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PENANG MALAYSIA - August 2021 - ViTrox Technologies, the world’s most trusted technology company for the semiconductor and electronic packaging industries, is pleased to announce that its 360-Degree Virtual Tour will be officially launched from 23 August 2021, in conjunction with SEMICON Southeast Asia 2021 which will be held virtually from 23 to 27 August 2021!

The world is undergoing challenges imposed by Covid-19 pandemic where travelling is restricted, it offers an opportunity for ViTrox to showcase its beautiful Campus 2.0 through virtual mode. The virtual tour operates 24-hour a day, 365 days a year where you can access it at anytime and anywhere! With just a few clicks, you will be able to learn about ViTrox from various perspectives.

FIVE key highlights of the 360-degree panoramic virtual tour:
i. Spectacular exterior scenery of ViTrox Campus 2.0
ii. V-Gallery encompasses 20 Years Journey of ViTrox
iii. Body. Mind. Soul (BMS) Theme illustrates a second home concept and humane corporate culture
iv. Learning & Growth Theme for continuous learning and sharing
v. Resource Centre Theme serves as a one-stop centre for experience and knowledge sharing

ViTrox embraces the core values, I.A.C.T.G. (Integrity . Accountability . Courage . Trust & Respect . Gratitude & Care), ESG (Environmental, Social, and Governance) and the philosophy of Body . Mind . Soul (BMS), cultivating humanism and compassionate corporate culture for ViTroxians. From this virtual tour, you will experience and feel about all these in every corner of ViTrox.

ViTrox is excited to bring you to explore the 360-Degree Virtual Tour during its official launch at SEMICON SEA 2021. You are welcome to visit ViTrox virtual booth for the comprehensive solutions showcase, 360-degree virtual tour, and also the insightful webinar sessions!

The virtual tour will also be available at ViTrox Corporate Website, ViTrox LinkedIn Page and ViTrox Facebook Page from 23 August 2021 onwards. Please register and join us for the virtual tour!
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About ViTrox Technologies
Since 2000, ViTrox is committed to providing the most innovative, advanced and cost-effective machine vision solution of excellent quality to its customers through integrating ViTrox’s technologies, their people and their strategic alliances. ViTrox is the exclusive company that offers a full spectrum of automated 3D vision inspection solutions including Intelligent Advanced Robotic Vision System, PCB Assembly SMT Vision Inspection Solutions and Industry 4.0 smart Solution. ViTrox is headquartered in Penang, Malaysia, and with offices in Asia, Germany, and the United States, along with sales and support sites globally. For more information about ViTrox’s products and services, please visit www.vitrox.com.

YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today announced that Bioh Kim has joined its management team as President of YES Korea. Based in the YES Korea office in Dongtan, he will be responsible for establishing the regional business structure and growing the company’s presence in Korea.

Bioh is a highly experienced executive with strong technology, business, and management credentials in the semiconductor and display industries. Prior to joining YES, he served in various executive roles for over a decade at leading equipment manufacturers, including Vice President of the ECD business unit and worldwide sales & service for TEL NEXX (Tokyo Electron US), Managing Director of packaging field technology for Applied Materials, and General Manager for APEVA (a subsidiary of Aixtron).

Bioh started his career at Samsung in Korea after earning his BS and MS degrees in Materials Science and Engineering from Seoul National University. He then spent 20 years in the US semiconductor industry, returning to Korea in early 2020.

“We are very pleased to welcome Bioh to our senior team,” said Rezwan Lateef, President of YES. “His track record of successful business development, coupled with his understanding of our customer base in current and emerging markets, will be valuable resources for YES as we continue to expand our business in Asia.”

First on Bioh’s to-do list will be the establishment of YES’s new office in Dongtan, enabling a closer relationship with the company’s longtime key customers in the Korea region. “Our company’s mission is to be the preferred provider in the markets we serve,” said YES CEO Rama Alapati. “As our systems have become increasingly critical to our customers’ operations, having physical proximity enables us to be more responsive to their needs, and better able to anticipate and address their roadmaps. We have high expectations for this new chapter of YES’s ongoing global growth.”

About YES
YES (Yield Engineering Systems, Inc.) is a preferred provider of high-tech, cost-effective equipment for transforming surfaces, materials and interfaces. The company’s product lines include vacuum cure ovens, chemical vapor deposition (CVD) systems, and plasma etching tools used for precise surface modification and thin-film coating of semiconductor wafers, semiconductor and MEMS devices, and biodevices. With YES, customers ranging from startups to Fortune 100 companies can create and volume-produce products in a wide range of markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality and Life Sciences. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit http://www.yieldengineering.com.

