The chips powering today’s cell phones, cars, computers, and more can contain billions of transistors. Designing these chips requires a team of engineers with expertise in various aspects of the design flow, along with Electronic Design Automation (EDA) tools that are needed to implement and verify these complex designs.
This Master Class is intended for non-technical staff that wish to understand the basics of semiconductor chip design. It provides an appreciation of the complex design flows and an understanding of some of the terminology used by chip design teams.
For students, the course will introduce some of the rewarding challenges and career opportunities available in the design and EDA industries.
In this class we will cover basic information about digital chips, then introduce some of the key steps and tools used during the design flow. We will also discuss some of the tradeoffs of different implementation methodologies and some of the challenges presented by various critical applications such as devices used in medical and automotive systems.
Complex semiconductor chips power today’s cell phones, cars, computers, and more. This on-line Master Class will provide non-technical people who work in and around the chip design industry a high-level overview and understanding of how these complex chips are designed.
ESD Alliance Master Class: Introduction to Chip Design and EDA
Overview of the design of today's complex chips with Electronic Design Automation tools.
(On-line Event)
10:00 am - 11:30 am
Off
Add to Calendar2025-06-25 10:00:002025-06-25 11:30:00ESD Alliance Master Class: Introduction to Design and EDAComplex semiconductor chips power today’s cell phones, cars, computers, and more. This on-line Master Class will provide non-technical people who work in and around the chip design industry a high-level overview and understanding of how these complex chips are designed. SEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
Register Now to Watch the Recorded Event
Session #1 – Overview of Agentic AI in Semiconductor Manufacturing
The session introduces Agentic AI and its applications in semiconductor manufacturing, addressing critical challenges like defect detection, yield enhancement, and process variability. Through real-world case studies, it will demonstrate how AI-driven solutions can significantly improve in fab efficiency and accuracy. The discussion will highlight the transformative potential of Agentic AI in optimizing semiconductor production, setting the stage for deeper exploration in future discussions.
Keynote Speaker - Industrial Co-Pilots and Agentic AI
9:55 am
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10:25 am
Coffee Break
10:25 am
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10:55 am
Michael Passow
AI/ML Leader for IBM Semiconductors
IBM
Real World Manufacturing Applications
10:55 am
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11:25 am
Garrett Schlenvogt
VP, Worldwide Field Applications Engineering
Silvaco
Leveraging Physics-Based Digital Twins for Efficient Semiconductor Manufacturing
11:25 am
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11:45 am
Sean Tropsa
Principal Solution Consultant
SEEQ
Sponsor Presentation - SEEQ
11:45 am
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12:15 pm
Panel Discussion
12:15 pm
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1:15 pm
Lunch
Afternoon, Day 1: June 11, 2025
1:15 pm
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5:15 pm
Session #2 – Process Control with Agentic AI
The session will focus on leveraging Agentic AI for process optimization, including Smart FDC, YMS, ML Ops, and recipe optimization. Key topics will include look-ahead scheduling, line balancing, virtual metrology, and smart inspection strategies. Energy and gas management strategies are highlighted alongside AI-driven sampling optimization. Practical methods for seamlessly integrating AI into existing manufacturing systems will be explored, with an emphasis on streamlining operations to achieve autonomous manufacturing.
