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ROSENHEIM, Germany, 10 July 2026 — esmo group (esmo), a leading global full-service systems integrator, developer, and supplier of advanced automation solutions, is marking its 25th anniversary in 2026 from a position of continued growth, having completed three facility expansions across Germany, China and Taiwan within a six-month period. The investments strengthen the company’s engineering, manufacturing and customer support capabilities in key semiconductor markets worldwide.

Engineering Growth Through 25 Years of Customer Trust

Today, the esmo Group employs approximately 285 people and generates annual revenue of around EUR 60 million through its two business divisions: semiconductor test solutions and special-purpose machinery.

Founded in 2001, esmo has grown from a small engineering company delivering just three manipulators in its first year to a globally recognised specialist serving customers in more than 70 countries. The company today produces more than 2,000 manipulators annually and is the world’s leading supplier in the segment. Its customer base includes leading semiconductor manufacturers such as CCTec, ADVANTEST, Infineon, Bosch, STMicroelectronics and Intel, with many customer relationships spanning more than 15 years. Notably, esmo’s very first customer remains an active customer today.

“Reaching 25 years is a significant milestone, but what matters more to us is what it represents — a track record built on engineering discipline and long-term customer relationships,” expressed Mr Andreas Rothstein, CEO of esmo AG. “The expansions we are completing this year are a natural extension of that foundation, and a clear signal of where we are headed.”

Expanding Presence Across Strategic Semiconductor Markets

As part of its latest growth phase, esmo has expanded its global footprint through three facility investments.

In Rosenheim, Germany, the company has established a new building adjacent to its existing assembly hall. The facility houses administrative functions as well as engineering and software development teams from esmo semicon. Following the building’s soft opening in November 2025, the site also hosted esmo’s 25th anniversary open house in June 2026, welcoming nearly 1,000 visitors for a behind-the-scenes look at its production and engineering capabilities, including technologies supporting advanced semiconductor test applications such as AI and high-performance computing (HPC).

In Shanghai, China, esmo has opened a new production facility featuring dedicated manufacturing space and a cleanroom environment. Focused on automated test equipment (ATE) and prober solutions, the site enhances the company’s ability to deliver precision assembly, quality assurance and local support for customers in one of the world’s largest semiconductor markets.

Meanwhile, in Zhubei, Taiwan, esmo has joined a new shared office established through an initiative led by Accuron Industrial Technologies, esmo's parent group. The facility brings together several Accuron portfolio companies, including RECIF Technologies, mechatronic systemtechnik, Trymax Semiconductor Equipment and NexGen Wafer Systems, strengthening collaboration and creating new opportunities to support customers across the semiconductor value chain in a strategically important market.

Investing in the Future of Semiconductor Test

Looking ahead, esmo is focused on advancing semiconductor handling technologies to meet the increasingly demanding requirements of AI, high-performance computing and other next-generation applications. At the same time, the company continues to expand its global service capabilities, invest in automation and digitalisation, and develop more sustainable manufacturing processes while building the next generation of engineering talent.

“The semiconductor industry is evolving faster than ever, and our customers need partners who can keep pace,” said Rothstein. “We’ve built our success on engineering excellence, reliability, and the ability to solve complex challenges. As we look to the future, we will continue to invest in our people, our technology, and our global presence to ensure that esmo remains the partner of choice for the world’s leading chipmakers.”

Verific App Store Opens with
Downloadable Examples of Parser Platform Applications

• Initial offerings include a hierarchy explorer, linter, HDL editor, signal tracer, essential tools for hardware design and verification
• Verific App Store opens July 27 as 63rd DAC begins in Long Beach, Calif.

ALAMEDA, CALIF. –– July 22, 2026 –– Verific Design Automation today announced the Verific App Store with a toolkit and downloadable example applications showcasing a variety of essential electronic design automation (EDA) point tools and solutions built using its Parser Platforms.

The Verfic App Store will open Monday, July 27, as the 63rd Design Automation Conference (DAC) convenes at the Long Beach Convention Center in Long Beach, Calif. Verific will offer in DAC Booth #1052 demonstrations of the new Verific App Store examples along with demonstrations of its SystemVerilog, Verilog, VHDL and UPF front-end Parser Platforms.