SEMI Members:  $49

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $99

Students:  Free

Contact Gity Samadi ([email protected]) with a picture of your student ID to receive your discount code. 

Flexible Hybrid Master Classes are offered on many topics!  Visit this page for entire list and links to more detailed information on each one.

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Course Outline

  1. Flexible hybrid electronics:  definition, design, and fabrication
  2. Challenges to interface hard and soft electronic components
  3. Introduction to the IEEE Heterogeneous Integration Roadmap (HIR)
  4. Overview of inks and encapsulants
  5. Printing methods: dispense, inkjet, screen printing, multi-axis aerosol jet printing
  6. Electromechanical evaluation of printed interconnects
  7. Additive manufacturing of resistors and capacitors
  8. Highly stretchable conductors
  9. Interconnecting in the z direction - printed vias
  10. Printed RF devices and antennas
  11. Device and component placement and assembly
  12. Thinned semiconductor devices
  13. Approaches to bond devices and components to flexible substrates
  14. Concepts of operation and evaluation of performance and reliability
  15. Applications to medical and industrial sensors will be incorporated throughout

About the Instructor

Mark PoliksMark D. Poliks, Ph.D. is a SUNY Distinguished Professor of Engineering and Empire Innovation Professor in Systems Science and Industrial Engineering and Materials Science and Engineering at the State University of New York at Binghamton.  He is director of the Center for Advanced Microelectronics Manufacturing (CAMM), a New York State Center of Advanced Technology and home to the New York Node of NextFlex.  He serves as Chair of the Smart Energy Transdisciplinary Area of Excellence at the Binghamton campus. 

His research is in the areas of industry relevant topics that include high performance electronics packaging, flexible hybrid electronics, medical and industrial sensors, printed RF components, materials, processing, aerosol jet printing, roll-to-roll manufacturing, in-line quality control and reliability of electronics.  He is the recipient of the SUNY Chancellor’s Award for Excellence in Research. 

He received SEMI FLEXI awards for leadership in Technology and Education in 2009 and 2019.  He has authored over one hundred fifty technical papers and holds forty-eight US patents.   He was the General Chair of the 69th IEEE ECTC and serves as a IEEE Electronics Packaging Society (EPS) Distinguished Lecturer and an elected member of the IEEE EPS Board of Governors. 

United States

EMG FlexTech Standards

This course, the 9th in the FlexTech Master Class Series, takes a deep dive into best known methods for optimizing flexible electronics into medical devices and industrial products.  Our expert speaker cover the most important considerations when designing flexible and printable parts and circuits into systems or subsystems and the many approaches to consider.

This course is appropriate for those new to electronics design, as well as those familiar but looking for a refresher on the latest materials and techniques.  

10:00 am - 12:00 pm Off Add to Calendar Disabled America/Los_Angeles
Event format

Odyssey Technical Solutions, world leader in RF, DC, and microwave repairs, is pleased to announce a new distribution agreement with EKK Eagle Semicon Components for both the Americas and European markets. EKK Eagle Semicon Components (EKKSC), a leader in O-ring and vacuum sealing technologies, was established as the sales and engineering division of EKK Eagle for all semiconductor markets outside Japan since 2010, located in San Jose, California.

“In looking for additional products that addressed our existing customers’ needs, EKKSC’s O-rings and related products are an excellent fit,” said Jim Plourde, president of Odyssey Technical Solutions. “Odyssey, with a twenty-year history and over 100,000 successful worldwide repairs, is already working with many of the same people within the wafer fabs and other industries. This agreement offers an excellent opportunity for Odyssey to work with yet another world leader.”

EKKSC became a world leader due to its vertical integration, including manufacturing its own monomers and controlling the entire process from base monomer structure to polymerization. EKKSC’s wide range of Superior® elastomers from FKMs to next generation FFKMs gives it the ability to provide the best solution to the markets it serves. An agreement with EKKSC only further expands Odyssey’s ability to make high-quality repairs with outstanding customer service.

“When we were looking for partners to help support our existing and potential customers, Odyssey Technical Solutions jumped to the forefront. Odyssey is already supporting the semiconductor and industrial markets where EKKSC products are used,” remarked Patrick Giorda, president of EKKSC. “As Odyssey also distributes other critical components, it has an experienced understanding of customers’ needs and expectations within those markets. It is the perfect partner for EKKSC.”

