Integrated photonics offers the semiconductor industry a new way to increase the speed and capability of classical compute functions, as well as enabling quantum computing. The III-V Summit, hosted by SEMI Europe in partnership with Photon Delta at SEMICON Europa, opened with a compelling question: why is a photonics summit taking place in the middle of a semiconductor event? Ajit Manocha, President and CEO of SEMI, highlighted the growing convergence of the semiconductor and photonics industries, stating, “It is my firm belief that a boost to Moore’s Law will come from the III-V world.” Declaring that the rate of growth in integrated photonics is set to pick up substantially, Manocha assured, “I will be your ambassador to make sure that the III-V technologies gain far greater visibility than they have today.”Ajit Manocha, President and CEO, SEMIThe promise of new III-V technologies is generating significant excitement within the semiconductor industry. Abdul Rahim, Ecosystem Manager at PhotonWorld, acknowledged the reality that today’s III-V device industry operates in a limited sphere, stating, “The III-V world is still at the interface of industry and academia. There is one main application for III-V devices – transceivers for data centers.” Abdul Rahim, Ecosystem Manager, PhotonWorld Carlos Lee, Director General of the European Photonics Industry Consortium (EPIC), echoed this message, “Photonics is not so much an industry today; it’s an ecosystem. It lacks the standards, roadmaps, and market data that a full-fledged industry needs – but we are getting there.” Carlos Lee, Director General, European Photonics Industry Consortium (EPIC)However, Rahim pointed to a number of trends that are driving the growth of III-V technology for integrated photonics. One key development is large-scale integration, “over the years, the number of devices in one photonics integrated chip (PIC) has been growing fast, reaching tens of thousands of components on-chip,” Rahim explained. Additionally, the widening frequency range supported by III-V devices is unlocking new applications beyond the telecom sector. Broad Scope of Research into III-V Technology for Integrated PhotonicsResearch into III-V technology spans an impressive range of materials, processes and applications. Nick Singh, CTO at Compound Semiconductor Applications (CSA) Catapult, a government-backed technology incubator, described in detail the most important fields of research that are driving innovation in integrated photonics. “III-V materials are special because they can be engineered,” Singh explained. Highlighting their potential role in advancing quantum computing, Singh added, “The ability to use new materials is crucial to reducing the reliance on algorithmic compensation for errors and non-linearity in hardware.” Nick Singh, CTO, Compound Semiconductor Applications Catapult However, Singh emphasized the need for the photonics industry to address structural challenges that could hinder progress. “Collaboration is crucial to standardize process development kits (PDKs) for photonics device fabrication processes—it’s like the Wild West in PDKs right now,” Singh remarked. “Additionally, the availability of raw materials presents a significant challenge.”The truth of this warning was confirmed by Diane Scott, Vice President of TECHCET, stating, "The US has deemed gallium to be the number one supply chain risk among a list of 50 raw materials, and the European Union (EU) has identified gallium as a critical raw material."Diane Scott, Vice President, TECHCETSuch geopolitical concerns have done little to dampen the intensity of research in III-V technology. One of the powerhouses of integrated photonics research is IBM, and Heike Riel, a Fellow at IBM Research with a special interest in quantum computing, revealed promising avenues that IBM is exploring. “IBM has developed local III-V-on-silicon heteroepitaxy, “Riel explained. “Using a direct growth method, we can grow vertical, lateral, and even 3D structures in III-V, such as stacked GaAs structures.” Riel highlighted the potential applications of this technology in emerging processor designs, including the Artificial Intelligence Unit (AIU) and analog computing devices with in-memory logic. “Here, we can deploy GaAs as a photorefractive material, used as a grating, to perform the same function as conventional electronic non-volatile memory in an analog computer chip,” Riel noted. Heike Riel, IBM Fellow, IBM ResearchAlso at the forefront of photonics integration is Black Semiconductor, a start-up company based in Aachen, Germany, which is developing devices using graphene. Cedric Huyghebaert, CTO of Black Semiconductor, shared the company’s vision, “We want to use electronics to compute, and photonics to transfer data, and bring both functions together on the same chip.” Black Semiconductor’s mission is to become the first foundry to offer integrated graphene technology. “Our ambition is to integrate graphene in line with semiconductor standards using semiconductor tools – avoiding the need for exotic processing technologies,” Huyghebaert explained. “We also aim to demonstrate co-integrated photonics on a 300mm wafer system, regardless of the process node. In doing so, we want to