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Brooks Instrument Launches Ultra-Compact, High-Performance Mass Flow Controller

HATFIELD, Pa. (USA), June 18, 2026 — Brooks Instrument, a world leader in precision fluid measurement and control technology, announced the global launch of its new ultra-compact AMF Series™ Advanced Mass Flow Controller. About the size of a standard Post-it® Note pad, it has the smallest footprint of any mass flow controller (MFC) in its performance class.

Combining precise gas flow control, fast response, industry-leading 1000:1 turndown capability and advanced diagnostics, the AMF Series offers equipment manufacturers and end users more operating flexibility and improved reliability and process control without the limitations of traditional compact MFCs.

“Equipment designers historically have had to choose between compact dimensions and advanced capabilities,” said Steve Kannengieszer, Global Marketing Director. “With the AMF Series, we’re changing that trade-off. Customers can now integrate high-performance flow control and predictive diagnostics into the most space-constrained systems without sacrificing accuracy, reliability or process insight.”

Advanced Features in a Compact Footprint

As equipment size across industries continues to shrink while growing in complexity and throughput, maintaining stable and precise gas flow becomes increasingly critical. The AMF Series was developed specifically to address these challenges.

With a 1-inch x 3-inch x 3-inch footprint, the MFC fits easily inside compact gas cabinets. Despite its small size, the highly accurate AMF Series features advanced capabilities, including integrated EtherNet/IP™ digital communications and onboard diagnostics for predictive maintenance.

By providing actionable diagnostic data alongside accurate flow measurement and control, the AMF Series helps users identify potential issues before they impact production, reducing unplanned downtime and improving overall equipment effectiveness.

Easier Operation and More Uptime

In addition, the AMF Series was designed to maximize uptime and simplify operation with a universal USB-C service port and embedded web-based interface that streamlines in-situ commissioning and troubleshooting. Industry-leading long-term sensor stability helps reduce maintenance requirements and eliminate periodic recipe adjustments and recalibrations.

The AMF Series also supports multi-gas configurability and simplified ordering bundles, helping OEMs reduce system complexity while streamlining product selection and integration.

Wide Range of Use

The AMF Series is especially suitable for pilot-scale applications where precise low-flow gas control and equipment miniaturization are critical, including:
• Bioprocessing and laboratory-scale bioreactors
• Thin film coating and vacuum deposition systems
• Carbon capture, utilization, and storage (CCUS)
• Hydrogen and energy transition technologies
• Analytical instrumentation
• University and research laboratories
• Industrial gas processing

Demand for Smaller Instrumentation

“Across biotechnology, we’re seeing a shift toward smaller-scale development platforms that demand greater flexibility and precision from process instrumentation,” said Joe Sipka, Business Development Director, Biotechnology. “The AMF Series was developed for micro-dosing and pilot-scale systems and delivers a wealth of digital insights—including health indicators, reliability metrics and pedigree—that enable greater automation and support a path to prescriptive maintenance. Many of these same trends are emerging in adjacent applications, such as industrial coatings, where engineers are being asked to do more with increasingly compact systems. Developed directly from conversations with our customers, the AMF Series delivers the precise low-flow control, wide operating range and reliability needed to accelerate innovation while maximizing valuable equipment space.”

For more information about the AMF Series Advanced Mass Flow Controller, visit www.BrooksInstrument.com/product/AMF.

About Brooks Instrument:
Since 1946, Brooks Instrument has been a leader in precision fluid measurement and control technology. Providing instrumentation for flow, pressure and vapor delivery, the company serves customers in semiconductor and high-tech manufacturing, laboratories and other processes and industries. With manufacturing, sales and service locations in the Americas, Europe and Asia, Brooks Instrument has the world’s largest installed base of mass flow controllers.

For more information, please visit www.BrooksInstrument.com. The company is also on LinkedIn (www.linkedin.com/company/Brooks-Instrument) and YouTube (www.youtube.com/user/Brooks407).

