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Deventer, October 12, 2023 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, and CERN, the European Laboratory for Particle Physics, are expanding their collaboration with the Compact Muon Solenoid (CMS) Outer Tracker ASICs project. The long-standing partners are thus jointly facing another large and significant project.

The ASICs tested for the CMS will enable the collection of essential data during experiments in the Large Hadron Collider (LHC). The LHC is purpose-built to help scientists in addressing fundamental questions within the field of particle physics.
As part of the planned 2026 upgrade to the CMS detector, CERN will again use RoodMicrotec's expertise and testing services. RoodMicrotec will test and deliver over 1,000 12" silicon wafers. The three ASIC modules on the wafers will become an integral part of the detectors. They will collect and process the enormous amounts of data that emerge during the generation of collision experiments.

"We are very pleased to have this long-standing partnership with RoodMicrotec. In the past, we have been able to successfully test and apply the ASIC components that are so important for science," says Kostas Kloukinas, project manager of the CMS Outer Tracker ASICs project at CERN.

For RoodMicrotec, the cooperation with CERN also means a lot. Especially the opportunity to contribute to the progress of science is very fascinating. Furthermore, the project helps to advance the company's own expertise even further.

"The employees of RoodMicrotec are proud to be able to significantly contribute with their services to the basic research of the large CERN family," says Martin Sallenhag, CEO of RoodMicrotec.

About CERN
CERN, the European Laboratory for Particle Physics was founded in 1954 and is the world's leading laboratory for particle physics. Here, physicists and engineers explore the fundamental structure of the universe to find out what it is made of and how it works. For their studies of the basic constituents of matter – the elementary particles – they use the world’s largest and most complex scientific instruments. To investigate those particles, they are accelerated to almost the speed of light and thus made to collide. The resulting events tells physicists how particles interact and provide insights into fundamental laws of nature. CERN has 23 member states and further nations from all over the world that contribute to its research programs.
For more information please visit https://home.cern/science/experiments/cms

About RoodMicrotec
With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is a leading independent company for semiconductor supply and quality services. RoodMicrotec is a highly valued partner for many companies worldwide and offers specifically tailored turnkey solutions for each single customer's requirements. The turnkey services include project management, wafer test, assembly, final test, qualification, failure analysis, and logistics. All services provided by RoodMicrotec meet the high quality standards of the automotive, industrial, healthcare, and high reliability aerospace sectors. RoodMicrotec is headquartered in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany.
For more information, please visit https://www.roodmicrotec.com

This press release is available in English and German. In case of conflict between these versions, the English version shall prevail.

Malaysia Singapore Vietnam Members' Networking Night Business Executive
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Browse our 2024 Singapore Members' Networking Night Photo Gallery

Jyu Lae Bistro @ Suntec Tower 5
3 Temasek Blvd, #01-315
Singapore 038983
Singapore

6:00 pm

Registration & Cocktail Reception

6:30 pm

Live Performance I

6:40 pm
Andrew_Goh_SEA
Mr. Andrew Goh

Welcome Speech

Mr. Andrew Goh | Vice Chairman, SEMI Southeast Asia Regional Advisory Board | Corporate Vice President and General Manager, Southeast Asia Lam Research Singapore

7:00 pm

Networking Buffet & Drinks

9:15 pm

Live Performance II

10:00 pm

End of Networking Night

Program is subject to change

Join SEMI Southeast Asia for a night of networking and celebration at our exclusive Members' Networking Night. Get a chance to connect with other industry leaders, exchange valuable insight on the sector, and unlock a myriad of business opportunities.

 

Non-member fee: SGD 800 (limited tickets available)

Members: Free (restricted to 2 pax per member company)

Time

6:00 pm - 9:30 pm

Location

Jyu Lae Bistro @ Suntec Tower 5
3 Temasek Blvd, #01-315
Singapore 038983
Singapore

Direction to Jyu Lae Bistro

 Jyu Lae

Contact us for enquiries!