1:15 pm
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2:00 pm
Jon Herlocker
VP & General Manager of Tignis, a Cohu Analytics Solution
Tignis
Keynote Speaker - Agentic AI in Process Control: A Practical Roadmap for Fab Transformation
2:00 pm
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2:30 pm
Christopher Nguyen
CEO & Co-Founder
Aitomatic
Autonomous Process Control & Optimization
2:30 pm
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3:00 pm
Brendon Choe
VP of Technology
Gauss Labs
Purpose-Specific Automatic Learning Machine for Fab-Wide Virtual Metrology
3:00 pm
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3:30 pm
Coffee Break
3:30 pm
-
4:00 pm
John Bongaarts
Applied AI Consultant
Soliton Technologies
AI Agents as Troubleshooting Partners & Knowledge Managers
4:00 pm
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4:30 pm
Dr. Holland M. Smith III
Director of Data Science
INFICON
Automate the Mundane or Achieve the Incredible (or Both): The Dawn of Agents in the Fab
4:30 pm
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5:00 pm
Panel Discussion
5:00 pm
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5:15 pm
John Behnke
Smart Manufacturing GM
INFICON
SEMI Smart Mfg NA Chapter introduction with the Smart Mfg Roadmap pyramid
5:15 pm
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7:15 pm
Networking Dinner Reception
Sponsored by SEEQ
Morning, Day 2: June 12, 2025
8:00 am
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9:00 am
Registration & Breakfast
9:00 am
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1:00 pm
Session #3 – Predictive Maintenance in Semiconductor Fabs
The session will highlight the use of Agentic AI for equipment health monitoring and predictive maintenance in fabs and sub-fabs, exploring benefits such as cost savings, improved uptime, and enhanced operational efficiency. Key topics will include smart maintenance, prognosis health monitoring, anomaly detection and techniques for estimating the remaining useful life (RUL) of equipment. The session will emphasize AI's role in optimizing maintenance practices.
9:00 am
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9:30 am
Pugal Janakiraman
Global Manufacturing CTO
Snowflake
Keynote Speaker – Agentic AI for Industry 4.0 (Smart Manufacturing)
9:30 am
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10:00 am
David Meyer
CEO
Lynceus
From Engineer Assistant to Virtual Engineer
10:00 am
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10:30 am
Kiran Karunakran
CTO
Via Automation
AI Agents for Factory Maintenance: Using Factory Data for Automated Decisions
10:30 am
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11:00 am
Coffee Break
11:00 am
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11:30 am
Mayurakshi Dutta
Director Industry Advisor Semiconductor Industry
Microsoft
Predictive Maintenance in Semiconductor Fabs
11:30 am
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12:00 pm
David Duval
Edwards
Enhancing Predictive Maintenance Algorithms through Equipment Failure Analysis
12:00 pm
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12:30 pm
Maryia Kurdina
AI R&D Group Leader
Tokyo Electron Limited Technology and AI Design
AI agents in a few-shot learning for autonomous fault detection and prediction in semiconductor fabrication
12:30 pm
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1:00 pm
Viraj Modak
Sr. Solutions Architect
Nvidia
Vineeth Kalluru
Senior Solutions Architect - Generative AI
Nvidia
Building observable and scalable Multi Agent Workflows for Predictive Maintenance
1:00 pm
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2:00 pm
Lunch
Afternoon, Day 2: June 12, 2025
2:00 pm
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5:00 pm
Session #4 – Data Integration & Supply Chain
Efficiency in supply chains can be significantly enhanced by deploying AI agents for fundamental tasks such as factory-level planning, floor scheduling, real-time dispatching, and monitoring manufacturing processes at remote or contract facilities. These agents can quickly issue alerts for variations in yields or shipping schedules, taking corrective actions, such as expediting or rerouting shipments to prevent delays. Given the complexity of extended global supply chains—especially those involving multiple fabrication, assembly, and testing cycles compounded by chiplet production and advanced packaging—AI agents substantially improve coordination and operational efficiency.