For more information about EKK Eagle Semicon Components, visit www.ekksc.com.

For more information about Odyssey Technical Solutions, call +1.512.989.7007, email [email protected], or visit our website at www.odysseyrf.com.

About Odyssey Technical Solutions
Odyssey Technical Solutions' technology center is a state-of-the-art repair facility located in Round Rock, Texas. The engineering staff consists of highly skilled professionals working in a meticulously maintained facility, specializing in RF Generators, Automatch Networks, DC Power Supplies, and Microwave Generators / Power Supplies. Odyssey's reputation for quick turnaround times and customer satisfaction has provided it the opportunity to become involved with an array of different processes and equipment within the industry. The Odyssey team is engaged, motivated, customer focused, and current with the latest advancements in process and equipment engineering. Services include repair, refurbishment, core exchanges, process and equipment engineering, and equipment sales. Odyssey is an ISO 9001:2015 and ANSI/ESD S20.20 Certified company, and a US veteran-owned company.

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For more information please contact:

Larry Broome
Senior Director of Global Sales and Marketing
Odyssey Technical Solutions
+1.512.989.7007
[email protected]

FREMONT, Calif. – Aug 9, 2021 – YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today announced its first shipment of the VertaCure™ XP vacuum curing system to a China-based OSAT customer. The system will support high volume manufacturing of flip chip and wafer-level packaging (WLP) applications. Multiple repeat orders are expected from this customer for delivery in 2022.

During the evaluation process, the OSAT was able to validate the VertaCure XP’s technical superiority over competing options – 5x less outgassing, 25-30% process time reduction and significant CoO (cost of ownership) improvement – for a variety of polyimides including the Hitachi Dupont HD-4100 series, Asahi BM-300 and BL-301, Fujifilm, and more. In addition, the VertaCure XP's vacuum technology provided excellent particle performance and allowed for a wider range of processes with which to create new applications.

“OSATs are increasingly critical to the supply chain as advanced packaging technology requirements evolve,” explained Alex Chow, Asia Sales President & General Manager at YES. “This major win further confirms YES’s ability to support OSATs globally with the operational flexibility, technology leadership and high economic value that they require. We look forward to helping these key customers create innovative solutions for the vibrant semiconductor market.”

“Advanced packaging is a fundamental building block for innovation in the semiconductor industry. YES's leadership position is based on providing superior on-wafer results coupled with low cost-of-ownership. This order solidifies YES's growing role as a trusted global partner in the production of leading-edge technologies,” said Rezwan Lateef, President of YES.

About YES
YES (Yield Engineering Systems, Inc.) is a preferred provider of high-tech, cost-effective equipment for transforming surfaces, materials and interfaces. The company’s product lines include vacuum cure ovens, chemical vapor deposition (CVD) systems, and plasma etching tools used for precise surface modification and thin-film coating of semiconductor wafers, semiconductor and MEMS devices, and biodevices. With YES, customers ranging from startups to Fortune 100 companies can create and volume-produce products in a wide range of markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality and Life Sciences. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit www.yieldengineering.com.

WILMINGTON, Mass., Aug. 3, 2021 -- Energetiq Technology, a world leader in high brightness broadband light sources, is celebrating the launch of the Chromatiq Spectral Engine (CSE™).

The CSE allows users to emulate real-world lighting conditions, combine spectra from multiple sources, and create unique, dynamic spectra to fulfill demanding applications. It offers unparalleled spectral match accuracy, spectral resolution, and repeatability across an unmatched dynamic range. The CSE has been developed with automated calibration workflows in mind and easily integrates into any optical test protocols.

“Designing the CSE around Energetiq’s unique Laser-Driven Light Source (LDLS™) and applying an innovative, proprietary optical architecture, results in a product with robust spectral stability and a combination of throughput, resolution, and dynamic range unmatched in the market,” says Don McDaniel, Ph.D., VP of Research & Development. “We are providing our customers the ability to emulate near-infinite combinations of light sources ranging from incandescent to highly structured light sources such as CFLs with extremely fast switching necessary to support high-throughput testing."

