Biography: Phil Marzolf serves as Chief Commercialization Officer for Arieca, where he is responsible for transitioning Arieca’s technology from the laboratory to end market applications. He has over 30 years of experience commercializing new products in the semiconductor and computer technology markets. He was a founding member of nSerial, a SERDES startup that was acquired by Intel in 2001. Phil is an adjunct professor and entrepreneur in residence at Carnegie Mellon University and is an investor and Board member for several early-stage companies. He earned a BSEE from the University of Notre Dame, an MSEE from Santa Clara University, and an MBA from the Wharton School at the University of Pennsylvania.

Biography: Christine Kurek is currently the Sr. Director for the Customer Fulfillment Organization in the Electronics business of Merck KGaA, Darmstadt, Germany. In this Integrated Supply Chain role, Christine is responsible for Customer Service, and Logistics, as well as Process Enablement, functions, Master Data, and Analytics for the Electronics Division. Christine has over 25 years of experience in managing Materials Supply Chains that support the semiconductor industry. She earned a BS degree in Chemistry from Pennsylvania State University, a graduate certificate in Supply Chain Management from the Penn State Smeal College of Business; and, she has achieved certification as an APICS Certified Supply Chain Professional.

Biography: Julie Ply is the Director of Quality Materials at Brewer Science. Julie started her career in the semiconductor industry in 2014 as a Senior Quality Engineer with Brewer Science. Julie’s current responsibilities include oversight of BSI Strategic Supplier Development, Quality Engineering and Quality Control teams. Prior to that she spent 26 years of her career in automotive related manufacturing with an emphasis on process engineering and improvement. She has co-authored several papers for SAE (Society of Automotive Engineers) and TMS (The Minerals, Metals and Materials Society). She is a graduate of University of Missouri – Rolla (now Missouri University of Science and Technology) with a degree in Metallurgical Engineering.

Biography

Biography

The continued strong growth of the semiconductor industry has led to increased demand for wafer fab materials. This talk will assess relevant trends impacting key materials segments, overall wafer fab materials landscape. It will also review key suppliers and importance of 3DNAND to the overall materials industry.

Biography

Over 90% of NAND bits shipped today are fabricated with a 3D NAND process. 3D NAND is evolving with structural and material changes that will have significant impact on the material types and usages. 3D NAND has two major approaches in production: Floating Gate, a gate-first process with an oxide/poly memory stack was introduced by Intel-Micron, and continues to be used by Intel with SK Hynix set to take over from Intel. And, Charge Trap, a gate-last process with an oxide/nitride stack is in use at Kioxia, Micron, SK Hynix, Samsung, and others. Charge trap uses tungsten as the replacement word line material after etching out the nitride in the memory stack, whereas Floating gate uses poly that is retained as the word-line from the original memory stack. In addition to these high-level distinctions, changes in the placement of the peripheral CMOS, slot fill, word line and channel materials and others will all impact the materials needs. In this talk I will present the 3D NAND family tree and explore the structural changes by company and time, and the impact on material types and usage.

Paul Trio, Senior Manager, Strategic Initiatives
SEMI

Patrick Martin, Business Development, New Markets and Alliances
Applied Materials

Speaker Bios

David Laube, CTO,
Pentagon Technologies

Speaker Bios

Reed Rosenberg, CTO
Cleanpart USA

Speaker Bios

Victor Chia, International Expert; Director, Surface Contamination Technologies
Air Liquide / Balazs NanoAnalysis

Speaker Bios

Max van den Berg, System Architect, Electronics and Assembly, Global Application Engineering
Festo

Speaker Bios

Yusheng (Alvin) Zhou is a Product Marketing Manager in Surfscan & ADE division of KLA. Prior to that, he held various roles in global product management and process engineering for CVD products at Applied Materials. Alvin has a Ph.D. in Materials Science and Engineering and M.S. in Electrical Engineering from Georgia Institute of Technology.

Dr. Tim Z Hossain

Tim Z. Hossain received a Ph.D. in Chemistry with specialization in nuclear analytical from University of Kentucky in 1982. He worked at Eastman Kodak (1982-1989), Texas Instruments (1989-1991), and was at Cornell University teaching at Nuclear Engineering program (1991-1995), department of Applied Physics. He joined AMD in 1995, and currently serves as Chief Scientist at Cerium Laboratories, an AMD Spin-off Company. Dr. Hossain has broad experience in analytical methodologies, particularly for semiconductor process technology. He discovered the cosmic ray neutron effect on memory chips with borated dielectric. He was selected by IAEA of United Nations for a nuclear technology mission to Saudi Arabia. He is the former secretary/treasurer of American Nuclear Society. Tim has published over 100 papers and holds more than 30 patents to his credit.

