Shanghai
China
China
CAST EMG ESD Alliance FlexTech FOA ITL MSIG SCIS SE&A SiPAT Standards Workforce Development Off Add to Calendar 2021-11-19 00:00:00 2021-11-19 00:00:00 2021年 SEMI 中日交流协作会 China SEMI.org [email protected] America/Los_Angeles publicChina
CAST EMG ESD Alliance FlexTech FOA ITL MSIG SCIS SE&A SiPAT Standards Workforce Development Off Add to Calendar 2021-11-19 00:00:00 2021-11-19 00:00:00 2021 SEMI China-Japan Collaboration Conference China SEMI.org [email protected] America/Los_Angeles public
Complimentary for SEMI Members.
Use your corporate email address during login to be recognized as a SEMI Member.
$99 for Non-Members.
The semiconductor industry is expected to reach US$1 trillion by the end of the decade. The next big technology revolutions (AI, 5G/6G, VR/AR, qubit computing, and more) are driving the need to manage exponential amounts of data. Everything from cars to coffee machines are generating data that needs to be moved, stored, computed, secured, and converted to end-user information. To make this a vision a reality requires innovation throughout the semiconductor industry, from new materials to new and improved process equipment to new device architectures designed to perform at speeds and densities once thought unachievable. In this webinar, we will hear from industry experts on what the 10-year technology trends look like and how semiconductor material and equipment suppliers are responding to the trends.
Dr. Todd Younkin, President and CEO of Semiconductor Research Corporation (SRC) will discuss the evolving challenges and five “seismic shifts” that are driving advancement in the semiconductor industry.
Following Dr. Younkin’s talk, David Medeiros, Senior Director, CTO Office of Entegris, Inc. will address these challenges and describe how Entegris is driving materials innovation to overcome the obstacles faced by chip manufacturers.
United States
Biography: Darron Jurajda is the Director of Semiconductor Business Operations at Brewer Science. He is an expert in materials and process research for anti-reflective materials, multilayer materials, and processes for lithography. He has a diverse background including photolithography, chemical operations, and laboratory research. Darron has published in several technical proceedings and publications including SPIE, IEEE, and Solid State Technology. He has been a member of multiple SEMI Committees over the last 10 years. Darron holds a BS in chemical engineering from the University of Texas at Austin.
Biography: Dr. Todd Younkin is a talented and seasoned executive with more than 20 years of experience in technology innovation. His extensive Research and Development experience spans Intel’s 0.18um to 5nm nodes with technical contributions in novel materials, nanotechnology, integration, advanced lithography, and integrated photonics. Most recently, he engineered, launched, and led all programmatic aspects of the five-year, $240 million JUMP research initiative. It has six multi-university, multi-disciplinary innovation Centers with 133 faculty, 835 students, and 360 industrial engineering liaisons. It emphasizes the advancement of Computer Science, Electrical Engineering, and Materials to secure continued U.S. thought leadership.
Todd brings a wealth of expertise with strengths in areas such as cultivating relationships with strategic partners, entrepreneurship and investment strategies, technology innovation, operational excellence, and talent management. He has spent much of his career working alongside young minds that are aspiring to influence the ever-changing world of smart and autonomous electronics. He has built programs from the ground up, leveraging his entrepreneurial leadership to drive new business development that has generated multi-millions in funding. He has been a key contributor in introducing new technology advances and starting new global research in the U.S., Europe, and Asia.
Dr. Younkin holds a Ph.D. from the California Institute of Technology in Pasadena, California. He completed his Bachelor of Science at the University of Florida in Gainesville, Florida. He aspires to continue to influence the next generation of technology and inventors, bringing ideas and investors together to drive heterogeneous electronic solutions that will deliver a smarter, shared future.
Biography: David Medeiros joined Entegris as a Senior Director of Engineering in the office of the CTO in April of 2021. His responsibilities involve developing an enterprise-wide lithography strategy, with a primary focus on the rapidly expanding field of EUV. Previously he spent six years at GLOBALFOUNDRIES (GF), first as the Senior Director of Patterning at Fab 8 in Malta, NY, and later as the Vice President of Central Engineering. Prior to GF, he spent seventeen years at IBM, starting as a Research Staff Member at T. J. Watson Research Center and culminating as the Director of Patterning R&D in the Microelectronics Division. His career began in the semiconductor industry as a synthetic chemist at Shipley Company, which is now part of DuPont. David holds a Ph.D. in Organic Chemistry from the University of Texas, Austin, where he was an Eastman Kodak fellow, and a B.S. in Chemistry from the University of Massachusetts, Amherst.