RENA Technologies GmbH, a long-standing and experienced manufacturer of wet processing solutions for the semiconductor, advanced packaging, and solar industries, has been awarded a multi-million Euro order by a leading European semiconductor manufacturer for a specialized cleaning application designed for advanced substrates.

The solution is based on a high-performance batch wet processing platform and has been specifically engineered to deliver ultra-clean and highly efficient processing of demanding substrates. By combining advanced process control with a scalable batch architecture, the system ensures outstanding process stability, repeatability, and optimized throughput.

The customer’s decision underscores the technological strength and competitiveness of RENA’s wet processing solutions. Particularly when handling complex substrate materials, the application provides significant advantages in quality assurance, process control, and overall production efficiency. The mature cleanroom capabilities, excellent process control, and high- volume automation solutions of RENA add up to the perfect fit for the customer’s needs.

With this order, RENA further strengthens its position in the European semiconductor market and reinforces its commitment to delivering innovative, locally supported solutions to key industry players.

“Our success in securing this project highlights the growing demand for advanced wet processing technologies in Europe,” said Peter Schneidewind, CEO of RENA Technologies GmbH. “With more than 80 glass treatment tools in production worldwide - including cutting etch TGV/advanced packaging applications - RENA´s sophisticated technological solutions prove again in this new application for specialized semiconductor substrates.”

United States Japan Taiwan South Korea Belgium France Germany Ireland Italy Russia India Malaysia Singapore Vietnam Inside the Fab Oct 27 Training

Course Description 

This course provides a comprehensive introduction to semiconductor manufacturing, guiding participants through the complete journey from silicon fundamentals to chip fabrication and packaging. Designed for professionals new to the semiconductor industry, the course explains key concepts, terminology, devices, and manufacturing processes used in modern fabs. 

Who Should Attend

Anyone interested in understanding semiconductor manufacturing, including new employees, professionals in related industries, and those seeking to broaden their knowledge of the field.  

Learning Objectives

Upon completion of the course, participants should be able to:

  • Explain fundamental semiconductor concepts, including silicon materials, doping, PN junctions, and basic device behavior. 
  • Identify and correctly use common semiconductor manufacturing terminology.
  • Outline the key steps involved in front-end wafer fabrication, from bare silicon to patterned wafers.
  • Summarize back-end manufacturing processes, including assembly, packaging, and testing.

Topics Included

  • Basic Electronics and Microelectronics
  • Process Nodes
  • Device Physics and Transistor Operation
  • Crystal Growth and Wafer Preparation
  • Advanced Transistor Technologies
  • Circuit Design and Layout
  • Wafer Processing

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge. 

Can't find the training link on the day of the training? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders 24 hours in advance and 1 hour before, with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

 

Kalya Shubhakar
Kalya Shubhakar
Senior Lecturer
 

 

Singapore

- SEMI U

Strengthen your knowledge and skills by learning about the journey from silicon fundamentals to chip fabrication and packaging. 

Singapore: 3:00pm - 7:00pm

India: 12:30pm - 4:30pm

London: 8:00am - 12:00pm
 

Pricing                     
  • Members:  $399
  • Non-Members:  $449

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]

3:00 pm - 7:00 pm Off Add to Calendar 2026-10-27 15:00:00 2026-10-30 19:00:00 Inside the Fab: An Introduction to Semiconductor Manufacturing (Asia) 10/27 Strengthen your knowledge and skills by learning about the journey from silicon fundamentals to chip fabrication and packaging. Singapore: 3:00pm - 7:00pmIndia: 12:30pm - 4:30pmLondon: 8:00am - 12:00pm Pricing                     Members:  $399Non-Members:  $449* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected] Singapore SEMI.org [email protected] Asia/Singapore public Asia/Singapore Register Now
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Belgium China France Germany India Ireland Italy Japan Malaysia Singapore South Korea Taiwan United States Vietnam Download the white paper Cost Benefit Calc cropped for events page Business Technical Training
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SEMI
United States

9:00 am - 9:15 pm
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Peilun Sun
Consortium Manager
SEMI