For the event:

Mr. Glenn Tan | [email protected] | +65.8228.0662

For registration:

Ms. Gillian Lim | [email protected] | +65.9048.1123

6:00 pm - 9:30 pm Off Add to Calendar 2024-10-10 18:00:00 2024-10-10 21:30:00 Members' Networking Night Join SEMI Southeast Asia for a night of networking and celebration at our exclusive Members' Networking Night. Get a chance to connect with other industry leaders, exchange valuable insight on the sector, and unlock a myriad of business opportunities. Non-member fee: SGD 800 (limited tickets available)Members: Free (restricted to 2 pax per member company)Time6:00 pm - 9:30 pmLocationJyu Lae Bistro @ Suntec Tower 53 Temasek Blvd, #01-315Singapore 038983SingaporeDirection to Jyu Lae BistroContact us for enquiries!For the event:Mr. Glenn Tan | [email protected] | +65.8228.0662For registration:Ms. Gillian Lim | [email protected] | +65.9048.1123 Jyu Lae Bistro @ Suntec Tower 5 3 Temasek Blvd, #01-315 Singapore 038983 Singapore SEMI.org [email protected] Asia/Singapore public Asia/Singapore

PENANG, MALAYSIA - OCTOBER 2023 Curious about how Integrated Circuit (IC) manufacturers keep pace with fast-changing technology? Discover how automated systems are revolutionising the semiconductor industry, enhancing production efficiency and cost-effectiveness.

ViTrox, which aims to be the world’s most trusted technology company, is thrilled to introduce a game-changing addition to our advanced machine vision inspection solutions: the 4-sided Auxiliary (AUX 4S+) Inspection Module. This exciting optional add-on feature is designed with our customers' needs in mind and is set to elevate the capabilities of Tray-to-Tray Vision Inspection Handler – TH3000i and Tray-to-Tape & Reel Vision Inspection Handler – TR3000i.

Our Tray-Based Vision Handlers, the TH3000i and the TR3000i are high-quality machine vision inspection solutions that support emerging industries like 5G, IoT, Automotive, and Industry 4.0, with the main difference being their handling mechanism. Both tray-based handlers are designed to support inspection capabilities that accommodate IC package sizes up to 120 mm x 120 mm, including BGA, QFP, QFN, CSP, TSSOP, MSOP, and SOP. In addition, both solutions offer an array of benefits, such as high-speed IC inspection, easy operation, quick conversion time, and low maintenance cost.

The auxiliary module inspection function enables more precise defect detection that occurs at the sides of the semiconductor device. This is achieved via dedicated optics, lighting and software algorithms. The optional advance inspection function is particularly beneficial for customers who demand stringent product quality, especially for automotive, computing, and telecommunications end-applications.

The AUX 4S+ elevates electronics manufacturing to the next level by providing a comprehensive 4-sided inspection solution. It's all about ensuring the highest quality and reliability of customers’ electronic components. Explore the awe-inspiring capabilities of the AUX 4S+ showcased below.:

Enhanced Inspection Capabilities
The AUX 4S+, built upon an innovative design concept, goes beyond conventional inspection capabilities. In addition to the bottom and side vision station, it features an additional vision module dedicated to performing direct side view inspections on specialised devices like Power Devices, Land Grid Array (LGA), and Ball Grid Array (BGA) with Metal Lid components. This advanced hardware concept incorporates high-performance cameras, precision lighting, and motorised focusing mechanisms, ensuring adaptability across a wide range of package sizes. Furthermore, its cutting-edge software concept employs advanced algorithms tailored for intricate inspections. As a result, the AUX 4S+ significantly enhances inspection capabilities, meticulously inspecting products from all angles, reducing the risk of unnoticed defects, and ultimately upholding the highest standards of quality and reliability.