“We want to show how you can build really cool EDA products with our Platform," remarks Rob Dekker, Verific's president, founder and CTO. "In the Verific App Store, we started with a number of useful EDA point tools that are fast running, simple to license and easy to use by AI and HI (Human Intelligence) alike.”

As the leading provider of front-end platforms, Verific powers EDA with its SystemVerilog, Verilog, VHDL and UPF parser software used as the foundation for both in-house and commercially available EDA tools and flows. Applications range from synthesis and formal verification to emulation, debugging, virtual prototyping, low-power design and design-for-test tools.

Currently Available Parser Platform Apps
Example apps currently available at the Verific App Store include a hierarchy explorer, a linter, an HDL editor and a signal tracer, essential tools for hardware design and verification.

HierRTL is a Hierarchy Explorer that reports the structural hierarchy of Verilog, SystemVerilog, and VHDL designs directly from the parse tree without the need for elaboration. Engineers can visualize and navigate the hierarchical structure of their designs and understand relationships between different modules and components, making it easier to manage complex designs.

LintRTL is a Linter tool for SystemVerilog and VHDL that identifies design issues early with configurable lint rules and advanced synthesizability checks. It analyzes code for potential errors, style issues and adherence to coding standards. It helps ensure that the HDL code is clean and maintainable, reducing bugs before simulation or synthesis.

SnapRTL is an automated HDL editor used to analyze, modify and export designs while preserving the original code and formatting. It gives engineers confidence to be able to modify their designs in a specialized environment for writing and editing HDL code. SnapRTL features syntax highlighting, code completion and error detection, streamlining the coding process and improving productivity.

TraceRTL is a Signal Tracer for SystemVerilog and VHDL to improve traceability and speed debug. It monitors and analyzes signals within the design and provides insights into signal behavior during simulation, helping engineers effectively debug and optimize their designs.

Additional apps will be added in the future.

Availability and Pricing
"We will be adding more EDA point tools as we go,” says Dekker. “Currently most base products are free of charge, and we only charge a small fee for more advanced product features.”

The Verific App Store will open July 27. Tool flow developers can download the tools in the Verific Toolkit with or without being an existing Verific customer, but registration is required. New users will be asked to register with a Verific Passport account.

Basic tools are currently free, but advanced features require a monthly subscription fee. Free evaluations are available for 14 days.

The Verific App Store can be found at: https://store.verific.com/

Verific at DAC
Attendees can arrange demos or private meetings with Verific during DAC exhibit hours July 27-29 by sending email to [email protected].

DAC registration is open.

About Verific Design Automation
Verific Design Automation is the leading provider of SystemVerilog, Verilog, VHDL and UPF Parser Platforms that enable project groups worldwide to develop advanced electronic design automation (EDA) products quickly and cost effectively. Verific’s software serves as the front end to synthesis, formal verification, emulation, debugging, virtual prototyping, low-power design and design-for-test tools. With offices in Alameda, Calif., and Kolkata, India, Verific has shipped more than 80,000 copies of its software used by the EDA and semiconductor industry since it was founded in 1999.

Engage with Verific at:
Email: [email protected]
Website: www.verific.com
LinkedIn: https://www.linkedin.com/company/verific-design-automation-inc/

China Taiwan India Malaysia Singapore Vietnam Sub Fab November Training

Course Description

By the end of this course, participants will understand the scope of SubFAB and its critical role within the semiconductor manufacturing ecosystem, tracing its evolution and recognizing new trends. They will be able to identify and describe the core SubFAB systems and interpret typical facility layouts and equipment installation specifics. Learners will assess the environmental, and sustainability impacts of modern SubFABs. They will map a standard SubFAB organizational chart, typical roles, and responsibilities, and simulate incident-response workflows to reinforce operational readiness. Participants will be exposed to preventive maintenance and safety best practices to ensure reliability and compliance with regulations.

Who Should Attend

This course is designed for engineers and technicians in semiconductor manufacturing, equipment suppliers/OEM on-site service personnel, IE and MEP designers. 