Setting the Stage: Industry Drivers & SCC Initiative Context

• Semiconductor Industry Decarbonization Challenges
• The Need for Quantified Business Cases
• SCC Initiative Background & Development Journey
• Vision for Industry Adoption & Collaboration

9:16 am - 9:34 am
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Ben Gross
Director DTMS - Sustainability
Applied Materials

SCC Cost-Benefit Calculator Overview & Walkthrough

• Tool Architecture & Methodology
• Key Inputs & Assumptions
• Understanding the Outputs & Metrics
• Live Demonstration & Example Scenario
• Current Limitations & Future Development Opportunities

9:36 am - 9:50 am
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Jeff Rudnik
Director of Environmental Sustainability & Net Zero
ASM

Industry Use Cases & Practical Applications

• Evaluating Decarbonization Projects
• Comparing Alternative Mitigation Strategies
• Supporting Internal Investment Decisions
• Lessons Learned from Early Applications
• Opportunities for Industry Collaboration

9:51 am - 10:00 am

Open Discussion & Q&A

• Audience Questions
• Feedback & Enhancement Opportunities
• Next Steps & SCC Engagement Opportunity

Smart MFG Sustainability

The semiconductor industry is under increasing pressure to decarbonize its operations, particularly with regard to Scope 1 emissions — direct greenhouse gas emissions (GHG) from owned or controlled sources. Yet many companies face a persistent challenge: how to make a clear, consistent, and financially credible case for emissions reduction investments. To help address this need, the Semiconductor Climate Consortium (SCC) has developed a Cost-Benefit Calculator — a simplified and flexible tool that offers a structured starting point for evaluating carbon emissions reduction projects. The calculator enables users to estimate the Net Present Cost (NPC) per ton of CO₂ equivalent emissions reduction, helping to translate environmental impact into business-relevant terms.

Join SEMI's Semiconductor Climate Consortium (SCC) Scope 1 Working Group and document authors for a webinar discussing their journey creating the Cost-Benefit Calculator and outlining the use cases for this tool.  The Cost-Benefit Calculator is a functional spreadsheet with built in report creation tools. For business managers who need to calculate emissions for Scope 1.

SCC members can download the Cost Benefit Calculator Report here.

9:00 am - 10:00 am Off Add to Calendar 2026-06-16 09:00:00 2026-06-16 10:00:00 SCC: Cost Benefit Calculator Webinar The semiconductor industry is under increasing pressure to decarbonize its operations, particularly with regard to Scope 1 emissions — direct greenhouse gas emissions (GHG) from owned or controlled sources. Yet many companies face a persistent challenge: how to make a clear, consistent, and financially credible case for emissions reduction investments. To help address this need, the Semiconductor Climate Consortium (SCC) has developed a Cost-Benefit Calculator — a simplified and flexible tool that offers a structured starting point for evaluating carbon emissions reduction projects. The calculator enables users to estimate the Net Present Cost (NPC) per ton of CO₂ equivalent emissions reduction, helping to translate environmental impact into business-relevant terms.Join SEMI's Semiconductor Climate Consortium (SCC) Scope 1 Working Group and document authors for a webinar discussing their journey creating the Cost-Benefit Calculator and outlining the use cases for this tool.  The Cost-Benefit Calculator is a functional spreadsheet with built in report creation tools. For business managers who need to calculate emissions for Scope 1.SCC members can download the Cost Benefit Calculator Report here. SEMI United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Register Today!
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ROSENHEIM, Germany / KUALA LUMPUR, 5 May 2026 — esmo group (esmo), a leading global full-service systems integrator, developer, and supplier of advanced automation solutions for the semiconductor test industry, today announces the debut of its X-change Cart. A dedicated, semi-automated Device Interface Board (DIB) exchange system that enables a complete load board changeover by a single operator in under one minute, the X-change Cart addresses the safety, efficiency, and reliability challenges associated with manual board handling on the semiconductor test floor.

In high-mix semiconductor test environments, load board changeovers are a frequent and operationally significant activity. The reliance on manual handling has long presented challenges around changeover time, operator safety, and the risk of damage to high-value boards.

