Silicon on Insulator technology is a very diverse and multi-faceted enabler of semiconductor products. In certain areas if offers performance advantages across a wide dynamic range of leakage and in other areas it enables the use of high voltages in multi-domain designs. It also inherently bring low capacitance which makes it great for ultra-fast switching in RF designs and significantly improved radiation robustness compared to bulk CMOS; it’s easy to see why SOI technology continues to expand in use through-out the industry.
Attend this webinar to see how these advantages are being applied to products in the medical and automotive (and more) application spaces.
CA United States
8:00 am
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8:10 am
Carlos Mazure
SOI Consortium
Welcome and Introduction
8:10 am
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8:30 am
Jon Cheek
Sr. Director, Process Technology Development
NXP Semiconductor
SOI Technology: Enabling Everything from Automotive to 6G
Abstract – The use of Fully-Depleted SOI, FD-SOI, combined with an ultrathin buried oxide create a technology ideally suited for the Internet of Things revolution. FDSOI enables the dynamic modulation of the threshold voltage during operation, not just during the design phase, to open a whole new world of creative product opportunities. One such example is the creation of ultralow leakage embedded SRAM memories which consume so little power that some resulting IoT products can last years on a single household battery. Other versions of SOI Technology with thick buried oxide enable use of 50V to 70V domains on a chip without need of complex isolation schemes. This ability to provide high voltage support along with digital processing is yet another reason SOI is adopted to provided differentiation in product offerings. Each of these approaches will be discussed and shown how it benefits the final products.
8:30 am
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8:50 am
Giulio Ricotti
Design Director & Technical Staff Fellow
ST Microelectronics
BCBD-SOI Technologies and Applications in Ultrasound Imaging and More
Giulio Ricotti – Design Director and Technical Staff Company Fellow - STMicroelectronics
After earning his Electronics Engineering degree, Giulio joined ST in 1994 as a design engineer in their Smart Power (SP) products group. Currently a Design Director and Technical Staff Company Fellow, Giulio has more than 60 patents and has authored 70 publications. Giulio has also been awarded the “Premio dei Premi” in 2009 by the Italian president Giorgio Napolitano for his crucial contribution to innovation with the 4D ultrasound imaging project that is used today all over the world for pregnancy and cardiology screenings.
Join us for the the first in a series of webinars focused on applications of SOI technology, brought to you by the SEMI SOI Consortium. The series will underline the breadth of products that SOI technologies cover.
The first webinar of the series will feature ST Microelectronics and NXP. ST Microelectronics will focus on their BCD-SOI technologies and applications, such as medical ultrasound imaging. NXP will showcase multiple applications of SOI technologies in automotive from power electronics through infotainment.
Latest Trends in SOI-based Microelectronics Applications
8:00 am - 9:00 am
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America/Los_Angeles
Society has come to depend on the rapid, predictable, and affordable scaling of computing performance for consumer electronics, the rise of ‘big data’ and data centers, scientific discovery, and national security. The approaching end of lithographic scaling threatens to hinder continued health of the $2T electronics industry, impacting many related fields that depend on computing and electronics. By some projections, within a decade, the technological underpinnings for Moore’s Law will come to an end, as lithography gets down to atomic scale. At that point, it will not be feasible to create lithographically produced devices, with dimensions nearing atomic scale, where a dozen or fewer silicon atoms are present across critical device features and will therefore represent a practical limit for implementing logic gates for digital computing. In 2019, SEMI launched a special thought leadership initiative – SEMI Think Tanks – where the leading minds of our industry gather to address the challenges and opportunities for the semiconductor and broader electronics industries with a 20-30 year horizon. SEMI is honored to be the rallying force behind bringing together the industry stalwarts and thought leaders to share their prophetic views in our pioneering Think Tank series on The Future of Computing.
