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YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today announced that Kimihiko Matsubara has joined its senior management team and will lead its sales efforts in the Japan market, supporting the rapidly evolving semiconductor and advanced organic substrate market segments in the region.

“We welcome Matsubara-san warmly to the YES senior team. His proven management and relationship-building skills, strong record of sales growth, and deep knowledge of the country’s precision machinery and semiconductor industries will be highly valuable to YES as we build our local presence in Japan,” said Rezwan Lateef, President of YES.

Kimihiko Matsubara started his career with process equipment manufacturer Hakuto, spending three decades there in positions of increasing managerial responsibility. He subsequently held business development and senior sales management roles at TASMIT (a subsidiary of Toray, specializing in semiconductor inspection and metrology) and Faro Japan, a maker of 3D metrology and visualization systems. He earned his bachelor’s degree in Mathematics from Meijo University in Nagoya, Japan.

About YES
YES (Yield Engineering Systems, Inc.) is a preferred provider of high-tech, cost-effective equipment for transforming surfaces, materials and interfaces. The company’s product lines include vacuum cure ovens, chemical vapor deposition (CVD) systems, and plasma etching tools used for precise surface modification and thin-film coating of semiconductor wafers, semiconductor and MEMS devices, and biodevices. With YES, customers ranging from startups to Fortune 100 companies can create and volume-produce products in a wide range of markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality and Life Sciences. YES is headquartered in Fremont, California, with a growing global presence.

For more information, please visit www.yieldengineering.com.

Registration

Registration is free for SEMI Members.  Use your company email when registering for the system to recognize you as a member.  

Non-Member fee = $49

Contact Paul Trio at [email protected] with any questions.

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Do you sometimes feel like you are operating in the dark when dealing with the new challenges and opportunities in process and design?  These continue to emerge in parallel to ever shrinking semiconductor device geometries.

While Moore’s law and beyond are driving scale reduction, the industry is facing increased process sensitivity and complexity, and is redefining on-wafer defect tolerance in terms of size and complexity.  

To detect, identify, understand the source and eliminate yield limiter defectivity are key for total wafer environment contamination characterization and control and are essential for yield enhancement to ensure the success of the latest technology nodes. 

It is more imperative than ever that the semiconductor industry works together to enable improved defect detection, speciation/characterization metrology, and as needed, hybrid analytical technology for upcoming HVM readiness.

Join us for this session for speakers and discussion on tackling some of these industry challenges.

Virtual
United States

7:30 am - 7:35 am
Paul Trio
Paul Trio
Senior Manager, Strategic Initiatives
SEMI

Welcome

7:35 am - 7:55 am
Archita Sangupta
Archita Sengupta
Sr. Technologist
Intel

IDM Perspective of Defectivity with regard to Next-Gen Metrology and Analysis Tools

Intel logo
7:55 am - 7:58 am
Robert McIntosh
Moderator
Robert McIntosh
Consultant
Enviro-Energy Solutions

Introduction to the Presentations

7:58 am - 8:13 am
Hiroyuki_Hamada_Daikin
Hiroyuki Hamada
Senior Scientist
Daikin - Chemicals Division

Contamination Control for PFA

Ashwin_Rao_Daikin
Ashwin Rao
Semiconductor Marketing Manager
Daikin - Chemicals Division

8:13 am - 8:14 am

Introduction: Ashutosh Bhabhe

8:14 am - 8:29 am
Ashutosh_Bhabhe_Entegris
Ashutosh Bhabhe
Wet Etch & Cleans Applications Manager
Entegris

Metrology: (Ideally) Enabling the What, When, How, and Where of Unknown Contamination Detection and Control

8:29 am - 8:30 am

Introduction: Fuhe Li

8:30 am - 8:45 am
Fuhe Li - Air Liquide / Balazs
Fuhe Li
Director, Advanced Materials, Thin Films and Nanoparticles
Air Liquide - Balazs

Challenges in detecting nanoparticle, NVR, native oxide, and trace metals for 5 nm and beyond processes

8:45 am - 8:46 am

Introduction: Hugh Gotts

8:46 am - 9:01 am
Hugh_Gotts_Balazs
Hugh Gotts
International Fellow, Director R&D
Air Liquide - Balazs

HMW Organic Contaminants: What, Where, How?