Course Outline

  • Introduction & Course Logistics
    • Welcome, introductions, and platform quick start
    • Learning objectives and course flow
  • Module 1: SubFAB Fundamentals
    • Definition & scope of SubFAB
    • Historical evolution (from early fabs to today)
    • Core equipment & support systems overview
    • Typical facility layouts and installation configurations
  • Module 2: Environmental & Sustainability Considerations
    • Key environmental impacts (emissions, water/chemical use)
    • Gas abatement and PFAS management fundamentals
    • Metrics & case studies in sustainable SubFAB operation
  • Module 3: Organizational & Operational Structures
    • SubFAB org charts and stakeholder roles
    • Operational workflows (from tool install to maintenance)
    • Incident-response and escalation paths (role-play)
  • Module 4: Safety, Maintenance, & Reliability
    • Preventine- maintenance best practices
    • Safety protocols and hazard identification
    • Reliability metrics and continuous improvement loops
  • Module 5: Emerging Trends & Innovations
    • Automation, digital twins, and Industry 4.0 in SubFAB
    • Advanced materials handling and process integration
    • Open discussion: Where SubFAB will go next
  • Wrap-Up & Next Steps
    • Final Q&A and feedback collection
    • Certification requirements and further resources
    • Suggested post-course readings and SEMI standard references 

 

Instructor

Ilya Zabelinksy

Instructor Bio

 

 

 

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge. 

Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in advance and an hour before with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

Singapore

SEMI U Standards

SubFAB 101: Foundations of Semiconductor Support Facilities is a 4-hour course that covers SubFAB basics and its critical role within the semiconductor manufacturing ecosystem, including its evolution and new trends. 

  • Singapore:   1:00 PM - 5:00 PM 
Pricing
  • Members: $349
  • Non-Members: $399

* For group orders with 10+ attendees, and for Students/Veterans, discounted pricing, please contact [email protected]

1:00 pm - 5:00 pm Off Add to Calendar 2026-11-18 13:00:00 2026-11-18 17:00:00 SubFAB 101: Foundations of Semiconductor Support Facilities (Asia) SubFAB 101: Foundations of Semiconductor Support Facilities is a 4-hour course that covers SubFAB basics and its critical role within the semiconductor manufacturing ecosystem, including its evolution and new trends. Singapore:   1:00 PM - 5:00 PM PricingMembers: $349Non-Members: $399* For group orders with 10+ attendees, and for Students/Veterans, discounted pricing, please contact [email protected] Singapore SEMI.org [email protected] Asia/Singapore public Asia/Singapore Register Now
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Brno, Czech Republic - July 10, 2026

Tescan, a pioneer in electron microscopy, announces the successful completion of its full acquisition by Shimadzu Corporation. As of July 7th, Tescan officially becomes a member of the Shimadzu Group, marking an important milestone in the company’s continued growth and evolution.

This step builds on the strong business alliance established in 2024 and reflects a shared commitment to advancing scientific discoveries and industrial innovations worldwide.
 

“For Tescan customers, this new chapter brings enhanced capabilities, broader expertise, and expanded access to integrated solutions, while preserving the agility, innovation, and customer focus that define the Tescan way,” said Sirine Assaf, CRO, Tescan. 

By combining Tescan’s leadership in surface analysis and electron microscopy technologies, including SEM, FIB-SEM, and TEM, with Shimadzu’s strengths in compositional and materials analysis, customers will benefit from:
 

  • More comprehensive solutions across research, development, and production workflows

  • Deeper application support through combined expertise in materials science, life sciences, and semiconductors

  • Accelerated innovation driven by joint R&D and shared technologies

  • Access to a larger global support network and enhanced service capabilities

  • Expanded product portfolio and future integrated offerings

Importantly, Tescan remains committed to maintaining its customer-centric approach, strong technical support and responsiveness, ensuring continuity in partnerships and daily operations.