“Across test floors, we kept seeing the same pattern,” said Josef Weinberger, Head of Business Unit, esmo semicon. “Board changeovers were slow, physically demanding, and too dependent on individual technique. In tight spaces, that's where mistakes happen and time is lost. That observation drove us to build a dedicated solution that makes changeovers fast, repeatable, and manageable by a single operator in under a minute.”

Engineered for the Modern Test Floor

The X-change Cart removes the physical demands and variability of manual board handling from the equation entirely. Through a structured, HMI-controlled process, a single operator can lock, rotate, and transfer a board to the tester within a minute. The ability to carry two boards in a single trip makes that timescale achievable in practice. Thoughtful design details, including a ±180° rotation at the locking mechanism and a ±90° tower swivel, address the real-world constraints of a busy test floor.

Broad compatibility with leading ATE platforms (e.g. Teradyne, Advantest, SPEA and more) facilitates integration into existing multi-vendor environments without reconfiguration, allowing OSATs and IDMs to realise multiple benefits without disruption to their current setup.

For facilities with longer-term automation objectives, an optional configuration allows the interface tower to be mounted onto a customized AGV or AMR, providing a practical upgrade path toward autonomous test floor operations. The modular design further allows additional features to be incorporated as operational requirements evolve.

Weinberger added, “Reliability in production comes down to the details. The gripper head is engineered to perform consistently under real production conditions, with ESD-safe construction ensuring the board is protected at every point of contact. That level of engineering discipline is what makes the difference on a real production floor.”

X-change Cart Key Features

  • Modular DIB exchange system for reliable, error-free board loading and unloading
  • One-person operation — complete board change in under one minute
  • Transports two load boards simultaneously for rapid exchange
  • Full multi-axis rotation: ±180° at locking mechanism | ±180° Y-axis | ±90° Z-axis
  • Compatible with leading ATE platforms — Teradyne, Advantest, SPEA and more
  • Interfaces with test head, prober, DIB-loader, storage rack, and maintenance workbench
  • Tower swivels ±90° for use in narrow corridors and constrained test floor layouts
  • Integrated Human-Machine Interface (HMI), sensor detection, safety hand-brake, and modular battery
  • Optional: fully automated configuration mountable on AGV or AMR

The X-change Cart will be available for live demonstration at the esmo booth throughout SEMICON Southeast Asia 2026. Visit esmo at Booth 2145, Hall 8, Level 2, MITEC Kuala Lumpur from 5–7 May 2026, or contact [email protected] to arrange a meeting or request further information.

Date: April 21, 2026
Location: Hsinchu, Taiwan

yieldWerx is expanding its presence in Taiwan through a collaboration with Enlight Technology Co., Ltd., bringing advanced test data aggregation and analysis capabilities to one of the world’s most concentrated semiconductor markets.

The collaboration combines Enlight Technology’s established role across Taiwan’s semiconductor design, manufacturing, and research landscape with yieldWerx’s expertise in data aggregation and statistical analysis. Together, the companies aim to address the increasing demand for data-driven yield optimization as device complexity grows across advanced packaging, silicon photonics, and heterogeneous integration.

Enlight Technology is the authorized representative of Siemens EDA in Taiwan and provides a portfolio of electronic design automation (EDA), manufacturing execution systems (MES), and engineering solutions spanning IC, silicon photonics, MEMS, PCB, and system-level applications. The company supports semiconductor and electronics customers, including fabless design houses, foundries, OSATs, and system companies, with engagement across more than 100 semiconductor organizations and 300 system companies in the region.

As part of the partnership, the companies will work together to:

Provide localized technical engagement and support aligned with Taiwan’s semiconductor workflows and language requirements.

Support improved yield learning cycles and more efficient production ramp across the region.

Extend yield analytics capabilities into an ecosystem spanning design, verification, and manufacturing execution.

