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OXFORD INSTRUMENTS PROVIDES COHERENT WITH STATE-OF-THE-ART, FULLY AUTOMATED PROCESSING EQUIPMENT, FOR 6” INP WAFER MANUFACTURING, ENABLING NEXT GENERATION AI APPLICATIONS

Oxford Instruments (OXIG), a leading provider of advanced plasma processing solutions for the compound semiconductor industry, announces the key role it is playing to support the industry’s first fully automated 6-inch indium phosphide (InP) wafer fabrication capability for photonic devices, led by Coherent Corp. (NYSE: COHR), a global leader in compound semiconductors and high-performance optical networking solutions.

Oxford Instruments’ cutting-edge plasma processing equipment is central to Coherent’s groundbreaking achievement of ramping up 6-inch InP fabs in Sherman, Texas, and Järfälla, Sweden. These fabs will play a pivotal role in driving advancements in AI datacentre, telecommunications, and sensing applications. Coherent’s transition to 6-inch wafers is set to deliver significant benefits, including a substantial increase in capacity, lower die cost and more than four times the number of devices per wafer.

Oxford Instruments has supplied fully automated, high-throughput 6-inch InP processing equipment, enabling Coherent to achieve these remarkable productivity gains. This advanced equipment is designed to support the transition from 800G to 1.6T products, a key requirement to meet the growing demands of AI interconnects and optical communications.

“We have been the leading supplier of InP plasma etch equipment to the datacom market, and Coherent, for many years. Our technology, with the quality, throughput and reliability that we have developed alongside excellent service, is ideally positioned to support the current device demand inflection we are seeing with the release of generative AI applications. We are delighted to be partnering with Coherent during this exciting period of market expansion and look forward to continuing to develop and release innovative and valuable plasma processing solutions.” Matt Kelly, Managing Director, Oxford Instruments Plasma Technology.

"Coherent’s move to 6-inch InP wafer fabrication marks a transformative milestone for the industry. Oxford Instruments’ expertise in plasma processing has been essential in enabling our Sherman and Järfälla fabs to reach world-class performance,” said Dr. Beck Mason, Executive Vice President – Semiconductor Devices at Coherent. “Together, we are advancing InP technology to support faster networks, greater efficiency, and the new applications that will define the future of connectivity."

The joint efforts of Oxford Instruments and Coherent have culminated in a manufacturing platform that sets the stage for the next generation of InP optoelectronic devices. These devices are critical enablers for applications ranging from AI datacentres and datacom transceivers to advanced sensing in consumer electronics and automotive technologies.

China https://www.semi.org.cn/semiconchina/mail/251017/251017.html SIIAS2 Business Executive Technical
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Nijmegen, October 20, 2025 – Chip Integration Technology Center (CITC) will become part of TNO. This strategic move marks a significant step toward ensuring the long-term continuity and stability of CITC’s research and operations. The integration emphasizes TNO’s ambition to take a leading position in the innovation of chip packaging technologies and strengthen the regional semiconductor ecosystem in Nijmegen.

“In the coming years, TNO aims to play a key role in the development of advanced chip packaging in the Netherlands,” says Arnaud de Jong, director of High Tech Industry at TNO. “By integrating CITC into TNO, we can intensify and expand our research efforts. We also contribute to the further development of Lifeport in Nijmegen as a strong, future-proof semiconductor ecosystem.” With the investment in CITC, TNO connects chip technology activities between Nijmegen and other semiconductor hubs such as Eindhoven.

Advanced chip packaging
CITC was founded in 2019 by TNO and Delft University of Technology (TU Delft), among others, as an independent innovation center for advanced chip packaging technology. Within an ecosystem of companies, research institutions and educational organizations, CITC has developed into a broad R&D hub that collaborates on technological breakthroughs in advanced chip packaging.

“CITC’s integration into TNO marks a noteworthy moment for CITC. This step underscores our shared vision for the future of chip integration and packaging technology,” says Jeroen van den Brand, general manager of CITC in Nijmegen. “This provides room for growth, accelerates innovation, and strengthens CITC’s international position as a center of expertise for chip packaging.”