Tescan’s growth will be further supported by Shimadzu’s global presence, particularly in Asia, alongside strengthened positions in Europe and the Americas. This will allow Tescan to:
 

  • Reach new markets and customers worldwide 

  • Scale manufacturing and service capabilities

  • Enhance operational efficiency while maintaining flexibility 

At the same time, Tescan will continue to operate from its headquarters in Brno, preserving its identity, expertise, and innovation culture. 

Since its founding in 1991, Tescan has delivered over 4,000 electron microscopes across more than 80 countries, supporting customers in both research and industrial environments. 

This acquisition reinforces Tescan’s long-term strategy to expand its technological leadership and deliver higher-value solutions, ensuring customers remain at the center of its development. 

The successful collaboration between Tescan and Shimadzu has already been demonstrated through the joint “Shimadzu by Tescan” SEM product line introduced in Japan. 

Building on this strong foundation, the integration marks a natural next step in deepening cooperation across technologies and markets. As part of this evolution, Tescan will adopt a new endorsed brand identity, “Tescan, A Shimadzu Company,” across its portfolio and communications. This reflects both the strength of the combined organizations and Tescan’s continued commitment to delivering innovative, customer-focused solutions under a globally recognized framework.

This acquisition is in fully synergy with Tescan and Shimadzu strategic plans and it makrs an acceleration of what Tescan already does best: delivering high-performance systems, application-driven innovation, and close collaboration with customers.

Tescan develops and manufactures advanced electron microscopy solutions for materials science, life sciences, semiconductor research, industrial R&D, and quality control. With a focus on imaging performance, automation, usability, and long-term collaboration, Tescan helps researchers see the invisible and accelerate discovery through reliable, future-ready microscopy workflows.

China Japan Taiwan South Korea India Malaysia Singapore Vietnam From Wafer to Chip Nov Asia Training

Course Description 

This course provides a comprehensive introduction to semiconductor manufacturing, guiding participants through the complete journey from silicon fundamentals to chip fabrication and packaging. Designed for professionals new to the semiconductor industry, the course explains key concepts, terminology, devices, and manufacturing processes used in modern fabs. 

This course is divided into four modules, enabling a progressive learning experience that builds from fundamentals to manufacturing execution. Participants will gain a clear understanding of how chips are made, the role of transistors, and the steps involved in front-end manufacturing, followed by back-end assembly and packaging processes. The course also introduces the broader semiconductor ecosystem, including supply chain players, helping learners connect technical fundamentals with real-world manufacturing practices. 

Who Should Attend

This course is designed for sales and marketing professionals, as well as new employees, students, and anyone interested in gaining a knowledge about semiconductor manufacturing.   

Learning Objectives

Upon completion of the course, participants should be able to:

  • Explain fundamental semiconductor concepts, including silicon materials, doping, PN junctions, and basic device behavior. 
  • Identify and correctly use common semiconductor manufacturing terminology.
  • Outline the key steps involved in front-end wafer fabrication, from bare silicon to patterned wafers.
  • Summarize back-end manufacturing processes, including assembly, packaging, and testing.

Topics Included

  • Module 1: Semiconductor Fundamentals

    Introduces semiconductor basics, silicon materials, doping PN junctions, and core device concepts, building a foundation for understanding how electronic devices function.

  • Module 2: Semiconductor Terminologies and Manufacturing Context

    Covers essential semiconductor terminology, cleanroom concepts, supply chain players, process nodes, and packaging to help learners navigate manufacturing discussions with confidence.

  • Module 3: Front-end and Back-end Semiconductor Manufacturing

    Provides an overview of the key steps involved in front-end wafer fabrication and back-end assembly, packaging, and testing processes.

  • Module 4: Transistors and Their Operation

    Explains different types of transistors and their working principles, showing how transistors function as switches and amplifiers inside integrated circuits. 

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge. 

Can't find the training link on the day of the training? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders 24 hours in advance and 1 hour before, with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

 

Mayura Padmanabhan
Program Manager
SEMI

 

Singapore

SEMI U

Strengthen your knowledge and skills by learning about the journey from silicon fundamentals to chip fabrication and packaging. 

