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PDF Solutions, Inc. (Nasdaq: PDFS), a leading provider of comprehensive data solutions for the semiconductor and electronics ecosystems, today announced it will host an Executive Conference on the power of AI to transform semiconductor design and manufacturing. This event will take place on December 12, 2024, in downtown San Francisco, CA, following the 70th Annual IEEE International Electron Devices Meeting.

This one-day Executive Conference will feature presentations from PDF Solutions executives, industry thought leaders, solutions partners and customers on the state of art and best practices to design, deploy, scale, and manage trusted AI/ML solutions across the global semiconductor industry.

Additional information including agenda, logistics, and registration, will be available in the coming weeks.

About PDF Solutions
PDF Solutions (Nasdaq: PDFS) provides comprehensive data solutions designed to empower organizations across the semiconductor and electronics ecosystems to improve the yield and quality of their products and operational efficiency for increased profitability. The Company’s products and services are used by Fortune 500 companies across the semiconductor ecosystem to achieve smart manufacturing goals by connecting and controlling equipment, collecting data generated during manufacturing and test operations, and performing advanced analytics and machine learning to enable profitable, high-volume manufacturing.

Registration

For questions or inquiries, please contact: 

Elle Liang

[email protected]

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On-demand
Belgium China France Germany India Ireland Italy Japan Malaysia Russia Singapore South Korea Taiwan United States Vietnam 360x317_Event_Calendar_Ad_DAI_Analyzing AI_Driven_v1@2x Business Executive
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The wide adoption of Artificial Intelligence is profoundly impacting many industries, perhaps none more so than the semiconductor industry. Beyond serving as a growth driver for chips across a diverse range of applications, AI and semiconductors are beginning a virtuous cycle where AI is helping to design more powerful chips that in turn enable more advanced AI. The semiconductor industry’s path to $1 trillion in annual revenue by the end of the decade is promising, thanks in large part to AI, but what will that journey actually look like?

This webinar will examine the industry’s AI-driven growth opportunities in depth, while looking at the technological innovation needed to fuel the market expansion. Dr. Handel Jones, CEO of IBS, and author of When AI Rules the World, will share his analysis of how AI will shape the outlook for semiconductor end-markets and segments – along with the race to achieve 1.0nm technology nodes and accelerate the virtuous AI-semiconductor development cycle. He will also cover the future of semiconductor market growth in the AI era as well as areas of opportunities.

About IBS

United States

10:00 am - 10:05 am
Ajit Manocha, SEMI
Ajit Manocha
CEO
SEMI

Welcome Remarks

10:05 am - 10:10 am
Pushkar Apte
Pushkar Apte
Strategic Technology Advisor, Smart Data-AI
SEMI

SEMI Smart Data-AI Initiative and Future of Computing Update

10:10 am - 11:00 am
Handel Jones
Dr. Handel Jones
CEO
IBS

Why AI Will Propel the Semiconductor Market to $1 Trillion and Achieve 1.0nm by 2030

11:00 am - 11:15 am

Q&A

Explore how Artificial Intelligence will impact the semiconductor market through the end of the decade with a deep-dive analysis of the fast-shifting industry landscape focusing in on growth across end markets and segments.

10:00 am - 11:15 am Off Add to Calendar 2024-11-20 10:00:00 2024-11-20 11:15:00 Analyzing AI-Driven Growth: $1T and Beyond Explore how Artificial Intelligence will impact the semiconductor market through the end of the decade with a deep-dive analysis of the fast-shifting industry landscape focusing in on growth across end markets and segments. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles On-demand
Event format
China https://www.semi.org.cn/semiconchina/mail/240729/240729.html SEMI半导体供应链国际论坛—主题四：先进封装（异构集成） Business Technical
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Guangzhou
China