9:01 am - 9:02 am

Introduction: Gary Van Schooneveld

9:02 am - 9:17 am
Gary_Van_Schooneveld_CTAssociates
Gary Van Schooneveld
President
CT Associates

Advance Metrology for Particle Sizing and Identification in Ultrapure Liquids

9:17 am - 9:18 am

Introduction: Ali O Altun

9:18 am - 9:35 am
Ali_O_Altun_Unisers
Ali O Altun
Co-Founder & CEO
Unisers

On-wafer detection and characterization of organic defects with Unisers

9:35 am - 10:00 am

Open Discussion

CAST FOA SCIS Standards

New challenges and opportunities in process and design continue to emerge in parallel to ever shrinking semiconductor device geometries. While Moore’s law and beyond are driving scale reduction, the industry is facing increased process sensitivity and complexity, and is redefining on-wafer defect tolerance in terms of size and complexity.  

Join us for this webinar-like session to discuss best-known methods from industry leaders

7:30 am - 10:00 am Off Add to Calendar Disabled America/Los_Angeles
Japan standards
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SEMI Japan Office
市ヶ谷 九段南4-7-15
千代田区
Tokyo
1020074
Japan

Standards

FLEXIBLE HYBRID ELECTRONICS (FHE) JAPAN TC CHAPTER MEETING


Date: Friday, January, 2022 

Time: 15:00 - 17:00 [Japan Standard Time]
via Web Conference


AGENDA

 

Standards Contact Information:

Keigo Nakajima

Coordinator, SEMI Japan

Email: [email protected] 

Phone: 81.3.3222.5863

 

NOTE:

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!

Questions? Contact your local staff coordinator: Click here

3:00 pm - 5:00 pm Off Add to Calendar 2022-01-14 15:00:00 2022-01-14 17:00:00 Flexible Hybrid Electronics (FHE) Japan TC Chapter Meeting FLEXIBLE HYBRID ELECTRONICS (FHE) JAPAN TC CHAPTER MEETING Date: Friday, January, 2022  Time: 15:00 - 17:00 [Japan Standard Time] via Web Conference AGENDA   Standards Contact Information: Keigo Nakajima Coordinator, SEMI Japan Email: [email protected]  Phone: 81.3.3222.5863   NOTE: Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! Questions? Contact your local staff coordinator: Click here SEMI Japan Office 市ヶ谷 九段南4-7-15 千代田区 Tokyo 1020074 Japan SEMI.org [email protected] Asia/Tokyo public Asia/Tokyo
Japan Standards
Highlighted content

SEMI Japan Office
九段南4-7-15
千代田区
Tokyo
1020074
Japan

Standards

TRACEABILITY JAPAN TC CHAPTER MEETING

Date: December 24, 2021

Time: 10:00-12:00 [JST]

via Web Conference

 

AGENDA

 

Standards Contact Information:

Keigo Nakajima

Coordinator, SEMI Japan

Email: [email protected] 

Phone: 81.3.3222.5863

 

NOTE:

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!

Questions? Contact your local staff coordinator: Click here

10:00 am - 12:00 pm Off Add to Calendar 2021-12-24 10:00:00 2021-12-24 12:00:00 Traceability Japan TC Chapter Meeting TRACEABILITY JAPAN TC CHAPTER MEETING Date: December 24, 2021 Time: 10:00-12:00 [JST] via Web Conference   AGENDA   Standards Contact Information: Keigo Nakajima Coordinator, SEMI Japan Email: [email protected]  Phone: 81.3.3222.5863   NOTE: Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! Questions? Contact your local staff coordinator: Click here SEMI Japan Office 九段南4-7-15 千代田区 Tokyo 1020074 Japan SEMI.org [email protected] Asia/Tokyo public Asia/Tokyo
Belgium China France Germany Ireland Italy Japan Malaysia Russia Singapore South Korea Taiwan United States Vietnam https://china.semi.org.cn/article/171 Business Executive Technical
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China

CAST EMG ESD Alliance FlexTech FOA ITL MSIG SCIS SE&A SiPAT Standards Workforce Development Off Add to Calendar 2021-09-24 00:00:00 2021-09-24 00:00:00 SEMI China Smart Mobility Webinar China SEMI.org [email protected] America/Los_Angeles public
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ESPOO, Finland, 7th of September 2021 – Picosun Group has taken into use new facilities at its production laboratory in Kirkkonummi, Finland. The Picosun Innovation Lab will be used for the company’s own research and development projects, for demo purposes and most importantly for serving the company’s global semiconductor customers operating in the 300 mm market.

