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Malaysia

Location: Richardson, Texas

Modus Test, a leader in advanced test socket testing solutions and performance validation, and yieldWerx, a semiconductor data and yield analytics platform, today announced a strategic partnership to help close the gap between test hardware and yield intelligence. The collaboration combines Modus Test’s high-performance socket test technology with yieldWerx’s enterprise-scale yield management platform to provide manufacturers with direct visibility into the relationship between socket health and device performance.

The partnership addresses a long-standing disconnect between test execution and data analytics in high- volume manufacturing. Degraded, misaligned, or worn sockets can introduce false failures or escapes without clear root-cause identification. By integrating hardware performance data with yield analytics, manufacturers can better distinguish contact-related artifacts from true silicon failures.
Through this partnership, customers can now:
• Monitor and trend socket performance across testers, sites, and handlers
• Correlate device failures to specific sockets, test cells, or contact events
• Identify unnecessary device rejects caused by socket degradation
• Detect potential escapes where devices pass due to intermittent contact issues
• Optimize preventive maintenance cycles using data-driven insights

By integrating Modus Test equipment data with yieldWerx’s wafer-, lot-, and device-level analytics, manufacturers gain the ability to separate true device behavior from test interface variability, improving confidence in test outcomes and accelerating root-cause resolution.

About yieldWerx
yieldWerx provides a semiconductor yield management platform that enables manufacturers to collect, analyze, and act on production data across the manufacturing lifecycle. The platform consolidates data from wafer fabrication through final test, delivering visibility into product quality, process performance, and yield improvement opportunities.

About ModusTest
Modus Test, LLC was founded on the idea that there are creative ways to improve results by combining innovation with the best-known methods in test design and manufacturing. Providing innovative test solutions includes the MPT series of parametric tests, systems, and accessories. Modus Test has a global presence and the capability to support customers in all the IC development centers and high-volume manufacturing sites around the world. See for yourself how combining innovation with best-known methods can improve your results.

Statements from Leadership
“yieldWerx was built to unify disparate manufacturing data into actionable yield intelligence,” said Aftkhar Aslam, CEO of yieldWerx. “Valuable data exists across testers, handlers, sockets, MES systems, and inspection tools, but it often remains siloed. Our platform connects these domains into a unified analytical framework that enables faster, data-driven decisions that reduce costs.”

“This partnership represents an important step forward in bringing greater transparency and intelligence to semiconductor test,” said Jesse Ko, COO of Modus Test. “Modus Test’s high-performance socket validation solutions, combined with yieldWerx’s powerful analytics platform, create a closed-loop ecosystem where hardware performance and yield outcomes are fully correlated. Together, we are enabling a smarter, more adaptive test environment.”

For further information, please visit https://www.yieldWerx.com or https://www.ModusTest.org.

China India Japan Malaysia Singapore Taiwan Vietnam Chiplet & Heterogeneous 6/30 Training

Course Description 

This workshop reviews the needs of the packaging solution to meet the demand for digitalization through the artificial intelligent and Internet-of-things from urbanization, sustainability to industry. The course provides an overview of the fabrication process of IC carriers of leadframe, ceramics, substrate and flex and how they have to evolve to meet the heterogeneous integration. With these foundations, various stacking and integration technologies through wirebonding, flip chip and 3D interconnect from interconnect to system level will be shared. Packaging innovation of TSV, fan-in, fan-out wafer level packaging and its challenges will also be shared for chiplet and heterogeneous integration. It ends off by sharing the embedded technologies and embedded multi-die interconnect bridge for chiplet and heterogeneous integration.

The course looks into the R&D development as well as the dynamics changes of heterogeneous integration technologies in the Semiconductor packaging arena. This workshop curates the technologies development to date and provides the necessary information for professionals in the manufacturing and R&D environment to perform their tasks.

Who Should Attend

This course is intended for both manufacturing and R&D know-how in IC packaging professionals, including but not limited to:

  • Directors
  • Managers
  • Process Engineers
  • R&D Engineers
  • Sales and Application Engineers who supply packaging materials and tools

Learning Objectives

  • Understand why chiplet and heterogeneous integration for advanced packaging
  • Review of IC carriers
  • Summarize 3D and TSV for Chiplet and Heterogeneous Integration
  • Explain Fan-in and Fan-out wafer-level packaging for chiplet and heterogeneous integration
  • Describe chiplet, embedded, and embedded multi-die interconnect beam for chiplet and glass substrate for heterogenous integration 

Instructor

Dr. Lee Teck Kheng

Institue of Technical Education

Instructor Bio

Testimonials 

See what previous course participants had to say about this training!