  • Singapore: 8:00 am - 12:00 pm 
  • San Francisco: 5:00 pm - 9:00 pm
Pricing                     
  • Members:  $199
  • Non-Members:  $249


Any questions, please contact [email protected]

8:00 am - 12:00 pm Off Add to Calendar Disabled Asia/Singapore Register Now
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Brooks Instrument Launches Ultra-Compact, High-Performance Mass Flow Controller

HATFIELD, Pa. (USA), June 18, 2026 — Brooks Instrument, a world leader in precision fluid measurement and control technology, announced the global launch of its new ultra-compact AMF Series™ Advanced Mass Flow Controller. About the size of a standard Post-it® Note pad, it has the smallest footprint of any mass flow controller (MFC) in its performance class.

Combining precise gas flow control, fast response, industry-leading 1000:1 turndown capability and advanced diagnostics, the AMF Series offers equipment manufacturers and end users more operating flexibility and improved reliability and process control without the limitations of traditional compact MFCs.

“Equipment designers historically have had to choose between compact dimensions and advanced capabilities,” said Steve Kannengieszer, Global Marketing Director. “With the AMF Series, we’re changing that trade-off. Customers can now integrate high-performance flow control and predictive diagnostics into the most space-constrained systems without sacrificing accuracy, reliability or process insight.”

Advanced Features in a Compact Footprint

As equipment size across industries continues to shrink while growing in complexity and throughput, maintaining stable and precise gas flow becomes increasingly critical. The AMF Series was developed specifically to address these challenges.

With a 1-inch x 3-inch x 3-inch footprint, the MFC fits easily inside compact gas cabinets. Despite its small size, the highly accurate AMF Series features advanced capabilities, including integrated EtherNet/IP™ digital communications and onboard diagnostics for predictive maintenance.

By providing actionable diagnostic data alongside accurate flow measurement and control, the AMF Series helps users identify potential issues before they impact production, reducing unplanned downtime and improving overall equipment effectiveness.

Easier Operation and More Uptime

In addition, the AMF Series was designed to maximize uptime and simplify operation with a universal USB-C service port and embedded web-based interface that streamlines in-situ commissioning and troubleshooting. Industry-leading long-term sensor stability helps reduce maintenance requirements and eliminate periodic recipe adjustments and recalibrations.

The AMF Series also supports multi-gas configurability and simplified ordering bundles, helping OEMs reduce system complexity while streamlining product selection and integration.

Wide Range of Use

The AMF Series is especially suitable for pilot-scale applications where precise low-flow gas control and equipment miniaturization are critical, including:
• Bioprocessing and laboratory-scale bioreactors
• Thin film coating and vacuum deposition systems
• Carbon capture, utilization, and storage (CCUS)
• Hydrogen and energy transition technologies
• Analytical instrumentation
• University and research laboratories
• Industrial gas processing

Demand for Smaller Instrumentation

“Across biotechnology, we’re seeing a shift toward smaller-scale development platforms that demand greater flexibility and precision from process instrumentation,” said Joe Sipka, Business Development Director, Biotechnology. “The AMF Series was developed for micro-dosing and pilot-scale systems and delivers a wealth of digital insights—including health indicators, reliability metrics and pedigree—that enable greater automation and support a path to prescriptive maintenance. Many of these same trends are emerging in adjacent applications, such as industrial coatings, where engineers are being asked to do more with increasingly compact systems. Developed directly from conversations with our customers, the AMF Series delivers the precise low-flow control, wide operating range and reliability needed to accelerate innovation while maximizing valuable equipment space.”

For more information about the AMF Series Advanced Mass Flow Controller, visit www.BrooksInstrument.com/product/AMF.

About Brooks Instrument:
Since 1946, Brooks Instrument has been a leader in precision fluid measurement and control technology. Providing instrumentation for flow, pressure and vapor delivery, the company serves customers in semiconductor and high-tech manufacturing, laboratories and other processes and industries. With manufacturing, sales and service locations in the Americas, Europe and Asia, Brooks Instrument has the world’s largest installed base of mass flow controllers.

For more information, please visit www.BrooksInstrument.com. The company is also on LinkedIn (www.linkedin.com/company/Brooks-Instrument) and YouTube (www.youtube.com/user/Brooks407).