“We are excited to partner with Enlight Technology as we expand into Taiwan and the broader Asian market. Their deep domain expertise and strong ecosystem presence significantly enhance our ability to deliver scalable, data-driven yield solutions to customers operating at the forefront of semiconductor innovation.” — Aftkhar Aslam, CEO, yieldWerx

“As advanced packaging and silicon photonics drive exponential test data growth, our partnership with yieldWerx equips Taiwan's ecosystem with powerful statistical analysis. We empower customers to turn complex data into actionable insights, accelerating yield learning and time-to-market” — Su Cheng Yu, General Manager, Enlight Technology

About yieldWerx
yieldWerx is a leading data and yield analytics platform for semiconductor manufacturing, advanced packaging, and photonics I/O. The platform provides end-to-end visibility across wafer probe, optical and electrical wafer acceptance, module assembly, and system-level test. By analyzing this data, yieldWerx helps organizations understand yield performance, variability, and production trends, enabling optimized quality and faster time-to-market.

About Enlight Technology Co., Ltd.
Enlight Technology Co., Ltd. is a Taiwan-based provider of electronic design automation and engineering solutions and serves as the authorized representative of Siemens EDA in Taiwan. The company delivers solutions spanning IC, silicon photonics, MEMS, PCB, DFM, and manufacturing execution systems, supporting customers from IC-level design to system-level integration. With over three decades of experience, Enlight Technology provides customized solutions and technical services to the electronics industry.

For further information, please visit https://www.yieldWerx.com or https://www.enlight-tec.com/.

China Japan Taiwan South Korea Belgium France Germany Ireland Italy Russia India Malaysia Singapore Vietnam Inside_Fab Training

Course Description 

This course provides a comprehensive introduction to semiconductor manufacturing, guiding participants through the complete journey from silicon fundamentals to chip fabrication and packaging. Designed for professionals new to the semiconductor industry, the course explains key concepts, terminology, devices, and manufacturing processes used in modern fabs. 

Who Should Attend

Anyone interested in understanding semiconductor manufacturing, including new employees, professionals in related industries, and those seeking to broaden their knowledge of the field.  

Learning Objectives

Upon completion of the course, participants should be able to:

  • Explain fundamental semiconductor concepts, including silicon materials, doping, PN junctions, and basic device behavior. 
  • Identify and correctly use common semiconductor manufacturing terminology.
  • Outline the key steps involved in front-end wafer fabrication, from bare silicon to patterned wafers.
  • Summarize back-end manufacturing processes, including assembly, packaging, and testing.

Topics Included

  • Basic Electronics and Microelectronics
  • Process Nodes
  • Device Physics and Transistor Operation
  • Crystal Growth and Wafer Preparation
  • Advanced Transistor Technologies
  • Circuit Design and Layout
  • Wafer Processing

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge. 

Can't find the training link on the day of the training? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders 24 hours in advance and 1 hour before, with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

 

Kalya Shubhakar
Kalya Shubhakar
Senior Lecturer
 

 

Singapore

- SEMI U

Strengthen your knowledge and skills by learning about the journey from silicon fundamentals to chip fabrication and packaging. 

Singapore: 3:00pm - 7:00pm

India: 12:30pm - 4:30pm

London: 8:00am - 12:00pm
 

Pricing                     
  • Members:  $399
  • Non-Members:  $449

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]

3:00 pm - 7:00 pm Off Add to Calendar 2026-08-17 15:00:00 2026-08-20 19:00:00 Inside the Fab: An Introduction to Semiconductor Manufacturing (Asia/EU) Strengthen your knowledge and skills by learning about the journey from silicon fundamentals to chip fabrication and packaging. Singapore: 3:00pm - 7:00pmIndia: 12:30pm - 4:30pmLondon: 8:00am - 12:00pm Pricing                     Members:  $399Non-Members:  $449* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected] Singapore SEMI.org [email protected] Asia/Singapore public Asia/Singapore Register Now
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Thank you to our sponsors:  

 

 

         Sundt Construction Company & General Contractor | Sundt                                   SCREEN logo

 

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United States

9:00 am - 9:10 am

Welcome and Overview of the Water Management Working Group

9:10 am - 9:25 am
Pascal Osten
Leader, Water Solution Providers Cohort
Pascal Osten
DAS Environmental Expert GmbH

Procedures Guide

9:25 am - 9:35 am
Catherine Marsan-Loyer
Co-Lead, Fab, OSATs Cohort
Catherine Marsan-Loyer
C2MI

Water Savings Guide and Baseline-setting

9:35 am - 9:45 am
Jared Burdik
Co-Lead, Fab, OSAT Cohort
Jared Burdick
Sundt Corp.