The Innovation Lab hosts Picosun’s new generation tools PICOSUN® Morpher and PICOSUN® Sprinter. Morpher was launched in 2019 and it started a completely new era in Picosun products. Its adaptive and versatile nature makes it an ideal ALD solution for to the changing needs of different business verticals in the up to 200 mm wafer industries. Sprinter was launched late 2020 for the 300 mm wafer markets to meet the ever-increasing demands of semiconductor, display and IoT component manufacturing lines. It has brought single wafer film quality and uniformity for fast batch processing and met the challenges in high volume ALD manufacturing.

The Innovation Lab increases the laboratory capacity Picosun currently has on its premises significantly. The new facilities will have the ability to host tens of ALD tool modules. The facilities also support a variety of process gases including for example N2, O2, O3, Ar, H2, NH3 and NF3. Furthermore, special attention has also been paid for the best-in-class building management and safety systems.

“The opening of the new Innovation Lab reflects our role in being the pioneer in ALD and continuing the daily work in setting the standards for future innovations in the ALD sphere. The Innovation Lab has been a big investment for the company, but we see this as an essential investment to our and our customers’ future”, says Jussi Rautee, CEO of Picosun Group.

Watch the video on Picosun Innovation Lab: https://press.picosun.com/picosun-invests-in-future-with-its-innovation…

More information:
Jussi Rautee
CEO, Picosun Group
Tel: +358 50 345 4457
Email: [email protected]
www.picosun.com

About Picosun
Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

The SEMI Electronics System Design (ESD) Alliance today announced completion of the anti-piracy SEMI Server Certification Protocol (SSCP) for software license management, a year-long joint development effort led by the ESD Alliance, a SEMI Technology Community.

The SSCP, approved by development committee members Cadence, Siemens EDA and Synopsys, uniquely identifies each customer license server to assure that licenses are issued only by authorized servers to help protect against software piracy. The SCCP is now undergoing standardization and will be managed by the SEMI Standards group after its finalization as an industry standard. The committee members intend to implement the protocol in their respective license management software.

"A big thank you to Cadence, Siemens EDA, and Synopsys, our joint development association partners, for their work to push the protocol forward," said Bob Smith, executive director of the SEMI ESD Alliance. "It took a concerted effort to reach this key milestone and that push will continue as we move forward to finalizing SSCP as an industry standard. Software piracy costs industry billions of dollars per year and hurts both vendors and their customers, a problem the protocol will help mitigate."

An industry-standard protocol to combat software piracy is a growing necessity for design automation software suppliers to ensure only authorized servers are issuing licenses. Design automation software is complex and requires ongoing and significant R&D investments. Bad actors can apply server cloning techniques to access unlicensed copies of the software, putting legitimate users and software vendors at a competitive disadvantage by forcing software vendors to increase prices to support continuing investments in R&D.

"The SSCP is a significant step forward for the semiconductor industry in its efforts to stem software piracy," said Nimish Modi, senior vice president of market and business development at Cadence. "The collaboration among design automation suppliers ensures a wide-ranging and inclusive anti-piracy strategy."

"Completing the server certification protocol is a huge achievement," said Joe Sawicki, executive vice president of IC EDA for Siemens. "Congratulations to everyone who worked to establish this anti-piracy standard that protects against theft and provides a level playing field for all our users."

"Synopsys is pleased to collaborate across the design automation industry to define a method to combat piracy," said Arun Venkatachar, vice president of Synopsys central engineering. "It is critical for the industry to level the playing field for legitimate users. We are committed to working with SEMI and the industry to implement the protocol and make it an industry standard."

"Ansys applauds the anti-piracy initiative led by the SEMI ESD Alliance to develop the SSPC," said Shane Emswiler, senior vice president at Ansys. "Ansys is committed to ensuring fair access for all users and combating piracy. We are proud to stand with our peers in this effort."

To learn more about SSCP, contact the SEMI ESD Alliance at [email protected].