RENA Technologies GmbH, a long-standing and experienced manufacturer of wet processing solutions for the semiconductor, advanced packaging, and solar industries, has been awarded a multi-million Euro order by a leading European semiconductor manufacturer for a specialized cleaning application designed for advanced substrates.

The solution is based on a high-performance batch wet processing platform and has been specifically engineered to deliver ultra-clean and highly efficient processing of demanding substrates. By combining advanced process control with a scalable batch architecture, the system ensures outstanding process stability, repeatability, and optimized throughput.

The customer’s decision underscores the technological strength and competitiveness of RENA’s wet processing solutions. Particularly when handling complex substrate materials, the application provides significant advantages in quality assurance, process control, and overall production efficiency. The mature cleanroom capabilities, excellent process control, and high- volume automation solutions of RENA add up to the perfect fit for the customer’s needs.

With this order, RENA further strengthens its position in the European semiconductor market and reinforces its commitment to delivering innovative, locally supported solutions to key industry players.

“Our success in securing this project highlights the growing demand for advanced wet processing technologies in Europe,” said Peter Schneidewind, CEO of RENA Technologies GmbH. “With more than 80 glass treatment tools in production worldwide - including cutting etch TGV/advanced packaging applications - RENA´s sophisticated technological solutions prove again in this new application for specialized semiconductor substrates.”

ESG progress, industry-first sustainability leadership and long-term governance goals

Rolla, Mo. — June 2, 2026 — Brewer Science, a global leader in developing and manufacturing next-generation materials and technologies for the semiconductor industry, today released its 2026 Impact Report, detailing continued progress across environmental stewardship, people-first initiatives, community engagement, and collaborative innovation. Additionally, the company announced it has earned GreenCircle Certified Zero Waste to Landfill certification for the eleventh consecutive year, remaining the first and only company in the semiconductor and microelectronics industry to achieve this designation.

Explore Brewer Science’s 2026 Impact Report

“The consistency matters,” said Matthew Beard, Executive Director of Strategic Planning, Management Systems, and Sustainability at Brewer Science. “Eleven consecutive years of Zero Waste to Landfill certification demonstrates our commitment to improving our processes, finding more innovative ways to reduce, reuse, and recycle our waste, thus leading to more sustainable business operations and having a positive impact on our supply chain.”

Environmental leadership rooted in verification and results

The 2026 Impact Report highlights continued momentum toward Brewer Science’s climate and waste-reduction goals, including:
• More than 631 tons of material diverted from landfills over the past decade
• 56% of generated waste reused or recycled during the most recent reporting period
• Over 75% of hazardous waste volume diverted annually to reuse applications
• 100% renewable energy consumption achieved annually
• 5% reduction in Scope 3 greenhouse gas emissions year over year
• Continued progress toward reducing Scope 1 and Scope 2 emissions by 80% by 2030 (from a 2018 baseline) and achieving net-zero carbon emissions by 2050

Brewer Science’s Zero Waste to Landfill certification verifies that 100% of waste leaving company facilities is diverted through approved methods such as reuse, recycling, composting, or source reduction. GreenCircle Certified’s program is widely regarded as one of the most rigorous third-party validations of waste diversion claims.

People, community, and industry impact

Beyond environmental performance, the Impact Report details how Brewer Science’s sustainability commitments extend to its workforce, communities, and industry partnerships:
• Named a Top Workplace in the Manufacturing Industry for the fifth consecutive year
• Employee-owners volunteered more than 3,200 hours to 129 organizations
• Supported STEM education, early childhood education, and workforce development initiatives across local and national communities
• Continued leadership as a founding member of the Semiconductor Climate Consortium, collaborating with peers to reduce emissions across the global semiconductor supply chain
• Ongoing innovation in PFAS free materials development, aligning product performance with environmental responsibility

A platform for collaboration and accountability
The 2026 Impact Report also highlights Brewer Science’s Sustainability Outreach Program, which provides tools and education for employees, customers, suppliers, and community partners to drive meaningful, scalable environmental action.