Strategic choice for Nijmegen
CITC’s integration into TNO will formally take effect on January 1, 2026. CITC will become part of TNO’s High Tech Industry business unit and will remain located at the Noviotech Campus in Nijmegen. Toni Versluijs, chairman of the CITC Supervisory Board: “CITC continues on its current course. For the Supervisory Board, it is essential that, with TNO’s ambition and investment, we secure continuation of the CITC activities, while building on the existing talent and technology and give CITC room to grow further.”

Lucas van Vliet, member of the CITC Supervisory Board on behalf of TU Delft: “The collaboration between TU Delft and TNO within CITC will change form as of January 1 but remains as strong as ever. TU Delft believes in the importance and growth potential of chip packaging and sees incorporating CITC into a strong organization like TNO as an opportunity to further accelerate innovation in chip technology.”

- ENDS -

About CITC
CITC is a non-profit, joint innovation center specializing in heterogeneous integration and advanced chip packaging technology. With the aim of bridging the gap between academia and industry, CITC has created an effective ecosystem where companies, research and educational institutions collaborate. CITC was founded in 2019 with strategic partners TNO and Delft University of Technology and is supported by the province of Gelderland and Nijmegen municipality. Located on Noviotech Campus Nijmegen, CITC is perfectly situated in the heart of the Dutch semiconductor industry.
www.citc.org

About TNO
TNO is the largest independent research and technology organization in the Netherlands and one of the largest in the EU. We innovate, investigate, and orchestrate, collaborating closely with governments, universities and the private sector. We inform government on policies and empower evidence-based decision-making through rigorous investigations, cutting-edge scientific insights, and reliable measurements. By building national and international consortia and ecosystems, we drive technological and methodological breakthroughs that help to realise a secure, sustainable, healthy, and digital society, and strengthen the earning power of the Dutch economy.
www.tno.nl/en/

Contact
Christian Ketelaars, Communications Manager
E [email protected]
M +31 (0)6 48 15 42 92

Breker Donates Advanced Test Suite Components to RISC-V International for Use in Future Compliance Activities

• Donation includes open-source system integrity tests for core and SoC certification
• Unique Breker tests complements existing test sets
• Breker’s RISC-V SystemVIP will be demonstrated at booth #P4 during RISC-V Summit North America 2025

SAN JOSE, CALIF. –– October 16, 2025––Breker Verification Systems today announced a donation to RISC-V International of a subset of its RISC-V advanced test suite developed through its work with more than 20 RISC-V core producers.

The donation is designed to be complementary to the existing Architectural Compliance Test (ACT) and ongoing ISA compliance activities, consisting of unique tests not available from other sources.

Breker provides test suites for the complete verification of RISC-V cores and SoCs from detailed microarchitectural analysis to advanced system integrity validation. The radonation will consist of a subset of these tests to target ISA compliance. The test donation will cover both core and SoC certification and will include, but is not limited to, coherency, hypervisor, vectors, advanced interrupt architecture, IOMMU and other scenarios. Each component is designed to complement existing tests.

“Breker is now working with over 20 commercial entities and other organizations to verify their RISC-V cores, providing us with unique experience of the myriad of unusual verification issues inherent in these processors,” says David Kelf, Breker’s CEO. “We are giving back to the RISC-V community by providing a subset of these tests, open source, that can target ISA compliance and for other purposes.”

The announcement of the donation coincides with the RISC-V Summit North America Tuesday, October 21, through Thursday, October 23, at the Santa Clara Convention Center in Santa Clara, Calif. As a Platinum Sponsor, Breker will exhibit in Booth #P4 and offer five presentations as part of the RISC-V Summit program.

“At RISC-V International, we greatly value the expertise of the Breker team and the contributions they have made to ongoing ISA compliance work,” remarks Andrea Gallo, RISC-V International’s CEO. “I am looking forward to Breker’s donation and the impact it can have in complementing and extending our existing ACT test suites.”

