This cutting-edge panel-level wet processing demo tool handles large 510 × 515 mm substrates, delivering world class, high density Through Glass Vias (TGV) formation and ultra-small taper angles essential for advanced packaging in high performance computing.

Gütenbach, Germany – July 15, 2025 – RENA Technologies, a leading manufacturer of wet processing equipment for semiconductor and advanced packaging production, today announced the ramp-up of its dedicated glass core substrates facility in Germany. This new line, designed for substrates up to 510 × 515 mm, immediately opens for customer test lots, underscoring RENA's proven expertise in glass processing and creating new opportunities for process development and customer sample production. “As experts in precision wet processing, we can now offer large panel demo services for high aspect ratio through glass via (TGV) formation on various glass types,” said Dr. Holger H. Kuehnlein, SVP Technology at RENA. “Our alkaline based TGV process delivers extremely small taper angles, low sidewall roughness, and exceptional dimensional control at panel scale, enabling high density via applications. Customers can begin validating these capabilities today.”

Why Glass, and Why Wet Processing?
Glass substrates offer significant advantages for advanced electronics, including ultra-flat surfaces, low dielectric loss, and superior thermal stability. However, realizing these benefits at scale requires defect free surface preparation and the formation of uniform, high density TGVs with minimal taper angles. RENA's wet processing systems are specifically designed to address both challenges:
1. Surface Engineering – Our systems ensure precise cleaning and stress relief across 600 x 600mm panels with submicron total thickness variation (TTV).
2. Chemically Formed TGVs – Following initial laser modifications performed by our specialist partners, RENA’s proprietary chemistries form, enlarge and shape each via to exact specifications. This process consistently delivers very small taper angles and smooth sidewalls, ideal for subsequent metallization.

By collaborating with leading German and international laser partners, RENA offers customers the flexibility to choose their preferred laser vendor while ensuring all downstream wet processing steps are handled by our advanced equipment.

Key Highlights of the New Facility
Panel Size: Focus on 510 x 515mm and up to 600 × 600mm, smaller possible
Tool Set: Alkaline TGV etching, advanced rinse/dry, optical inspection & metrology
Field-Proven Recipes: Process conditions migrated from high volume tools
On-Demand Access: Customers may run demo substrates, qualify custom chemistries, or request full process flows
Sustainability: Low temperature chemistries and closed loop water reclamation reduce energy and ultrapure water (UPW) consumption

Market Impact
High-Performance Computing (HPC) as well as 5G/6G RF modules increasingly require new package designs, including panel-level fan-out and trend towards more complex chiplet architectures. Glass substrates, long considered the “holy grail” for core and interposer material, effectively eliminate the limitations imposed by warpage and dielectric loss in organic substrates. By combining laser modification from our vetted partners with RENA's chemistry driven via shaping, designers can now validate glass packaging concepts on the lab-platform proven at 600x600mm dimensions.
“With this lab-tool, we've created a great opportunity for semiconductor manufacturers to perform demos on panel level glass substrates,” added Peter Schneidewind, CEO of RENA. “From surface preparation to via formation, our wet process flow is ready for customers substrates to support TGV technology breakthroughs. This is world class made in Black Forest.”

Availability & Engagement Model
• Testing available now
• Flexible collaboration: Bring your own laser modified substrates, or leverage RENA’s ecosystem partners to benefit from joint process development support, and metrology services for process validation.

About RENA Technologies GmbH
RENA Technologies is a leading global supplier of production machines for wet chemical surface preparation. RENA products are used in path-breaking application fields such as semiconductors, MedTech, renewable energies, the glass industry and additive manufacturing. RENA equipment is used to treat or modify surfaces of, for example, semiconductor wafers, solar cells, glass, optical substrates, 3D-printed metal components or other high-tech products using wet chemical processes. RENA offers proven standard machines as well as customer-specific solutions and process support.

CONTACT
Sales:
Felix Fink
Phone: +49 7723 9313-403
E-Mail: [email protected]

Press:
Dirk Hensel
Phone:+49 7723 9313-914
E-Mail: [email protected]
www.rena.com

• Read more about RENA Technologies Commissions High-Tech-Processing Facility for TGV Glass Substrates

Martinez, CA—EUV Tech (EUVT), a global leader in designing and manufacturing at-wavelength EUV metrology equipment, is excited to announce the release of the FALCON Photoresist Flood Exposure Tool. As our next-generation EUV resist characterization and diagnostics tool, FALCON allows photoresist manufacturers to rapidly and accurately test EUV resist sensitivity, as well as providing patterning materials developers critical insights into exposure mechanisms.