2:00 pm
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2:30 pm
Paul Schneider
Principal Engineer, Director
Intel
Agentic AI in Factory Planning & Scheduling Digital Twin Solutions
2:30 pm
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3:00 pm
Jeff David
VP of AI Solutions
PDF Solutions
Data Integration & Supply Chain - Challenges & Opportunities
3:00 pm
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3:30 pm
Sunil Pandit
Senior Director
Accel4
Orchestrating Data for Agentic AI: Transforming Semiconductor Manufacturing
3:30 pm
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3:45 pm
Coffee Break
3:45 pm
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4:15 pm
Sebastian Steele
Product Director
Flexciton
Agentic AI and Advanced Optimization for Production Planning and Scheduling
4:15 pm
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4:45 pm
Itzik Gilboa
CEO
Minds.ai
Multi-Agent Reinforcement Learning and Tool Processing Time Prediction for Optimized Semiconductor Manufacturing
This workshop will delve into the transformative impact of Agentic AI on semiconductor manufacturing. Agentic AI refers to AI Systems that can act with a certain level of autonomy and are capable of making decision to achieve specific objectives. In this workshop, the focus will be on how Agentic AI can revolutionize various stages of semiconductor manufacturing. Aligned with SEMI Smart Manufacturing’s roadmap vision Agentic AI systems are poised to significantly enhance areas such as process control (FDC, APC, etc.), Virtual Metrology, predictive maintenance, and more - including reducing energy and material usage. This workshop will provide an in-depth look as to how Agentic AI can optimize factory systems and improve outcomes. It's ideal for semiconductor manufacturing professionals, AI enthusiasts, and business leaders seeking to leverage Agentic AI for a competitive edge.
Agentic AI For Next-Generation Semiconductor Manufacturing
In-Person Training
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Add to Calendar2025-06-11 00:00:002025-06-12 00:00:00Agentic AI For Next-Generation Semiconductor ManufacturingThis workshop will delve into the transformative impact of Agentic AI on semiconductor manufacturing. Agentic AI refers to AI Systems that can act with a certain level of autonomy and are capable of making decision to achieve specific objectives. In this workshop, the focus will be on how Agentic AI can revolutionize various stages of semiconductor manufacturing. Aligned with SEMI Smart Manufacturing’s roadmap vision Agentic AI systems are poised to significantly enhance areas such as process control (FDC, APC, etc.), Virtual Metrology, predictive maintenance, and more - including reducing energy and material usage. This workshop will provide an in-depth look as to how Agentic AI can optimize factory systems and improve outcomes. It's ideal for semiconductor manufacturing professionals, AI enthusiasts, and business leaders seeking to leverage Agentic AI for a competitive edge.Milpitas, CA United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
Registration—SOLD OUT!
Heterogeneous Integration (HI) has come a long way in 50 years. The world of multi-chip modules (MCMs) has given way to a vast ecosystem of chiplets, 3D stacked die, and co-packaging of antenna, high-bandwidth memory (HBM), and optics. HI is at the center of “More than Moore” development activities, as innovative engineers look for creative ways to overcome the slower scaling of silicon technology. The promise of HI is new devices with superior power, performance, area, and cost (PPAC). All these promises come with new challenges. Managing different process nodes, physical characteristics, mechanical stresses, and other system-level challenges not found in monolithic system-on-chip (SoC) devices, creates a great opportunity for design and manufacturing companies to reshape our industry.
In this webinar, we’ll explore this enabling technology from both the device maker and material supplier perspectives. We will learn about demands placed on devices by new applications and what new tools are needed to meet these demands. We will also hear about the challenges placed on materials and equipment suppliers to develop processes capable of manufacturing the individual components and integrating them into final products. Join us as our panel of experts address the issues and opportunities involved with heterogeneous integration.
United States
Arsalan Alam, PhD
Member of Technical Staff (MTS), 3D Stacking Technology Group
AMD Packaging
2nd Generation 3D V-Cache™ Enablement
Andrea Chacko, PhD
Director of Packaging Solutions
Brewer Science
Dongshun Bai, PhD
Business Development Director and Senior Technologist of Packaging Solutions
Brewer Science
Enabling Heterogeneous Integration through Material Design
The realization of Heterogeneous Integration (HI) has been key in driving advancements in semiconductor technology. The complexities of integrating dissimilar materials continue to be a challenge for HI. All advanced packaging technologies rely on advanced materials to address the many challenges in achieving continued shrinking and improved performance of devices. Novel materials capable of managing mechanical stresses and increased thermal budgets with strict cleanliness requirements are required for processes such as wafer thinning, fan-out wafer-level packaging, and hybrid bonding. This presentation will highlight how advanced materials can address the growing challenges in the industry.