Breker’s donation provides alignment with RISC-V International programs. This will provide value to the company’s customers, as well as the RISC-V designer community, by aligning Breker’s full RISC-V verification test suite with RISC-V test developments.

In addition to existing test suites and generators, which are focused on random instruction generation for instruction set architecture testing, with SystemVIPs, Breker has been able to significantly extend testing to advanced system-level integrity. Using test suite synthesis technology, Breker is able to provide a high degree of coverage by driving cross functional stress verification and unpredictable corner case discovery. The donation will include tests generated using test suite synthesis.

David Kelf and Adnan Hamid, Breker’s Executive President and CTO, were elected Chairperson of the Requirements Working Group and Vice-Chairperson of the Test Plan Working Group, respectively, in the RISC-V International Certification Steering Committee.

Breker at RISC-V Summit North America 2025
Breker will demonstrate its RISC-V CoreAssurance and SoCReady SystemVIPs and Trek Test Suite Synthesis solutions at RISC-V Summit North America, Tuesday, October 21 through Thursday, October 23, at the Santa Clara Convention Center.

Presentations featuring Breker executives include:
Member Day: “Framework for RISCV Certification—Software, Hardware and Systems”
Nambi Ju, Lyle Technologies, LLP
Tuesday at 4 p.m. in Grand Ballroom H (Level 1)

Demo: “RISC-V AIA Expanding Interrupts: Applications, Implementation and Verification”
Adnan Hamid
Wednesday at 1 p.m.
Exhibit Hall A, Demo Theater

“RISC-V System Level Certification from Verification Foundations”
Adnan Hamid
Wednesday at 3:15 p.m.
Theater (Level 2)

Lightning Round: “Leveraging AI to understand the RISC-V ISA Specification”
Dave Kelf and Nambi Ju
Wednesday at 4:15 p.m.

“Unleashing ML Processing Power Through RISC-V Vectors: Applications, Implementation and Verification”
Brian Baker, Solutions Architect
Thursday at 2:35 p.m.
Grand Ballroom G (Level 1)

To arrange a demonstration or private meeting, send email to [email protected].

About Breker Verification Systems
Breker Verification Systems solves complex semiconductor challenges across the functional verification process from streamlining UVM-based testbench composition to execution for IP block verification, significantly enhancing SoC integration and firmware verification with automated solutions that provide test content portability and reuse. Breker’s solutions include a SystemVIP library of scenarios for RISC-V and Arm, core and SoC testing, coherency, security and other critical areas. Breker solutions easily layer into existing environments and operate across simulation, emulation, prototyping, and post-silicon execution platforms. Its Trek family is production-proven at leading semiconductor companies worldwide and enables design managers and verification engineers to realize measurable productivity gains, speed coverage closure and easy verification knowledge reuse. As a leader in the development of the Accellera Portable Stimulus Standard (PSS), privately held Breker has a reputation for dramatically reducing verification schedules in advanced development environments. Case studies that feature Analog Devices, Broadcom, IBM and other companies leveraging Breker’s solutions are available on the Breker website.

Engage with Breker at:
Website: www.brekersystems.com
Twitter: @BrekerSystems
LinkedIn: https://www.linkedin.com/company/breker-verification-systems/
Facebook: https://www.facebook.com/BrekerSystems/

TrekSoC, TrekSoC-Si, RISC-V CoreAssurance SystemVIP and RISC-V SoCReady SystemVIP are registered trademarks of Breker Verification Systems. Breker Verification Systems acknowledges trademarks or registered trademarks of other organizations for their respective products.