Solutions Maturity Scale

9:45 am - 9:55 am

Q&A & WrapUp

EHS SMG Sustainability EMG FOA Standards

Join the SEMI Water Management team and document authors for a webinar discussing their research and findings for the Water Management Strategy Reports.  The reports are guides for water managers for understanding their water balance, baseline, potential savings and a general maturity scale for several solutions to be considered to move up the maturity scale to Zero Liquid Discharge (ZLD). The webinar will provide an overview on how the documents should be used to work with water solutions providers and provide strategies for both new and legacy facilities with end-of-pipe solutions as well as treatments for individual process stage water discharge. 

The webinar will include a discussion of next steps for the continued development of the reports, including how they interact with SEMI Standards and the industry roadmaps.

Reports can be downloaded HERE.

9:00 am - 10:00 am Off Add to Calendar 2026-05-21 09:00:00 2026-05-21 10:00:00 Water Management Strategies Webinar Join the SEMI Water Management team and document authors for a webinar discussing their research and findings for the Water Management Strategy Reports.  The reports are guides for water managers for understanding their water balance, baseline, potential savings and a general maturity scale for several solutions to be considered to move up the maturity scale to Zero Liquid Discharge (ZLD). The webinar will provide an overview on how the documents should be used to work with water solutions providers and provide strategies for both new and legacy facilities with end-of-pipe solutions as well as treatments for individual process stage water discharge. The webinar will include a discussion of next steps for the continued development of the reports, including how they interact with SEMI Standards and the industry roadmaps.Reports can be downloaded HERE. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Watch the recorded webinar
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High-performance connectivity software delivers structured, high-volume equipment data required by tier-one fabs and advanced packaging facilities ahead of the expected mid-2026 SEMI standards update

POITIERS, March 25, 2026 – Agileo Automation, a leading provider of control and connectivity solutions for global semiconductor manufacturing, today unveils Agil'EDA, a new software solution implementing Equipment Data Acquisition (EDA), a set of SEMI standards also known as Interface A, to enable semiconductor equipment manufacturers to meet the evolving high-performance connectivity requirements of tier-one fabs and advanced packaging facilities.

As semiconductor manufacturing moves towards higher levels of automation and data-driven optimization, fab owners increasingly require EDA alongside traditional SECS/GEM connectivity from semiconductor OEMs for their production tools. Agil'EDA addresses this by separating the control flow from the data flow, ensuring that structured, high-frequency data collection does not interfere with critical equipment operations.
Designed for long-term deployment, Agil'EDA fully supports the widely used EDA Freeze 2 (SOAP/XML) and is architected for the transition to Freeze 3 (gRPC/protocol buffers). This next-generation standard offers significantly higher data throughput and reduced latency. Agileo has already successfully tested and validated its EDA Freeze 3 implementation at SEMI’s North America Standards Fall Meetings in November 2024 in Milpitas, California. SEMI’s EDA Freeze 3 standards suite is expected to be released mid-2026.

Complementing the SECS/GEM standards used to control equipment behavior, Agil’EDA incorporates robust cybersecurity features such as authentication and encrypted communications. The product is available as a stand-alone solution for any existing equipment software using a platform-independent gRPC application programming interface (API) to communicate with it or as a pre-integrated component within Agileo’s A²ECF-SEMI framework. When used with Agil'GEM and Agil'GEM300, it provides a comprehensive connectivity solution that significantly reduces time to market for OEMs.