Seamless Integration
Designed for seamless integration with your TH3000i and TR3000i models, the AUX 4S+ offers vision-enabled flexibility and ease of use in inspection processes. This integration streamlines workflow by harnessing the power of advanced vision technology. It reduces downtime and minimises manual intervention, resulting in faster and more efficient inspections. This vision-enabled workflow optimisation allows users to meet production schedules, reduce operational costs, and deliver products to customers with uncompromised quality.

Comprehensive Inspection Coverage
The existing TH3000i and TR3000i solutions offer 3D vision inspection, Leaded Packages Inspection, Ball Packages Inspection, Leadless Packages Inspection, Top 3D POP Inspection, 2D Barcode Inspection, Mark Inspection, Package Vision Inspection, Passive Component Inspection, and 6-sided (6S) Colour Inspection. By adding the AUX 4S+ vision inspection module, users can now comprehensively cover a wide range of inspection items, including side package defects, Lid Gap inspection, Package Height inspection, and more. With the advanced vision capabilities to ensure meticulous inspection of every detail, users can save initial costs of investments as they can now rely on one solution for various inspections.

Versatile Package Size and Thickness Support
Another significant advantage of the AUX 4S+ vision inspection module is its versatility when it comes to accommodating component sizes. From compact 2x2 mm to spacious 120x120 mm packages, the system seamlessly adapts with minimal need for conversion kits. Additionally, it offers automated conversion, effortlessly transitioning between these diverse package sizes. This not only simplifies users’ inspection operations but also minimises the need for costly specialised equipment. As a result, it improves production efficiency and keeps the operational cost to a minimum.

At ViTrox, we are dedicated to empowering users with cutting-edge solutions to enhance product quality and manufacturing efficiency. The AUX 4S+ is the latest testament to our commitment to innovation and excellence; it's a game-changer for electronics manufacturing processes.

Are you interested in learning how to further enhance your IC package inspection for better results? Get in touch with us at [email protected] to learn more about our impressive AUX 4S+ feature and master the art of automation!

About ViTrox Technologies
ViTrox is committed to being the World’s Most Trusted Technology Company and the leading solutions provider through the most innovative, advanced, and cost-effective machine vision solution of excellent quality to its customers by integrating ViTrox’s technologies, people, and strategic alliances.

ViTrox offers a full spectrum of solutions, ranging from Middle & Back-end Semiconductor Inspection Solutions, SMT PCB Assembly Vision Inspection Solutions, Integrated Industrial Embedded Solutions, and Industry 4.0 Manufacturing Intelligence Solutions. ViTrox is headquartered in Penang, Malaysia, with offices in Asia, Germany, and the United States and sales and support sites worldwide.

For more information about ViTrox’s products and services, please visit www.vitrox.com.

Deventer, September 28, 2023 – RoodMicrotec N.V., a leading independent company for semiconductor supply and quality services, and Angst+Pfister Sensors and Power AG, an independently operating company of the Angst+Pfister Group, today announce their cooperation for testing semiconductor-based temperature sensors. These highly accurate sensors are able to measure extremely fine temperature differences down to +/-0.1 °C in wide temperature ranges from -45 °C to 130 °C.

Such sensitive and particularly accurate sensors will subsequently be used in industrial applications, in medical technology, and in the automotive sector and thus have to be tested with the greatest precision. In addition, these sensors have a very small drift, a repetition accuracy of 0.01 °C and a extremely fast reaction speed. Another advantage is that the sensor can be customized. The housing, the sensor technology, or the cables can be specially adapted to customer requirements.

"For this project, it was important for us to have a reliable partner who works with the utmost care. As our high-quality components are often used in very sensitive areas, they need to be tested at the highest level," says Robin Ellinger, Product Manager Temperature Sensors of Angst+Pfister Sensors and Power.

For RoodMicrotec, this collaboration means a great appreciation of its capabilities, as the company specializes in the precise testing of highly sensitive components.