Built upon EUV Tech’s proven resist tool technology, FALCON is a fully automated tool that supports high-throughput contrast curves on EUV-patterning materials and radiation chemistry diagnostics by integrating a wide variety of optional add-on analysis and processing modules.

Enhancing FALCON’s platform is an array of in-situ analysis and process modules, including Fourier Transform Infrared (FTIR) Spectroscopy, Atomic Mass Spectrometry, Total Electron Yield (TEY), Photo-Electron Spectroscopy (PES), environmental and vacuum bake module with additional diagnostics, and a scanner-environment exposure module.

Key to FALCON’s effectiveness is its highly uniform exposure spot size of 6 mm, supporting high-sensitivity chemical analysis and over 1,000 exposures for a 300 mm wafer in a single recipe run. Built-in data visualization tools make it possible to analyze this rich data. Combining uniformity, high configurability, and deep data collection and analysis makes FALCON a highly efficient, cost-effective tool for advanced photoresist development.

For more information on the enhanced FALCON Flood Exposure Tool or any of EUV Tech’s at-wavelength metrology tools, please visit euvtech.com.

About EUV Tech
EUV Tech enables technology advancement in the frontiers of semiconductor manufacturing and material science through the development of world-leading EUV and soft-x-ray instrumentation and techniques.

For further information, contact:
EUV Tech, Inc.
[email protected]
+1 (925) 229-4388

• Read more about EUV Tech Advances Semiconductor Manufacturing with the Launch of FALCON

Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson’s customer, Powertech Technology, Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. For details about this solution developed in late 2024 and 2025, download the case study here: Customer Success: Powertech Technology Inc. (PTI) Advances Panel Level Packaging with Nordson.

PTI, one of the world’s top OSAT (Outsourced Semiconductor Assembly and Test) companies, worked with the Nordson applications team to set up a comprehensive PLP demonstration that achieved high-quality, void-free underfill results at scale, using the industry-leading ASYMTEK Vantage® Series fluid dispensing system, equipped with the ASYMTEK IntelliJet® Jetting system. Nordson’s precision technology mitigated warpage and optimized fluid flow while decreasing cycle time by almost 30%.

PLP offers a path to managing the complexity of larger die sizes and higher-density designs while maintaining manufacturability and cost efficiency as the semiconductor industry transitions from 300-mm wafers to panels. PTI is enabling PLP applications that are designed to meet the semiconductor industry’s growing demands to serve AI, high-performance computing (HPC), and chiplet-based architectures.

Underfill has been pivotal in semiconductor packaging since the adoption of flip-chips in the 1990s. As applications have become more demanding, particularly in high-performance CPUs, GPUs, and advanced architectures like flip-chip and 2.5D/3D ICs, the importance of underfilling to enhance mechanical reliability and thermal performance has grown. Since the beginning, Nordson developed innovations for underfill processes as the industry evolved from PC board, substrate, wafer, and now panel applications.

Nordson’s distributor, Jetinn Global Equipment Ltd., supported the advancements discussed in this case study by investing in demonstration equipment and providing expert technical support.

• Read more about Nordson Electronics Solutions develops panel-level packaging solution for Powertech Technology, Inc. that achieves yields greater than 99% for underfilling during semiconductor manufacturing

Test Research, Inc. (TWSE: 3030), the leading test and inspection systems provider for the electronics manufacturing industry, is proud to announce its successful partnership with Bosch in the development of an AI visual check solution for MEMS packaging.

Bosch has recognized TRI's valuable contribution to their success in MEMS packaging in 2025 with a Certificate of Appreciation. The certificate acknowledges the successful completion of the AI visual check for MEMS packaging, highlighting the strong cooperation and partnership between the two companies.

This collaboration demonstrates TRI's expertise in AI-driven inspection solutions and its commitment to providing valuable solutions for the electronics manufacturing industry. TRI's AI-powered solutions include the AI Defect Detection, AI Smart Programming, AI Verify Host, AI training tool, AI Station, and more.