  • "All the necessary information are neatly fitted into a few slides prepared by Dr. Lee"
  • "I found the review of the material between sessions and the slides to follow along with to be the most beneficial aspects of the training."
  • "Much thanks to Dr. Lee & SEMI University for giving me a chance to study all my unclear items in the past."

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge. 

Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the trainings on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

Singapore

SEMI U

Chiplet and heterogeneous integration of packaging has been embraced as the next revolutionary innovation to meet the quest of size, cost, and performance for packaging. The technologies are seen as another disruptive technology to bring devices into a package by integrating the various Multi-chip module (MCM), 3D packaging, Through Silicon Via (TSV), and Fan-out wafer level packaging (Fo-WLP) technologies into a system in the package for applications. Chiplet, EMIB, and glass substrate will also be shared in this course. 

Pricing
  • Members: $599
  • Non-Members: $649

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]

8:30 am - 5:00 pm Off Add to Calendar 2026-06-30 08:30:00 2026-06-30 17:00:00 Chiplet and Heterogeneous Integration for Microelectronics Packaging (Asia) Chiplet and heterogeneous integration of packaging has been embraced as the next revolutionary innovation to meet the quest of size, cost, and performance for packaging. The technologies are seen as another disruptive technology to bring devices into a package by integrating the various Multi-chip module (MCM), 3D packaging, Through Silicon Via (TSV), and Fan-out wafer level packaging (Fo-WLP) technologies into a system in the package for applications. Chiplet, EMIB, and glass substrate will also be shared in this course. PricingMembers: $599Non-Members: $649* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected] Singapore SEMI.org [email protected] Asia/Singapore public Asia/Singapore Register Now
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The Challenge

Ayar Labs’ engineering teams faced challenges ingesting and analyzing non-standard test data across electro-optical and final test flows while scaling to meet aggressive go-to-market timelines. They sought a test analytics partner capable of loading, validating, and extracting insights from diverse datasets while supporting real-time alerting, yield recovery, and deep engineering analytics.

The Implementation

Week 1–2: Connecting the Pipes

Within the first two weeks, a secure cloud instance of yieldWerx was deployed, and raw data files were streaming in. The platform’s flexible pipelines ingested test data without custom code. The yieldWerx team went further, helping refine business rules, improve data quality, and enrich the information for greater downstream impact.

Week 3: First Insights

By week three, live dashboards were operational. Engineers could view wafer maps, outlier signatures, and correlations that previously required manual effort and scripting. Instead of working across multiple spreadsheets, they now had traceable, drill-down analytics at their fingertips.

Week 4: Real Results

In less than a month, the system was already supporting real yield decisions. Lots that previously required lengthy reviews were dispositioned in hours. Engineers trusted the analytics, and leadership recognized the tangible impact on quality and time-to-market. Ayar Labs is now preparing to onboard additional data formats, including qualification, reliability, and characterization.

The Outcome

The 30-Day Challenge demonstrated that yieldWerx is not just another analytics solution. In weeks, not months, yieldWerx moved from fragmented data to a unified platform that drives yield improvement, accelerates ramps, and reduces risk.

About yieldWerx

yieldWerx, an industry leader in semiconductor yield management, provides a platform that enables manufacturers to collect, validate, and act on production data across the entire semiconductor manufacturing lifecycle.

About Ayar Labs

Ayar Labs, a leader in optical engines for co-packaged optics, is transforming AI infrastructure by accelerating data movement in scale-up networks. Its industry-first optical I/O solution enables customers to maximize compute efficiency and performance while reducing costs, latency, and power consumption. Based on open standards and optimized for AI training and inference, Ayar Labs’ optical interconnect solutions are backed by a robust ecosystem to easily integrate into AI systems at scale. Ayar Labs was founded in 2015 and is funded by domestic and international venture capital firms, as well as strategic investors including AMD, Applied Ventures, GlobalFoundries, Hewlett Packard Pathfinder, Intel Capital, and NVIDIA.