Dive into the dynamic world of semiconductor materials and discover the future landscape as the industry experts provide a glimpse into the future of the semiconductor ecosystem in the era of heterogenous integration.
Heterogenous Integration finds its place
Webinar
10:00 am - 11:00 am PT
Zoom
10:00 am - 11:00 am
Off
Add to Calendar2024-10-16 10:00:002024-10-16 11:00:00Heterogeneous Integration finds its placeDive into the dynamic world of semiconductor materials and discover the future landscape as the industry experts provide a glimpse into the future of the semiconductor ecosystem in the era of heterogenous integration.United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
REGISTER NOW
INAUGURAL EVENT FOCUSED ON SMART MANUFACTURING & SMART MOBILITY
Join us for a groundbreaking Midwest conference and tradeshow on April 1-2, 2025, focused on Smart Manufacturing and Smart Mobility with an emphasis on the semiconductor industry! Automotive electronics and smart manufacturing are two of the key end markets on the path to $1T in semiconductor revenue.
A significant amount of both markets is concentrated in the Midwestern United States. SEMIEXPO in the Heartland will bring these two key markets together and provide an opportunity for collaboration and growth.
Smart Manufacturing
The program will focus on the deployment of Industry 4.0 or Smart Manufacturing tools, technologies, and methods for the semiconductors required for this growing market.
Smart Mobility
The program will unite stakeholders in the semiconductors/sensors and mobility ecosystems to identify and address technical issues and supply chain dynamics that are best addressed collectively.
Ways to Participate
Exhibit
Sponsor
Speak
Attend
MAKE YOUR MARK AT THE INAUGURAL SEMIEXPO HEARTLAND
Plan Now to Exhibit or Sponsor. Contact— Shane Poblete | +1 202-847-5983 | [email protected]
NEW EVENT!
April 1–2, 2025
Indiana Convention Center, Indianapolis, IN
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Add to Calendar2026-04-29 00:00:002026-04-30 00:00:00SEMIEXPO Heartland 2026Indiana Convention Center 100 S Capitol Ave Detroit, MI United StatesSEMI.org[email protected]America/Detroitpublic
America/Detroit
The SEMI Supply Chain Management initiative is a unique global platform that brings together top industry leaders to advance a more resilient and agile electronics supply chain. Recent geopolitical and natural events have exposed vulnerabilities but also new opportunities that require industry-wide and precompetitive collaboration. That's where SEMI comes in. The initiative’s newly formed Industry Advisory Council is committed todriving engagement, creating tools and solutions through collaboration, and ensuring alignment in global end-to-end supply chain continuity, visibility, and transparency. Through deep dives, educational forums, benchmarking, standards development, and strategic partnerships, SEMI seeks to empower our members to anticipate and respond to future disruptions proactively.
If you are interested in learning more about how your company can participate in the SCM initiative, please contact us at [email protected].
Join us for an insightful webinar as we present the findings from the 2024 Semiconductor Supply Chain Survey, a collaborative effort between the SEMI Supply Chain Management initiative and McKinsey & Company.
The annual survey aims to establish benchmarks for operational agility metrics, covering the entire value chain from material suppliers to OEMs, offering a comprehensive view of the landscape.
During this webinar, we will share results from the survey uncovering key trends, challenges, and opportunities within the semiconductor supply chain. By attending, you'll gain valuable insights to benchmark your organization against peers, identify areas for improvement, and course-correct more effectively. Please contact us if you like to learn about how your company can participate in the SCM initiative.
Join us for a webinar on the 2024 Semiconductor Supply Chain Survey results, a collaboration between SEMI and McKinsey & Company. Discover key trends, challenges, and opportunities across the value chain. Gain insights to benchmark your organization and enhance your strategic planning.