Target applications:
Calibration and test of ambient light sensors
Cameras/image sensors/CMOS
Colorimetry instrument calibration
Light sources for spectroscopy
Any application where the ability to generate a custom spectrum is important

Energetiq will present the Chromatiq Spectral Engine at the SPIE Optics + Photonics taking place August 3-5, 2021. For more information, visit www.energetiq.com/chromatiq.

About Energetiq Technology, Inc.
Energetiq, a Hamamatsu subsidiary, introduces breakthrough products using patented, ultra-bright Laser-Driven Light Source (LDLS™) and Electrodeless Z-Pinch™ EUV technologies. These sources are used in a variety of markets, primarily in high-end semiconductor manufacturing, sensor testing for mobile devices, academic research and in a variety of drug discovery and medical applications. For more information visit www.energetiq.com.

Japan
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SEMIジャパン
市ヶ谷
1-17
千代田区 九段南, Tokyo
1020074
Japan

Standards

Automation Technology Japan TC Chapter Meeting

Date: January 27, 2022

Time: 13:30-17:30 [JST]

via Web Conference

 

AGENDA

 

Standards Contact Information:

Hirofumi Kanno

SEMI Japan

Email: [email protected] 

Phone: 81.3.3222.5760

 

NOTE:

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!

Questions? Contact your local staff coordinator: Click here

Off Add to Calendar 2022-01-27 00:00:00 2022-01-27 00:00:00 Automation Technology Japan TC Chapter Meeting Automation Technology Japan TC Chapter Meeting Date: January 27, 2022 Time: 13:30-17:30 [JST] via Web Conference   AGENDA   Standards Contact Information: Hirofumi Kanno SEMI Japan Email: [email protected]  Phone: 81.3.3222.5760   NOTE: Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! Questions? Contact your local staff coordinator: Click here SEMIジャパン 市ヶ谷 1-17 千代田区 九段南, Tokyo 1020074 Japan SEMI.org [email protected] Asia/Tokyo public Asia/Tokyo

YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today announced that one of its customers has been awarded a multimillion-dollar contract by the US’s National Institutes of Health to manufacture a new COVID testing device for mass distribution. The award was made possible through the NIH’s Rapid Acceleration of Diagnostics (RADxSM) initiative.

Key to the customer’s product is an innovative technology that enables instant-read accuracy rivalling that of conventional PCR testing, which can require a day or more to provide results. Scaling this promising new device to high production volumes will leverage the capabilities of YES’s EcoCoat™ HVM molecular vapor deposition system.

The YES EcoCoat HVM system and manufacturing process applies a highly uniform surface-transforming film coating to the customer’s devices. This molecular monolayer coating provides a functional interface between the device surface and COVID-specific biomolecular recognition elements applied later in manufacturing. The high-capacity vapor phase coating system and automated substrate load/unload capabilities provide throughput enabling millions of individual detection devices per month.

“YES is honored that our process equipment was chosen to help get this novel diagnostic technology into the hands of millions of people, as the worldwide battle against COVID-19 continues,” said Rezwan Lateef, President of YES.

About YES
YES (Yield Engineering Systems, Inc.) is a preferred provider of high-tech, cost-effective equipment for transforming surfaces, materials and interfaces. The company’s product lines include vacuum cure systems, chemical vapor deposition (CVD) systems, and plasma etching tools used for precise surface modification and thin-film coating of semiconductor wafers, semiconductor and MEMS devices, biosensors and medical substrates. With YES, customers ranging from startups to Fortune 100 companies can create and volume-produce products in a wide range of markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality and Life Sciences. YES is headquartered in Fremont, California, with a growing presence globally. For more information, please visit http://www.yieldengineering.com.

Don Foldenauer Joins YES as Vice President of Operations

FREMONT, Calif. – July 19, 2021 — YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today announced that Don Foldenauer is the company’s new VP of Operations.

“I am very pleased to welcome Don to our executive staff,” said Vinod Mahendroo, Senior VP of Operations at YES. “I expect that his extensive industry experience and proven track record of building and managing high-functioning teams will be considerable assets to YES as we continue our rapid growth and transition to a world-class, global manufacturer.”

Mr. Foldenauer began his career as a design engineer of semiconductor manufacturing equipment systems and has been awarded multiple patents. He spent more than 15 years in Field Operations management at Applied Materials and KLA-Tencor. His resumé also includes over 15 years in Manufacturing Operations management at Applied Materials, followed by VP of Operations roles at three contract manufacturers: Jabil, Celestica, and Ultra Clean Technology. In addition to holding bachelor’s degrees in electronic engineering and business management, and an MBA from San Jose State University, he is a regular guest lecturer at Stanford University on the topics of photovoltaics and semiconductor manufacturing.