Statements from Leadership

“Our collaboration with yieldWerx gave us measurable results in just 30 days. Their platform ingested
our complex photonics data, and the insights have accelerated how we make yield and quality decisions.”

— Garth Thompson, CIO, Ayar Labs

“Partnering with Ayar Labs has been both inspiring and validating. Photonics test data is some of the most complex in the industry, spanning electrical, optical, and multi-dimensional signatures that traditionally take months to integrate. Delivering measurable results in just 30 days shows the power of a unified, modern analytics platform. We’re proud that yieldWerx is helping Ayar Labs accelerate their roadmap, improve yields, and bring truly groundbreaking optical I/O technology to market faster and with higher confidence. “

— Aftkhar Aslam, CEO, yieldWerx
For further information, please visit https://www.yieldWerx.com or https://ayarlabs.com/.

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United States

Sustainability

SEMI Sustainability, in collaboration with STX Group, hosted a webinar on Internal Carbon Pricing (ICP) for the semiconductor value chain. The session was anchored in a new industry report developed with input from members of SEMI’s Carbon Pricing Workgroup and will feature speakers from ASML, Delta Electronics, and Lam Research.  The webinar  highlighted the 5 key steps in creating and implementing your own ICP plan, and understand the process, its benefits and the opportunities offered.

The presentations explored key insights from the report alongside SEMI member perspectives, with speakers sharing practical examples and lessons learned—from early exploration to applied approaches—across the semiconductor value chain. 

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Oxford Instruments, a leading provider of advanced plasma processing solutions, today announced a plasma equipment supply agreement with Applied Optoelectronics Inc. (AOI) (Nasdaq: AAOI), a leading provider of advanced optical and hybrid fibre-coaxial networking products that power the internet, for several etch and deposition cluster systems at their facility in Sugar Land, Texas.

The agreement will support AOI’s transformative expansion and technological advancements in indium phosphide (InP) for optoelectronic device manufacturing, as the company rapidly scales to increase production capacity within the U.S.

As AOI undergoes a significant growth phase, the company is upgrading its production capabilities to meet increasing demand for high-performance InP optoelectronic devices. Oxford Instruments’ advanced plasma etch and deposition processing systems will play a key role in this transformation by supporting AOI with fully automated 3-4-6-inch capable production systems for InP processes.

“AOI is expanding its U.S. manufacturing capacity in Texas to support demand for our optical transceivers in AI datacentres, and key suppliers like Oxford Instruments will help us continue to upgrade our fully automated production line,” said Fred Chang, Senior Vice President and North American General Manager at AOI. “With our combined technology, we can speed the processing of multiple wafer sizes, ranging from 3 to 6 inches, while improving overall quality and reducing costs.”

“AOI has been a valued long-term partner, and we are thrilled to have earned their trust as the chosen supplier for their production expansion and technology upgrades. Our unique high-temperature Electrostatic Chuck (ESC) design, which enables advanced processing capabilities, was a key factor in their decision. AOI also conducted an extensive vendor qualification process, including a visit to our brand-new purpose-built manufacturing facility in Bristol, UK, where we received high praise for our technology and production capabilities,” said Emiel Thijssen, Vice President of Sales and Business Development USA, Oxford Instruments Plasma Technology. “We are also investing significantly to ensure we continue to deliver world-class service capability in the Texas region, focusing on the availability of spares and expanding our field service and process engineering teams, to support the rapid expansion of leading manufacturers in the region such as AOI.”

###


For media enquiries, please contact:
Grant Baldwin, Head of Marketing
Oxford Instruments Plasma Technology
E: [email protected]
About Oxford Instruments plc
Oxford Instruments provides academic and commercial organisations worldwide with market-leading scientific technology and expertise across its key market segments: Materials Analysis, Healthcare & Life Science and Semiconductors. Innovation is the driving force behind Oxford Instruments' growth and success, supporting its core purpose to accelerate the breakthroughs that create a brighter future for our world. The vigorous search for new ways to make our world greener, healthier and more productive is driving unprecedented levels of R&D investment in new materials and techniques to support productivity and decarbonisation worldwide, creating a significant opportunity for Oxford Instruments to grow.