United States
8:00 am
Ajit Manocha
President and CEO
SEMI
Welcome Remarks and Speaker Introductions
8:07 am
Bettina Weiss
Chief of Staff
SEMI
What are SEMI Think Tanks? Concept, Scope and Deliverables
8:12 am
Mukesh Khare
Vice President: Hybrid Cloud
IBM
"It Takes a Village" Think Tank Leadership View on the Future of Computing
8:32 am
Jim Sexton
IBM Fellow; Department Group Manager, Data Centric Systems
IBM
Progress Report on Active and Planned Think Tank Workstreams
Jim Clarke
Director of Quantum Hardware
Intel
8:47 am
Q&A
8:55 am
Closing
A Look Into the Future: Computing in 2040
8:00 am - 9:00 am
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Add to Calendar2021-12-01 08:00:002021-12-01 09:00:00A Look Into the Future: Computing in 2040United StatesSEMI.org[email protected]America/Los_Angelespublic
9:00 am - 5:30 pm
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Add to Calendar2021-09-28 09:00:002021-09-28 17:30:00BIPV TASK FORCE MEETINGBIPV TASK FORCE MEETING
光伏建筑一体化（BIPV）屋顶抗风揭试验方法标准交流会ChinaSEMI.org[email protected]America/Los_Angelespublic
10:00 am - 11:30 am
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Add to Calendar2021-09-17 10:00:002021-09-17 11:30:004H-SiC Homoepitaxial Wafer Task Force Meeting 会议邀请：4H-SiC同质外延片工作组线上会议
4H-SiC Homoepitaxial Wafer Task Force Meeting
Meeting：Link
Friday, September 17, 2021
10:00-11:30ChinaSEMI.org[email protected]America/Los_Angelespublic
Electromechanical evaluation of printed interconnects
Additive manufacturing of resistors and capacitors
Highly stretchable conductors
Interconnecting in the z direction - printed vias
Printed RF devices and antennas
Device and component placement and assembly
Thinned semiconductor devices
Approaches to bond devices and components to flexible substrates
Concepts of operation and evaluation of performance and reliability
Applications to medical and industrial sensors will be incorporated throughout
About the Instructor
Mark D. Poliks, Ph.D. is a SUNY Distinguished Professor of Engineering and Empire Innovation Professor in Systems Science and Industrial Engineering and Materials Science and Engineering at the State University of New York at Binghamton. He is director of the Center for Advanced Microelectronics Manufacturing (CAMM), a New York State Center of Advanced Technology and home to the New York Node of NextFlex. He serves as Chair of the Smart Energy Transdisciplinary Area of Excellence at the Binghamton campus.
His research is in the areas of industry relevant topics that include high performance electronics packaging, flexible hybrid electronics, medical and industrial sensors, printed RF components, materials, processing, aerosol jet printing, roll-to-roll manufacturing, in-line quality control and reliability of electronics. He is the recipient of the SUNY Chancellor’s Award for Excellence in Research.
He received SEMI FLEXI awards for leadership in Technology and Education in 2009 and 2019. He has authored over one hundred fifty technical papers and holds forty-eight US patents. He was the General Chair of the 69th IEEE ECTC and serves as a IEEE Electronics Packaging Society (EPS) Distinguished Lecturer and an elected member of the IEEE EPS Board of Governors.
This course, the 9th in the FlexTech Master Class Series, takes a deep dive into best known methods for optimizing flexible electronics into medical devices and industrial products. Our expert speaker cover the most important considerations when designing flexible and printable parts and circuits into systems or subsystems and the many approaches to consider.
This course is appropriate for those new to electronics design, as well as those familiar but looking for a refresher on the latest materials and techniques.
Optimizing Design and Fabrication of FHE for Medical and Industrial Applications
ON DEMAND
10:00 am - 12:00 pm
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America/Los_Angeles
Session 2: Ultra Wide Band Gap Wafer and Heat Sink Diamond Substrates
4:15 pm - 4:35 pm
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Add to Calendar2021-09-23 16:15:002021-09-23 16:35:00Session 1: Ultra Wide Band Gap Wafer and Heat Sink Diamond SubstratesSEMI International Standards Program
Compound Semiconductor Technology Forum
Note: Forum language is mandarin, no simultaneous Interpretation provided
Session 2: Ultra Wide Band Gap Wafer and Heat Sink Diamond Substrates
Speaker: Xing Zhang, CEO of Compound Semiconductor Manufacturing（Xiamen) Co., Ltd
Thursday, September 23, 2021
16:30-17:00
Wuhu, Anhui, China
Webinar Link: Click here
Event Contact information:
Ein Wu
SEMI China
Email: [email protected]
Phone: 86.21.6027.8509ChinaSEMI.org[email protected]America/Los_Angelespublic
Mark D. Poliks, Ph.D. is a SUNY Distinguished Professor of Engineering and Empire Innovation Professor in Systems Science and Industrial Engineering and Materials Science and Engineering at the State University of New York at Binghamton. He is director of the Center for Advanced Microelectronics Manufacturing (CAMM), a New York State Center of Advanced Technology and home to the New York Node of NextFlex. He serves as Chair of the Smart Energy Transdisciplinary Area of Excellence at the Binghamton campus. 