"With the growing demand for data to improve yield in tier-one fabs, as well as in Advanced Packaging and 3D integration, EDA is no longer optional. It is becoming a mandatory requirement for equipment entering the world's most advanced fabs," explains Marc Engel, chief executive officer of Agileo Automation. "The key value we deliver for OEMs is a fast and easy adoption path for a seamless EDA architecture that delivers compliant production machines to global fab customers. By providing a future-proof architecture ready for Freeze 3, which will significantly increase performance, we address OEMs’ current needs while preparing them for the evolving requirements of semiconductor manufacturing, including AI-driven process control."

- ends -

About Agileo Automation
Agileo Automation is a trusted partner for equipment manufacturers, helping them build smarter, automated, and more connected machines that integrate seamlessly into advanced semiconductor fabs. Founded in 2010 in Poitiers, France, Agileo helps OEMs with control, communication, data acquisition, and testing across their tools through proven software and expert support. Its flagship A²ECF-SEMI framework provides a solid foundation for developing equipment controllers fully aligned with SEMI SECS/GEM, GEM300, and EDA standards. As an active member of SEMI and the OPC Foundation, Agileo Automation contributes directly to shaping the standards that drive manufacturing. For more information, please visit our website or follow us on LinkedIn.

Dresden, Germany, March 24, 2026 – As semiconductor manufacturing continues to expand in China, reliable and efficient environmental technologies are becoming increasingly important for stable and sustainable fab operation. DAS Environmental Experts presents its SALIX wet scrubber product family, a series of high-efficiency point-of-use systems designed for the treatment of waste gases from wet chemical processes in semiconductor manufacturing.

SALIX systems are engineered to ensure high removal efficiency and stable operation in demanding semiconductor production environments. SALIX reliably removes substances such as IPA, ammonia and hydrofluoric acid (HF) from waste gas streams of modern single wafer clean systems – a key contribution to safe and sustainable semiconductor manufacturing. In addition, the technology removes particles, salts and droplets from the processed gas stream. The robust system design supports high uptime and long maintenance intervals, contributing to reliable fab operation.

A key advantage of the SALIX product family is its flexible portfolio. SALIX products are among the smallest and most compact systems on the market and are suitable for both new fabs and retrofit applications in existing fabs. DAS Environmental Experts offers the technology in four different products, providing semiconductor manufacturers with a wide range of configuration options:

• NEW: SALIX – the latest release with improved performance and optimized system operation
• SALIX MINI – a compact two-stage system for space-constrained installations
• NEW: SALIX MICRO [SR1.1]– a highly compact configuration with pre-scrubber section for flexible integration

This structured product portfolio enables customers to select the most suitable system according to process requirements, fab layout and integration needs. The availability of multiple system variants within one technology platform provides semiconductor manufacturers with excellent flexibility in system selection and plant design.

SALIX systems are designed for compatibility with all common process tools and can be adapted to a wide range of wet chemical applications. Their compact design and flexible configuration support efficient integration into modern fabs, helping manufacturers optimize both environmental performance and operational efficiency.

The SALIX product family will be presented during SEMICON China 2026 (March 25–27, Shanghai New International Expo Centre). Interested visitors can learn more about the technology and its applications at the DAS Environmental Experts booth (Booth N2 | 2619).

With more than three decades of experience in environmental technology for the semiconductor industry, DAS Environmental Experts continues to support chip manufacturers worldwide with solutions that combine high process reliability, efficient emission treatment and long-term operational stability.

About the Company
DAS Environmental Experts Group (DAS Group), headquartered in Dresden, Germany, was founded in 1991 and is now a global organization with subsidiaries on three continents and more than 950 employees worldwide. Over the past three decades, DAS Group has become one of the leading technology and equipment providers for waste gas abatement solutions with a focus on semiconductor industry.
In addition, DAS Group develops advanced process and system solutions for industrial water treatment, with extensive expertise in the recycling and reuse of wastewater from the semiconductor industry.
DAS solutions are engineered to meet the stringent purity requirements of semiconductor manufacturing, helping clients comply with global environmental standards.