mr. Ehsanul Islam

4:55 pm

Plaque Presentation and Photo-taking

5:00 pm

Lucky Draw

9:30 am

Registration | Coffee and Tea

10:00 am
TakahitoMatsuzawa
Mr. Takahito Matsuzawa

AI Adoption for Semiconductor Manufacturing World

Mr. Takahito Matsuzawa | Vice President, Tokyo Electron Limited

10:20 am
Ms. Wint Kyi Phyu
Ms. Wint Kyi Phyu

Harnessing AI and Machine Learning in Operations for Quality and Efficiency Improvement

Ms. Wint Kyi Phyu | Manager, Operation Engineering-Data Analyst and Manufacturing System, Kulicke & Soffa

10:40 am
Dr. ArulMurugan Ambikapathi
Dr. Arulmurugan Ambikapathi

"AI Era" for End-to-End Process Development

Dr. Arulmurugan Ambikapathi | Data Science Manager, LAM Research

11:00 am

Break & Networking

11:20 am
VishalSingh
Mr. Vishal Singh

Digitalization at Infineon, Powered by Data & AI : Fostering Process Efficiency and Productivity

Mr. Vishal Singh | Head of Centre of Competence Analytics and Director, IT, Infineon Technologies

11:40 am
Mr. Oh Theng Cheng
Mr. Oh Theng Cheng

Applying artificial intelligence and machine learning for optimization in increasingly complex semiconductor manufacturing processes

Mr. Oh Theng Cheng | Senior Director, Innovation Engineering, Smart Manufacturing & AI, Micron Semiconductor Asia Pte Ltd

12:00 pm
Ms. Ice Li
Ms. Ice Li

Boosting Productivity by Using AI for Semiconductor Chip Design

Ms. Ice Li | Application Engineering Director, DSG SEA, Cadence

12:20 pm
SabryAly
Dr. Mohamed M. Sabry Aly

EMASS: Towards Algorithm-to-silicon ultra-low power Edge AI devices

Dr. Mohamed M. Sabry Aly |CEO & Founder, EMASS

12:40 pm

Plaque Presentation and Photo-taking

12:45 pm

Lunch & Networking

1:40 pm
JulianTan
Mr. Julian Tan

The Advancements of Quantum Computing and What this Means for Cybersecurity

Mr. Julian Tan | IBM Digital Supply Chain Transformation Leader (AI, Analytics and Quantum), IBM Singapore

2:00 pm
Dr. Khin Mi Mi Aung
Dr. Khin Mi Mi Aung

Emerging Digital Trust Technologies for Big Data Value Capture

Dr. Khin Mi Mi Aung | Senior Principal Scientist, Cybersecurity Department, Institute for Infocomm Research, 12R (A*STAR)

2:20 pm
HarisJavaid_AMD
Dr. Haris Javaid

Architectures for AI-Based Network Security

Dr. Haris Javaid | Director & Principal Researcher, AMD Singapore

2:40 pm
MartinSaerbeck
Dr. Martin Saerbeck

From Wafers to Firewalls: How AI Just Flipped Your Script

Dr. Martin Saerbeck | Chief Technology Officer - Digital Services, TUV SUD Asia Pacific Pte Ltd

3:00 pm

Break & Networking

3:20 pm
Ms. Veronika Indirawati
Ms. Veronika Indirawati

Secure from Start to Finish - Cybersecurity Integration Across the Semiconductor Manufacturing Process Lifecycle

Ms. Veronika Indirawati | Portfolio Consulting Professional, Siemens

3:40 pm
AkankshaJagwani
Ms. Akanksha Jagwani

Revolutionizing Manufacturing: Unleashing AI's Visual Inspection Power

Ms. Akanksha Jagwani | CEO and Founder, SixSense.ai

4:00 pm

Panel Discussion: Business Considerations in AI Strategy

Moderator: Mr. Julian Tan | IBM Digital Supply Chain Transformation Leader (AI, Analytics and Quantum), IBM Singapore