“Zero waste is not a finish line, it’s a responsibility we share,” Beard added. “We encourage our partners across the supply chain to align around verified sustainability standards and measurable impact.”

The full 2026 Impact Report is available on Brewer Science’s Going Green page at:
www.brewerscience.com/going-green

About Brewer Science
Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that enable cutting-edge technology. Since 1981, the company has expanded its technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to support microdevices and industrial monitoring solutions. Brewer Science’s relationship-focused approach ensures critical outcomes for its partners worldwide. Headquartered in Rolla, Missouri, Brewer Science operates globally. Learn more at www.brewerscience.com.

About GreenCircle Certified, LLC
GreenCircle Certified, LLC provides independent, third-party certification of environmental claims to ensure transparency and credibility in the marketplace. Since 2009, GreenCircle Certified has helped organizations validate sustainability performance through rigorous evaluation. Its certifications, including Zero Waste to Landfill, are accredited by the ANSI National Accreditation Board (ANAB). Learn more at www.greencirclecertified.com.

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Belgium China France Germany India Ireland Italy Japan Malaysia Singapore South Korea Taiwan United States Vietnam Download the white paper Cost Benefit Calc cropped for events page Business Technical Training
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SEMI
United States

9:00 am - 9:15 pm
Peilun Sun headshot
Peilun Sun
Consortium Manager
SEMI

Setting the Stage: Industry Drivers & SCC Initiative Context

• Semiconductor Industry Decarbonization Challenges
• The Need for Quantified Business Cases
• SCC Initiative Background & Development Journey
• Vision for Industry Adoption & Collaboration

9:16 am - 9:34 am
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Ben Gross
Director DTMS - Sustainability
Applied Materials

SCC Cost-Benefit Calculator Overview & Walkthrough

• Tool Architecture & Methodology
• Key Inputs & Assumptions
• Understanding the Outputs & Metrics
• Live Demonstration & Example Scenario
• Current Limitations & Future Development Opportunities

9:36 am - 9:50 am
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Jeff Rudnik
Director of Environmental Sustainability & Net Zero
ASM

Industry Use Cases & Practical Applications

• Evaluating Decarbonization Projects
• Comparing Alternative Mitigation Strategies
• Supporting Internal Investment Decisions
• Lessons Learned from Early Applications
• Opportunities for Industry Collaboration

9:51 am - 10:00 am

Open Discussion & Q&A

• Audience Questions
• Feedback & Enhancement Opportunities
• Next Steps & SCC Engagement Opportunity

Smart MFG Sustainability

The semiconductor industry is under increasing pressure to decarbonize its operations, particularly with regard to Scope 1 emissions — direct greenhouse gas emissions (GHG) from owned or controlled sources. Yet many companies face a persistent challenge: how to make a clear, consistent, and financially credible case for emissions reduction investments. To help address this need, the Semiconductor Climate Consortium (SCC) has developed a Cost-Benefit Calculator — a simplified and flexible tool that offers a structured starting point for evaluating carbon emissions reduction projects. The calculator enables users to estimate the Net Present Cost (NPC) per ton of CO₂ equivalent emissions reduction, helping to translate environmental impact into business-relevant terms.

Join SEMI's Semiconductor Climate Consortium (SCC) Scope 1 Working Group and document authors for a webinar discussing their journey creating the Cost-Benefit Calculator and outlining the use cases for this tool.  The Cost-Benefit Calculator is a functional spreadsheet with built in report creation tools. For business managers who need to calculate emissions for Scope 1.

SCC members can download the Cost Benefit Calculator Report here.

