The semiconductor industry has long followed a well-defined cyclical structure. Typically, price declines lead to a contraction in capital expenditure, followed by inventory normalization and eventual recovery. This repeated pattern—comprising pricing correction, investment pullback, inventory adjustment, and eventual market rebound—continues to offer a relevant lens through which to interpret the current uncertain market environment.As of April 2025, the industry faces a mix of conflicting signals. Concerns are rising that AI-related demand may have already peaked, while cautious optimism persists over a possible rebound in DRAM prices in the second half of the year. These market dynamics are further complicated by rising macroeconomic uncertainty, including renewed trade friction between the U.S. and China, reemerging tariff risks, and persistent inflationary pressure. In such a complex and volatile environment, the importance of cycle-based structural analysis has never been greater.Viewed from a momentum perspective, the recovery in semiconductor equipment investment—marked by a rebound in year-over-year growth (measured on a 12-month moving average basis) beginning in mid-2024—can be interpreted as a potential sign of renewed demand. However, this apparent stability may be misleading. While global companies significantly curtailed their fab investments throughout the second half of 2023 and the first half of 2024, China moved in the opposite direction, intensifying state-led expansion efforts aimed at achieving semiconductor self-sufficiency. This divergence in investment behavior has distorted the global capital expenditure landscape, potentially creating the impression of a broader recovery, while in reality the momentum remains concentrated in a single region driven by policy rather than market fundamentals.Similarly, the recent uptick in DRAM pricing appears to be driven more by production cuts than demand-side momentum. Major suppliers have been deliberately scaling back output to manage inventory and support pricing. In this context, price rebounds not backed by end-market demand are unlikely to sustain a meaningful recovery in wafer procurement. Simulation results—based on second-half projections—suggest that unless DRAM blended ASP increases by more than 20% quarter-over-quarter in both Q3 and Q4 2025, a meaningful upward inflection in the year-over-year pricing trend (on a 12-month moving average basis) remains improbable. This highlights the fragility of the current price recovery suggests that without a meaningful improvement in end-market demand—particularly for DRAM—wafer procurement for DRAM production is unlikely to recover in a sustained manner, regardless of supply-side actions. As SEMI highlights in this Silicon Wafer Market Monitor Report, a deeper understanding of the wafer market requires a close examination of raw material inventory trends. The inventory behavior of memory makers—due to their dominant scale and transparency—is widely regarded as a proxy for broader semiconductor industry trends. Following the pandemic, memory makers' raw material stockpiles surged to levels equivalent to five times their historical average relative to sales. While these ratios were significantly reduced between 2023 and 2024, inventory levels still meaningfully exceed pre-pandemic norms. With leading players signaling further inventory drawdowns, there is little incentive to rebuild raw material stockpiles—including silicon wafers—unless there is clear evidence of sustained demand recovery.This inventory dynamic is closely tied to wafer shipment growth. Historical data reveals a strong inverse relationship between raw material inventory-to-sales ratios at the top three memory makers—Samsung, SK hynix, and Micron—and wafer shipments. When this ratio declines year-over-year, wafer shipment growth typically improves. However, a slowdown in the pace of inventory ratio reduction could result in stagnant or declining wafer shipment growth in subsequent periods.Moreover, even as these inventory ratios continue to decline, wafer average selling prices (ASPs) have yet to show signs of recovery. This decoupling of pricing from inventory adjustments reflects the presence of a structural imbalance in supply and demand. On the supply side, all top five global wafer producers have secured greenfield fab capacity and are prepared to scale production. With depreciation pressures mounting, they face strong incentives to maintain economically viable utilization rates, contributing to ongoing ASP erosion.Meanwhile, chip capacity expansion in China—primarily driven by demand for 200mm applications—is adding further downward pressure. Chinese wafer suppliers, who already hold a meaningful share in China’s 200mm market, are now directing more of their investment toward 300mm wafer production—intensifying price pressure and adding to the longer-term competitive pressures facing global suppliers. This focus aligns with China’s broader push into mature process nodes, even as demand outside the region remains tepid. Accordingly, local Chinese wafer suppliers are competing aggressively on price, weakening the regional competitiveness of established global wafer players.As a result, the competitive landscape is undergoing a structural shift: global wafer suppliers are contending with intensified price-based competition among themselves in non-China markets, while simultaneously coming under mounting pressure from Chinese local players within China. This dual-front competition highlights the threshold point the industry has reached—where traditional pricing models and market dynamics are being fundamentally challenged.Moreover, long-term supply agreements (LTAs), once effective tools for pricing stability, are expected to gradually lose relevance. As semiconductor manufacturers—who purchase wafers under LTAs—move toward shorter-term and more customized purchasing models, and as pricing volatility increases, the incentive to commit to such agreements is projected to steadily diminish. The market, therefore, is not yet in a phase of strong recovery but appears to be undergoing a structural transition defined by persistent imbalances. The full report presents three scenario-based outlooks centered on four key variables—DRAM pricing, inventory normalization, equipment investment, and China’s regional influence. The most probable scenario currently assumes modest growth in 2025–2026, a correction in 2027, and a recovery in 2028. Wafer shipment growth rates under this scenario are projected at +5.1%, +5.4%, –6.2%, and +9.8%, respectively.However, even this base case remains vulnerable to potential macroeconomic disruptions. The large-scale tariff measures announced by the U.S. in April 2025 could trigger cascading effects across the ecosystem—from weakening enterprise demand and delaying infrastructure investments to softening DRAM prices and curbing wafer procurement. In past cycles, leading macro indicators such as the OECD Composite Leading Indicators (CLI) tended to lead DRAM price movements. If macro momentum slows, the market could deviate from the base case and move closer to the downside scenario. This downside scenario assumes weak or negative growth through 2026, a moderate recovery in 2027, and a stronger rebound by 2028 as supply-demand conditions begin to normalize.The current market trajectory suggests limited room for either sharp declines or sharp rebounds. The next phase will depend on how four forces interact: DRAM price momentum, inventory rebalancing pace, regional investment activity, and policy risks. A clear inflection point will only emerge when these factors begin to align. In other words, a meaningful shift—either upward or downward—will only occur when these forces move in the same direction and reinforce one another. Ultimately, any directional shift—whether delayed or accelerated—will still unfold within the broader framework of the semiconductor cycle previously discussed. In that sense, these indicators do not reverse the cycle itself; they merely influence the timing and pace at which it plays out.This article presents a summary of key insights from the Q1 2025 Market Update section of the SEMI’s Silicon Wafer Market Monitor Report, which is compiled in PowerPoint format and distributed as a PDF. In this edition, scenario-based analysis was used to navigate growing macroeconomic uncertainty and assess potential turning points in wafer demand. To support this analysis, the Market Update section presents 10 core quantitative charts and long-term data series dating back to 2000—particularly curated to visualize and analyze semiconductor revenue, investment, and pricing cycles in a single view. Separate from this focused section, the full SEMI’s Silicon Wafer Market Monitor Report includes a much broader array of charts and indicators, providing a multi-dimensional analysis of how fundamental variables interact to shape the future of the silicon wafer industry. Rather than simply offering background explanation, the full report is intended to provide clear, data-driven insights that can support strategic thinking amid market uncertainty.For more information on the report or to subscribe, please contact the SEMI Market Intelligence Team at [email protected]. Details on SEMI market data are available at SEMI Market Data. Sungho Yoon is a Principal Analyst on the SEMI Market Intelligence team.