FOR IMMEDIATE RELEASE

Media contact: M. Guilbert, [email protected]

RECIF Technologies Adopts Agileo Automation’s Combined Speech Scenario and E84 PIO Box Solution to Test E84 and SECS/GEM SEMI Standard Compliance of Wafer Handling and Tracking Equipment

Global French manufacturer of automated handling equipment, wafer sorters, and equipment front-end modules (EFEMs) saves significant fab equipment integration time and enhances customer satisfaction

PHOENIX, October 7, 2025 – Agileo Automation, a leading provider of control and connectivity solutions for global semiconductor manufacturing equipment, today announced at Booth #877 at SEMICON West 2025 that RECIF Technologies has adopted its combined Speech Scenario and E84 PIO Box solution to test its wafer handling and tracking equipment for E84 and SECS/GEM compliance. The global company headquartered in Toulouse Blagnac, France, which specializes in the design, manufacturing, and installation of automated equipment for semiconductor wafer handling, needed a fast and effective solution to validate the compliance of its products with SEMI’s E84 and SECS/GEM standards before they are shipped and implemented at customers’ semiconductor manufacturing sites all over the world.

Speech Scenario is a software that emulates the fab host to validate SECS/GEM tool scenarios before shipping brand-new production equipment to fabs. The E84 PIO Box is a compact and lightweight device that serves as an interface between Speech Scenario and E84 passive equipment. Used together, these products allow RECIF Technologies to generate complete test reports that can be communicated to its customers, ensure fast detection of non-compliance and errors to avoid downtime, as well as quick and reliable SEMI E84 and SECS/GEM compliance testing, especially in the management of complex cases. The company has now better control over host-sorter interactions, with customizable scenarios related to automatic carrier delivery defined in the E84 standards. With Speech Scenario, RECIF teams can more effectively replicate customer use cases when resolving anomalies.

“We were using less flexible software where automation messages were not easily modifiable and old emulation technology for validation of only the PIO part of the E84 standard, which meant that more complex cases and host-sorter interactions had to be tested and adapted in the field during machine integration at customer sites,” explains Thomas Brillouet, research and development director for RECIF Technologies SAS. “We selected Agileo’s all-in-one Speech Scenario and E84 PIO Box solution because we believe that it is the most efficient and competitive product currently on the market. The flexibility and time savings we have garnered since using Agileo’s solution has translated into enhanced overall customer satisfaction for our company.”

“Over the past 40 years, RECIF Technologies has built a solid reputation as an innovative industry leader in advanced semiconductor equipment manufacturing and as an early adopter of SEMI standards,” adds Marc Engel, CEO of Agileo Automation. “Agileo Automation, whose origins are closely tied to RECIF Technologies, benefits from a strong cultural and technical proximity with the company. We are proud to contribute to RECIF Technologies’ success, both as a technology partner and by supporting them in demonstrating quality and reliability to their customers.”

- ends -

About Agileo Automation
Since its inception in 2010 in Poitiers, France, Agileo Automation has empowered global semiconductor equipment manufacturers to optimize their production machines with control, communication, data acquisition, and testing solutions, enabling their deployment in large-scale fabs worldwide. At the heart of Industry 4.0, Agileo’s A²ECF-SEMI framework provides a robust foundation for developing equipment controller software, leveraging the SEMI SECS/GEM and GEM300 standard suites. As a member of SEMI and the OPC Foundation, Agileo Automation is a key contributor to the development and integration of industry standards such as SEMI and OPC UA. For more information, please visit our web site or follow us on LinkedIn.

About RECIF Technologies
RECIF Technologies, headquartered in Toulouse-Blagnac, France, has been providing advanced robotic solutions for semiconductor wafer handling since 1985. The company designs and manufactures reliable sorters, EFEMs, and compact handling tools that help leading semiconductor manufacturers worldwide improve productivity, ensure reliability, and reduce total cost of ownership. As a member of SEMI and the Aeneas association, RECIF Technologies actively contributes to the industry standards and collaborative projects shaping the future of the semiconductor industry. For more information, please visit our web site or follow us on LinkedIn.