prove that deep technological innovation of this kind is possible in Europe.”Cedric Huyghebaert, CTO, Black Semiconductor GmbH Bringing Integrated Photonics to the MassesAs III-V technology develops to enable a broader range of integrated photonics applications beyond the telecom market, experts are recognizing the need for it to become more accessible if it is to be adopted by a wider range of manufacturers. Joni Mellin, manager of the photonics business line at the X-Fab Group, emphasized, “As an industry, we need to bring electronics design automation (EDA) tools up to a level of capability that matches that of the silicon world, so that you do not need a PhD to do product design – we need to make it accessible to ordinary electronics engineers.” Joni Mellin, BL Manager Photonics, X-FAB GroupAdoption of the technology also requires access to production capacity. Peter Maat, Senior Product Manager at SMART Photonics, an open foundry for indium phosphide (InP) programmable interface controllers (PICs), highlighted the challenges in this area. Maat explained that the availability of the foundry as “not a trivial capability,” because many InP fabs are run by integrated device manufacturers, and are closed to other users. The SMART Photonics business model aims to provide a comprehensive enablement service for fabless manufacturing of PICs. “Our responsibility is to produce stable, manufacturable building blocks that we make available to designers and to provide a platform which enables our circuit building blocks to be combined into an integrated photonics circuit,” Maat said.Peter Maat, Senior Product Manager, SMART Photonics Jayakrishnan Chandrappan, Head of Advanced Packaging Technology at CSA Catapult, also emphasized the importance of access to production capability. “The CSA Catapult has one of the world’s only sub-10micron hybridization facilities for advanced packaging that is open to third-party users,” Chandrappan noted.Jayakrishnan Chandrappan, Head of Technology, Head of Technology - Advanced Packaging, Compound Semiconductor Applications CatapultPromising Future for Integrated PhotonicsAs the summit concluded, the atmosphere was charged with optimism about the future of integrated photonics. The discussions highlighted how III-V materials, combined with advanced packaging, are set to play a pivotal role in shaping next generation technologies. A recurring theme throughout the event was the profound impact III-V materials will have, as they poised to become a corner stone of virtually every emerging technological advancement. SEMI ContactLaith Altimime, President of SEMI EuropeEmail: [email protected]

“Every working family in America knows how hard it is today to find affordable childcare or early childhood education.” – U.S. Senator Bernie Sanders“Finding solutions to improve affordability of childcare is very much an overall workforce issue.” – U.S. Senator Chuck GrassleyThe semiconductor industry will need more than a million new workers to fuel its anticipated growth toward $1 trillion in economic impact by the early 2030s. The types of jobs available within the industry will be as varied and diverse as will the people needed to fill them. This presents an extraordinary opportunity to provide Americans with access to meaningful economic opportunities and pathways to lifelong careers. Identifying, recruiting, and training these many workers will require a new level of partnership between industry, academia, workforce development networks, and more. Retention of those workers – and employees currently in the industry – is an equally significant challenge. Key to solving the retention problem is childcare – affordable, accessible, and quality childcare for all working parents. About 40% of the nation’s workforce are parents with children under the age of 18, and about 11% are parents with children under 5 years old. According to a study by the National Women’s Law Center, 23% of families cannot find or pay for care. Only 12% of U.S. companies provide childcare benefits, and 1 in 4 American parents have been forced to quit their job or leave their education pathways due to a lack of affordable, accessible, and quality child care. More than 50% of Americans live in a “childcare desert” – meaning that for every licensed childcare slot, there are three children who need that slot. All of this equates to huge losses: taxpayers lose $21 billion each year in lower tax revenue; employers lose $23 billion each year due to childcare challenges; and families lose $73 billion a year due to insufficient childcare. Companies alone cannot solve the childcare crisis. It will require the partnership of government, industry, advocates, providers, and more. One significant step the federal government has made in improving childcare systems in America is requiring childcare plans from companies who apply for more than $150 million in funding from the CHIPS Science Act of 2022 – and strongly encouraging all applicants to include them regardless of funding request amounts. This requirement has shown early promise and has shifted the conversation around childcare, even for semiconductor companies not receiving CHIPS funding.Many chip companies reached out to the SEMI Foundation, SEMI’s nonprofit