In a world where technological advancements move at lightning speed, the semiconductor industry is facing unprecedented challenges. The demand for smaller, faster, and more energy-efficient devices is growing, and traditional manufacturing processes are being pushed to their limits. Enter Spin-on Dielectrics (SOD), a breakthrough material technology that offers a cost-effective, scalable solution for micro-gap filling and high-performance dielectric films. As the industry evolves, SOD is expected to play a pivotal role in enabling the next generation of chips that power everything from AI to everyday electronics.To learn more, SEMI Europe and Merck KGaA, Darmstadt, Germany, held a joint webinar that focused on semiconductor device process evolution by SOD. The session featured insights from three technology experts in the company, including Dr. Surésh Rajaraman, Executive Vice President and Head of Thin Film Business Unit, along with Atsuko Yamamoto, R D Manager for Spin-On Dielectric, and Go Nakano, Global Marketing Manager for Dielectric Materials.SEMI: What is SOD, and how does it fit within the broader semiconductor manufacturing process?Rajaraman: SOD, Spin on Dielectrics, is a unique class of materials used to deposit thin layers of dielectric films, which act as insulators or other functional films, on semiconductor devices. The fabrication of a semiconductor chip involves thousands of intricate steps that incorporate conductors, semiconductors, and insulators. SOD is a versatile technology that supports device performance and miniaturization by enabling better gap fill and film uniformity, all while offering attractive cost of ownership.SEMI: Why is there so much focus on SOD materials, and how are they evolving to meet future industry demands?Rajaraman: As semiconductor devices become more complex—such as 3D NAND scaling to more than 300 layers and DRAM incorporating pillar capacitors—there’s a growing need for materials that can address challenges like interconnect delays, power consumption, and heat generation while maintaining optimal performance. Traditional dielectric materials are reaching their limits, making Spin-on Dielectrics (SOD) a critical solution. SOD offers advantages like bottom-up and seam-free gap filling, enabling ultra-thin insulating and other functional layers that enhance electrical and thermal efficiency and support next-generation device scaling.The industry is pushing the boundaries of scaling, with increasing aspect ratios and complex structures in Logic, 3D NAND and DRAM. Modern devices now require deposition in features which are not only incredibly narrow but also increasingly deep due to going into the third dimension. This creates new challenges, such as stress buildup and cracking in conventional SOD materials. To overcome this, we are developing enhanced formulations with improved mechanical stability and polymer backbone engineering. These innovations enhance gap-filling properties and resistance to process-induced stress, ensuring SOD remains a key enabler for advanced semiconductor manufacturing.SEMI: What are the current industry trends driving the adoption of SOD?Nakano: SOD is becoming a key technology because of its excellent gap-filling performance. Unlike gas-phase deposition methods like Chemical Vapor Deposition (CVD) and Atomic Layer Deposition (ALD), SOD is a liquid-phase process. This makes it more efficient for high-aspect-ratio structures. It also helps reduce costs while maintaining high-performance dielectric properties.With increasing demand for high-density memory and logic devices, SOD is crucial for applications like DRAM and NAND flash, which require precise dielectric layer formation. In DRAM, we’re witnessing a shift from planar to vertical transistors, and even to monolithic 3D DRAM. These changes require new materials for gate insulators and electrodes, alongside improvements in aspect ratio gap filling.For NAND memory, manufacturers are increasing the number of memory layers, leading to taller memory stacks and deeper trenches. As lateral scaling progresses, narrower and more complex structures demand high-aspect-ratio trench fills to maintain performance and reliability.Logic devices are also evolving, with transistor structures moving from FinFETs to nanosheets and forksheets. This transition enhances performance, but it also introduces challenges in wiring density and electrical properties. The narrower pitch of wiring requires advanced dielectric solutions, like SOD, to enable reliable, high-performance semiconductor architectures.SEMI: With all these recent innovations, what role does Merck KGaA, Darmstadt, Germany play in supporting these advancements, and what does the company offer its customers? Rajaraman: As the semiconductor industry pushes the boundaries of scaling, doing so requires materials that can support increasingly complex structures. We are the only materials company in the industry to possess the full spectrum of process technologies for gap-filling capabilities, including SOD, ALD, CVD, and Flowable CVD. Our strategic acquisition of Versum Materials has expanded our capabilities with organosilicon precursors. Combined with our SOD expertise, it allows us to reengineer material backbones with more material choices and tailored properties to optimize performance in high-aspect-ratio applications.To support this, we’ve expanded our global R D footprint. We now operate in various application labs, enabling close collaboration with customers for material customization and fine-tuning properties to address specific manufacturing challenges. Last year, we inaugurated a new R D center in Korea as part of our commitment to being near our customers and accelerating time-to-market for next-generation semiconductor solutions. As semiconductor roadmaps become more complex, customization and collaboration also become more critical. The key to innovation lies in working closely with our customers, understanding their challenges, refining materials, and optimizing processes together. By fostering this ongoing partnership, we can accelerate technological advancements and ensure that new solutions align seamlessly with evolving industry demands.SEMI: Can you share some technical insights on SOD?Yamamoto: SOD is a key material used in semiconductor manufacturing to create insulating layers with high precision. One of the essential components in SOD is PHPS (Perhydropolysilazane), a polymer composed of silicon, nitrogen, and hydrogen. This material is applied as a liquid solution and transforms into a high-quality silicon oxide film through a series of thermal processes.PHPS is essential because it enables precise gap filling in extremely small structures, helping to improve device reliability. The process involves spin-coating the polymer onto a wafer, followed by pre-baking to remove solvents. Then, it undergoes high temperature curing in an oxygen and steam atmosphere, forming a dense silicon oxide film. This method ensures uniform coverage and cost efficiency compared to traditional dry film deposition techniques.Our Spinfil® product line has evolved over the past two decades, starting with the Spinfil® 400 series and advancing through the Spinfil® 600 to the widely used Spinfil® 800 series. These improvements have enhanced gap-filling capabilities and film uniformity, making them ideal for high-aspect-ratio trench structures. The critical baking process involves spin coating and pre-baking before wafers undergo batch processing in a high-temperature furnace. Controlled temperature and moisture conditions transform Spinfil® into silicon oxide films, optimizing properties such as refractive index, shrinkage, and etching resistance and ensuring reliability in semiconductor applications.SEMI: What are the latest trends in new polymer development for SOD?Yamamoto: Our research focuses on three key areas: enhancing film quality, developing SOD for high-aspect-ratio trench filling, and advancing low-k SOD for semiconductor processes.To improve film quality, we introduced the Neofil®series, an evolution of the Spinfil® 800 series. This innovation reduces film shrinkage, lowers stress, and enhances wet etching rates, making it ideal for next-generation semiconductor nodes.Our latest Neofil® series for high-aspect-ratio trench filling is targeted for traditional dry processes like CVD and ALD, which can often lead to void formation and require multiple deposition-etch steps. Our latest SOD materials address this by improving polymer elasticity, ensuring uniform filling of deep trenches up to 16 microns without cracks, making them suitable for emerging 3D nanostaircase designs.In low-k SOD development, we’re focusing on siloxane-based polymers, which provide excellent trench-filling capabilities while maintaining strong mechanical and electrical properties. Compared to flowable CVD and ALD, SOD offers a more cost-effective and efficient alternative. With continued advancements, we anticipate SOD will become a key material for future semi-damascene processes, enhancing embedding performance and overall device reliability.SEMI ContactSitong He, Communications Manager Email: [email protected]

As the global semiconductor industry charges toward a projected $1 trillion market by 2030, regional innovation hubs are stepping into the spotlight. The inaugural SEMIEXPO Heartland—held April 1–2, 2025, at the Indiana Convention Center in Indianapolis—brought together key players from across the ecosystem to explore how advanced packaging, smart manufacturing, smart mobility, AI, and workforce development are fueling the semiconductor revolution.With a special focus on building self-reliance in the U.S. chip supply chain, the event highlighted efforts that are revitalizing the Midwest’s role as a key region driving innovation in the global semiconductor ecosystem. SEMIEXPO Heartland showcased leading-edge strategies and technologies from global giants and regional champions alike—underscoring the deep connections between government, academic, research, and industry leaders.Keynote HighlightsSK hynix: Accelerating the Future with Chiplets and Advanced PackagingDr. Woong Sun Lee, Senior Vice President at SK hynix, kicked off the event with a powerful vision for the future of semiconductor manufacturing. In response to skyrocketing demand fueled by AI, autonomous vehicles, and next-gen mobile applications, SK hynix is pursuing aggressive innovation through heterogeneous integration and chiplet-based design.Using 12-inch wafers, SK hynix’s chiplet strategy compresses product development timelines from 10-20 years to as little as 2-5 years. This leap in design efficiency enables faster time-to-market and greater performance optimization—crucial in an industry where speed and scale are paramount.A major component of this vision is the company’s investment in a state-of-the-art advanced packaging facility in Indiana. Targeting mass production by 2028, the new hub will not only expand SK hynix’s U.S. manufacturing footprint but also support national goals around workforce development and ecosystem growth. It’s a bold move that aligns the company’s R D leadership with America’s strategic reshoring efforts.Robert Bosch Semiconductor: Driving the Future with Silicon Carbide (SiC)Thorsten Scheer, Regional President Mobility Electronics and Plant Manager at Bosch Roseville, presented a deep dive into how Bosch is preparing for the electrified mobility era. Central to Bosch’s strategy is the adoption of silicon carbide (SiC) semiconductors, which are increasingly critical to electric vehicle powertrains.As vehicles become more connected and automated, Bosch projects more than 40 semiconductor chips per car by 2035. To meet this demand, Bosch is developing dual-channel trench MOSFET technology using SiC—a move that enhances power conversion efficiency and reduces heat, two of the biggest challenges in EV design.Bosch’s global expansion includes a new SiC wafer fab in Roseville, California, which is set to begin production in 2026. This facility is not only a technological investment but also a commitment to supply chain resilience, ensuring that the U.S. plays a central role in future automotive innovation.Polar Semiconductor: Reshoring Advanced Foundry CapabilitiesSurya Iyer, President and COO of Polar Semiconductor, shared the company’s mission to reinvigorate America’s semiconductor manufacturing capabilities. Headquartered in the Midwest, Polar is a rare U.S.