PDF Solutions Secures Landmark Contract with Global IDM Customer
Large 2025 Contract Validates High-Volume Manufacturing Strategy

PDF Solutions, Inc. (Nasdaq: PDFS) today announced a landmark contract signing: a significant multi-year agreement to expand a prior contract and deploy eProbe® tools, Characterization Vehicle® infrastructure, and associated Exensio® analytics software across multiple high-volume manufacturing facilities of a major global semiconductor manufacturer.

Breakthrough Technology Scales to Mass Production

PDF Solutions' eProbe technology delivers contactless testing of 3D semiconductor structures using electron beam, optimized for each wafer's specific design characteristics. This agreement encompasses multiple eProbe systems with deployment in 2025, supported by PDF Solutions' comprehensive software suite for machine optimization and results analysis.

The contract marks a pivotal milestone that validates PDF Solutions' strategic vision and demonstrates the critical role of eProbe technology in both advanced node development and high-volume manufacturing.

Integration of Process characterization, Design and in-line Fabrication data

PDF Solutions combines the eProbe DirectScan™ application with Characterization Vehicle test chips and Exensio analytics software to enable faster yield learning in high-volume manufacturing environments.

This landmark contract validates the approach of integrating process characterization data with design layout data and in-line fabrication data to enhance detectability to ppb levels to accelerate root cause for yield diagnosis and variability control.

Secure Connected Solutions Drive Value

PDF Solutions will deploy eProbe tools and associated software at the Foundry’s manufacturing sites, using PDF Solutions’ secureWISE® network to provide secure remote equipment support and maintenance. This deployment exemplifies PDF Solutions' strategic vision: creating a cross-industry analytics and collaboration platform that connects key players in the semiconductor ecosystem.

Comprehensive connectivity is essential for achieving faster yield ramps and delivering on the promise of AI in semiconductors. To successfully implement AI solutions, the industry needs automated connections between data sources, tools, and enterprise software systems across the entire semiconductor supply chain.

About PDF Solutions
PDF Solutions (Nasdaq: PDFS) provides comprehensive data solutions designed to empower organizations across the semiconductor and electronics industry ecosystem to improve the yield and quality of their products and operational efficiency for increased profitability. The Company’s products and services are used by Fortune 500 companies across the semiconductor and electronics ecosystem to achieve smart manufacturing goals by connecting and controlling equipment, collecting data generated during manufacturing and test operations, and performing advanced analytics and machine learning to enable profitable, high-volume manufacturing.

Founded in 1991, PDF Solutions is headquartered in Santa Clara, California, with operations across North America, Europe, and Asia. The Company (directly or through one or more subsidiaries) is an active member of SEMI, INEMI, TPCA, IPC, the OPC Foundation, and DMDII. For the latest news and information about PDF Solutions or to find office locations, visit https://www.pdf.com.

Headquartered in Santa Clara, California, PDF Solutions also operates worldwide in Canada, China, France, Germany, Italy, Japan, Korea, Sweden, and Taiwan. For the Company’s latest news and information, visit https://www.pdf.com.

San Diego, CA[Date] ElevATE Semiconductor, a leading provider of advanced pin electronics (PE) and device power supply (DPS/PMU/VI) IC solutions for the semiconductor test market, proudly announces the appointment of Heather Kirkby as Chairwoman of its Board of Directors.  

Heather Kirkby, who has served on ElevATE’s board since 2024, brings more than 25 years of leadership experience across technology, life sciences, and semiconductor industries. Most recently, she was the Chief People Officer at Recursion Pharmaceuticals, where she helped scale the company through IPO and global growth. Prior to Recursion, Ms. Kirkby spent over 15 years at Intuit, where she held senior leadership roles in product management, marketing, and talent development, driving innovation and organizational transformation. She has also held leadership positions at Siebel (acquired by Oracle) and Schlumberger in her early career. 

Ms. Kirkby’s leadership has earned industry recognition, including Intuit’s CEO Leadership Award in 2017 and being named a finalist for the Women Tech Council Leadership Award in 2020. She also earned her MBA from Harvard Business School.   