China
CAST EMG ESD Alliance FlexTech FOA ITL MSIG SCIS SE&A SiPAT Standards Workforce Development Off Add to Calendar 2021-09-24 00:00:00 2021-09-24 00:00:00 SEMI China Smart Mobility Webinar China SEMI.org [email protected] America/Los_Angeles publicSEMI Members: $49
Use your corporate email address during log in to be recognized as a SEMI Member.
Non-Members: $99
Students: Free
Contact Gity Samadi ([email protected]) with a picture of your student ID to receive your discount code.
Course Outline
About the Instructor
Mark D. Poliks, Ph.D. is a SUNY Distinguished Professor of Engineering and Empire Innovation Professor in Systems Science and Industrial Engineering and Materials Science and Engineering at the State University of New York at Binghamton. He is director of the Center for Advanced Microelectronics Manufacturing (CAMM), a New York State Center of Advanced Technology and home to the New York Node of NextFlex. He serves as Chair of the Smart Energy Transdisciplinary Area of Excellence at the Binghamton campus.
His research is in the areas of industry relevant topics that include high performance electronics packaging, flexible hybrid electronics, medical and industrial sensors, printed RF components, materials, processing, aerosol jet printing, roll-to-roll manufacturing, in-line quality control and reliability of electronics. He is the recipient of the SUNY Chancellor’s Award for Excellence in Research.
He received SEMI FLEXI awards for leadership in Technology and Education in 2009 and 2019. He has authored over one hundred fifty technical papers and holds forty-eight US patents. He was the General Chair of the 69th IEEE ECTC and serves as a IEEE Electronics Packaging Society (EPS) Distinguished Lecturer and an elected member of the IEEE EPS Board of Governors.
United States
This course, the 9th in the FlexTech Master Class Series, takes a deep dive into best known methods for optimizing flexible electronics into medical devices and industrial products. Our expert speaker cover the most important considerations when designing flexible and printable parts and circuits into systems or subsystems and the many approaches to consider.
This course is appropriate for those new to electronics design, as well as those familiar but looking for a refresher on the latest materials and techniques.
Venue: Xinhua Ballroom, 3F of HUALUXE Wuhu (No. 34 Changjiang South Road, Yijiang District, Wuhu City, Anhui Province)
China
CAST EMG ESD Alliance FlexTech FOA ITL MSIG SCIS SE&A SiPAT Standards Workforce DevelopmentSEMI International Standards Program
HB-LED China TC Chapter Fall Meeting 2021
Wednesday, September 22, 2021
13:30-16:30
Wuhu, China
Agenda
13:00 – 13:30 Registration
13:30 – 13:50 Welcome
13:50 – 13:55 Review and Approval of Previous Meeting Minutes
13:55 – 14:00 SEMI Staff Report
14:00 – 14:15 Liaison Reports
14:15 – 15:00 Task Forces Reports
15:00 – 15:50 Documents Request for Ballots
15:50 – 16:20 New SNARFs Application
16:20 – 16:25 New Action Items
16:25 – 16:30 Next Meeting Date & Locale
Web Meeting link：Click here
Standards Contact information:
Isadora Jin
Manager, SEMI China
Email: [email protected]
Phone: 86.21.6027.8578
China
CAST EMG ESD Alliance FlexTech FOA ITL MSIG SCIS SE&A SiPAT Standards Workforce DevelopmentSEMI International Standards Program
Compound Semiconductor Technology Forum
Note: Forum language is mandarin, no simultaneous Interpretation provided
Session 2: Ultra Wide Band Gap Wafer and Heat Sink Diamond Substrates
Speaker: Xing Zhang, CEO of Compound Semiconductor Manufacturing（Xiamen) Co., Ltd
Thursday, September 23, 2021
16:30-17:00
Wuhu, Anhui, China
Webinar Link: Click here
Event Contact information:
Ein Wu
SEMI China
Email: [email protected]
Phone: 86.21.6027.8509
China
CAST EMG ESD Alliance FlexTech FOA ITL MSIG SCIS SE&A SiPAT Standards Workforce DevelopmentSEMI International Standards Program
Compound Semiconductor Technology Forum
Note: Forum language is mandarin, no simultaneous Interpretation provided
Session 2: Progress of VCSEL Technology and Its Applications in 3D Sensing and Lidar
Speaker: Qingwei Mo, Chief scientist of ZJEAGLE.Co., Ltd
Thursday, September 23, 2021
16:35-17:00
Wuhu, Anhui, China
Event Contact information:
Ein Wu
SEMI China
Email: [email protected]
Phone: 86.21.6027.8509
China
CAST EMG ESD Alliance FlexTech FOA ITL MSIG SCIS SE&A SiPAT Workforce Development Off Add to Calendar 2021-12-21 00:00:00 2021-12-21 00:00:00 SEMI China Micro LED Forum China SEMI.org [email protected] America/Los_Angeles public