-owned foundry playing a strategic role in reshoring production and building domestic capacity.Specializing in power semiconductors—including MOSFETs, IGBTs, and wide-bandgap (GaN) devices—Polar focuses on serving critical sectors such as automotive, aerospace and defense, and industrial applications. With advanced automation and a commitment to cost-efficient scale, the company is helping to bring more semiconductor innovation back to U.S. soil.Polar’s flexible business models and emphasis on workforce training position it as a linchpin in the nation’s efforts to build a more secure and agile semiconductor supply chain.Smart Manufacturing and Mobility SessionsUnlocking the Future with AI, Edge, and Digital TwinsThe opening session on April 1 showcased how AI and advanced simulation are transforming the semiconductor manufacturing process. NHanced Semiconductor introduced "Foundry 2.0," a platform delivering chiplet-based solutions tailored for low-volume, high-mix applications—highlighting flexibility and speed.Kulicke Soffa emphasized the use of AI, digital twins, and agentic automation in backend operations, helping to cut costs and boost efficiency. Humatics demonstrated its Milo microlocation system, addressing factory automation and labor challenges with precision positioning technologies.Meanwhile, Purdue University’s research in chip-package co-design and semiconductor education reflected the essential role of academia in building future-ready capabilities.AI, Edge, and Digital Twins in Backend ManufacturingThis session continued to explore the shift toward intelligent, connected manufacturing ecosystems. Allan Lewis of Nordson Electronics Solutions showcased AI-powered inspection systems that reduce downtime and improve yield.Jim Redman from ErgoTech Systems emphasized the importance of scalable, decentralized data platforms using low-code tools. Luis Rivera of Koh Young Technology introduced KSMART Server and CFX standards, enabling real-time optimization and machine-to-machine communication.Josh Mangahas from INFICON detailed how digital twins and AI/ML models are enhancing production scheduling and delivery timelines, while Mahesh Deshpande of Dassault Systèmes illustrated how virtual twins and XR-based tools are supporting agile packaging environments.The Convergence of AI, Robotics, and Digital TwinsSession 3 on April 2 featured cross-disciplinary insights from leaders at Arizona State University (ASU), Fraunhofer IZM, Teradyne, and Purdue. A common theme: AI, robotics, and digital twins are converging to redefine factory dynamics.Dr. Binil Starly (ASU) explained how reinforcement learning and MQTT protocols are enabling adaptive robotic inspections. Erik Jung (Fraunhofer IZM) highlighted how packaging and AI systems evolve in tandem to achieve tighter integration and higher performance.Teradyne’s Mat Najibnia focused on the ROI of robotic material handling systems, while Purdue’s Dr. Martin Jun shared a vision for democratized smart manufacturing—especially for small and medium-sized manufacturers (SMMs).Building Future-Ready Semiconductor EcosystemsThe final session underscored the importance of collaboration, resilience, and cybersecurity. Athinia discussed its work harmonizing raw material and fab data to improve manufacturing insights. IBM presented use cases combining digital twins and generative AI for yield improvement and predictive maintenance.Siemens focused on sustainability and decarbonization through digital twin platforms. The Florida Semiconductor Engine (FSE) illustrated how regional ecosystems can support leadership in packaging innovation and talent development.PEER Group spotlighted the Semiconductor Manufacturing Cybersecurity Consortium (SMCC), advocating for a standardized, collaborative approach to securing manufacturing infrastructure.Workforce Development and Regional ImpactA strong undercurrent throughout SEMIEXPO Heartland was the need for strategic workforce development. The event featured a Workforce Pavilion offering job seekers access to career coaching, resume guidance, and mentorship.Local universities and community colleges were well represented, as were federal and state workforce programs. These partnerships are crucial to ensuring a robust talent pipeline and equipping workers with the skills needed for a rapidly evolving industry.The presence of SK hynix, Polar, and other major players making sizable investments in the Midwest signaled not just a resurgence of regional manufacturing, but a renewed commitment to community growth, equitable opportunity, and long-term sustainability.A Midwest Moment with Global ImplicationsSEMIEXPO Heartland 2025 captured a pivotal moment in the evolution of the semiconductor industry. From chiplets and SiC to AI-driven smart factories and cyber-resilient ecosystems, the event highlighted how innovation, collaboration, and policy alignment are driving progress.As America looks to fortify its semiconductor future, the Midwest is emerging as a powerhouse of talent, technology, and tenacity. With support from industry, government, and academia, the region is well-positioned to lead the charge into a smarter, more secure, and more resilient semiconductor era.For questions about SEMI’s Smart Manufacturing initiative, contact Anshu Bahadur at [email protected]. Read more about SEMIEXPO Heartland in this press release: Inaugural SEMIEXPO Heartland Event Underscores Midwestern U.S. as a Global Hub for Smart Manufacturing and Smart Mobility.Anshu Bahadur is Sr. Program Manager, Technology Communities at SEMIRafael Tudela is Sr. Technical Marketing Manager at SEMI

Industry growth has consequences.Rapid growth for semiconductor companies has meant increasing amounts of spent materials and chemicals. As expected, these have enlarged environmental impacts, disposal costs, and liability. Semiconductor companies confront challenges that not every sector faces: larger company size, higher value added per unit of production, and higher technological capacity are not always related to lower quantities of waste per unit of production.Collective action is needed to turn this challenge into business resilience. SEMI, imec, and our SEMI Circularity Working Group community are sharpening our cooperation to meet the need.MOVING FROM LINEAR TO CIRCULARSemiconductor value chain companies are making strides to pivot from a linear economy (take, make, waste) to a circular economy (maintain, reuse, refurbish, remanufacture, recycle). Early strategies were anchored primarily to waste management, waste-to-energy, waste diversion, and recycling programs. Lately companies are expanding to novel raw materials strategies, waste repurposing methods, and improvement of remanufacturing through resale at new-product-like performance and quality. This is a real opportunity for companies because using spent chemicals as a feedstock can cut costs, bolster supply chain management, reduce greenhouse gas emissions, create opportunities for brands, and bolster social license to operate. Yet most breakthroughs in circular practices are happening in relative isolation across the value chain. Until now, there is no widely recognized system for identifying and ranking materials used in manufacturing to prioritize where conversion from linear to circular use would provide the most gains. A FRAMEWORK FOR PRIORITIZATIONA 2025 report – produced through collaboration between SEMI and imec – presents an inventory of 69 distinct materials prioritized for circularity along with the framework for ranking. It also shares the method to support calibration to fit specific use cases. The outputs will be immediately useful for decision-makers across functions in the semiconductor value chain, including, but not limited to:ProcurementSustainabilityEHS (environment, health, and safety), andRisk management. These professionals now have a cross-industry reference for driving impactful circular initiatives at their firms.Download the reportCATALYZING RESEARCH DEVELOPMENT, VALIDATION, AND ADOPTIONIn conjunction with the publication, SEMI and imec are launching the Circular Semiconductors Research Network, a platform to connect research teams with industry adopters to accelerate validation and deployment of circular technologies and methods. Ideal collaborators can substantiate Technology Readiness Level (TRL) 4 or greater and seek industry validation, adoption, and acceleration of circularity solution deployment aimed to purify, reuse, and/or resell spent materials and by-products – either onsite or offsite at a permitted facility under the conditions set out in our invitation.Research teams with relevant subject matter expertise are welcome to submit proposals for research in exploratory phases (lower TRLs) for review by SEMI members. Preference will be given to research teams that address practical hurdles faced by semiconductor value chain companies as they navigate regulatory frameworks for onsite vs. offsite treatments.The call for collaboration seeks to amplify research and development of technologies that comply with applicable regulations and meet one of the following conditions: (1) the owner/operator does not need to obtain a waste permit, or (2) the technology needs to be put offsite at a permitted waste facility. View the Invitation – Applications due May 30, 2025THE BIGGER PICTUREThe publication and launch of the Circular Semiconductors Research Network is a response to growing attention from business leaders and policymakers on critical materials in semiconductor manufacturing. Supply chain security for these materials has become a strategic issue for governments and the private sector, not only because it could affect the pace of the energy transition but also because materials sourcing has become contested among geopolitical rivalries and alliances. The network will provide momentum for industry and research to prioritize the development and adoption of circular methods for materials that would generate the most strategic, economic, and environmental gain in the semiconductor value chain. It will do so in dialogue with the SEMI Circularity Working Group, a venue for collective action among SEMI members that works closely with other trade association initiatives such as the SEMI Supply Chain Management Initiative, which is focused on resilience, agility, and responsibility, and the SEMI Accelerating Sustainability with Smart Manufacturing Task Force, which develops an industry technology roadmap. For more information, write to the Circular Semiconductors Research Network at [email protected]. SEMI members are invited to join the Circularity Working Group meeting monthly. If interested, contact Jordan Famularo at [email protected]. Jordan Famularo, PhD, is Program Manager – Sustainability at SEMI.