"We are really pleased that the quality of our work and our capabilities are so highly appreciated in the semiconductor business. For us, the most fundamental basis of a strong cooperation is mutual trust," says Martin Sallenhag, CEO of RoodMicrotec.
About Angst+Pfister Sensors and Power AG

About Angst+Pfister
Angst+Pfister Sensors and Power AG belongs to the Angst+Pfister Group. The Group´s headquarter is located in Switzerland. It has been a leading developer and manufacturer of technical components and engineering solutions for more than 100 years. With local sales and technical support units as well as logistics centers all over the world, the company serves more than 20,000 customers of numerous industries in over 50 countries. Angst+Pfister operates state-of-the-art research and development centers in Switzerland, Turkey, and Italy. Furthermore, the company runs its own production facilities for elastomer and rubber-metal parts and compounds in Switzerland, Turkey, Italy, Denmark, China, and Vietnam. To complement the capabilities, Angst+Pfister has production partners in over 15 countries, thus enabling the Group to always be at the cutting edge of technology.

Angst+Pfister attaches the utmost importance to reliability and flexibility as well as the respectful and fair treatment of all people who are somehow correlated with them. In proactively implementing the principles of the "United Nations Global Compact", Angst+Pfister pursues the goal of sustainability in all its activities in order to have a positive impact on our planet and society through pragmatic, meaningful, and measurable initiatives.

For more information please visit www.sensorsandpower.angst-pfister.com

About RoodMicrotec
With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is a leading independent company for semiconductor supply and quality services. RoodMicrotec is a highly valued partner for many companies worldwide and offers specifically tailored turnkey solutions for each single customer's requirements. The turnkey services include project management, wafer test, assembly, final test, qualification, failure analysis, and logistics. All services provided by RoodMicrotec meet the high quality standards of the automotive, industrial, healthcare, and high reliability aerospace sectors. RoodMicrotec is headquartered in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany.
For more information, please visit https://www.roodmicrotec.com

This press release is available in English and German. In case of conflict between these versions, the English version shall prevail.

Industry survey finds 83% of respondents would be more inclined to buy used equipment with money-back guarantee.

Moov, the largest and fastest growing global marketplace for used semiconductor equipment, today announced changes to its industry-first “Money Back Guarantee” (‘MBG’) program that will expand access to buyers by eliminating the premium previously associated with this warranty. Moov will now offer its no-questions-asked, money-back guarantee free of charge for end users (semiconductor manufacturers) who purchase semiconductor equipment and parts through Moov’s global marketplace, valid on over 90% of inventory. This announcement comes as Moov’s marketplace surpasses another milestone, exceeding $4bn FMV in active listings for pre-owned semiconductor manufacturing equipment.

Historically, reliability has been a significant barrier for semiconductor manufacturers looking to incorporate secondhand equipment in their procurement strategies. In fact, this problem has been so pervasive that 81% of industry respondents surveyed by Moov “strongly agree” or “agree” that reliability is a top barrier to purchasing secondhand semiconductor manufacturing equipment.

“Reliability is arguably the biggest barrier to the growth of the global secondary equipment market, and the growth of used equipment as a percentage of fabs’ overall equipment spend,” said Steven Zhou, CEO and cofounder of Moov Technologies. “In growing Moov to become the world’s largest marketplace for used equipment, solving the reliability challenge is at the core of just about everything we’ve built – from verified listings to digital inspections, white-glove logistics, and most importantly our no-questions-asked money-back guarantee.”

A money-back guarantee fundamentally shifts risk away from buyers and significantly impacts manufacturers’ willingness to purchase used equipment. Indeed, 83% of industry respondents agreed that they would be more inclined to purchase secondhand equipment if offered a 100% no-questions asked money-back guarantee.

Moov’s decision to offer its MBG free to all buyers reflects its commitment to quality.