workforce development arm, seeking support for creating or strengthening company workforce development plans and equity strategies for their CHIPS applications. This led to requests for support for childcare plans as well. To address this need, the SEMI Foundation collaborated with childcare experts - policymakers, providers, and consortia – to best advise companies. Through this work, SEMI Foundation and the consulting firm Policy Equity Group became thought partners in helping SEMI member companies create stronger childcare benefits and support stronger childcare systems nationwide. This work, called Chips Childcare, is in partnership with the W.K. Kellogg Foundation and David and Lucile Packard Foundation through the Investing in America Child Care Partnership.Our work is to not just help families and companies thrive, but to truly understand the problem and find both proven and creative solutions. Why is it so difficult to find affordable, accessible, and quality childcare? Why is childcare such a critical component of workforce development, particularly to the semiconductor industry? Michelle Williams, Executive Director of the SEMI Foundation, sat down with Jeff Capizzano, President and Founder of Policy Equity Group, to ask these questions.Williams: Jeff, tell me about Policy Equity Group and the company’s mission.Capizzano: The Policy Equity Group is an early childhood consulting firm. Our main office is located on Capitol Hill in Washington, D.C., but we have staff across the country. We spend our days working with policymakers, advocates, companies, early childhood providers, and families on ways to improve the quality of early care and education and to make it more accessible and affordable to families. I started the Policy Equity Group to help advocates and to be a bridge between stakeholders and policymakers. Now, we spend our days trying to leverage currently existing policy (like the CHIPS Act), and advocating for new policies that improve the access, affordability, and quality of early care and education programs. Williams: What is the state of childcare in this country? Capizzano: The childcare sector is in bad shape. Childcare is expensive, hard to find, and often not of sufficient quality to promote a child’s development and learning. When parents can find childcare, it might not be in the ideal location or type of facility, or meet their scheduling needs. At the heart of the issue is the fact that childcare is a very difficult business model to sustain. Because it involves caring for children as young as six weeks old, it is heavily regulated to ensure that children are healthy and safe while in care. And rightly so. The most important regulation is the number of children that can be cared for per teacher in a childcare setting. At the same time, these regulations make it very difficult for childcare businesses to generate enough revenue based on what parents can afford to pay. This is why you see low pay in the profession, high turnover within the childcare workforce, and a low supply of care, particularly for children younger than three. Researchers at the University of California, Berkeley have a saying: “Families can’t afford to pay, teachers can’t afford to stay.” Source: Policy Equity GroupWilliams: You’ve talked about “childcare deserts”. Tell me more about that term. Are there “deserts” in the three states where we are working together – Arizona, Michigan, and Ohio?Capizzano: In the early childhood field, we refer to childcare deserts as a specific geographic area where childcare is scarce. The technical definition is a census tract where there are more than three children under age five to one licensed childcare slot. It’s an imperfect measure but is a decent indicator of where the demand for childcare has the potential to far exceed the capacity. Arizona, Ohio, and Michigan have childcare deserts. According to the research, nearly half of families in Arizona live in a childcare desert, compared to 44% of families in Michigan, and 39% in Ohio. Increasing childcare capacity is going to be one of the major challenges of our work with semiconductor companies in these states. Williams: How does the availability – or lack thereof – of affordable, accessible, and quality childcare affect today’s workers? Capizzano: The lack of access to affordable, quality childcare has a profound impact on workers. First, when childcare is difficult to access, it has an impact on labor force participation, particularly among women. For example, in the childcare desert areas that I talked about, the labor force participation rates for women are lower (3% on average) than other areas. Equally important, breakdowns in childcare arrangements among workers cause them to miss work, come in late or leave early, be distracted at work, or leave the workforce altogether. The U.S. Chamber of Commerce Foundation has done a good job of documenting the economic losses to businesses and to state economies, and the losses total billions of dollars annually for families, companies, and federal and state budgets. Williams: We don’t know much about the quality or extent of childcare offerings in the semiconductor industry. The studies I’ve found indicate that we are below the national average