“In technology it’s about the people: getting the best people, retaining them, nurturing a creative environment and helping to find a way to innovate.” Marissa MayerThe annual Women in Semiconductors (WiS) program organized by the SEMI Foundation and held in conjunction with the SEMI Advanced Semiconductor Manufacturing Conference (ASMC) returns for a second year in Albany, New York. This year’s themes are Empowerment in Action and Beyond Buzzwords with a focus on real actions to create success. As in the past, the WiS committee recognizes that everyone needs to be part of these important discussions. Collectively, we are committed to building workplaces that are supportive of all the people who will drive future semiconductor industry growth and success. Meeting the global semiconductor industry’s talent needs to underpin future growth will require continued progress on drawing more women to its workforce. "It’s critical that companies continue to invest in women," Rachel Thomas, CEO, LeanIn.org.WiS co-chairs Samira Bagheri, PhD., Senior Operations Manager at EMD Electronics and Rosanna Robert, ES Process Engineer ll at TEL Technology Center America shared their thoughts about their involvement in the committee, their careers, and why they are excited about this year’s WiS program. SEMI: How did you become involved in the Women in Semiconductors committee and program? Samira Bagheri, PhD., Senior Operations Manager at EMD ElectronicsBagheri: I became involved in WiS through my passion for fostering greater opportunities for everyone in the semiconductor industry. My journey began with my active engagement in employee resource groups (ERGs) at EMD Electronics, particularly the Women’s Success Network, where I led initiatives to support and empower women in STEM. Recognizing the need for a dedicated platform to connect, mentor, and amplify women’s voices in our field, I took on a leadership role within WiS. My involvement has allowed me to collaborate with inspiring women and industry leaders, working together to create meaningful conversations and drive impactful change.Rosanna Robert, ES Process Engineer ll at TEL Technology Center AmericaRobert: I became involved with WiS because of the personal impact I believe I can have, especially with younger girls entering the STEM field. I aim to help improve systems and increase involvement. It’s a great opportunity to collaborate with other companies and colleges. It’s also a great way to look back and see the impact you can make.SEMI: We recently celebrated Women’s History Month and International Women’s Day. How did your company recognize the women at your company? Bagheri: At EMD Electronics, we celebrated Women’s History Month and International Women’s Day with a series of events aimed at recognizing and empowering women in our organization. We hosted panel discussions featuring women leaders, highlighting their career journeys and the challenges they’ve overcome. Additionally, our Women’s Success Network organized networking sessions and workshops focused on leadership development and mentorship. We also reinforced our commitment to inclusion through executive sponsorship and by sharing stories that showcase the invaluable contributions of women in the semiconductor industry.Robert: TEL was able to host multiple seminars during the month of March, covering the national conference for women and providing career talks from one of our female managers. We also had some positive outcomes with our ERGs.SEMI: What can industry leaders do to better engage and inspire female students to pursue a career in the semiconductor industry?Bagheri: Industry leaders play a critical role in shaping the future workforce by actively engaging with female students early in their academic journeys. One of the most effective ways to inspire young women is through mentorship and visibility—having female engineers and leaders share their career paths and experiences can make a huge impact. Hands-on workshops, industry-sponsored hackathons, and participation in organizations like WiS help bridge the gap between education and industry, making the semiconductor field more accessible and appealing.Robert: I believe a great way to get more engagement is through mentorship, scholarships, and funding. Offering scholarships or funding opportunities specifically for women in STEM fields can help with college expenses.SEMI: What was your biggest takeaway from the Women in Semiconductors panel discussion hosted by EMD Electronics last November? Bagheri: The biggest takeaway from our November Women in Semiconductors panel discussion was the power of community and sponsorship. The panelists emphasized that while mentorship is crucial, sponsorship—where leaders actively advocate for women’s career growth—can have an even greater impact. We also had deep conversations about the systemic challenges women face in semiconductor careers and the need for industry-wide initiatives to address these barriers. The event reinforced the importance of building a strong network of support and advocating for policies that create a more inclusive workplace, where everyone has a voice.Robert: It was nice that this program was hybrid so I could join remotely. One of my key takeaways on how to overcome barriers in our workplace is the ability to identify those barriers and figure out how to address them. It’s not just about overcoming them but also approaching them with practical strategies.SEMI: What resources would you recommend to individuals and companies on how to be better allies to women in the workplace?Bagheri: To be better allies, individuals and companies can leverage several resources:Books: Lean In by Sheryl Sandberg, The Memo by Minda Harts, and How Women Rise by Sally Helgesen and Marshall Goldsmith.Training: Workshops and leadership development programs tailored to expand understanding.Networks: Initiatives like WiS, Women in Technology (WIT), and Society of Women Engineers (SWE) provide valuable tools and networking opportunities.Company Initiatives: Establishing mentorship and sponsorship programs, ensuring expanded representation in leadership, and actively promoting work-life balance policies. Being an advocate is an ongoing commitment, and these resources provide a strong foundation for driving meaningful change.Robert: I know there are a few good books out there for people to read, such as Invisible Women by Caroline Criado Perez. There are also great training courses on LinkedIn Learning that individuals can take at their leisure. Additionally, leading by example is a great way for individuals to advocate for others; stand up for women in their companies, and ensure they have a chance to be heard.SEMI: Is there someone who has supported you in your career or been an inspiration?Bagheri: Yes, I’ve been fortunate to have several mentors and sponsors throughout my career. Their leadership, advocacy, and guidance have helped me navigate challenges and seize growth opportunities. Additionally, the women I’ve met through WiS and other ERG initiatives continue to inspire me. Their resilience, innovation, and commitment to making the semiconductor industry more inclusive motivate me to keep pushing for progress.Robert: Support and inspiration come from everywhere. My first mentor hired me not only for my skills but also to give women a chance in the semiconductor field. The inspiration I have comes from a young girl, Francesca. She was always amazed by my work and would frequently ask what I did that day, even though she probably didn’t fully understand. Her curiosity drives me to do better and change the environment for women to explore. Every challenge and barrier I face is one that Francesca and other females can overcome with smiles on their faces. I am inspired to make the industry a welcoming place for her and others!SEMI: What can attendees expect from this year’s Women in Semiconductors scheduled on May 8, 2025 in Albany, New York?Bagheri: This year’s Women in Semiconductors program will be an incredible opportunity to connect, learn, and engage with industry leaders committed to advancing parity among employees in the semiconductor space. Attendees can expect thought-provoking panel discussions, interactive workshops, and networking sessions that provide actionable insights for career growth and leadership. The theme will focus on empowering women and exploring strategies to level up in the workplace. We will also highlight success stories, share best practices, and create a platform for meaningful conversations about the future of women in the semiconductor industry.Robert: This year will be amazing! We’ll discuss key words to grab attention, as well as how to craft a compelling elevator pitch that engages others in a short amount of time.We invite everyone to participate in the upcoming Women in Semiconductors event and learn more about how to become an agent of change. For details and to register, visit the event website. WiS is made possible through generous support of our sponsors: Axcelis, Energetiq, IBM, Kokusai Electric, Nikon Precision and Onto Innovation. Samira Bagheri is a distinguished professional in the field of nanotechnology, holding a Ph.D. in the subject. She has authored over 200 ISI articles, contributing significantly to the advancement of knowledge in materials science and semiconductors. Bagheri was a recipient of SEMI Foundation Excellence in Achievement Award 2024, which recognizes those within the global microelectronics sector who have made significant contributions to advance workforce development initiatives.Rosanna Robert is a Process Engineer at Tokyo Electron. Robert is active in TEL-US Women’s Network, and UPWARDS program with RIT. Prior to joining TEL Technology Center, America she attended University of Albany to obtain her master’s in Nanoscale Engineering. She supports many local church groups along with volunteering at veteran homes and food banks in her Upstate New York Community. Margaret Kindling is Senior Program Manager at the SEMI Foundation. She promotes inclusive workplaces via initiatives like Women in Semiconductors, Semiconductor PRIDE and develops workforce and career programming at SEMICON West and SEMIEXPO Heartland.