“I am honored to step into the role of Chairwoman at ElevATE,” said Heather Kirkby. “Having served on the Board over the past year, I’ve seen firsthand the company’s commitment to innovation and excellence in the semiconductor test market. I look forward to working with the leadership team to continue building on this momentum and driving ElevATE’s long-term growth.” 

Ms. Kirkby succeeds Chris Puscasiu, Managing Partner of Presidio Investors, who helped guide ElevATE through a period of rapid growth and innovation.  

“It has been a privilege to serve as Chairman of ElevATE since 2018," said Chris Puscasiu. "After guiding the company’s growth for the past six years, I am ready to give the reins to Heather. She has already made a meaningful impact on the Board, and I am confident her leadership will further strengthen ElevATE’s position in the semiconductor test market.” 

Since its founding in 2012, ElevATE Semiconductor has established itself as a leader in innovation in the Test and ATE markets. The appointment of Heather Kirkby as the new Chairwoman marks a crucial step in the company’s evolution, reflecting its dedication to scaling its impact and shaping the future of semiconductor testing. 

Brewer Science Named 2025 National Top Workplace in Manufacturing Industry

Ninth Consecutive Year Receiving 2025 Top Workplace in Greater St. Louis

Rolla, MO – August 7, 2025 – Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries, has been named a 2025 National Top Workplace in the Manufacturing Industry, marking the fifth consecutive year the company has received this recognition.

Brewer Science has been named 2025 Top Workplaces based on employee feedback

This list is based solely on employee feedback gathered through a third-party survey administered by employee engagement technology partner Energage LLC, a research company with more than 18 years of experience surveying over 27 million employees at 70,000 organizations. Results are calculated by comparing the survey’s research-based statements, including 15 Culture Drivers proven to predict high performance against industry benchmarks.

In addition to being named a National Top Workplace in the Manufacturing Industry, Brewer Science received regional recognition as a 2025 Top Workplace in Greater St. Louis, marking the ninth consecutive year the company has received this recognition.

“Being recognized as a Top Workplace both on a national industry level, as well as locally within our community, speaks volumes to Brewer Science’s dedication in providing our employee-owners with the most fulfilling work experience,” states Dan Brewer, co-CEO at Brewer Science.

Providing customized solutions to customers’ unique, complex situations requires a high regard for a sense of purpose and commitment by everyone within the company. This dedication has been instilled through the company values and creates a workplace flourishing with culture. The employees at Brewer Science are attentive to their roles in the company and the value they articulate to the customers, suppliers, and industry. This has been exemplified by the company becoming Certified Employee-Owned in 2020. Additionally, the company was recognized for meeting the highest corporate social and environmental standards, transparency, and accountability to all stakeholders by becoming a Certified B Corporation™ in 2021.

Learn more about Brewer Science’s company culture and explore career opportunities by visiting our website: https://www.brewerscience.com/about-us/company/careers/

About Brewer Science

Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique quality monitoring systems for water and air applications. We are Certified Employee-Owned and a Certified B Corporation™, using our business as a force for good. Our headquarters are in Rolla, Missouri, with customer support throughout the world. Learn more at: www.brewerscience.com.

###

Company Contact:

Nathan Ayres

Tel: (US) +1.573.364.0444, ext. 1923

Email: [email protected]