Please visit the following link to learn more about TRI's AI Solutions:
https://www.tri.com.tw/en/about/about-107-2-2.html

Learn more about the Bosch Group by following the link below:
https://www.bosch-presse.de/pressportal/de/en/company-page.html

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About Test Research, Inc. (TRI)

TRI (TWSE: 3030), offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. Learn more at http://www.tri.com.tw. For sales and service information, please write to us at [email protected] or call +886-2-2832 8918.

• Read more about TRI and Bosch Partner on AI Solution for MEMS Packaging

Stanton Chase is pleased to announce that Sundar Rajan Ramalingam has joined the firm as a Partner in North America. His addition strengthens the firm's executive search and leadership consulting capabilities for the semiconductor sector at a time of rapid transformation.

Sundar brings nearly three decades of leadership experience across manufacturing and global technology sectors. He has scaled a multi-billion-dollar global engineering division and supported the growth of several Global Capability Centers (GCCs). Within the semiconductor ecosystem, he has played a pivotal role in building and advising leadership teams across chip design, chip-to-cloud platforms, semiconductor fabs, and foundry operations.

This deep operational and strategic background gives Sundar a unique perspective on the evolving talent needs of semiconductor organizations.

"The semiconductor industry is entering a pivotal era—what I call a 'perfect leadership storm'—driven by generative AI, strategic autonomy imperatives, and breakthroughs like 3nm and advanced packaging," said Sundar. "While these trends are accelerating innovation, the industry also faces a growing talent gap. Companies need capable leaders who can navigate complexity, scale innovation, and build resilient teams. I plan to use my experience in technology and manufacturing to help semiconductor companies find executives who deliver results and foster sustainable growth."

Sundar's career spans both strategic HR leadership and general management with P&L responsibility, offering clients a rare blend of technical insight and leadership development expertise.

"Sundar fits well with our North American team and fills a specific need in our practice," said Mickey Matthews, Managing Director at Stanton Chase in North America and Chair of the Governance Committee. "His time working across borders gives him a genuine understanding of how global teams function. Blending this multicultural understanding with Sundar's deep technology products and services vertical expertise matters a lot to the clients we serve and specifically in the semiconductor space."

Jan-Bart Smits, Managing Partner at Stanton Chase Amsterdam and Global Sector Leader for Semiconductors, added: "Sundar joins us when the semiconductor industry sits at a turning point. Firms in this sector are looking for something different in their executives—people who understand both market forces and engineering details. Sundar knows this world and will further enhance our ability to serve chip makers and their suppliers."

As the semiconductor industry moves into a new chapter—marked by AI-driven demand, geopolitical shifts, and the race toward next-gen nodes—Sundar's appointment signals Stanton Chase's commitment to helping clients lead with confidence and clarity.

Sundar holds an MBA from XLRI Jamshedpur (India) and completed executive education programs, including the Chief Human Resource Officer Program at Wharton, University of Pennsylvania.

He will serve clients from Stanton Chase offices in Baltimore and Raleigh, USA, as well as Bangalore, Hyderabad, and Chennai, India—locations near semiconductor business centers.

Click here to learn more about Sundar.

Click here to learn more about Stanton Chase's semiconductor expertise.

About Stanton Chase

Stanton Chase ranks among the top global retained executive search firms with more than 76 offices in 45 countries and a worldwide team of senior consultants. Stanton Chase serves clients across multiple industry specialties and places C-suite executives, senior managers, and board members for companies ranging from global corporations to emerging businesses. Stanton Chase belongs to the Association of Executive Search and Leadership Consultants (AESC), adhering to the highest industry standards of professionalism and ethics.

• Read more about Stanton Chase Welcomes Sundar Rajan Ramalingam as Partner in the Semiconductor Practice

Singapore, May 12, 2025 - DuPont (NYSE: DD) is excited to announce its participation in SEMICON Southeast Asia (SEMICON SEA), taking place May 20-22, 2025, in Singapore. At booth L3105, DuPont will showcase the latest offerings of Kalrez® perfluoroelastomer parts specifically designed for semiconductor and electronics applications, aimed at enhancing manufacturing efficiency and operational sustainability.