“We eliminated the small premium on this program because Moov stands by the quality of our service and inventory on our marketplace,” said Raymond Mahon, Head of Customer Success at Moov. “All eligible purchases on Moov will now include our no-questions-asked, money-back guarantee so that buyers can fully leverage the secondary market as an integral part of their procurement strategy – without the risk historically associated with purchasing secondhand equipment.”

To learn more about Moov’s Money Back Guarantee program visit www.moov.co/services.

About Moov Technologies Inc.
Headquartered in Tempe, Arizona, and Austin, Texas, Moov is a technology-driven marketplace and asset management platform that matches buyers and sellers of pre-owned semiconductor manufacturing equipment. Built by a team with more than 50 years of experience in the manufacturing equipment brokerage industry, Moov's platform ensures accurate listings and faster transactions. CEO Steven Zhou and Managing Director Maxam Yeung co-founded the company in 2017. To learn more, please visit Moov.co.

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PFAS is prevalent in our world and very much in our current conversation. But what is it? (or more correctly, what are they?), why are they under great scrutiny? are they all hazardous? and how would the semiconductor industry be impacted by their removal? With so much at stake, it is imperative that we have clarity in the discussion to ensure we successfully address this issue.

This webinar will address the what, why, and how of PFAS in the semiconductor industry. Laurie Beu, noted semiconductor EHS consultant and leader of SIA’s Semiconductor PFAS Consortium, will provide an overview of PFAS materials, concerns about health effects, and the current state of regulatory response. Laurie’s talk will be followed by Ralph Dammel, Technology Fellow at EMD Electronics, who will provide insights from a materials manufacturer’s perspective on the use of PFAS in the multiple markets addressed by EMD. He will discuss the importance of PFAS in lithography chemicals, the impact of potential new regulations, and options to reduce or eliminate the use of PFAS in semiconductor applications.

Virtual, Online
United States

Laurie Beu
Laurie S. Beu, P.E.
Consultant
Laurie S. Beu Consulting
Ralph R. Dammel
Ralph R. Dammel
Technology Fellow, CTO Office
EMD Electronics
James Amano
Moderator
James Amano
Sr. Director, EHS
SEMI
EMG FOA Standards

PFAS is prevalent in our world and very much in our current conversation. But what is it? (or more correctly, what are they?), why are they under great scrutiny? are they all hazardous? and how would the semiconductor industry be impacted by their removal? With so much at stake, it is imperative that we have clarity in the discussion to ensure we successfully address this issue.

Join the SEMI Electronic Materials Group (EMG) for a open conversation about the impact on the materials sector. 

 

10:00 am - 11:00 am Off Add to Calendar 2023-10-18 10:00:00 2023-10-18 11:00:00 Spelling semiconductors without “F” (luorine) PFAS is prevalent in our world and very much in our current conversation. But what is it? (or more correctly, what are they?), why are they under great scrutiny? are they all hazardous? and how would the semiconductor industry be impacted by their removal? With so much at stake, it is imperative that we have clarity in the discussion to ensure we successfully address this issue. Join the SEMI Electronic Materials Group (EMG) for a open conversation about the impact on the materials sector.    Virtual, Online United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
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Session Speaker: 

Mr. Tan Say Chuan

Principal Engineer, Intel Malaysia

Say Chuan is a Principal Engineer within Intel’s Network and Edge (NEX) Group, specializing in Edge AI solutions. He is focusing on ensuring AI applications from Intel’s customers are optimized on Intel Processor by providing technical advisory and technical support to the customer. 

 

Guest Speaker:

Mr. Ewe Kok Howg

Senior Director of Software Validation & Engineering, Intel Malaysia

Kok Howg has been with Intel for more than 24 years and currently leading the PID software validation team spread across all geo. Kok Howg is an advocate for AI development and acceleration within the organization and the local community. He has been involved in AI/Machine learning projects since 2013 including, anomaly detection in HVAC systems, and early involvement in autonomous driving etc.