Brewer Science Named 2025 National Top Workplace in Manufacturing Industry

Lightium, MPI Corporation, and Axiomatic_AI Announce Strategic Partnership to Revolutionize Photonic Integrated Circuit (PIC) Device Testing with AI-Driven Solutions
Zurich, Switzerland; Hsinchu, Taiwan; and Boston, USA – January 6, 2025 – Lightium AG, MPI Corporation, and Axiomatic_AI Inc. have entered into a Memorandum of Understanding (MoU) to jointly develop the world's first Intelligent, Autonomous, and Integrated Test Solution (IAITS) for photonic devices.
This strategic collaboration aims to revolutionize the testing and qualification processes of photonic integrated circuit (PIC) devices by uniting state-of-the-art artificial intelligence, next-generation hardware, and deep domain expertise. The IAITS platform will deliver breakthrough performance in testing workflows—enabling unmatched efficiency, precision, and scalability to meet the ever-evolving demands of the photonics industry.
A Unified Vision for the Future of Photonics Testing
This partnership is driven by a shared commitment to deliver groundbreaking AI driven and self-optimizing solutions to the photonics industry. By combining Axiomatic_AI’s cutting-edge, reasoning-based, self-learning artificial intelligence with MPI Corporation’s industry-leading wafer probing systems and automation software, and leveraging Lightium AG’s advanced testing infrastructure and deep expertise in ultra-high-speed photonic device measurements, the collaboration aims to bring fully integrated, intelligent photonic integrated circuit (PIC) test solutions to market.
Together, the three companies are creating a unified AI platform that addresses the growing complexity and performance demands of characterizing photonic integrated circuits—unlocking new levels of automation, precision, and scalability for next-generation applications.
Disruptive Value Creation Across Hardware and Human Resources
The Intelligent, Autonomous, and Integrated Test Solution (IAITS) introduces a new paradigm in photonic integrated circuit (PIC) testing, delivering transformative value across both technology infrastructure and human capital.
Key Benefits of IAITS:
• Increased Throughput: By automating complex test routines, minimizing downtime, and optimizing measurement system utilization, IAITS significantly accelerates test cycles and reduces iteration times.
• Enhanced Human Efficiency: The system reduces reliance on manual operation, programming, and debugging—freeing skilled personnel to focus on high-value engineering and strategic innovation tasks.
IAITS will be commercially available as an advanced software add-on package for MPI Corporation’s wafer probing systems. Designed to support both R&D and high-volume production environments, the solution sets a new industry benchmark for efficiency, precision, and scalability—ultimately lowering the total cost of testing and accelerating time-to-market for next-generation PIC devices.
About Lightium AG
Lightium AG is a Swiss-based startup specializing in Photonic Integrated Circuit (PIC) foundry and design services, built on its proprietary, production-grade Thin-Film Lithium Niobate (TFLN) platform. Lightium accelerates customer innovation by delivering unmatched photonic performance, a streamlined and cost-efficient supply chain, and seamless scalability from prototyping to high-volume manufacturing.
As Europe’s first production-grade TFLN foundry, Lightium plays a pivotal role in enabling next-generation photonic solutions across a diverse range of industries, including telecommunications, data communications, quantum computing, artificial intelligence, and space technologies.
Further information can be found at: Lightium - Thin Film Lithium Niobate (TFLN) Photonic Foundry
About MPI Corporation
MPI Corporation, headquartered in Taiwan, is a global leader in advanced probe systems and testing solutions for the semiconductor, photonic, and photonic integrated circuit (PIC) industries. The company designs and manufactures high-performance wafer probing systems known for their exceptional precision, automation capabilities, and scalability—empowering cutting-edge testing across research, development, and high-volume production.
MPI’s innovations play a critical role in advancing next-generation technologies in wireless communication, electronics, and photonics. The company is publicly listed on the Taipei Exchange (TAIEX: 6223).
For more information, please visit: About MPI Corporation – Global Semiconductor Testing Leader
About Axiomatic_AI Inc.
Axiomatic_AI Inc., headquartered in Boston, is a pioneering startup developing physics-based reasoning artificial intelligence to accelerate innovation and reduce the cost and risk associated with deep-tech development. Its cutting-edge AI technologies are redefining how high-tech industries design, measure, and optimize complex systems—enabling faster, smarter decision-making across R&D and production environments.
Axiomatic_AI’s mission is to unlock new efficiencies and capabilities in fields where precision and complexity are paramount.
Learn more at: https://axiomatic-ai.com/mission/

This cutting-edge panel-level wet processing demo tool handles large 510 × 515 mm substrates, delivering world class, high density Through Glass Vias (TGV) formation and ultra-small taper angles essential for advanced packaging in high performance computing.