About YES
YES (Yield Engineering Systems, Inc.) is a preferred provider of high-tech, cost-effective equipment for transforming surfaces, materials and interfaces. The company’s product lines include vacuum cure systems, chemical vapor deposition (CVD) systems, and plasma etching tools used for precise surface modification and thin-film coating of semiconductor wafers, semiconductor and MEMS devices, biosensors and medical substrates. With YES, customers ranging from startups to Fortune 100 companies can create and volume-produce products in a wide range of markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality and Life Sciences. YES is headquartered in Fremont, California, with a growing presence globally. For more information, please visit www.yieldengineering.com.

ESPOO, Finland, 28th of July 2021 – Picosun Group delivers cutting-edge Atomic Layer Deposition (ALD) technology to ams OSRAM for volume manufacturing of optical semiconductor devices.

ams OSRAM has invested in a fully automated PICOSUN® Morpher production cluster, which can deposit multiple materials on a batch of wafers even during the same process run. The flexibility and process variety of the PICOSUN® Morpher system is a key advantage, which enables volume production as well as the testing of new processes for R&D of future products.

Picosun Group and ams OSRAM have collaborated in a public funded project FLINGO (m-era.net project) to develop new ALD materials and processes to improve the characteristics of LEDs, such as efficiency and durability. The collaboration between the parties will continue after the ALD system delivery with activities to further expand the use of ALD in optoelectronic semiconductor processing.

“We have been working with Picosun since 2010 and now with this investment we can bring our collaboration to the next level. We are very excited to have the PICOSUN™ Morpher F cluster platform installed in our cleanroom”, states Dr. Sebastian Taeger, at ams OSRAM.

“The optical semiconductor market is one focus area of Picosun today. It is a fast-growing market where we have a strong presence with our tailored solutions for compound semiconductor-based devices. We have had excellent collaboration with the ams OSRAM technical team during project FLINGO and during the system specification stage. The expertise from both companies has resulted in optimized ALD solutions to boost the performance of the customer’s products.”, continues Dr. Christoph Hossbach, General Manager of Picosun Europe GmbH.

More information:
Dr. Christoph Hossbach, General Manager, Picosun Europe GmbH
Tel. +49 1522 449 49 11
Email: [email protected]
www.picosun.com

Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

About ams OSRAM
The ams-OSRAM Group, including the listed companies ams AG as parent company and OSRAM Licht AG, is a global leader in optical solutions. By adding intelligence to light and passion to innovation, we enrich people’s lives. This is what we mean by Sensing is Life.

With over 110 years of combined history, our core is defined by imagination, deep engineering expertise and the ability to provide global industrial capacity in sensor and light technologies. We create exciting innovations that enable our customers in the consumer, automotive, healthcare and industrial sectors maintain their competitive edge. We thereby drive innovation that meaningfully improves the quality of life in terms of health, safety and convenience, while reducing impact on the environment.
Our around 30,000 employees worldwide focus on innovation across sensing, illumination and visualization to make journeys safer, medical diagnosis more accurate and daily moments in communication a richer experience. Our work creates technology for breakthrough applications, which is reflected in over 15,000 patents granted and applied. Headquartered in Premstaetten/Graz (Austria) with a co-headquarter in Munich (Germany), the group achieved well over USD 5 billion combined revenues in 2020 (pro-forma).

ams AG is a listed company on the SIX Swiss Exchange (ISIN: AT0000A18XM4). OSRAM Licht AG remains a listed company on the XETRA market in Germany (ISIN: DE000LED4000).

To find out more about us on https://ams-osram.com

ams is a registered trademark of ams AG. In addition many of our products and services are registered or filed trademarks of ams Group. All other company or product names mentioned herein may be trademarks or registered trademarks of their respective owners. Information provided in this press release is accurate at time of publication and is subject to change without advance notice.
Join ams social media channels: >Twitter >LinkedIn >Facebook >YouTube
Join OSRAM social media channels: >Twitter >LinkedIn >Facebook >YouTube

Please note: The ams brand is owned by ams AG, the OSRAM brand is owned by OSRAM GmbH. ams group and OSRAM group are in the process of integration. The combination of the ams and OSRAM brand is not representing a new brand. This is a visual symbol of the two companies coming together, representing the aspiration of our future joined group.