Panelists:
Dr. Haris Javaid, Dr. Martin Saerbeck, Ms. Akanksha Jagwani, Asst. Prof. Mohamed M. Sabry Aly

4:45 pm

Plaque Presentation & Lucky Draw

5:00 pm

End of ASTC 2023 November

6:00 pm - 9:00 pm

Members' Networking Night (by Invitation only)

Agenda is subject to change

-

The remarkable advancements in Artificial Intelligence (AI) have spurred extraordinary expansion and creative innovation within the industry. This has paved the way for the SEMI Southeast Asia ASTC Conference & Exhibition of this year, which aims to delve into the Potential of AI and Cybersecurity associated in Manufacturing sector.

Off Add to Calendar 2023-11-16 00:00:00 2023-11-17 00:00:00 Advanced Semiconductor Technology Conference (ASTC) 2023 November The remarkable advancements in Artificial Intelligence (AI) have spurred extraordinary expansion and creative innovation within the industry. This has paved the way for the SEMI Southeast Asia ASTC Conference & Exhibition of this year, which aims to delve into the Potential of AI and Cybersecurity associated in Manufacturing sector. Andaz Singapore The Glasshouse @ Level 3 5 Fraser Street 189354 Singapore SEMI.org [email protected] Asia/Singapore public Asia/Singapore Register Now!

Virginia Beach, Virginia - Busch Vacuum Solutions, a leading provider of reliable solutions for SubFab Management, is proud to exhibit at this year's SEMICON West show and conference. As a reliable partner for vacuum pumps, gas abatement systems, leak detection and more, Busch provides the semiconductor industry with the highest quality solutions and services.

At SEMICON West, Busch is showcasing their comprehensive subfab management services. Critical SubFab systems are monitored and predictively maintained by Busch. Their SubFab management minimizes production downtime and enables energy-efficient operation and cost savings. Continuous monitoring extends maintenance intervals and the entire product life cycle. All Busch on-site service teams are certified to ISO9001:2016, ISO14001:2016 and ISO45001:2018 standards.

"We are proud of our comprehensive solutions for the semiconductor industry," said Mark Magill, Vice President of Medium High Vacuum at Busch Vacuum Solutions. "SubFab service capabilities and innovative products provide customers with reliable performance and maximum process safety to achieve optimal yields."

Magill also said they are featuring a new patented redundancy vacuum system at the show, “It uses an optimized combination of two pumps plus one booster to minimize changes in chamber pressure in case of pump failure.” This vacuum system eliminates wafer scrap and process excursion.

Visit Busch Vacuum Solutions at SEMICON WEST from July 11-15 in San Francisco, CA. Meet their experienced vacuum experts, exchange ideas and get valuable advice at booth #541.

About Busch
For more than 50 years, Busch has been an integral part of the global semiconductor industry by providing reliable solutions that enable manufacturers to produce advanced microchips. Their commitment to quality is in every product they offer and service provided. Continuous advancements ensure that Busch solutions are always state-of-the-art and used by hundreds of subfabs worldwide. www.buschusa.com | [email protected]

PEER Group® has announced an upcoming webinar designed to help semiconductor equipment manufacturers prepare for the increasing demand from backend factories for automation capabilities and SEMI® Standards compliance in assembly and test processes.

Taking place on June 22, 2023, at 1:00 p.m. ET/11:00 a.m. MT, the webinar, Standardizing the Assembly and Test Process, will feature an in-depth discussion between Jason Cicero, Micron Technology’s Senior IT Domain Architect, and PEER Group’s Director of Marketing, Doug Suerich.

Topics covered will include: why the backend, including assembly and test, needs more automation and standardization, how this will impact equipment design and integration, common issues faced by factories when integrating new tools, and how equipment suppliers can help solve these issues. There will also be a live Q&A for attendees to ask questions during the webinar.