 

Navy Specialty Coffee
72-1-23 & 23A, Arena Curve, Jalan Persiaran Mahsuri, Mk12, 11950 Bayan Lepas, Penang, Malaysia
11950 Penang
Malaysia

Thursday | 22 Aug

2:00 pm

Welcome Remarks & Introduction of Speaker

2:05 pm

SEMI Overview

2:20 pm

Demystifying AI: Unveiling Its Potential, Capabilities and Future Trajectories

Mr. Tan Say Chuan | Principal Engineer, Intel Malaysia

3:20 pm

"GenAI" Live Dialogue Session featuring Mr. Ewe Kok Howg

Speakers:
Mr. Tan Say Chuan | Principal Engineer, Intel Malaysia
Mr. Ewe Kok Howg | Senior Director of Software Validation & Engineering, Intel Malaysia

4:30 pm

Q&A

4:45 pm

Penang STEM Talent Blueprint

Ms. Chin Sook Cheng | Lead, Talent Programs, Invest Penang

5:05 pm

SEMI University

Ms. Cecelia Fong | Manager, Workforce & Talent Development, SEMI

5:30 pm

Evaluation & Plaque Presentation

5:45 pm

Lucky Draw & Closing Remarks

6:00 pm

Program End

Program is subject to change

Workforce Development

Demystifying AI: Unveiling Its Potential, Capabilities and Future Trajectories

Artificial intelligence (AI) is transforming industries and enhancing productivity and decision-making across diverse domains. This presentation provides an introduction to AI techniques and key concept, and demonstration of the GenAI platform.  We will explore its current capabilities and limitations, and also emerging trends and opportunities in AI. The presentation aims to establish a common understanding of AI while addressing concerns, so that the audience leaves better equipped to evaluate if and how AI can augment their work. 

 

Registration Fee: RM 120/pax (includes snacks, drinks and goodie bag)

Dress code: Smart Casual

Target Audience: Engineers < 5yrs of industrial experience

 

HRDC_2023

 

This event is HRDC Claimable for Malaysian Companies (Subject to T&C, please contact HRDC for more information)

For HRDC Claims, please refer to the following:

More Information: https://hrdcorp.gov.my/training-providers/ 

2:00 pm - 6:00 pm Off Add to Calendar 2024-08-22 14:00:00 2024-08-22 18:00:00 Tech Talk Over Coffee | Penang, Malaysia Demystifying AI: Unveiling Its Potential, Capabilities and Future TrajectoriesArtificial intelligence (AI) is transforming industries and enhancing productivity and decision-making across diverse domains. This presentation provides an introduction to AI techniques and key concept, and demonstration of the GenAI platform.  We will explore its current capabilities and limitations, and also emerging trends and opportunities in AI. The presentation aims to establish a common understanding of AI while addressing concerns, so that the audience leaves better equipped to evaluate if and how AI can augment their work.  Registration Fee: RM 120/pax (includes snacks, drinks and goodie bag)Dress code: Smart CasualTarget Audience: Engineers < 5yrs of industrial experience   This event is HRDC Claimable for Malaysian Companies (Subject to T&C, please contact HRDC for more information)For HRDC Claims, please refer to the following:HRDC Approval Letter for Tech Talk Over Coffee Allowable Cost MatrixHRDC SBL Grant HelperHRDC SBL Claim HelperMore Information: https://hrdcorp.gov.my/training-providers/  Navy Specialty Coffee 72-1-23 & 23A, Arena Curve, Jalan Persiaran Mahsuri, Mk12, 11950 Bayan Lepas, Penang, Malaysia 11950 Penang Malaysia SEMI.org [email protected] Asia/Singapore public Asia/Singapore Sign Up

SANTA BARBARA, CA – September 1, 2023 – Sikama International Inc., in collaboration with AirProducts Inc.™, is proud to announce the full commercial launch of its acid-free Electron Attachment (EA) Fluxless Reflow Soldering System, a revolutionary step for the Advanced Packaging Semiconductor sector.