Oxford Instruments holds a unique position to anticipate global drivers and connect academic researchers with commercial applications engineers, acting as a catalyst that powers real world progress. Founded in 1959 as the first technology business to be spun out from Oxford University, Oxford Instruments is now a global company listed on the FTSE250 index of the London Stock Exchange (OXIG).

For more information, visit www.oxinst.com

About AOI 
Applied Optoelectronics, Inc. (AOI) is a leading developer and manufacturer of advanced optical and HFC networking products that are the building blocks for AI datacentres, CATV and broadband fibre access networks around the world. AOI supplies this critical infrastructure to tier-one customers across cloud computing, CATV broadband, telecom, and FTTH markets. The company has R&D facilities in Atlanta, GA, and engineering and manufacturing facilities at its corporate headquarters in Sugar Land, TX, as well as in Taipei, Taiwan and Ningbo, China. For additional information, visit www.ao-inc.com. 

Advancing Thermal Scanning Probe Lithography

Zurich, Switzerland — Following the successful introduction of the modular NanoFrazor nanolithography system in 2024, Heidelberg Instruments is proud to announce the installation of the newest NanoFrazor. The system is equipped with the recent modules, enabling parallelized thermal scanning probe lithography (t-SPL). The beta site is hosted by the research partner EPFL, the Swiss Federal Institute of Technology in Lausanne, Switzerland. The installation marks a significant step forward in joint efforts to bring next-generation nanofabrication technologies into practice, promising advances in nanoscale research and applications.

Designed for high-resolution lithography down to 20 nm, with application flexibility and increased throughput, the system features parallelized t-SPL with ten heated tips writing simultaneously, Direct Laser Sublimation (DLS), and advanced automation. “Parallelizing t-SPL was the logical next step in advancing thermal nanolithography. The implementation, however, was far from trivial.” states Dr. Emine Cagin, CTO of Heidelberg Instruments Nano AG. “Parallelization required a decade of development, culminating in a new and scalable framework for electronics and software that now powers the new NanoFrazor.”

The new module, named the Decapede, increases the throughput up to tenfold, without compromising on high-resolution capabilities. “With improved throughput, we are considering upscaling grayscale nano surfaces that enable deterministic and localized strain engineering of 2D materials from chip-level to wafer-scale for potential industrial integration”, says Berke Erbas, Postdoctoral Researcher in the Microsystems Laboratory at EPFL. “We also aim to upscale grayscale nanoimprint lithography stamps fabricated through t-SPL and dry-etching approaches.”

EPFL — A Hub for Innovation
EPFL’s expertise in t-SPL and broad nanofabrication capabilities make it an ideal beta site and mark the continuation of a long-standing, trusted partnership with Heidelberg Instruments. The consortium of research groups involved brings together a combination of deep knowledge in t-SPL and diverse nanofabrication techniques, along with fresh ideas and challenging applications. The generous commitment to providing continuous feedback will help Heidelberg Instruments further validate the system performance and refine user interfaces.

From Nanoelectronics to Quantum Devices, a Look Ahead
The EPFL beta site is not only a testing and validation site for the system’s capabilities but first and foremost a catalyst for innovation in nanolithography. Applications at the EPFL beta site span nanoelectronics, plasmonics, quantum devices, and bio-nano-sensors. Jürgen Brugger, Professor in Microengineering and Materials Science at EPFL, highlights: “t-SPL has proven to be an excellent tool for educating junior researchers due to its capabilities for fast prototyping with a low threshold to create nano-patterns in short time scales. We are excited to expand towards parallel writing capabilities.” For example, the Laboratory of Nanoscience for Energy Technologies (LNET), Professor Giulia Tagliabue, is exploring the use of its gray-scale functionalities for realizing advanced metasurfaces that can strongly confine light at nanoscale dimensions for energy conversion and probing of interfacial processes.

We are looking forward to seeing how the beta site will accelerate discoveries and enable new possibilities in nanoscale science, both in research and educational use of the NanoFrazor system.