“The SEMI Standards Program has been around for more than 40 years,” says Suerich. “During that time, these standards have evolved into the guiding principles which ensure compatibility and interoperability across suppliers and factories, improving manufacturing productivity, quality, and reliability, and reducing the cost and pain of integrating new equipment onto the factory floor. Universally adopted in the frontend, we are starting to notice increasing demand from factories to implement standards in the backend, including assembly and test processes.”

Evidence of this shift is seen as major players in the frontend enter the assembly and test market while established facilities announce major capital investments into their operations. This expansion introduces new, high-value processes to assembly and test and closer integration with the frontend – both of which are enabled through the application of standards. Meanwhile, the SEMI Advanced Backend Factory Integration task force continues to investigate and promote the adoption of SEMI Standards for assembly and test.

The webinar is scheduled to last 30 minutes followed by a 15-minute Q&A. All registrants will have the opportunity to access a recording of the webinar. For more information, including how to register, visit: https://bit.ly/3mq2yf3

About PEER Group
PEER Group® is the largest supplier of innovative factory automation software products for the semiconductor industry. Since 1992, our solutions have helped the world’s most advanced OEMs and factories reduce time to market and lower costs by solving their equipment automation, data management, and process control problems. A multi-award winning company, PEER Group has been named a Best Workplace by Great Place to Work Canada 11 times, and most recently was one of six recipients of Intel’s 2022 EPIC Outstanding Supplier Award, which recognizes the absolute top performers in the Intel supply chain. Follow PEER Group on LinkedIn and Twitter at @PEERgroup_Inc..

Deventer, May 11, 2023 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, and Svenska Grindmatriser AB (SGA), a well-established fabless IDM for the development and supply of customized mixed-signal ASICs, today announce that the companies have started a cooperation for high-volume production testing of SGA’s ASIC products.

The cooperation with RoodMicrotec as European partner enables SGA to meet the rapidly growing market demand. Furthermore, RoodMicrotec as a supplier will help SGA to strengthen its supply chain by providing flexible testing capacities as well as other quality assessment services.

“This collaboration offers us the opportunity to grow faster. In addition, both companies benefit from each other's knowledge, which is of tremendous value! Therefore, I am expecting this cooperation to be growing to a strategic level”, says Henrik Sjöberg, CEO of SGA.

Being a leading European service provider in the semiconductor industry, this partnership matches well with RoodMicrotec’s portfolio of capabilities.

Martin Sallenhag, CEO of RoodMicrotec, says, “This cooperation shows that we are a reliable partner for test and quality services in Europe. It is always nice to see that such strong companies as SGA rely on our expertise and test capabilities. In addition, this project helps us to strengthen our position as a service provider for the Swedish semiconductor industry.”

About SGA
SGA is a fabless manufacturer of analog and mixed-signal ASICs. SGA works closely with customers throughout the entire product lifecycle, from development to high-volume production. SGA's deep technical expertise and continuous quality focus has led to long-lasting partnerships in a broad set of industries. The company was founded in 1986 and is located in the city of Linköping, Sweden.
For more information please visit www.sga.se.
Further information
Henrik Sjöberg, CEO or Andreas Marinus, Sales
Phone +46 13 36 46 60, E-mail [email protected]

About RoodMicrotec
With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is a leading independent company for semiconductor supply and quality services. RoodMicrotec is a highly valued partner for many companies worldwide and offers specifically tailored turnkey solutions for each single customer's requirements. The turnkey services include project management, wafer test, assembly, final test, qualification, failure analysis, and logistics. All services provided by RoodMicrotec meet the high quality standards of the automotive, industrial, healthcare, and high reliability aerospace sectors. RoodMicrotec is headquartered in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany.
For more information please visit https://www.roodmicrotec.com
Further information
Martin Sallenhag, CEO or Arvid Ladega, CFO
Phone +31 570 745623, E-mail [email protected]

This press release is available in English and German. In case of conflict between these versions, the English version shall prevail.