About SEMI
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

About the Electronic System Design Alliance
The Electronic System Design (ESD) Alliance, a SEMI Technology Community representing members in the electronic system and semiconductor design ecosystem, is a community that addresses technical, marketing, economic and legislative issues affecting the entire industry. It acts as the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global Electronics industry.

Follow the ESD Alliance
ESD Alliance Bridging the Frontier blog
Twitter: @ESDAlliance
LinkedIn
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ESPOO, Finland, 31st of August 2021 – Picosun Group strengthens its position in the 300 mm semiconductor market with its new generation ALD tool PICOSUN® Sprinter.

PICOSUN® Sprinter was first launched in December 2020 as a stand-alone module. Now also customer deliveries and installations of PICOSUN® Sprinter clusters have started.

“A Sprinter cluster consist of two Sprinter modules and a central vacuum wafer-handling robot utilizing 5 wafers handling. The set-up enables a throughput of more than 100 wafers an hour with 10nm aluminium oxide target film thickness”, explains Juhana Kostamo, VP, Industrial Business Area of Picosun Group.

“The throughput capability combined with the unique design of the tool’s reaction chamber, the record-breaking batch film quality and the fact that the tool can be fully integrated with the customers’ production line, makes PICOSUN® Sprinter the tool of choice for semiconductor, display and IoT component industries who need a future-proof tool with single wafer film quality and uniformity in fast batch processing”, Kostamo concludes.

Read more about PICOSUN® Sprinter and watch the video:
https://www.picosun.com/products/300mm-wafers/picosun-sprinter/

More information:
Juhana Kostamo
Vice President, Industrial Business Area, Picosun Group
Tel: +358 50 369 9565
Email: [email protected]
www.picosun.com

About Picosun
Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

Brooks Instrument, a leader in precision fluid measurement and control technology, has released the new GP200 Series, the first fully pressure-insensitive pressure-based mass flow controller (P-MFC) designed specifically for etch and chemical vapor deposition (CVD) processes in semiconductor manufacturing.

Mass flow controllers (MFCs) are the most important component in the gas delivery systems used to produce silicon wafers. MFCs must precisely deliver inert, corrosive and reactive gases to the process chamber, even when operating at very low vapor pressures.

The GP200 Series P-MFC operates well in high-vacuum conditions and above atmospheric pressure conditions that are intrinsic to etch and CVD processes. In comparison, conventional discrete P-MFCs can operate under high-vacuum conditions but degrade in performance and control range as the outlet pressures increase. By offering a greater operating range than conventional P-MFCs, the GP200 Series can improve etch process performance and expand the application scope to include CVD processes.

“Historically, thermal MFCs have been more heavily used in semiconductor manufacturing gas delivery systems; however, pressure-based MFCs are growing in popularity, as they provide significant advantages,” said Dr. Mohamed Saleem, Chief Technology Officer at Brooks Instrument. “We specifically designed our pressure-insensitive GP200 Series to optimize etch and CVD processes with highly precise, repeatable gas delivery.”

The GP200 Series unit features a patented architecture that overcomes the limitations of conventional P-MFCs to provide the most precise process gas delivery even when delivering low vapor pressure process gases. It includes several unique design aspects, including:
Integrated Differential Pressure Sensor: The GP200 Series uses an integrated differential pressure sensor paired with an absolute pressure sensor to compute pressure drop, instead of using two discrete pressure sensors, typically found in conventional P-MFCs. This combination reduces measurement uncertainty from calibration issues and improves the accuracy, repeatability and drift performance in semiconductor processes.

Laminar Flow Element: The GP200 Series also features a laminar flow element designed for low pressure drop, with a differential pressure sensor that is optimally ranged. This design makes it possible to accurately measure the flow of challenging low vapor pressure process gases used in etch processes, including silicon tetrachloride, boron trichloride and hexafluorobutadiene. Whereas conventional P-MFCs require high inlet pressures to operate, the high accuracy and repeatability of the GP200 Series in all operating conditions make it suitable for both standard pressure and critical low vapor pressure gases.

Downstream Valve Architecture: By positioning the control valve downstream of the flow restrictor, the GP200 Series is essentially immune to downstream pressure fluctuations as well as upstream pressure fluctuations This enables flow delivery into pressures as high as 1200 Torr.