Further information: https://heidelberg-instruments.com/product/nanofrazor/

Ball Wave Inc., a pioneer in advanced chemical sensing technology, today announced that its FT-450WT online trace moisture analyzer has received full certification from Taiwan's most advanced semiconductor manufacturer following rigorous validation testing. This milestone validates Ball Wave's proprietary ball SAW sensor technology and establishes the company as a strategic supplier in the critical semiconductor manufacturing equipment sector. The certification comes at a pivotal time as semiconductor manufacturers worldwide face increasing pressure to improve yield rates and reduce contamination in advanced node production. Ball Wave's technology addresses a critical pain point in fab operations, where even parts-per-billion levels of moisture can compromise chip quality and manufacturing efficiency. The successful certification demonstrates the analyzer's reliability in the most demanding production environments and opens significant commercial opportunities for specialty gas manufacturers who are the key players plagued with trace moisture contamination. 

Ball Wave President Shingo Akao stated, "This certification validates our core technology platform and demonstrates our ability to meet the stringent requirements of the world's most sophisticated semiconductor fabs to help them avoid unplanned shutdowns due to trace moisture contamination. Ball Wave's patented ball SAW sensor represents a fundamental breakthrough in trace moisture detection, offering speed and precision unmatched by legacy technologies. With proven performance in production environments and a robust IP portfolio, we are well-positioned to capture significant market share in the rapidly growing semiconductor manufacturing equipment sector, which is projected to exceed $156 billion by 20271."

Business Impact: For advanced semiconductor fabs operating at 3nm and below, moisture contamination can cost $5-10 million per incident2 in scrapped wafers and production delays. Industry data shows that facilities with inadequate moisture monitoring experience maintenance ratios below 1.0, where unplanned repairs consume over 50% of total downtime. Ball Wave's real-time detection capability enables preventive action before contamination reaches critical levels, helping customers avoid these costly failures and maintain the operational stability (M-ratio >4.0) essential for profitable advanced node production. This value proposition has resonated strongly with leading fabs, creating a clear path to rapid customer adoption.

About the FT-450WT and Ball Wave's Technology Platform: The FalconTrace ultra-trace moisture meter uses a proprietary ball SAW sensor to quantitatively measure the trace amounts of water molecules contained in industrial gases and natural gases. Its extremely fast response time allows for real-time monitoring of changes in moisture content, and it is also capable of measuring both moisture content and background gas composition. It can accurately measure moisture concentrations in gases down to the 1 ppbv (parts per billion) level, representing 10-100x improvement over competing technologies. The FT-450WT is a high-end model that maintains its fast response time while prioritizing integration into equipment, and the separation of the sensor unit and main body allows for greater layout flexibility in fab retrofits and new tool installations. 

Ball Wave's technology platform extends beyond moisture analysis to a broader range of chemical sensing applications, creating multiple revenue streams and cross-selling opportunities within semiconductor fabs and adjacent industries, including pharmaceuticals, aerospace, and industrial gases. 

Market Opportunity and Strategic Position: Ball Wave has established relationships with leading semiconductor manufacturers in Taiwan, with active discussions underway in South Korea, Japan, and the United States 

  • The company's technology addresses a growing market as advanced node production (5nm and below) requires increasingly stringent contamination control
  • Ball Wave holds key patents in ball SAW sensor technology with additional applications pending in major semiconductor manufacturing regions
  • The company's university origins provide access to cutting-edge MEMS research and ongoing innovation pipeline

About Ball Wave Inc.: Ball Wave Inc. is a technology company specializing in advanced chemical sensing solutions for critical industrial applications. Founded as a spin-out from Tohoku University, a global center of excellence in MEMS technology, Ball Wave leverages proprietary ball SAW sensor technology to deliver breakthrough performance in trace contamination detection. The company serves semiconductor manufacturers, industrial gas suppliers, and other industries requiring ultra-precise gas analysis. Ball Wave is headquartered in Sendai, Japan.

For inquiries regarding this matter, please contact: Ball Wave Inc., Corporate Strategy Division, Yusuke Tsukahara 

[email protected] 

Telephone: +81-3-5979-2357 

https://www.ballwave.jp/ 

1. https://www.semi.org/en/semi-press-release/global-semiconductor-equipment-sales-projected-to-reach-a-record-of-156-billion-dollars-in-2027-semi-reports 

2. https://www.mckinsey.com/industries/semiconductors/our-insights/need-to-boost-semiconductor-fab-efficiency-look-to-maintenance

Gütenbach, Germany – December 16, 2025 – RENA Technologies is proud to be a key industrial partner in a new 1.3 million Euro Government-funded project led by the National Physical Laboratory (NPL) and supported by the Department for Science, Innovation and Technology (DSIT). The initiative will establish critical new metrology capabilities to strengthen the UK’s semiconductor innovation infrastructure and accelerate the development and adoption of next-generation semiconductor materials and processes.

