Ravi Bhagat is Sr. Director leading IT Infrastructure and Security services for KLA Corporation. Over 20+ years of Experience leading global infrastructure teams and services. Has held various executive and senior level IT positions at KLA, including client services, architecture, managed service operations and product system support. Before joining KLA, Ravi held various senior roles at PCL and managed a country wide LAN/WAN and system deployment initiatives. He earned his MBA in US and his bachelor's degree in Computer Science from Nagpur University in India. He is an avid reader and travel enthusiast who loves to go around the world with his family.

Brian Christian is the Founder CEO/CTO of Flying Cloud Technologies, an IP security and protection company, and has been a luminary in the computer security industry for over 20 years. His roles have focused on enterprise security, software security and protection of corporate digital assets. Prior to Flying Cloud Technologies, Brian co-founded SPI Dynamics, the leading expert and industry thought leader in Web application security assessment and testing. SPI was purchased by Hewlett-Packard.

Dr. Bottoms received a B.S. degree in Physics from Huntington College in Montgomery, Alabama in 1965, and a Ph.D in Solid State from Tulane University in New Orleans in 1969 and is currently Chairman of Third Millennium Test Solutions. He has worked as a faculty member in the department of electrical engineering at Princeton University, manager of Research and Development at Varian Associates, founding President of the Semiconductor Equipment Group of Varian Associates and general Partner of Patricof & Co. Ventures. He has served as Chairman and CEO of many companies both public and private.

Dr. Bottoms has also served in a number of Government Advisory positions including Chairman of the Board on Assessment for NIST and a member of the Technical Advisory Committee on export controls for the US Commerce Department.

Dr. Bottoms has participated in the start up and growth of many companies through his venture capital activity and through his own work as an entrepreneur. These include companies in a wide range of industries.

Emeritus Member of the Board of Tulane University
Co-Chair of the Heterogeneous Integration Roadmap
Chairman of the SEMI’s Awards Committee
Chairman of the Packaging and Package Substrates Technical Working Group for INEMI
Member of the Board of MIT’s Microphotonic Center
Chairman of Fluence Analytics
Chairman of Third Millennium Test Solutions

Dr. Gambino received the B.S. degree in materials science from Cornell University, Ithaca, NY, in 1979, and the PhD degree in materials science from the Massachusetts Institute of Technology, Cambridge, MA, in 1984.

He joined IBM, Hopewell Junction, NY, in 1984, where he worked on silicide processes for Bipolar and CMOS devices. In 1992, he joined the DRAM development alliance at IBM's Advanced Semiconductor Technology Center, Hopewell Junction, NY. While there, he developed contact and interconnect processes for 0.25-, 0.175-, and 0.15-um DRAM products. In 1999, he joined IBM's manufacturing organization in Essex Junction, VT, where he worked on copper interconnects, CMOS image sensors, RF devices, and 3D integration.

He joined ON Semiconductor, Gresham, OR, in 2015. He is currently working on CMOS image sensors and high voltage semiconductors. He has published over 200 technical papers and holds over 500 patents.

As Project Development Director at Yole Développement (Yole), Jérôme Azémar is supporting the development of strategic projects, following leading customers of the company within the semiconductor industry, from manufacturing to packaging. His mission is to develop Yole’s business and technical knowledge in the industry, maintain long term relationships with its accounts and meet their expectations.

Jérôme is a member of Yole since 2013 and worked as a senior analyst, managing the day to day production of technology & market reports as well as custom consulting projects. He also deeply contributed to the business development of the Advanced Packaging & Semiconductor Manufacturing activities.

Jérôme is the author of numerous analysis and international publications covering advanced packaging, power electronics and semiconductor manufacturing. He is also regularly involved in international conferences, giving presentations, delivering keynotes, as well as organizing committees.

Along his career, Jérôme has developed a large network in the industry, being in touch with CEOs, CTOs, Marketing Managers, Business Development Managers…

Prior to this and upon graduating from INSA Toulouse (France) with a Master’s in Microelectronics and Applied Physics, Jérôme joined ASML and worked in Veldhoven (The Netherlands) for three years as an Application Support Engineer specializing in immersion scanners. During this time, he acquired Photolithography skills which he then honed over a two-year stint as a Process Engineer at STMicroelectronics (France).

Meeting room: Washington Park

Address:
4805 SW 229th Ave
Aloha, OR 97007

Address:
4805 SW 229th Ave
Aloha, OR 97007

Meeting Room: Washington Park

Meeting room: Beaverton Cafe

All FOA members: Analog Devices
Lunch to be held in: Beaverton Cafe

Meeting room: Beaverton Cafe

Fab Tour - Murel and Robotics Upskilling Lab

Address:
2725 SW Cedar Hills Blvd
Beaverton, OR 97005 United States

Rockwell Automation Electric Vehicle (EV) Innovation Center
111 N. Market Street, San Jose, CA 95113

About the Speaker

About the Speaker

(Update on Smart Manufacturing Benchmark Survey & Presentation on SEMI-Cornell AI/Machine Learning Project)

About the Speaker

Presentation Abstract

Abstract

In a gloomy economic environment, the MEMS industry is holding up. Following the semiconductor industry, MEMS had its best year so far, but with a slower YoY growth than expected. Consumer and automotive are responsible for almost 80% of the $11.5B market in 2018, driven mainly by inertial, pressure, microphone, infrared, RF and optical MEMS. Big players are competing in their corresponding established markets, eating up each other’s share of the pie. Competition therefore is getting fierce with each player struggling for differentiation in order to dominate the market. Piezoelectric tech, sensor fusion, AI & edge computing take the MEMS industry by hand up to the next corner of the market labyrinth. Will they lead it out to new horizons and further growth? Join the webcast regarding the status of the MEMS industry to find out!

Biography

Dimitrios Damianos, PhD joined Yole Développement (Yole) as a Technology and Market Analyst and is working within the Photonics, Sensing & Display division. Dimitrios is daily working with his team to deliver valuable technology & market reports regarding the imaging industry including photonics & sensors. After his research on theoretical and experimental quantum optics and laser light generation, Dimitrios pursued a Ph.D. in optical and electrical characterization of dielectric materials on silicon with applications in photovoltaics and image sensors, as well as SOI for microelectronics at Grenoble’s university (France). In addition, Dimitrios holds a MSc degree in Photonics from the University of Patras (Greece). He has also authored and co-authored several scientific papers in international peer-reviewed journals.