Gütenbach, Germany – July 15, 2025 – RENA Technologies, a leading manufacturer of wet processing equipment for semiconductor and advanced packaging production, today announced the ramp-up of its dedicated glass core substrates facility in Germany. This new line, designed for substrates up to 510 × 515 mm, immediately opens for customer test lots, underscoring RENA's proven expertise in glass processing and creating new opportunities for process development and customer sample production. “As experts in precision wet processing, we can now offer large panel demo services for high aspect ratio through glass via (TGV) formation on various glass types,” said Dr. Holger H. Kuehnlein, SVP Technology at RENA. “Our alkaline based TGV process delivers extremely small taper angles, low sidewall roughness, and exceptional dimensional control at panel scale, enabling high density via applications. Customers can begin validating these capabilities today.”

Why Glass, and Why Wet Processing?
Glass substrates offer significant advantages for advanced electronics, including ultra-flat surfaces, low dielectric loss, and superior thermal stability. However, realizing these benefits at scale requires defect free surface preparation and the formation of uniform, high density TGVs with minimal taper angles. RENA's wet processing systems are specifically designed to address both challenges:
1. Surface Engineering – Our systems ensure precise cleaning and stress relief across 600 x 600mm panels with submicron total thickness variation (TTV).
2. Chemically Formed TGVs – Following initial laser modifications performed by our specialist partners, RENA’s proprietary chemistries form, enlarge and shape each via to exact specifications. This process consistently delivers very small taper angles and smooth sidewalls, ideal for subsequent metallization.

By collaborating with leading German and international laser partners, RENA offers customers the flexibility to choose their preferred laser vendor while ensuring all downstream wet processing steps are handled by our advanced equipment.

Key Highlights of the New Facility
Panel Size: Focus on 510 x 515mm and up to 600 × 600mm, smaller possible
Tool Set: Alkaline TGV etching, advanced rinse/dry, optical inspection & metrology
Field-Proven Recipes: Process conditions migrated from high volume tools
On-Demand Access: Customers may run demo substrates, qualify custom chemistries, or request full process flows
Sustainability: Low temperature chemistries and closed loop water reclamation reduce energy and ultrapure water (UPW) consumption

Market Impact
High-Performance Computing (HPC) as well as 5G/6G RF modules increasingly require new package designs, including panel-level fan-out and trend towards more complex chiplet architectures. Glass substrates, long considered the “holy grail” for core and interposer material, effectively eliminate the limitations imposed by warpage and dielectric loss in organic substrates. By combining laser modification from our vetted partners with RENA's chemistry driven via shaping, designers can now validate glass packaging concepts on the lab-platform proven at 600x600mm dimensions.
“With this lab-tool, we've created a great opportunity for semiconductor manufacturers to perform demos on panel level glass substrates,” added Peter Schneidewind, CEO of RENA. “From surface preparation to via formation, our wet process flow is ready for customers substrates to support TGV technology breakthroughs. This is world class made in Black Forest.”

Availability & Engagement Model
• Testing available now
• Flexible collaboration: Bring your own laser modified substrates, or leverage RENA’s ecosystem partners to benefit from joint process development support, and metrology services for process validation.

About RENA Technologies GmbH
RENA Technologies is a leading global supplier of production machines for wet chemical surface preparation. RENA products are used in path-breaking application fields such as semiconductors, MedTech, renewable energies, the glass industry and additive manufacturing. RENA equipment is used to treat or modify surfaces of, for example, semiconductor wafers, solar cells, glass, optical substrates, 3D-printed metal components or other high-tech products using wet chemical processes. RENA offers proven standard machines as well as customer-specific solutions and process support.

CONTACT
Sales:
Felix Fink
Phone: +49 7723 9313-403
E-Mail: [email protected]

Press:
Dirk Hensel
Phone:+49 7723 9313-914
E-Mail: [email protected]
www.rena.com