This strategic investment underlines the UK’s commitment to maintaining global competitiveness in semiconductors, helping to attract private investment, strengthen supply chains, and support long-term economic growth. As advanced semiconductor materials become central to technologies such as electric vehicles, renewable energy, 5G communications and advanced electronics, robust measurement, verification and standards are increasingly essential.

The project brings together a broad consortium spanning industry and academia. Together, the partners cover the full innovation landscape, from materials research and process development to device fabrication and performance verification.

“At RENA, we develop advanced wet processing and surface treatment solutions that are critical in manufacturing of compound semiconductors and emerging materials. Through this collaboration, RENA will contribute industrial insight and process expertise to ensure that new measurement and testing capabilities are closely aligned with real manufacturing challenges.” States Peter Schneidewind, CEO of RENA Technologies.

While silicon remains the foundation of much of today’s semiconductor industry, many high-growth applications increasingly depend on advanced materials such as gallium arsenide (GaAs), gallium nitride (GaN), silicon carbide (SiC), and indium phosphide (InP). These materials offer superior performance in high-power, high-frequency and optoelectronic applications, but they also introduce new complexities in processing, characterization and quality assurance. Reliable standards and independent measurement methods are therefore essential to derisk innovation and support scale-up.

Through this project, consortium partners will work with NPL to:
• Develop new UK measurement and test capabilities for advanced semiconductor materials by combining academic research excellence with world-leading metrology expertise.
• Apply these capabilities to critical industry challenges, including assessing material integrity, verifying RF performance, and testing device reliability under demanding operating conditions.
• Share the resulting capabilities openly with industry, helping to build national consensus and strengthen the UK’s influence in international standards development for novel semiconductor technologies.

Following extensive consultation the consortium has identified three priority application areas where the UK can have the greatest global impact: power electronics, RF-communications, and optoelectronics. These areas align closely with RENA’s customer base and technology roadmap, particularly in power and compound semiconductor manufacturing.
By participating in this program, RENA reinforces its commitment to supporting the UK semiconductor ecosystem with industrially relevant innovation, enabling customers to adopt advanced materials with confidence, and helping position the UK as a global leader in next-generation semiconductor technologies.

About NPL
The National Physical Laboratory (NPL) is the UK's National Metrology Institute (NMI), developing and maintaining the national primary measurement standards, as well as collaborating with other NMIs to maintain the international system of measurement. As a public sector research establishment, it delivers extraordinary impact by providing the measurement capability that underpins the UK's prosperity and quality of life. NPL develops the metrology required to ensure the timely and successful deployment of new technologies and work with organizations as they develop and test new products and processes.

About RENA Technologies GmbH
RENA Technologies is a leading global supplier of production machines for wet chemical surface preparation. RENA products are used in path-breaking application fields such as semiconductors, MedTech, renewable energies, and the glass industry. RENA equipment is used to treat or modify surfaces of, for example, semiconductor wafers, solar cells, glass, optical substrates or other high-tech products using wet chemical processes. RENA offers proven standard machines as well as customer-specific solutions and process support.

 

Tirana, November 2025 – Atronix Sh.p.k., Albania’s pioneering Electronics Manufacturing Services company, officially inaugurated in November its new production facility at Tirana Industrial Park. The event marks a historic moment for Albania’s industrial landscape, establishing the country’s first advanced EMS factory with capacity to serve European and North American markets.

Equipped with the latest generation of JUKI SMT Production line with advanced AOI/X-ray inspection ERSA selective and wave soldering, and fully integrated traceability systems, Atronix introduces advanced technological capabilities. 

The inauguration ceremony brought together distinguished guests, including leading figures from the European electronics industry Mr. Dieter Weiss, EBRD representatives. Ms. Ekaterina Solovova, Ms. Egla Ballta, JUKI Europe Mr. Kenji Hirohata, Mr. Rui Vidal and Mr. Davor Jakulin international and national business partners, representatives from the Albanian Government, Academia and Universities, etc. 