The innovative technology behind this system is based on the Electron Attachment (EA) principle for activating hydrogen, a method that AirProducts has been refining for the past 15 years to efficiently reduce surface oxides. The EA technology is engineered to break down H₂ molecules into hydrogen anions, which are then targeted towards the soldering surfaces to effectively clean and reduce oxides before the reflow process. Additionally, this technology operates at ambient pressure and temperatures well within the window of traditional reflow processes.

The key advantages of this technology include:
• Truly Residue-Free: Enhanced reflow quality without flux-induced solder voids and wafer contamination. No post-reflow cleaning equipment is required and significantly less oven cleaning.
• In-line Process: Easily integrated into existing manufacturing lines without batch processing. The EA process occurs immediately before the reflow process.
• Environmental Impact: The EA flux-free process is entirely residue-free and environmentally benign with no organic vapors, hazardous residues, or CO2 emission.
• Ambient Pressure and sub-reflow temperatures: No vacuum requirements and safely processes substrates.

Sikama, as the exclusive global integrator of this technology and partner with AirProducts, views the technology and equipment commercialization as “a game-changer for this industry, as the need for advanced solutions to packaging evolutions in the semiconductor industry continue to evolve”, according to Herb Weigel, President and CEO of Sikama International.

The Sikama EA1200 Solder reflow oven is certified to EN 600204-1, SEMI S2/S8/S22/S23/F47/E6, is CE certified, and is verified to be compliant with NFPA79 in installed applications. Nearly 50 Worldwide Patents have been issued on this technology. The technology is well suited to provide significant benefits to small geometries in wafer bumping, copper pillar, and flip chip applications.

Established in 1982, Sikama International, Inc. designs and produces its products in Santa Barbara, California. Their reflow system offerings provide exceptional performance, with the fluxless systems set to redefine industry standards.

Reliable. Repeatable. Responsible. Reflow.

About Sikama
For over 40 years, Sikama International has offered highly reliable equipment and is the trusted option of manufacturers worldwide.

Sikama International, a trusted provider of state-of-the-art reflow systems is proud to announce their new partnership with CMT, a global leader specializing in back-end semiconductor solutions.

CMT was formed in August 2010 by Mr. CW Kwak, who has over 30 years experience in the semiconductor industry. CMT offers both material and equipment solutions in the back-end semiconductor assembly market.

CMT is a unique global marketing and sales company. CMT focuses on a micro-level marketing working directly with clients and customers through offering specific projects, right beta sites, and global project management. CMT focuses on short-term projects to deliver sales on client’s current products, then offers mid-term projects for next 2-3 years, and long-term programs 5-10 years out to deliver continuous long-term growth and sustainability.

Sikama’s new partnership with CMT will enable both companies to expand their reach to provide customers with an expansive range of solutions on a global platform.

About Sikama
For over 40 years, Sikama International has offered highly reliable equipment and is the trusted option of manufacturers worldwide.

Sikama’s sintering pre-dry ovens offer conductive heating in a controlled environment with adjustable O2 levels as low as 5ppm in a footprint of less than 1 square meter. With their compact design, highly efficient conductive thermal transfer to high-mass components, and the lowest carbon footprint in the industry, Sikama’s products are the perfect fit for any power electronics production line. Additionally, with only 15 minutes before reaching temperature set points, energy costs and gas requirements are kept to a minimum.

With SMEMA and SECS/GEM capability and customizable profiling, their Ultra Profile and Falcon series ovens seamlessly integrate into the automated production line. Providing accurate and consistent temperatures, controlled cooling rates, and each zone fully adjustable to within 1°C, the guesswork is removed from the pre-drying process. With multidirectional process flow using either sweeper bar or walking beam transport systems and the lowest vibration and power consumption in the industry, Sikama has a configuration for any need.

About Sikama
For over 40 years, Sikama International has offered highly reliable equipment and is the trusted option of manufacturers worldwide.