9:00 am - 10:00 am Off Add to Calendar 2026-06-16 09:00:00 2026-06-16 10:00:00 SCC: Cost Benefit Calculator Webinar The semiconductor industry is under increasing pressure to decarbonize its operations, particularly with regard to Scope 1 emissions — direct greenhouse gas emissions (GHG) from owned or controlled sources. Yet many companies face a persistent challenge: how to make a clear, consistent, and financially credible case for emissions reduction investments. To help address this need, the Semiconductor Climate Consortium (SCC) has developed a Cost-Benefit Calculator — a simplified and flexible tool that offers a structured starting point for evaluating carbon emissions reduction projects. The calculator enables users to estimate the Net Present Cost (NPC) per ton of CO₂ equivalent emissions reduction, helping to translate environmental impact into business-relevant terms.Join SEMI's Semiconductor Climate Consortium (SCC) Scope 1 Working Group and document authors for a webinar discussing their journey creating the Cost-Benefit Calculator and outlining the use cases for this tool.  The Cost-Benefit Calculator is a functional spreadsheet with built in report creation tools. For business managers who need to calculate emissions for Scope 1.SCC members can download the Cost Benefit Calculator Report here. SEMI United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Register Today!
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Semiconductor industry leader takes the helm to accelerate Beneq’s next phase of growth in atomic layer deposition

Espoo, Finland, 8 May, 2026 – Beneq Oy, the home of atomic layer deposition (ALD), today announced the appointment of Dr. Jason Harrison as Chief Executive Officer. Dr. Harrison succeeds Dr. Tommi Vainio and will lead Beneq into its next phase of growth across semiconductor, optical, and emerging technology markets.

A Strategic Leadership Transition
Beneq enters its next phase of growth from a position of strong commercial momentum. Recent milestones include the qualification of the Beneq Transform® cluster tool for volume production of GaN power and RF filter devices; the introduction of Beneq Transmute™ and Beneq Transform® XP, both engineered for high-volume manufacturing (HVM) of specialty semiconductors; growing adoption of the P-Series for coating critical chamber parts in advanced node devices; and selection of the C2R™ for AR waveguide production in next-generation XR optics.

Against this backdrop, the Board of Directors has determined that the time is right to align executive leadership with the company's evolving strategic priorities. As part of this transition, Dr. Tommi Vainio has decided to step down as CEO to pursue other opportunities. The Board of Directors extends its sincere thanks to Tommi, whose leadership advanced Beneq's technology platform, strengthened its market position in thin film deposition, and guided the company through important stages of its development.

A Proven Leader for a Scaling ALD Business
Dr. Harrison brings extensive global experience across the semiconductor and advanced technology sectors. He holds a Ph.D. in Quantum Chemistry and has built a distinguished career spanning device manufacturing, process development, and equipment solutions, with senior leadership roles at Intel, Lam Research, Veeco, and Applied Materials covering research and development, new product introduction, global account management, and business unit leadership. This combination of technical depth and commercial acumen positions him to scale Beneq’s commercial execution and growth across its global customer base.

Looking Ahead
Under Jason’s leadership, Beneq will accelerate strategic execution across its expanding portfolio, deepen customer engagement across North America, Asia, and Europe, and continue investing in innovative ALD solutions from R&D to HVM to deliver long-term value to customers, employees, and stakeholders.

Dr. Patrick Rabinzohn, Member of the Board of Directors, Beneq, said: “Jason brings the technical depth, the business and account management experience, and the global perspective Beneq needs at this stage of its growth. His academic background and compelling track record across the semiconductor industry positions Jason to build on the momentum the company generated especially.”

Dr. Jason Harrison, Chief Executive Officer, Beneq, added: “Beneq has a strong technology foundation, a talented team, and a growing pipeline of customers in some of the most important markets in semiconductors and optics. I look forward to working with the team to accelerate execution and deliver on the trust our customers place in us.”

About Beneq
Beneq pioneered industrial production of Atomic Layer Deposition (ALD) with the introduction of the first commercial ALD equipment in 1984. Today, Beneq advances ALD adoption and validation with a portfolio that includes the Beneq Transform®, Transform XP, Transform 300, and Transmute™ for specialty semiconductor device fabrication; TFS 200 and TFS 500 for R&D; the P400A, P800, and P1500 batch systems for coating critical semiconductor chamber components and complex part geometries; and spatial ALD platforms such as the C2R™ and roll-to-roll processing equipment. Headquartered in Espoo, Finland, Beneq enables ALD integration from lab to fab for semiconductors, optics, and functional coatings.

Press Contacts
Lie Luo
Head of Marketing
[email protected]