“Our vision from the beginning was clear: to build a factory that stands at the same level with Europe’s most advanced EMS providers,” said Ms. Enkeleda Kuka, Founder & CEO of Atronix. “Today, we are proud to show that Albania can compete in high-precision electronics manufacturing.” During the ceremony, Atronix extended appreciation to its international collaborators, including JUKI Europe, Kurtz-Ersa, and several global clients and advisors who have contributed to the company’s rapid development. 

“In this challenging business climate, it is very good to see a new EMS company being opened in Albania. Eastern Europe will see a strong growth of electronic production in the future and Atronix will participate in this development.” said Mr. Dieter G. Weiss, European EMS industry expert and longstanding supporter of the project. 

This factory sets a new standard for high-value manufacturing in the country and demonstrates how it can transform Albania's industrial landscape. EBRD has supported Atronix through our Advice for Small Business program and looks forward to the future successes of Atronix" said Ms Ekaterina Solovova, Head of Albania, EBRD.

With its inaugural production lines now operational, Atronix is preparing for a strong expansion phase, targeting new partnerships in Electronic Manufacturing and broader industrial integration across Europe and North America. 

“Atronix symbolizes what the next chapter of Albanian industry can look like,” added Ms. Kuka. “We are committed not only to manufacturing high-quality electronics, but also to building trust, reliability, and long-term value for every client who chooses Albania as their production base. 

 

www.atronix.al[email protected]; Tirana Industrial Park 48, Kashar, Tirana,  Albania

Second-generation platform delivers advanced control, in-cycle annealing, and high-throughput performance for Wide Bandgap power and RF device manufacturing

Espoo, Finland, November 24, 2025 – Beneq introduces the Beneq Transform® XP, a second-generation ALD platform developed to meet the performance demands of Wide Bandgap (WBG) power and RF device technology development and manufacturing. Building on the proven Beneq Transform® platform, the new system adds advanced ALD control, faster cycle times, and greater process capabilities in a high-throughput format.

The Beneq Transform® XP features a second-generation, flow-optimized 25-wafer mini-batch thermal ALD reactor that achieves breakthrough deposition rates with single-digit-second cycle times for common ALD oxides and nitrides. Refined flow and pressure dynamics ensure exceptional within-wafer and wafer-to-wafer uniformity – even at a few nm film thicknesses – while precise dwell-time control delivers excellent conformality on high-aspect-ratio structures.

Transform® XP also introduces advanced PEALD process control to precisely manage low-energy ions. This enables optimized plasma pre-cleaning and deposition, resulting in improved interface quality, tunable passivation, and enhanced device performance and reliability. The system integrates in-cycle annealing, a proprietary step that densifies and purifies films to achieve stoichiometric, low-impurity materials and crystalline alignment, such as AlN lattice orientation.

“Transform® XP is our response to the next wave of device challenges in power and RF manufacturing,” said Dr. Mikko Söderlund, Head of Sales, Semiconductor ALD at Beneq. “Customers value the original Transform® for its versatility and reliability. With XP, we introduce capabilities they specifically asked for – improved ion control, faster cycles, and in-cycle film densification – all in a versatile platform.”

With over a dozen Beneq Transform® clusters installed globally for WBG pilot and production use, and more than 100 process modules shipped, Beneq continues to support leading IDMs, foundries, and RTOs advancing More-than-Moore technologies.

About Beneq

Beneq pioneered industrial production of Atomic Layer Deposition (ALD) with the introduction of the first commercial ALD equipment in 1984. Today, Beneq advances ALD adoption and validation with a portfolio that includes the Beneq Transform®, Transform XP, Transform 300, Transmute™, and Prodigy™ for specialty semiconductor device fabrication; TFS 200 and TFS 500 for R&D; the P400A, P800, and P1500 batch systems for coating critical semiconductor chamber components and complex part geometries; and spatial ALD platforms such as the C2R™ and Genesis for roll-to-roll processing. Headquartered in Espoo, Finland, Beneq enables ALD integration from lab to fab for semiconductors, optics, and functional coatings.

Press Contact
Charlotte Bärlund
Event and Communications Lead
[email protected]