PENANG, MALAYSIA - MAY 2023 ViTrox, which aims to be the world’s most trusted technology company, is honoured to announce our participation at Semicon Southeast Asia (SEA) 2023 as a Platinum sponsor! We will be showcasing our breakthrough innovations at Booth #A304 in Setia SPICE Arena, Penang, Malaysia from 23rd to 25th May 2023.

Semicon SEA is one of the biggest and most influential events in the regional semiconductor industry, attracting thousands of visitors from around the world. The event provides an excellent opportunity for us to unleash cutting-edge New Product Introductions (NPIs) and a full range of inspection solutions, ranging from Middle & Back-end Semiconductor Vision Solutions to SMT PCB Assembly Vision Solutions, Electronics Communication Systems, and Industry 4.0 Manufacturing Intelligence Solutions – V-ONE, and engage in networking sessions with customers while sharing knowledge. We are excited to meet with industry professionals and players physically.

You will be able to experience the wonders of our advanced and Industry 4.0-ready solutions through our live product demonstrations and new product launch sessions, which is the key highlight of our participation in this grand event. Among the NPIs that will be showcased will be the:
• Wafer Vision Inspection Solution – the Wi8i G2 PRO!
• Die Sorting and Vision Inspection Solution – PX740i
• Advanced 3D Solder Paste Inspection (SPI) Solution for advanced packaging and microelectronics.
• Advanced 3D Optical Inspection (AOI) Solution for advanced packaging and microelectronics.
• V-ONE’s All-New Imaging Analytics with Deep Learning – DeeLIA

In addition, visitors will also have the opportunity to attend insightful sharing sessions from our technical experts at TechStage on 24 & 25 May (Wednesday & Thursday), SMART Enterprise Forum on 24 May (Wednesday) and Advanced Product Testing Forum on 25 May (Thursday)! Furthermore, we have also prepared a mini virtual-reality game called “Treasure Hunt”, whereby visitors get to virtually experience ViTrox Campus 2.0 and learn more about our company's background and culture.

Another thrilling news is that we will be stationed at the Workforce and Talent Development Pavillion (Booth #A1012) to showcase both career and education opportunities with ViTrox. The education arm of ViTrox – ViTrox Academy (VA) team will be on-site to promote their available courses and training programmes and our People Management team will be there to welcome aspiring candidates looking to join ViTrox! Moreover, the Sr. Manager of People Management, Ms Yeoh Siew Eng, will share about our company’s background and culture, internship and career opportunities at ViTrox.

ViTrox team is well-prepared and ready to present innovative solutions and technologies during the show! It's a great platform for us to reconnect and meet with our customers and visitors in person after the pandemic! Please send in your appointment request via the registration link to meet up with our field experts in person!

Registration Link: https://docs.google.com/forms/d/e/1FAIpQLSfXQoB0pe-RLHRY2oi4cJ0XVNNVBja…

[May 4, 2023 – Penang, Malaysia] INETest is partnering with Test Research, Inc. (TRI) at the SEMICON SEA exhibition in Penang, Malaysia. Visit INETest at booth #C513 in SEMICON SEA at the Setia SPICE Convention Centre from May 23 - 25, 2023.
TRI's AI-powered Inspection solutions for the Semiconductor and Advanced Packaging Industry can inspect Die / Wire / Wedge / Ball / Ribbon Bonding, Cross Wire, BBOS/BSOB, SiP, WLCSP, Underfill, Bumps, Cu Pad/Pillar, Epoxy, Flux, Glue, and foreign material detection.

TRI's Smart Factory innovations optimize the current Inspection through AI-powered algorithms, multiple 3D technologies, metrology-grade measurement, real-time SPC trends, and M2M communications. TRI's solutions comply with Industry 4.0 standards like the IPC-Hermes-9852, the IPC-DPMX, and the Connected Factory Exchange (IPC-CFX).

Visit booth #C513 to discuss TRI's Semiconductor and Advanced Packaging Industry Inspection Solutions with our staff.