“Our new Kalrez® product offerings are engineered for enhanced sealing performance, significantly reducing leaks and pumping times,” said Dr. Meredith Dunbar, Kalrez® Global Technology Leader, DuPont. “In our continuous pursuit of sustainability, we have achieved improvements in sealing performance under harsh process conditions, which enable substantial waste reduction. These advancements make Kalrez® seals an ideal choice for the toughest challenges in semiconductor fabs, and also showcase our dedication to delivering high-quality, efficient, and environmentally responsible solutions.”

Highlighting this longstanding commitment to innovation, the Kalrez® brand is proud to celebrate its 50th anniversary this year. This milestone reflects five decades of excellence and dedication to developing high-performance sealing solutions tailored for critical applications in demanding environments. At this year’s SEMICON SEA exhibition, attendees will discover several key advancements, including:

Kalrez® Bonded Door Seal (BDS): Specifically designed for semiconductor manufacturing equipment, including applications like plasma etching, CVD, and PVD, Kalrez® BDS offers improved sealing performance over conventional O-rings by reducing particle generation, extending seal life, and minimizing maintenance downtime.

Bonding Methodology: An innovative bonding method developed by DuPont's technology team, allowing Kalrez® components to be fused with other functional materials, creating unique, composite-structured Kalrez® parts.

Custom Shaped Parts: Kalrez® custom perfluoroelastomer parts can be tailored to unique geometries for specific sealing applications and are available in various shapes and compounds to meet different thermal, chemical, and plasma resistance requirements. Custom parts can be produced as both volume production and prototypes.

DuPont is proud to be driving technological advancements in the Kalrez® product family and providing game-changing solutions to its customers worldwide. All SEMICON SEA attendees are invited to join in celebrating the 50th anniversary of Kalrez® and explore how Kalrez® products can support their innovation programs.

For more information about Kalrez® parts and applications, please visit www.kalrez.com.

About DuPont

DuPont (NYSE: DD) is a global innovation leader with technology-based materials and solutions that help transform industries and everyday life. Our employees apply diverse science and expertise to help customers advance their best ideas and deliver essential innovations in key markets, including electronics, transportation, construction, water, healthcare, and worker safety. More information about the company, its businesses, and solutions can be found at www.dupont.com. Investors can access information included on the Investor Relations section of the website at investors.dupont.com.

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05/12/25

DuPont™, the DuPont Oval Logo, and all trademarks and service marks denoted with ™, ℠ or ® are owned by affiliates of DuPont de Nemours, Inc. unless otherwise noted. 

For further information, contact:

Rebekah Lazar
Semiconductor Technologies Communications Leader
DuPont
[email protected]

Cell: +1-302-509-1859

• Read more about DuPont to Introduce Advanced Kalrez® Sealing Innovations for Semiconductor Manufacturing at SEMICON Southeast Asia

[March 26, 2025 – Singapore] Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join SEMICON SEA held at the SANDS Expo and Convention Centre in Singapore from May 20 - 22, 2025. Visit booth #L2632 to learn about AI-powered AOI solutions for Advanced WLP/PLP and SEMI Back-End Package processes.

TRI will be exhibiting the new Wafer Inspection Platform, TR7950Q SII, featuring a High-resolution 2.5 μm 25MP camera and the TSV Metrology Module. The TR7950Q SII can perform Wafer Macroscopic 3D Inspection and micro measurement metrology. The TR7950Q SII can inspect Advanced WLP, Wafer Frame, Patterned Wafer, Wafer Bumping, WLCSP, through-silicon via (TSV), and more. The TR7950Q SII can measure TSV at ultra-high speeds, measuring sensing TSV depth, trench depth, oxide, nitride, PR, and PI film thickness.

Additionally, TRI will showcase the TR7007Q SII-S, the high-accuracy 3D SEMI SPI for precise solder measurements, supporting applications such as Mini-LED, C4 bumps (~100 μm Ø), and 008004 paste inspection. The lineup will also feature an X-ray Inspection Demo Station.

Join us at booth #L2632 at SEMICON SEA 2025 to discover TRI's cutting-edge SEMI inspection and metrology solutions!

• Read more about Advanced WLP/PLP and Back-End Inspection at SEMICON SEA 2025