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Add to Calendar2024-06-24 00:00:002024-06-24 00:00:00Benchmark Your Supply Chain AgilityJoin us for a webinar on the 2024 Semiconductor Supply Chain Survey results, a collaboration between SEMI and McKinsey & Company. Discover key trends, challenges, and opportunities across the value chain. Gain insights to benchmark your organization and enhance your strategic planning. Register now for one of the sessions:US/EU: 8:00 AM – 9:00 AM PT [Register Now] Asia: 5:00 PM – 6:00 PM PT [Register Now] United StatesSEMI.org[email protected]America/Los_Angelespublic
This seminar is designed to offer a platform where executives, managers, and engineers who specialize in process development, equipment maintenance, factory automation, and manufacturing can come together to discuss ways to improve production output, increase yield and work efficiency through implementing some of AI solutions presented in this seminar.
The landscape of Semiconductor manufacturing is undergoing a profound transformation, with Artificial Intelligence (AI) emerging as a driving force behind the evolution of future factories.
This theme invites participants to delve into the intricate interplay between advanced AI technologies and the manufacturing sector, showcasing the pivotal role AI plays in reshaping the entire manufacturing ecosystem.
This conference aims to provide a comprehensive platform for industry leaders, researchers, and innovators to exchange ideas, share success stories, and envision the future trajectory of manufacturing under the influence of AI.
Usual Member Rate: SGD 152 Usual Non-member Rate: SGD 227
*The above rates are inclusive of coffee/tea breaks and luncheon
30% Early Bird Rate extended until 1 March 2024!
*Malaysian Companies - HRDC Claimable for Penang Business Summit Seminar 2: Revolutionizing Manufacturing (The role of AI in Future Factories) (subject to T&C, please contact HRDC for more information). For HRDC claims, please refer to the following links on the claiming matrix and guidelines:
1:00 pm - 6:00 pm
Off
Add to Calendar2024-03-07 13:00:002024-03-07 18:00:00Penang Business Summit Seminar 2: Revolutionizing ManufacturingThe role of AI in Future FactoriesThe landscape of Semiconductor manufacturing is undergoing a profound transformation, with Artificial Intelligence (AI) emerging as a driving force behind the evolution of future factories.This theme invites participants to delve into the intricate interplay between advanced AI technologies and the manufacturing sector, showcasing the pivotal role AI plays in reshaping the entire manufacturing ecosystem.This conference aims to provide a comprehensive platform for industry leaders, researchers, and innovators to exchange ideas, share success stories, and envision the future trajectory of manufacturing under the influence of AI.*Note: Seminar 2 and Seminar 1 timing will overlap on 7 Mar Participating Fee:Usual Member Rate: SGD 152Usual Non-member Rate: SGD 227*The above rates are inclusive of coffee/tea breaks and luncheon30% Early Bird Rate extended until 1 March 2024! *Malaysian Companies - HRDC Claimable for Penang Business Summit Seminar 2: Revolutionizing Manufacturing (The role of AI in Future Factories) (subject to T&C, please contact HRDC for more information).For HRDC claims, please refer to the following links on the claiming matrix and guidelines:HRDC Approval Letter for Penang Business SummitAllowable Cost MatrixHRDC SBL Grant HelperHRDC SBL Claim Helper Contact us for enquiries!For Program: Mr. Glenn Tan | [email protected] | +65.8228.0662For Registration / HRDC Claims: Ms. Gillian Lim | [email protected] | +65.9048.1123 Presentation slides can be found HERE!Royale Chulan Penang No 1 & 2, Pengkalan Weld, Georgetown 10300 Penang Pulau Pinang MalaysiaSEMI.org[email protected]Asia/Kuala_Lumpurpublic
Asia/Kuala_Lumpur
Register Today
Future of Computing
SEMI Member: $175
Non-Members: $225
This Event is SOLD OUT
Cancellations received on or before October 4, 2024 will be fully refunded. After this date, only substitutions will be accepted.
Please email your cancellation request to Agnes Cobar at [email protected]. Refunds will not be issued for cancellations (including no-shows) made after October 2. Substitutes are only accepted with written permission from the original registrant.