Geopolitical shifts, rapid technological advancement, and supply chain pressures continue to redefine the global semiconductor landscape. These forces framed the discussions at the 2025 SEMI Industry Strategy Symposium Europe (ISS Europe), held in Sopot, Poland. Over two days, industry leaders, and policymakers examined how Europe can boost resilience amid growing uncertainty.Artificial intelligence (AI) stood out as a key driver—powering global chip demand and transforming industry operations. In the past year, AI applications like generative models and edge computing helped push chip sales to new highs. The EU Chips Act, effective since September 2023, also fueled change. It has drawn tens of billions of euros into European semiconductor infrastructure, including major investments in Pomerania, the host region for this year’s symposium. “With AI expected to drive exponential growth in the semiconductor industry—projected to reach $1 trillion by 2030—Europe must act collectively to remain competitive,” said Laith Altimime, President of SEMI Europe. “We encourage collaboration across all countries to strengthen supply chain resilience, mitigate geopolitical risks, and harness the full potential of our diverse talent base.”Laith Altimime, President, SEMI EuropeSo what has the EU’s investment in the semiconductor industry achieved, and how much more remains to be done? Gustav Kalbe, Acting Director of Enabling and Emerging Technologies at the European Commission, cited €80 billion in public and private investment in European fabs as clear progress toward introducing "advanced technology that has not before been deployed on the continent of Europe." However, Kalbe emphasized a new urgency driven by AI’s rise. “We need in Europe a secure supply chain for AI chips in key sectors—particularly automotive,” said Kalbe. “That’s why we are really pushing for accelerated development of AI chips here.”Gustav Kalbe, Acting Director of Enabling and emerging technologies,DG CNECT, European CommissionPoland is a prime example of the EU Chips Act’s impact—driven by consistent government support. Dariusz Standerski, Secretary of State in the Ministry of Digital Affairs, highlighted Poland’s seven-pillar national semiconductor strategy, which includes expanding infrastructure and increasing engineering talent by 20% by 2030. “We need to build our production capacity to meet the strategic needs of Poland,” said Standerski. “Semiconductors are important not only because of market size, but because of their role in national security.”Dariusz Standerski, Secretary of State, Ministry of Digital Affairs, PolandRisks to the Industry from a World in Political TurmoilGeopolitical shifts and market volatility dominated the opening session of ISS Europe 2025. Malcolm Penn, CEO of Future Horizons, warned that despite strong 2024 revenues, industry fundamentals remain fragile. “All of the growth is in graphics processing units (GPUs) for AI and high-bandwidth memory (HBM) for AI servers—every other product sector is currently in recession,” said Penn. He forecast 12% industry growth in 2025 but cautioned against overcapacity and price pressures from China. “We are not seeing unit growth, and without unit growth, you don’t have sustainable market growth,” explained Penn. “If momentum in AI slows, the industry could face a significant retrenchment.”Malcolm Penn, CEO of Future HorizonsLooking beyond the immediate outlook for semiconductors, Hendrik Bourgeois, Vice President for European Governmental Affairs at Intel, turned the spotlight onbroader economic and security challenges facing the region. Bourgeois outlined four strategic policy priorities for Europe: Build internal strength to ensure external (global) relevance;Deepen alliances beyond the United States—such as with the UK, Canada, Japan, and South Korea;Be open to a stronger economic relationship with China;Recognize that the U.S. is more than its federal government: states, cities, people and corporations all have a role to play in bringing stability and certainty.Hendrik Bourgeois, Vice President for European Governmental Affairs, IntelBenedikt Ernst, Senior Vice President and Head of Strategy Transformation at Merck KGaA, Darmstadt, Germany, emphasized the strategic importance of strengthening Europe’s domestic semiconductor ecosystem. “No country or region can be fully self-sufficient,” said Ernst. “But Europe is particularly strong in domains like advanced materials, fabrication equipment, and semiconductor manufacturing. We have leading players in these fields – let’s bet on them.”Benedikt Ernst, Senior Vice President and Head of Strategy Transformation, Merck KGaA, Darmstadt, GermanyMikolaj Trunin, Deputy Director of the Invest in Pomerania, and its Strategic Investment Manager Radoslaw Bojarczuk, highlighted the region’s rising profile among global investors. Despite a global downturn in foreign direct investment (FDI) since 2015, the region stretching from Gdansk and Warsaw to Dresden and Magdeburg is emerging as a vibrant semiconductor hub. “The environment is becoming increasingly attractive to outside investors drawn by the region’s large talent pool, robust venture capital activity, and strong and stable economic growth,” said Trunin.Left: Mikołaj Trunin, Deputy Director, Invest in PomeraniaRight: Radosław Bojarczuk, Strategic Investment Manager, Invest in PomeraniaAdvancing on the Roadmap to Net ZeroThe symposium’s second session tackled sustainability—how to grow the industry beyond $1 trillion in revenue while cutting emissions. AI emerged as a key enabler of sustainable innovation. Bill Lussier, Managing Director of Tokyo Electron Europe, highlighted recycled aluminum which has a much lower carbon footprint, but noted that semiconductor equipment requires ultra-pure aluminum, which is not available off-the-shelf in recycled form. “The solution is to create a new circular economy for ultra-pure aluminum—a supply chain so complex that it cannot be managed without the aid of AI,” explained Lussier.Bill Lussier, Managing Director, Tokyo Electron EuropeAI is also helping decarbonize logistics, a critical yet often overlooked part of the semiconductor ecosystem. Rainer Kiefer, Executive Vice President and Global Head of Sales at Schenker AG, underscored the environmental cost of air cargo: “We need smart supply chain design to reduce the air miles of chips.” AI supports this by optimizing routing, loads, predictive maintenance, and demand forecasting. Rainer Kiefer, Executive Vice President and Global Head of Sales, Schenker AGHowever, AI brings new energy demands. Malgorzata Kasperska, Vice President of Secure Power at Schneider Electric, urged greater efficiency in AI data centers: “We need to optimize both power capacity and efficiency, and deploy high-density infrastructure, all while enhancing sustainability practices.” Malgorzata Kasperska, Vice President of Secure Power, Schneider ElectricEnergy-intensive fab operations remain a major challenge. Charles Vaillant, Chief Technology Officer at MANN+HUMMEL, noted that heating and ventilation account for up to 50% of a fab’s energy use. To improve efficiency, the company introduced a filtration system using activated carbon ceramic technology. The innovation reduces pressure drop, cutting fan energy use and delivering up to 41% energy savings in cleanroom environments.Charles Vaillant, Chief Technology Officer at MANN+HUMMELFinding the Talent to Fuel the Industry’s GrowthAttracting and developing talent remains a critical challenge for the semiconductor industry. Andreas Schleicher, Director for Education and Skills at the OECD, cited a visibility gap: “Young people don’t see these engineering and IT jobs. You cannot be what you do not see.” Meike Boekelmann, Chief Human Resources Officer at Comet, echoed the sentiment. “Face-to-face, we can get people excited about joining our industry,” said Boekelmann. “The challenge is getting them in front of us in the first place.” Andreas Schleicher, Director for Education and Skills,Organization for Economic Co-operation and Development (OECD)In a panel discussion on Bridging the Talent Gap for Sustainable Growth, moderated by SEMI Europe’s Maria Daniela Perez, speakers explored how industry and academia can better collaborate to meet evolving workforce demands. Thomas Kralinski, Saxon State Secretary of Economic Affairs, Labor, Energy and Climate, emphasized the importance of future-ready education. “Do we know which fab is going to be built in 2035, or which start-up will be founded? No—but all the people who will work there are already alive. We need education to prepare these people for this unknown future.Thomas Kralinski, Saxon State Secretary of Economic Affairs, Labor, Energy and ClimatePanel Discussion on Bridging the Talent Gap for Sustainable GrowthAI Intensifies Scale of Innovation in Semiconductor FabricationDay two of ISS Europe 2025 spotlighted AI’s transformative impact on semiconductor innovation, from materials to manufacturing and chip design. John Behnke, General Manager for Smart Manufacturing at INFICON, emphasized AI’s growing role in managing fab complexity. “You need a lot of highly knowledgeable people to run a fab today,” said Behnke. “They must analyze huge amounts of data, and balance priorities like quality, on-time delivery, cycle time, and profitability.” In the future, he explained, AI-powered optimization engines will shoulder that burden by making autonomous decisions.John Behnke, General Manager for Smart Manufacturing, INFICONJean-Christophe Eloy, CEO of Yole Group, pointed to the rapid growth of data centers as a catalyst for architectural transformation, predicting a shift from monolithic AI ASICs to chiplet-based designs. “In the future, we can expect to see much of the value in the semiconductor business transfer from the front-end chip to the advanced packaging that integrates chiplets,” said Eloy. Jean-Christophe Eloy, CEO, Yole GroupThis sentiment was echoed by Christophe Frey, Vice President of EU Engagement at Arm, who described the industry’s shift from systems-on-chip to systems-of-chips. “Chiplets represents a unique opportunity for Europe to re-enter the game of high-end chips,” said Frey. He emphasized the need for an open chiplet marketplace, an effort Arm supports, but warned, “There is a long road ahead of us,” citing the need for silicon qualification, profiling, test and debug infrastructure, software standards, and specifications for mechanical and thermal integration.Christophe Frey, Vice President of EU Engagement, ArmThat transition is already taking shape in manufacturing. Volker Herbig, Vice President of the Microsystems Business Unit at X-FAB, noted that capabilities developed for CMOS+MEMS sensor in the early 2000s are now enabling heterogeneous integration (HI) at scale. “We are now an open HI foundry,” said Herbig, adding that X-FAB is building a dedicated HI facility with support from the EU Chips Act. “This technology is propagating down from the high-performance computing (HPC) world to medical and industrial applications — It’s happening as we speak.”An Industry Changing Faster Than Ever Volker Herbig captured the industry’s rapid evolution with the “Red Queen” theory from Alice in Wonderland: “You need to run as fast as you can just to stay in the same place.”Volker Herbig, Vice-President, BU MEMS, X-FABClosing the symposium, Leonard Hobbs, Director for Government Affairs at Intel Ireland, cited Charles Darwin: “The species which can best adapt to changes in its environment is the one which survives,” Hobbs added, “Over the past two days we have learned much that can help Europe’s semiconductor industry to adapt successfully to a rapidly changed world.” Leonard Hobbs, Director for Government Affairs, Intel IrelandAt the symposium’s gala dinner, delegates celebrated leaders driving the industry forward. SEMI presented the 2024 SEMI European Award to Kurt Sievers, President and CEO of NXP Semiconductors, and honored Anna-Riikka Vuorikari-Antikainen, Chief Commercial Officer of Okmetic, with the Special Service Award.Kurt Sievers, President and CEO, NXP Semiconductors (Middle)Anna-Riikka Vuorikari-Antikainen, Chief Commercial Officer, OkmeticOn behalf of SEMI, the SEMI Europe team and ISS Europe committee would like to thank all speakers, sponsors, and attendees for making the event a great success.SEMI Contact Cassandra Melvin, Senior Director of Business Development and Operations Email: [email protected]

