Silicon on Insulator technology is a very diverse and multi-faceted enabler of semiconductor products. In certain areas if offers performance advantages across a wide dynamic range of leakage and in other areas it enables the use of high voltages in multi-domain designs. It also inherently bring low capacitance which makes it great for ultra-fast switching in RF designs and significantly improved radiation robustness compared to bulk CMOS; it’s easy to see why SOI technology continues to expand in use through-out the industry.
Attend this webinar to see how these advantages are being applied to products in the medical and automotive (and more) application spaces.
CA United States
8:00 am
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8:10 am
Carlos Mazure
SOI Consortium
Welcome and Introduction
8:10 am
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8:30 am
Jon Cheek
Sr. Director, Process Technology Development
NXP Semiconductor
SOI Technology: Enabling Everything from Automotive to 6G
Abstract – The use of Fully-Depleted SOI, FD-SOI, combined with an ultrathin buried oxide create a technology ideally suited for the Internet of Things revolution. FDSOI enables the dynamic modulation of the threshold voltage during operation, not just during the design phase, to open a whole new world of creative product opportunities. One such example is the creation of ultralow leakage embedded SRAM memories which consume so little power that some resulting IoT products can last years on a single household battery. Other versions of SOI Technology with thick buried oxide enable use of 50V to 70V domains on a chip without need of complex isolation schemes. This ability to provide high voltage support along with digital processing is yet another reason SOI is adopted to provided differentiation in product offerings. Each of these approaches will be discussed and shown how it benefits the final products.
8:30 am
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8:50 am
Giulio Ricotti
Design Director & Technical Staff Fellow
ST Microelectronics
BCBD-SOI Technologies and Applications in Ultrasound Imaging and More
Giulio Ricotti – Design Director and Technical Staff Company Fellow - STMicroelectronics
After earning his Electronics Engineering degree, Giulio joined ST in 1994 as a design engineer in their Smart Power (SP) products group. Currently a Design Director and Technical Staff Company Fellow, Giulio has more than 60 patents and has authored 70 publications. Giulio has also been awarded the “Premio dei Premi” in 2009 by the Italian president Giorgio Napolitano for his crucial contribution to innovation with the 4D ultrasound imaging project that is used today all over the world for pregnancy and cardiology screenings.
Join us for the the first in a series of webinars focused on applications of SOI technology, brought to you by the SEMI SOI Consortium. The series will underline the breadth of products that SOI technologies cover.
The first webinar of the series will feature ST Microelectronics and NXP. ST Microelectronics will focus on their BCD-SOI technologies and applications, such as medical ultrasound imaging. NXP will showcase multiple applications of SOI technologies in automotive from power electronics through infotainment.
Latest Trends in SOI-based Microelectronics Applications
8:00 am - 9:00 am
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America/Los_Angeles
Do you sometimes feel like you are operating in the dark when dealing with the new challenges and opportunities in process and design? These continue to emerge in parallel to ever shrinking semiconductor device geometries.
While Moore’s law and beyond are driving scale reduction, the industry is facing increased process sensitivity and complexity, and is redefining on-wafer defect tolerance in terms of size and complexity.
To detect, identify, understand the source and eliminate yield limiter defectivity are key for total wafer environment contamination characterization and control and are essential for yield enhancement to ensure the success of the latest technology nodes.
It is more imperative than ever that the semiconductor industry works together to enable improved defect detection, speciation/characterization metrology, and as needed, hybrid analytical technology for upcoming HVM readiness.
Join us for this session for speakers and discussion on tackling some of these industry challenges.
Virtual United States
7:30 am
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7:35 am
Paul Trio
Senior Manager, Strategic Initiatives
SEMI
Welcome
7:35 am
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7:55 am
Archita Sengupta
Sr. Technologist
Intel
IDM Perspective of Defectivity with regard to Next-Gen Metrology and Analysis Tools
New challenges and opportunities in process and design continue to emerge in parallel to ever shrinking semiconductor device geometries. While Moore’s law and beyond are driving scale reduction, the industry is facing increased process sensitivity and complexity, and is redefining on-wafer defect tolerance in terms of size and complexity.
Join us for this webinar-like session to discuss best-known methods from industry leaders
Challenges in Metrology & Analysis for Next Gen Semiconductor Industry
7:30 am - 10:00 am
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America/Los_Angeles
Session 2: Ultra Wide Band Gap Wafer and Heat Sink Diamond Substrates
4:15 pm - 4:35 pm
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Add to Calendar2021-09-23 16:15:002021-09-23 16:35:00Session 1: Ultra Wide Band Gap Wafer and Heat Sink Diamond SubstratesSEMI International Standards Program
Compound Semiconductor Technology Forum
Note: Forum language is mandarin, no simultaneous Interpretation provided
Session 2: Ultra Wide Band Gap Wafer and Heat Sink Diamond Substrates
Speaker: Xing Zhang, CEO of Compound Semiconductor Manufacturing（Xiamen) Co., Ltd
Thursday, September 23, 2021
16:30-17:00
Wuhu, Anhui, China
Webinar Link: Click here
Event Contact information:
Ein Wu
SEMI China
Email: [email protected]
Phone: 86.21.6027.8509ChinaSEMI.org[email protected]America/Los_Angelespublic
Session 2: Progress of VCSEL Technology and Its Applications in 3D Sensing and Lidar
4:35 pm - 5:00 pm
Off
Add to Calendar2021-09-23 16:35:002021-09-23 17:00:00Session 2: Progress of VCSEL Technology and Its Applications in 3D Sensing and LidarSEMI International Standards Program
Compound Semiconductor Technology Forum
Note: Forum language is mandarin, no simultaneous Interpretation provided
Session 2: Progress of VCSEL Technology and Its Applications in 3D Sensing and Lidar
Speaker: Qingwei Mo, Chief scientist of ZJEAGLE.Co., Ltd
Thursday, September 23, 2021
16:35-17:00
Wuhu, Anhui, China
Webinar Link: Click here
Event Contact information:
Ein Wu
SEMI China
Email: [email protected]
Phone: 86.21.6027.8509ChinaSEMI.org[email protected]America/Los_Angelespublic