About TRI
Test Research, Inc. (TRI) provides the most cost-effective solutions to meet a comprehensive range of manufacturing test and inspection requirements, from Automated Optical Inspection (SPI, AOI, AXI) to Board Testers (ICT, MDA). Learn more at http://www.tri.com.tw. For sales and service information, please write to us at [email protected] or call +886-2-2832 8918.

About INETest Malaysia Sdn Bhd
INETest Malaysia Sdn Bhd is a leading provider of distribution and service solutions to the semiconductor and electronics manufacturing industries, offering innovative engineering-focused solutions. Learn more at https://www.ellipsiz.com/.

Heidelberg, Germany – Heidelberg Instruments, a global player in direct write technology and solution provider for the advanced packaging market, is transforming the semiconductor industry with its maskless laser lithography system, the MLA 300. Continuous and repeat orders of MLA 300 systems confirm Heidelberg Instruments' capabilities and customer satisfaction.

MLA 300 is increasing production capacity for wafer-level packaging providers.

Flexible designs, high throughput, uniformity, and yield are the basic requirements in the semiconductor industry. The MLA 300 Maskless Aligner meets all of these requirements and more, with its capability to expose a tailor-made design on each substrate to match the actual die locations. Unlike a fixed mask, the design data can be tailored and augmented before exposure, enabling yield improvements by compensating for line width bias due to processing or loading re-mapped designs that include die shift. In addition, serial number labeling and other dynamically generated, unique patterns can be added to each exposure.

The MLA 300 is optimized for industrial volume production and features distinct benefits such as full automation. The flexibility of maskless lithography allows rapid design customizations, even unique designs on each substrate, which can be updated automatically. This is particularly useful for chip packaging where mounted die shift due to the curing of a reconstituted wafer or panel. The MLA 300 system seamlessly integrates into wafer-level packaging production lines, fully automating production with a resolution down to 2 µm lines and spaces. Customers benefit from reduced production costs and efforts by eliminating mask procurement, verification, and management requirements. Operating costs are reduced by utilizing a long-lifetime exposure laser and fewer consumables. The modularity enables fast maintenance, replacement, or repair. Real-time autofocus compensates substrate warp or corrugations for flawless patterning.

“We are thrilled to witness this cutting-edge technology’s impact on the industry, and we’re excited that many important companies and groups are taking this journey with us. The MLA 300 is a game-changer in maskless lithography,” states Alexander Forozan, Head of Global Sales and Marketing at Heidelberg Instruments Group. “Its revolutionary features transform the production process, delivering unmatched precision and high throughput. So, whether you want to enhance productivity or streamline your operations, the MLA 300 is designed to exceed your expectations.”

Introduced into the market at the end of 2019, the MLA 300 Maskless Aligner is the first direct exposure system specially designed for industrial applications in advanced packaging, wafer-level packaging, electronics components, sensors, MEMS, and many more.

With continuous order intakes from leading wafer-level packaging providers in Asia, the Heidelberg Instruments MLA 300 Maskless Aligner has proven capabilities and customer satisfaction, making the company poised for growth in the demanding and fast-growing high-technology market.

Contact:
Sonja Pfeuffer
Head of Global Marketing
[email protected]

Further information:
https://heidelberg-instruments.com/

About Heidelberg Instruments Mikrotechnik GmbH
With over 35 years of experience and over 1,300 systems installed worldwide, Heidelberg Instruments is a world leader in designing, developing, and manufacturing high-precision laser lithography systems, maskless aligners, and nanofabrication tools. Industry stakeholders and working groups of renowned universities and research institutes worldwide use Heidelberg Instruments systems for advanced micro- and nanofabrication. Fields of applications include micro-optics and microsystems technology, photonics, electronics, semiconductors/ advanced packaging, quantum computing, MEMS/NEMS, micro-mechanics, biomedical engineering, 2D materials, IoT, and many more. Heidelberg Instruments provides lithography solutions tailored to meet our global customers' micro- and nanofabrication requirements – no matter how challenging.