On April 8-9, 2025, bees on cherry blossoms lining the streets of Washington D.C. were not the only things buzzing. The word “tariffs” floated in the air from TVs and conversations throughout Capitol Hill, as people eagerly awaited the implementation and response to United States President Donald Trump’s latest round of far-reaching trade policy. This was the backdrop for this year’s SEMI Washington Fly-In, hosted annually by the SEMI North America Advisory Board (NAAB), which gathered representatives from member companies to meet with government officials and advocate for policy changes vital to the semiconductor industry’s continued growth and innovation.SEMI executives and more than 50 representatives from member companies across the end-to-end semiconductor supply chain participated in the Fly-In. SEMI President and CEO Ajit Manocha, SEMI Americas President Joe Stockunas, and SEMI Vice President of Global Advocacy and Public Policy John Cooney met with Trump administration officials from the Department of Commerce. Reflecting the global reach of SEMI, Manocha traveled from Washington to Brussels for meetings with the European Commission. On April 8, Stockunas presided over a NAAB meeting, followed by a dinner and prep session for meetings with Congressional members and their staff the following day. Building on the priorities outlined in the briefing book prepared by Cooney’s Advocacy team in Washington, participants discussed priority messages to convey tailored to the specific officials.Focus topics included:Tariffs and Trade – Address the buzz of the day’s news cycle by spotlighting the challenges of multiple layers of tariffs facing U.S. operations due to the industry’s global supply chain.Export Control Policy – Revise export control rules to be narrow and focused with increased transparency to minimize uncertainty for companies contributing to the world’s most complex manufacturing processes.Tax Policy and Investment Incentives – Extend tax credits set to expire and expand them to include semiconductor material suppliers and packaging facilities to bolster the full semiconductor ecosystem.CHIPS Act Implementation – Streamline implementation and ensure that the full intended scope of the CHIPS Act is maintained to meet the goals of the bipartisan legislation.Workforce Development and Immigration – Highlight the need for multi-layered programs – from education to apprenticeships through career development – required to provide the skilled workforce that will underpin domestic industry expansion.Energy and Environment – Showcase the need for strong R D programs, industry-led standards, and permitting reforms to help the semiconductor industry address booming energy requirements to power Artificial Intelligence and meet the resource needs of the growing domestic chipmaking ecosystem.PFAS Regulation and R D Needs – Prioritize regulatory actions that take a risk-based approach to PFAS and other chemicals critical to semiconductor manufacturing, as well as R D to improve environmental controls and identify potential alternative substances.SEMI organized four groups by U.S. region – East, Midwest/South, Southwest and West – comprised of representatives from member companies with operations in the respective states of the Senate and House of Representative offices scheduled for meetings at Capitol Hill. On April 9, the groups met with Members of Congress and their staff from 20 of the nation’s states, including Arizona, Arkansas, California, Colorado, Delaware, Idaho, Kentucky, Louisiana, Massachusetts, Michigan, Minnesota, New Mexico, North Carolina, Ohio, Oregon, Texas, Utah, Virgina, Washington and West Virginia. The groups shared powerful perspectives, data and anecdotes on the impact of policies on their companies’ operations. While the groups for the SEMI Washington Fly-In included representatives from companies that are fierce business rivals, the focus of the discussions successfully presented a unified industry voice highlighting shared challenges, policy recommendations, and request for support – in true SEMI “Stronger Together” spirit.News of a 90-day pause on most tariffs broke while the groups were conducting their meetings. The intense difficulties of tracking changes on tariffs and other policies permeated throughout the conversations on the impact on business decision-making. While influencing policy changes will not occur instantaneously, the SEMI Washington Fly-In bolstered the SEMI Global Advocacy team’s ongoing efforts to educate officials on the nuances and critical importance of the complete semiconductor supply chain. Additionally, the discussions emphasized the policy modifications that will have the greatest impact in helping the industry continue its lasting legacy of innovation that improves the quality of life for people in the U.S. and around the world.On April 11, the Customs and Border Patrol issued an addendum to the tariff exemption list that did not result in a complete exemption for the semiconductor supply chain. President Trump posted afterward on social media: "We are taking a look at Semiconductors and the WHOLE ELECTRONICS SUPPLY CHAIN in the upcoming National Security Tariff Investigations."Traditionally, such investigations have been conducted over a prolonged period of time for the government to collect data directly from companies and solicit feedback from industry. If past precedent remains, this will represent the first formal opportunity for industry to engage on the Administration's tariffs. The President has stated that his plans for tariffs on semiconductors will be unveiled this week.Visit SEMI Global Advocacy to learn more about public policy efforts and developments, and SEMI Workforce Development for more information on efforts to address the microelectronics industry’s talent needs.Samer Bahou is Director of Marketing Communications at SEMI.

The semiconductor industry is a rapidly expanding sector in the United States with an anticipated 115,000 new jobs by 2030. A projected 67,000 of these in-demand roles will remain unfilled (SIA Workforce Blueprint, 2024), given the current training landscape. To address this workforce challenge, many strategies must be leveraged. One solution is to diversify the education and training needed to move workers into the semiconductor industry. Through semiconductor-specific programming at community colleges and universities, institutions can attract a wide array of learners, and by creating flexible credit, non-credit, degree, diploma, and certificate programs, education providers can meet hiring needs through many pathways. The SEMI Foundation, the workforce development arm of SEMI, is now offering Fundamental Semiconductor Knowledge Certification for high-quality programs that prepare entry-level workers for success in the growing semiconductor industry. SEMI’s Fundamental Semiconductor Knowledge Certification conveys that: Learners who are new to the semiconductor industry and successfully complete the program will be well-prepared for entry-level roles; Program completers have had exposure to fundamental semiconductor industry information and context, as well as introductory hands-on experience;Completers of these programs will have the specific knowledge and skills required for entry level positions; andProgrammatic design and content have been informed through input and feedback from local industry partners.Certified Programs: Spotlight on Austin Community CollegeAustin Community College District (ACC)—located in Austin, TX, was the inaugural recipient of the SEMI Foundation’s Fundamental Semiconductor Knowledge Certification for their Advanced Manufacturing Production (AMP) program. The strength of ACC’s programming is further illustrated by the College’s partnership with America’s Frontier Fund (AFF) Foundation, Merit America, and the Texas Institute for Electronics to expand the AMP program across the United States in 2025. This expansion will allow job seekers to access the SEMI Certified AMP program in a flexible, location-diverse capacity. ACC’s Dr. Laura Marmolejo, Dean of Advanced Manufacturing, and Laura Lucas, Director of Strategic Initiatives, spoke with SEMI Foundation to share the origin story of AMP and provide lessons learned and advice for others who are developing or expanding similar programs. Dr. Laura Marmolejo, Dean of Advanced Manufacturing, and Laura Lucas, Director of Strategic InitiativesKnowledge Sharing: Best Practices and StrategiesWhen asked what other schools can learn from ACC's experience, Dr. Marmolejo and Ms. Lucas focused on three key areas: direct engagement with industry, flexibility on programming and meeting local needs, and developing a pathway that can be clearly communicated to learners and industry alike. Dr. Marmolejo emphasized the importance of developing strong connections with industry. “Start by building these relationships with the company. They need to trust you,” said Dr. Marmolejo.” Ms. Lucas also spoke of how the program's origin and ultimate success emerged from direct engagement with companies. By understanding direct needs at each company, identifying consistent needs between the companies, and identifying ways that the College could support those needs, ACC was able to offer multiple solutions that appealed to both students and employers. Austin Community College offers several ways for learners or jobseekers to deepen their knowledge of the semiconductor industry and advanced manufacturing sector. Learners can begin their journey with the College’s 8-week Advanced Manufacturing Production (AMP) program, upskill with the Core Automation Semiconductor Training (CAST) program, or pursue a bachelor's or associate degree.Another benefit of the close collaboration between ACC and industry is that the College "is understanding where the regional hiring demand is at any given time,” said Ms. Lucas. This awareness, coupled with a mindset of flexibility and adaptability among the instructors and administrators, allows ACC to align programming with local needs, ensuring that jobseekers experience success once they complete their programs. For example, recently in Austin, employers have been focused on upskilling existing employees, so ACC has been able to open more sections of the Semiconductor Technician Advanced Rapid Start (STARS) program for incumbent workers within the local workforce ecosystem. When hiring gaps require more new additions to the industry, ACC will be able to pivot to increased AMP and CAST programming. This awareness of industry needs and the flexibility allows ACC to think about its offerings holistically.Advanced manufacturing students at ACCAnother consideration that schools and faculty can keep in mind when developing programs is how they scaffold programming and communicate the pathways and differences between offerings to external audiences. Internally, the distinctions between programs may feel obvious, but learning how to promote each pathway to learners, and how to differentiate them when seeking employer input is critical. Whether it's AMP, CAST, or STARS, "the topics are the same; what’s different is the level of depth,” explained Dr. Marmolejo. Ensuring learners enroll in the right program for their individual needs and career path will help the College build the right pathways for students from education to career. Clear communication about programming will also inform the industry about the best ways to get and stay involved in course development and iteration. Dr. Marmolejo with advanced manufacturing students at ACCACC’s success in building pathways for students into industry at the local level is evident in the more than 2,800 students enrolled across all advanced manufacturing programs, as well as its upcoming national program expansion for AMP. Other educational institutions and training providers can learn from the best practices and experiences of ACC, and can similarly have their work reviewed and certified by the SEMI Foundation.Press event at ACC in November 2024 to announce the expansion of AMP program nationwide and the awarding of the SEMI Certification.SEMI Certification: Next Steps for Training and Education PartnersSEMI Certification for training programs communicates to learners, jobseekers, and employers that the awarded programs have achieved the highest standards of program excellence in preparing entry-level workers to succeed in the growing semiconductor industry. Through 2025, the SEMI Foundation plans to expand program and course certification to include technician training programs. If you are a training or education partner looking to submit a program for consideration, please complete the SEMI Certificate Screening form. For more information about existing and future SEMI Certification efforts, please contact Anissa Hamdon-Morison at [email protected] or visit SEMI Certified Programs Courses | SCAN.Anissa Hamdon-Morison is the Curriculum and Training Manager at the SEMI Foundation.