Dr. Jim Conner

Jim Conner holds a PhD in Materials Science and Engineering from Cornell University and a BSc in Physics from the Massachusetts Institute of Technology. He conducted his doctoral work in thin film growth and characterization at Oak Ridge National Laboratory. He has worked at several semiconductor companies, including Motorola Semiconductor Products Sector, Freescale Semiconductor, Samsung, and Cerium Laboratories. Dr. Conner has specialized in high-resolution electron microscopy, including TEM/STEM and SEM imaging and associated analytical techniques including EDS and EFTEM. He has applied these methods to failure analysis of semiconductors and numerous other materials. He is an author or coauthor on over 40 publications in the field.

Dr. Rathsack is Vice President and Deputy General Manager of Technology and Manufacturing in Tokyo Electron America. His team is responsible for developing advanced equipment and process technologies in lithography track, etch, film deposition and cleans. His team specializes in advanced computational engineering, software applications and data science to develop SMART tools. He has 18 years of semiconductor development experience at Tokyo Electron and Texas Instruments. He is also a Senior Member of Technical Staff (SMTS) who has authored/ co-authored 50 publications and has 30 granted patents. He received his BS in chemical engineering from the University of Illinois/UC and his MS/PhD at the University of Texas/Austin.

E. Steve Putna is a Senior Supply Chain Manager at Intel Corporation focused on direct materials and capital equipment. Previously, Steve served in various engineering and supply chain roles inclusive of high-volume manufacturing, development and research spanning multiple Intel technology nodes. Steve additionally served as an Emerging Materials Thrust Director for the Semiconductor Research Corporation. Prior to Intel, Steve earned a PhD from the University of Pennsylvania and a BS from the University of Texas at Austin both in Chemical Engineering.

Dr. Bottoms received a B.S. degree in Physics from Huntington College in Montgomery, Alabama in 1965, and a Ph.D in Solid State from Tulane University in New Orleans in 1969 and is currently Chairman of Third Millennium Test Solutions. He has worked as a faculty member in the department of electrical engineering at Princeton University, manager of Research and Development at Varian Associates, founding President of the Semiconductor Equipment Group of Varian Associates and general Partner of Patricof & Co. Ventures. He has served as Chairman and CEO of many companies both public and private.

Dr. Bottoms has also served in a number of Government Advisory positions including Chairman of the Board on Assessment for NIST and a member of the Technical Advisory Committee on export controls for the US Commerce Department.

Dr. Bottoms has participated in the start up and growth of many companies through his venture capital activity and through his own work as an entrepreneur. These include companies in a wide range of industries.

Emeritus Member of the Board of Tulane University
Co-Chair of the Heterogeneous Integration Roadmap
Chairman of the SEMI’s Awards Committee
Chairman of the Packaging and Package Substrates Technical Working Group for INEMI
Member of the Board of MIT’s Microphotonic Center
Chairman of Fluence Analytics
Chairman of Third Millennium Test Solutions

Dr. Gambino received the B.S. degree in materials science from Cornell University, Ithaca, NY, in 1979, and the PhD degree in materials science from the Massachusetts Institute of Technology, Cambridge, MA, in 1984.

He joined IBM, Hopewell Junction, NY, in 1984, where he worked on silicide processes for Bipolar and CMOS devices. In 1992, he joined the DRAM development alliance at IBM's Advanced Semiconductor Technology Center, Hopewell Junction, NY. While there, he developed contact and interconnect processes for 0.25-, 0.175-, and 0.15-um DRAM products. In 1999, he joined IBM's manufacturing organization in Essex Junction, VT, where he worked on copper interconnects, CMOS image sensors, RF devices, and 3D integration.

He joined ON Semiconductor, Gresham, OR, in 2015. He is currently working on CMOS image sensors and high voltage semiconductors. He has published over 200 technical papers and holds over 500 patents.

Dr. Thomas Phely-Bobin is currently the Director of Applications and Metrology for the Microcontamination Control Division at Entegris. Thomas joined Entegris in 2012. Previously, Thomas led the Materials Research group at QinetiQ North America from 2004 to 2012. From 2002-2004, Thomas was a post-doctoral fellow at Sandia National Laboratories, US Department of Energy (Albuquerque, NM). Thomas earned an M.S. and PhD in Polymer Science and Engineering at the Institute of Materials Science at the University of Connecticut in 2001. Thomas is the author of more than 30 papers in technical journals or conferences, and 2 issued patents.

Dr. Dhiman Bhattacharyya is currently a member of technical staff at GLOBALFOUNDRIES. He has been working on process engineering in wet cleans for more than six years and also actively involved in analysis and quality improvements in bulk chemicals associated to wet cleans. Dhiman has published 10 papers at various technical conferences including ASMC, SPCC, CMC and UCPSS while representing GLOBALFOUNDRIES since 2013. Previously, Dhiman carried out his research works at Massachusetts Institute of Technology after completion of his Ph.D. He is a Ph.D. in chemistry from the University of Texas at Arlington with focus on surface modification by chemically vapor deposited polymer thin films. He has bachelor and master degrees in Polymer Science & Technology from Calcutta University, India. He has more than 30 publications in top peer-reviewed journals and technical conferences and 8 US patent applications with 4 being issued prior to joining GLOBALFOUNDRIES.