Off Add to Calendar 2024-11-14 00:00:00 2024-11-14 00:00:00 SEMI半导体供应链国际论坛—主题四：先进封装（异构集成） Guangzhou China SEMI.org [email protected] America/Los_Angeles public
China https://www.semi.org.cn/semiconchina/mail/240729/240729.html SEMI半导体供应链国际论坛—主题三：半导体先进测试技术 Business Technical
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Guangzhou
China

Off Add to Calendar 2024-11-14 00:00:00 2024-11-14 00:00:00 SEMI半导体供应链国际论坛—主题三：半导体先进测试技术 Guangzhou China SEMI.org [email protected] America/Los_Angeles public
China https://www.semi.org.cn/semiconchina/mail/240729/240729.html SEMI半导体供应链国际论坛—主题一：智能电动汽车芯片 Business Technical
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Guangzhou
China

Off Add to Calendar 2024-11-14 00:00:00 2024-11-14 00:00:00 SEMI半导体供应链国际论坛—主题一：智能电动汽车芯片 Guangzhou China SEMI.org [email protected] America/Los_Angeles public
Belgium China France Germany India Ireland Italy Japan Malaysia Russia Singapore South Korea Taiwan United States Vietnam EMG webinar HI Technical
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Heterogeneous Integration (HI) has come a long way in 50 years. The world of multi-chip modules (MCMs) has given way to a vast ecosystem of chiplets, 3D stacked die, and co-packaging of antenna, high-bandwidth memory (HBM), and optics. HI is at the center of “More than Moore” development activities, as innovative engineers look for creative ways to overcome the slower scaling of silicon technology. The promise of HI is new devices with superior power, performance, area, and cost (PPAC). All these promises come with new challenges. Managing different process nodes, physical characteristics, mechanical stresses, and other system-level challenges not found in monolithic system-on-chip (SoC) devices, creates a great opportunity for design and manufacturing companies to reshape our industry. 

 

In this webinar, we’ll explore this enabling technology from both the device maker and material supplier perspectives. We will learn about demands placed on devices by new applications and what new tools are needed to meet these demands. We will also hear about the challenges placed on materials and equipment suppliers to develop processes capable of manufacturing the individual components and integrating them into final products. Join us as our panel of experts address the issues and opportunities involved with heterogeneous integration. 
 

United States

Arsalam Alam
Arsalan Alam, PhD
Member of Technical Staff (MTS), 3D Stacking Technology Group
AMD Packaging

2nd Generation 3D V-Cache™ Enablement

Andrea Chacko
Andrea Chacko, PhD
Director of Packaging Solutions
Brewer Science
Dong Shun Bai
Dongshun Bai, PhD
Business Development Director and Senior Technologist of Packaging Solutions
Brewer Science

Enabling Heterogeneous Integration through Material Design

The realization of Heterogeneous Integration (HI) has been key in driving advancements in semiconductor technology. The complexities of integrating dissimilar materials continue to be a challenge for HI. All advanced packaging technologies rely on advanced materials to address the many challenges in achieving continued shrinking and improved performance of devices. Novel materials capable of managing mechanical stresses and increased thermal budgets with strict cleanliness requirements are required for processes such as wafer thinning, fan-out wafer-level packaging, and hybrid bonding. This presentation will highlight how advanced materials can address the growing challenges in the industry.

Andrea Maret
Andrea Maret
Senior Knowledge Manager
Entegris

Webinar Moderator

APHI CAST EHS NBMC Smart MFG SMG Sustainability EMG ESD Alliance FlexTech FOA ITL MSIG SCIS SE&A SiPAT SOI

Dive into the dynamic world of semiconductor materials and discover the future landscape as the industry experts provide a glimpse into the future of the semiconductor ecosystem in the era of heterogenous integration.

10:00 am - 11:00 am Off Add to Calendar 2024-10-16 10:00:00 2024-10-16 11:00:00 Heterogeneous Integration finds its place Dive into the dynamic world of semiconductor materials and discover the future landscape as the industry experts provide a glimpse into the future of the semiconductor ecosystem in the era of heterogenous integration. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles REGISTER NOW
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