Insights from the ISS Europe 2025 Press Briefing in SopotAt the SEMI Industry Strategy Symposium Europe (ISS Europe) 2025, held in Sopot, Poland, senior leaders from government, industry, and the investment community came together to share insights on Europe’s evolving semiconductor landscape. During a dedicated press briefing, they addressed Poland’s growing role in the ecosystem, the significance of international collaboration, and the strategic levers needed to bolster Europe’s competitiveness in semiconductors.Against the backdrop of accelerating investment through the EU Chips Act, speakers emphasized that building Europe’s semiconductor future will require more than funding. It will demand cross-border collaboration, cohesive public-private strategies, and a long-term vision to ensure talent pipelines and supply chain resilience.The briefing featured remarks and commentary from:Laith Altimime, President, SEMI EuropeAgnieszka Sygitowicz, President, The Polish-Taiwanese Chamber of Commerce and IndustryPawel Pudlowski, Ph.D., Deputy CEO, Polish Investment and Trade Agency (PAIH)Monika Morali-Majkut, Chairwoman of the Supervisory Board, Atlas WardBenedikt Ernst, Senior Vice President and Head of Strategy Transformation, Merck KGaA, Darmstadt, GermanyDionys van de Ven, President, Comet YxlonAnna-Riikka Vuorikari-Antikainen, Chief Commercial Officer, Okmetic From left to right: Agnieszka Sygitowicz, President, The Polish-Taiwanese Chamber of Commerce and Industry; Pawel Pudlowski, Ph.D., Deputy CEO, Polish Investment and Trade Agency; Monika Morali-Majkut, Chairwoman of the Supervisory Board, Atlas Ward; Laith Altimime, President, SEMI Europe; Benedikt Ernst, Senior Vice President and Head of Strategy Transformation, Merck KGaA, Darmstadt, Germany; Dionys van de Ven, President, Comet Yxlon; Anna-Riikka Vuorikari-Antikainen, Chief Commercial Officer, OkmeticSEMI: How are the private sector and international partners contributing to Poland’s ecosystem development?Morali-Majkut: The private sector is essential to building Poland’s semiconductor ecosystem. At Atlas Ward, together with like-minded companies, we’ve launched SEMICON Supply Poland to help develop a strong, scalable supply chain. We’re working to ensure that essential infrastructure is ready: land, utilities, materials, and specialized service providers that can meet the needs of incoming semiconductor investments. But this isn’t just a national effort. We’re closely aligned with ecosystem-building in Dresden, Prague, and across Central Europe. Collaboration across borders is essential.Sygitowicz: We believe strongly in the philosophy of “building bridges.” In our work with Taiwan and other partners, we focus on five “bridges”: knowledge, people, business, development, and shared success. These connections are critical for Poland to become an integral part of the global semiconductor supply chain. Poland is not trying to replicate what others have done, but to learn from it—particularly in ecosystem development. The long game is not just investment attraction; it’s ecosystem maturity. SEMI: Talent shortages remain a major concern across the industry. What steps are being taken to prepare the future-ready workforce?Morali-Majkut: We are working closely with academia to build the talent pipeline Poland will need as its semiconductor sector grows. Together with industry partners, we’re developing vocational training programs and university-level collaborations aimed at aligning skills with industry needs. There are already several R D-focused projects underway at Polish technical universities, and Poland’s strong foundation in technical education positions us well to support workforce growth as the industry scales up.The semiconductor industry has one of the most complex supply chains in the world. Investing in this industry creates ripple effects across a wide range of skill areas. When we invest in semiconductor education, the spillover benefits for the broader economy will be immense.Altimime: While the talent shortage is certainly a challenge, it also presents a massive opportunity. At SEMI, we’re committed to making Europe’s semiconductor investment a long-term success. Through strong collaboration with the European Commission and a broad network of consortium partners across Europe, including Poland and other Eastern European countries, we’re pushing forward both public and private sector engagement to ensure the continuity of growth and innovation.Europe is projected to face a shortage of 271,000 skilled workers in the semiconductor sector by 2030 if current trends persist. To address this challenge, SEMI is leading a range of initiatives focused on reskilling, upskilling, and cross-sector knowledge development. We’ve established an Educational Leaders Board with 18 consortium members and are organizing events to reach out to students and educational institutions – including the recent SEMI On Campus with the University of Gdańsk — all to foster stronger connections between academia and industry. SEMI: How can Europe strengthen its semiconductor supply chain resilience in the face of geopolitical challenges?Ernst: Resilience starts with recognizing and building on Europe’s existing strengths. While much attention is often given to gaps, Europe already has world-class players, technologies, and a strong consumer market. These are key strategic assets. What’s needed now is coordination—government and industry must work together to align efforts, avoid fragmentation, and ensure that political initiatives channel support in a unified direction.Van de Ven: For industry, true resilience means the freedom to operate globally. Trade controls and IP restrictions can create bottlenecks, so policies must support open access to markets across regions—including the U.S., Europe, and Asia. Companies also need to co-create with fabs and universities, embedding themselves where talent is trained and where innovation happens. This creates a robust, future-ready ecosystem. Location decisions are increasingly influenced by proximity to both production facilities and research institutions.Sygitowicz: Poland is well-positioned to support investment through a combination of ready-to-develop land, financial incentives (such as grants and tax exemptions), and ecosystem services. Beyond infrastructure, there is growing government support for talent development and innovation. Startups, accelerators, and academic partnerships are playing a larger role in building the technology pipeline—creating a more comprehensive, innovation-friendly environment for foreign investors.Vuorikari-Antikainen: Speed is an often overlooked but critical factor in competitiveness. Europe has historically moved slowly, but if countries like Poland can create fast-track pathways for permitting, investment, and project execution, they can set themselves apart. Pairing this agility with strong education and startup ecosystems will help deliver long-term resilience and responsiveness to market needs.Altimime: We must avoid country-centric thinking. Europe’s strength lies in its diversity with different regions excel in different areas, and the challenge is to bring those strengths together. Initiatives like the pilot lines are a great example of this in action, connecting capabilities in photonics, advanced packaging, and quantum technologies across the continent. With strong leadership from Europe’s research and technology organizations (RTOs), such as the Technical Research Centre of Finland (VTT), we’re seeing renewed momentum in areas where Europe has historically been strong, like communications and photonics.To truly accelerate Europe’s position in the global semiconductor landscape, we need to focus on integration—connecting the dots between regions, institutions, and industries. From left to right: Laith Altimime, President, SEMI Europe; Benedikt Ernst, Senior Vice President and Head of Strategy Transformation, Merck KGaA, Darmstadt, Germany; Dionys van de Ven, President, Comet Yxlon; Anna-Riikka Vuorikari-Antikainen, Chief Commercial Officer, OkmeticSEMI: With the European Commission discussing a potential second Chips Act, what lessons should we carry forward from the first—and how can Poland play a stronger role?Van de Ven: The primary objective of the Chips Act should be to enable investment and industrial action. In some cases, we’ve seen frameworks become overly complex, attempting to define platforms or outcomes in ways that don’t always align with business needs. From an industry standpoint, what’s most helpful is straightforward support—mechanisms that empower companies to invest where it makes sense and move quickly. Ultimately, the private sector will determine how to build and scale the necessary infrastructure and innovation.Pudlowski: It’s true that Poland did not benefit from the first Chips Act to the extent that its assets and potential might suggest. We offer a combination of engineering talent, geographic advantage, and industrial readiness—yet, in terms of EU-level influence and visibility, we’ve been underrepresented. That is beginning to change.Poland now has a national semiconductor strategy backed by the government, and this, combined with growing engagement from organizations like SEMI, positions us for stronger inclusion going forward. At the same time, we need more bottom-up visibility. Companies in Poland should proactively present their capabilities and publish their work more widely. We have a great deal to offer, and now is the time to ensure that’s recognized in Brussels and across Europe.Altimime: Poland’s recent release of its national chip strategy is both timely and critical. From SEMI’s perspective, this is a proven model: a clear strategic roadmap, strong government backing, and industry alignment create the right environment for success. The first Chips Act delivered real progress and global attention, and with Poland’s new strategy in place, we expect to see even greater integration into the European semiconductor value chain in the next phase of the initiative.Morali-Majkut: During recent conversations with international partners, particularly in Asia, it became clear that while countries like Germany and the Czech Republic are well known within the semiconductor ecosystem, Poland has not always been equally visible—despite being geographically and industrially well-positioned. That perception is starting to shift.Poland has long played a vital role in Europe’s industrial supply chain, particularly in collaboration with Germany. We bring a strong foundation in engineering, education, cost-efficiency, and industrial land availability. These assets are highly relevant to semiconductor expansion. Rather than seeing countries in isolation, we should frame this as a collaborative regional model—linking Germany, the Czech Republic, and Poland as an integrated supply chain hub. SEMI ContactSitong He, Communications ManagerEmail: [email protected]