As AI proliferates rapidly, AI models and datasets are also growing rapidly in size, giving rise to two fundamental challenges. First, this growth far outpaces performance improvement in hardware systems and infrastructure, and second, the energy consumption for AI continues to grow unsustainably.
These challenges are formidable and cannot be solved by one entity or in isolated silos. SEMI (www.semi.org), a global electronics industry association with 3300 member companies, is organizing this workshop under its Smart Data-AI Initiative. We are bringing together experts to discuss the latest innovations in the entire-AI ecosystem – including novel devices, 2D materials, analog computing, advanced packaging, chiplets, photonics, hardware-software co-optimzation and energy-efficient architectures & algorithms for data centers, cloud & edge.
Please join us on March 19th in Milpitas, CA. We will start with an inspiring keynote from Tristan Holtam, GVP, CEO Chief of Staff, Corporate Strategy and Development, Applied Materials, and continue through the day with industry leaders (AMD, Arm, ASE, Google DeepMind, IBM, Intel, Lam Research, Mckinsey, Micron, Nvidia, Qualcomm, SK Hynix); exciting start-ups (Cerebras, LightMatter, Mentium) and leading-edge academic researchers (Stanford U. and U. of California). Together, let us explore collaborative, system-level solutions for sustainable progress in AI systems.
SEMI 673 S. Milpitas Blvd Milpitas, CA95035 United States
8:00 am
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8:30 am
Registration, Coffee/Tea + Pastries
8:30 am
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8:35 am
Welcome
Pushkar Apte, Smart Data-AI Lead and Strategic Technology Advisor, SEMI
8:35 am
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8:45 am
SEMI Perspective
Ajit Manocha, CEO, SEMI
8:45 am
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9:30 am
Accelerating Energy-Efficient Computing
Tristan Holtam, GVP, CEO Chief of Staff, Corporate Strategy and Development, Applied Materials
9:30 am
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10:00 am
Future of Computing Landscape- Opportunities and Challenges
Jim Sexton, Fellow, IBM
10:00 am
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10:15 am
Coffee Break
10:15 am
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11:30 am
Chair/Moderator: Gity Samadi, Senior Director of R&D Programs, SEMI
David Fried, Corporate VP, Lam Research
Eric Pop, Pease-Ye Professor of Electrical Engg., Stanford University
Geoffrey Burr, Distinguished Research Scientist, IBM Research
Saif Islam, Professor, Dept. of Electrical & Computer Engg., U. of California, Davis
Ashonita Chavan, Distinguished Member of Technical Staff, Micron
11:30 am
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11:40 am
SEMI Technology Communities
Melissa Grupen-Shemansky, VP & CTO, SEMI
11:40 am
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12:55 pm
Chair/Moderator: Melissa Grupen-Shemansky, SEMI
Steve Klinger, LightMatter, VP of Product
Jaesik Lee, VP of Package Engineering, SK Hynix
Debendra Das Sharma, Senior Fellow, Intel and Chair of UCIe & CXL Consortium
Boris Vaisband, Asst. Professor, UC Irvine
12:55 pm
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2:00 pm
Lunch
2:00 pm
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2:10 pm
Market Overview for AI
Wendy Zhu, McKinsey & Co.
2:10 pm
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2:20 pm
SEMI Smart Data-AI Initiative Overview
Pushkar Apte
2:20 pm
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3:35 pm
Chair/Moderator: Jim Sexton, IBM
Evgeni Gousev, Senior Director, Qualcomm; and Chair, Board of Directors, TinyML Foundation
Mirko Prezioso, CEO, Mentium
Wilfred Gomes, CEO, Mueon
Chloe Jian Ma, Vice President, Arm
3:35 pm
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3:45 pm
Coffee Break
3:45 pm
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5:00 pm
Chair/Moderator: Pushkar Apte, SEMI
JP Fricker, Founder and Chief System Architect, Cerebras