Ultra-Fast, Highly Repeatable Transient Response: This downstream valve architecture also enables rapid shutdown and switching of recipe set points for pulsed gas delivery. Fast response times enable tighter process control, providing precise, highly repeatable gas flow delivery with matched transient response.

As the GP200 Series supports such a broad range of process conditions, it can be used as a drop-in replacement and upgrade for many traditional P-MFCs and thermal MFCs. It reduces the complexity and cost of ownership of the gas delivery system because it eliminates the need for components such as pressure regulators and transducers.

Visit experience.brooksinstrument.com/pressure-based-mass-flow-controller-gp200 to access a data sheet, explanatory videos and a white paper detailing how the GP200 Series improves accuracy and repeatability compared to discrete pressure sensors.

About Brooks Instrument
Since 1946, Brooks Instrument has been a leader in precision fluid measurement and control technology. Providing instrumentation for flow, pressure and vapor delivery, the company serves customers in the semiconductor, pharmaceutical and biopharmaceutical, fiber optics, thin film manufacturing, solar cells, LED, alternative energy, oil and gas, chemical and petrochemical industries.

With manufacturing, sales and service locations in the Americas, Europe and Asia, Brooks Instrument has the world’s largest installed base of mass flow controllers. Its broad family of products includes brands such as UNIT Instruments, Tylan, Key Instruments and Celerity.

For more information, please visit www.BrooksInstrument.com. The company is also on LinkedIn (www.linkedin.com/company/Brooks-Instrument) and YouTube (www.youtube.com/user/Brooks407).
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PENANG MALAYSIA - August 2021 - ViTrox Technologies, the world’s most trusted technology company for the semiconductor and electronic packaging industries, announces its participation in the SEMICON SEA 2021 Virtual Exhibition from 23rd to 27th August 2021.

As one of the Silver Sponsors of the SEMICON SEA 2021, ViTrox is showcasing its one-stop vision solutions, from Middle-end & Back-end Semiconductor Vision Solutions, PCBA SMT Vision Solutions, Electronic Communication Systems, to Industry 4.0 Smart Factory Solutions through the virtual platform. In addition, ViTrox is also showcasing a series of On-Demand Webinars from 23rd to 27th August 2021. Visitors are recommended to register their seats with ViTrox now at https://vitrox.com/exhibitions/sea-2021/index.php

Apart from the solutions showcase, Mr Gary Leong Chee Yeong, the Senior Director of ViTrox’s Industry 4.0 & Ecosystem Development is representing ViTrox to conduct a sharing during the “Meet The Experts” session. Mr Gary Leong is sharing the insights under the topic of “Smart Manufacturing Solutions: V-ONE for the Legacy Machines and Automated Vision Inspections (AVI) in the Semiconductor Manufacturing industries”. This session will be held on 23rd August 2021, from 4 PM to 4.30 PM. Visitors are invited to join this insightful sharing session.

Another key highlight of ViTrox virtual booth is the official launch of the 360° Virtual Tour of ViTrox Campus 2.0! Visitors may grab this opportunity to take a closer look at ViTrox Campus 2.0 and further understand about ViTrox's background. Please register now for exploring the 360° Virtual Tour through this link! >> https://vitrox.com/contact-us/virtual-tour-register.php > https://www.gevme.com/SEMICON-SEA-2021 > https://docs.google.com/forms/d/e/1FAIpQLScguSCbadSuIPX_Eir2iDv6DG9ryE-… About ViTrox Technologies
Since its inception in 2000, ViTrox is committed to providing the most innovative, advanced and cost-effective machine vision solution of excellent quality to its customers through integrating ViTrox’s technologies, their people and their strategic alliances. ViTrox is the exclusive company that offers a full spectrum of automated 2D/3D vision inspection solutions for Front-end Semiconductor, Back-end Semiconductor, PCB SMT Assembly, Advanced Robotic Vision Systems, Electronic Communication Systems, and Industry 4.0 Smart Solutions - V-ONE. ViTrox is headquartered in Penang, Malaysia, and with offices in Asia, Germany, and the United States, along with sales and support sites globally. ViTrox has more than 600 customers in over 40 countries, along with 8 overseas subsidiaries and R&D sites globally.

For more information about ViTrox’s products and services, please visit www.vitrox.com.