The semiconductor industry lies at the heart of Europe’s technological ambitions, powering breakthroughs in artificial intelligence, quantum computing, and advanced manufacturing. However, as the industry expands rapidly to meet surging global demand, the need for highly skilled workers is outpacing supply. According to the recently published ECSA Skills Strategy, Europe must train and hire tens of thousands of skilled professionals by 2030 to remain globally competitive. Without a robust and inclusive talent pipeline, the region’s independence in critical technologies might be at risk.At this year’s Industry Strategy Symposium Europe (ISS Europe) held in March, a panel discussion moderated by Maria Daniela Perez from SEMI Europe, brought together industry leaders and experts to explore solutions to this challenge. The discussion centered on how emerging technologies are reshaping the workforce, the role of education in preparing future professionals, and strategies for attracting and retaining diverse talent – all critical to ensuring sustainable workforce development in the semiconductor industry.Tackling Talent Acquisition and RetentionCatherine Le Lan, European University Program Manager from Synopsys, drew a direct connection between technological disruption and workforce challenges. “AI is driving unprecedented changes, and hardware is at the heart of the AI revolution,” said Le Lan. As the industry invests in new methodologies, leading-edge technologies, and innovative products, the demand for updated skillsets continues to outpace supply. This places a dual burden on companies – who must hire for both today’s and tomorrow’s skills – and on the education sector, which is expected to rapidly adapt.Meike Boekelmann, Chief of Human Resources at Comet, highlighted that the challenge is not just about attracting talent from within the semiconductor field – it is also about standing out in a crowded talent market. “We are not only competing within our industry for talent. We’re also competing against other industries: automotive, consumer electronics, and AI,” said Boekelmann. To succeed, companies must go beyond traditional incentives and offer meaningful, forward-looking career experiences. “Primarily what I see is that they’re really asking for creating an impact and also a sense of belonging… so they want to see what’s the outcome,” she explained. “There are more people leaving the labor market than entering the labor market,” added Thomas Kralinski from the Saxon State Secretary of Economic Affairs, Labour, Energy and Climate. “We need to think about immigration, family-work integration, and training.” His comments underscore the need for a holistic workforce strategy – one that not only fills immediate vacancies, but also strengthens the broader ecosystem through inclusive policies, targeted reskilling, and long-term demographic planning.Fostering Industry-Academia SynergyAs the industry evolves, so must its workforce. Andreas Schleicher, Director for Education and Skills at the OECD, made a stark observation. “There’s one thing worse than losing people – and that is to keep them and not upskill them.” He warned that the current pace of technological change demands far more than one-time training; it requires a culture of continuous learning. “Neither the industry nor the education sector has the capacity for upskilling and reskilling,” he noted, pointing out that while Europe performs well in early education, adult learning remains insufficient. “The incidence and intensity of upskilling and reskilling is so far out of what we will need.” Without scalable, lifelong learning systems, even experienced professionals risk being left behind.Building on this idea of future-readiness, Thomas Kralinski noted: “Do you know what kind of fab is going to be open in 10 years’ time or what startup is going to be founded in 10 years’ time? You probably don’t. But everybody who’s working there or will work there is born already – and is probably in school or at the university.” He underscored the need for steady investment in teachers, training systems, and educational infrastructure – not just to meet today’s demand but to ensure Europe’s long-term competitiveness.To truly inspire the next generation, Schleicher pointed to visibility as a vital factor. “You cannot be what you cannot see.” Without relatable role models or a clear understanding of how their interests connect to meaningful careers, young people – especially underrepresented students – often overlook STEM pathways. Schleicher described how even small actions, like industry professionals visiting schools to explain their work, can have a lasting impact. “You can bring someone from the semiconductors industry to speak to students and help them understand, for example, what’s in a mobile phone and that they can actually create tomorrow’s mobile phone.” That kind of engagement, he argued, helps “build dreams” and makes technology tangible, exciting, and inclusive.AI: An Enabler, Not a ThreatPanel moderator Maria Daniela Perez raised a critical question about the evolving role of AI in the workforce. Acknowledging the widespread concern that AI could lead to job displacement, she challenged the panel to consider a different perspective. How can AI be leveraged to broaden and accelerate the talent pipeline rather than replace it? In response, the panelists emphasized that AI is not a disruptor but an accelerator. Rather than eliminating jobs, AI-driven tools enhance productivity by automating repetitive tasks, freeing professionals to focus on innovation, problem-solving, and high-value work. Catherine Le Lan provided a compelling example, explaining how AI-powered electronic design automation (EDA) tools are enabling engineers to push the boundaries of technological advancement. She referred to a university study that compared two groups of students – one with access to AI tools and one without. “They found out that those AI tools helped to improve productivity and also helped to improve skills of the students,” she said. “The student who had used AI tools had better skills than the one who hadn’t used AI tools… because they had been able to focus on the high-level skills, and they got rid of the low-level skills.” Her remarks underscored how AI, when integrated into education, can accelerate both efficiency and learning outcomes.Collaboration: The Key to Sustainable Workforce DevelopmentAddressing the workforce challenge requires cross-sector collaboration among industry, academia, and policymakers. There is a shared responsibility to invest in long-term education strategies, develop structured training initiatives, and create an ecosystem where talent can thrive. This is precisely the mission of two SEMI Europe-led initiatives.The European Chips Skills Academy (ECSA) and the European Chips Diversity Alliance (ECDA) are playing a critical role in shaping Europe’s semiconductor workforce. ECSA is driving efforts to align education and training with industry needs, ensuring that both students and professionals are equipped with the technical expertise and practical experience required for the sector’s future. Meanwhile, ECDA focuses on building a more inclusive semiconductor workforce across the industry. By creating opportunities for underrepresented groups, ECDA is ensuring that the industry benefits from a broad talent pool.Securing Europe’s Semiconductor FutureIn her closing remarks, Maria Daniela Perez brought the discussion full circle, emphasizing that addressing the semiconductor talent gap requires collective ownership: “In the end, it ends up being all about collaboration,” said Perez. From engaging technology users to amplifying the industry’s visibility, to aligning with academia and policymakers, the path forward depends on shared action. By fostering this ecosystem-wide commitment – and investing in the people behind the progress – Europe can bridge the talent gap and shape a resilient, inclusive, and globally competitive semiconductor workforce.SEMI ContactKartikey Srivastava, Senior Specialist, CommunicationsEmail: [email protected]