in offering childcare benefits – indeed, perhaps as few as 8% of semiconductor companies offer these benefits. SEMI Foundation conducted an informal survey of some members and found that of the small number who offered childcare benefits, fewer than 5% of employees who were parents actually use those benefits. Can you explain why this might be?Capizzano: I can’t speak specifically to the semiconductor industry (yet), but I know from other sectors that I have worked in that companies have not taken the time to really understand their employees’ childcare needs. As every parent who uses childcare knows, the decision of where to place your child in care can be complicated. Factors involved in this choice include family structure (is there a non-working spouse or relative available), supply, cost, and preference. A company should understand their employees’ childcare needs and preferences before creating a benefits package. Clearly, with a 5% take-up rate in benefits, it’s either an awareness issue or the benefits are not meeting true childcare needs of employees. Wiliams: The SEMI Foundation and Policy Equity Group have demonstrated the value of bringing together industry and expert childcare consultants who could help companies and their proximate communities build stronger childcare benefits and systems, rooted in research and informed by best practices. Talk a bit about our collaboration – where it is happening, what the process looks like, what the results will be, and how we hope to amplify our findings and our successes. Capizzano: Having a team that knows the ins and outs of both the semiconductor and childcare sectors is a recipe for success. On the childcare side, when we work with companies, we take them through a four-step process to get them to an actionable childcare plan.Source: Policy Equity GroupWe start by working to better understand the childcare needs and preferences of employees and the capacity of the local childcare markets to meet those needs. We survey the employees and then conduct a market analysis to understand the extent to which the childcare supply in the market fits with the needs and preferences of employees.The second step is what we call a “last dollar in” analysis to determine what publicly funded childcare options could be accessed before companies make their own investments in childcare. In the third step, we explore different childcare options for the employer. These options include increasing awareness of what the company is already offering or childcare support in the community, helping to make childcare more affordable through stipends, and leveraging potential tax incentives. Finally, we weave together what we’ve learned to create a childcare plan that is customized and actionable, and that responds to the diversity of families’ needs and preferences, the current market context, and what makes the most sense for the company from a budget and capacity perspective.Williams: If you had a magic wand, what top two things would you change about how the U.S. approaches childcare?Capizzano: First, I would change how childcare is perceived by policymakers and U.S. society overall. The research on brain development is very compelling. The birth-to-five period is the most consequential phase of human development and the experiences of children in those early years wire their brains and bodies in a way that impacts the rest of their lives. Yet, society places little value on the programs and teachers that care for and educate our youngest children. Nothing upsets an early childhood teacher more than being called a “babysitter,” and yet this is often how they are perceived. This perception must change. A child’s experiences in a childcare/early education setting is the first and arguably the most important step in a child’s educational journey. We all need to understand that. Second, I would change how childcare is financed. The childcare system consists of several federal and state programs, but it is primarily financed by the tuition that parents pay. As I mentioned, this creates an unsustainable business model where parents can only pay so much for childcare, and childcare providers can only generate so much revenue per teacher because of the regulations that keep children safe. This causes overall low quality of programs, low wages for teachers, and high teacher turnover. As a field, we are starting to better understand what it really costs to pay for high-quality childcare that meets parents’ needs and promotes child development. The amount of funding we need to create a high-quality childcare system is going to require significant public financing. The country’s most noted economists, including the Noble Laureate James Heckman, agree that this is a good investment. Williams: What do you want semiconductor leadership teams to know about childcare?Capizzano: I would want them to know that childcare is vital to the success of their business. It provides access to a large and diverse labor pool that would otherwise be unavailable if it weren’t for childcare. It makes for more productive workers, reduces stress in the workplace, and supports recruitment and retention of the most talented workers. And like any other aspect of the business, you must be strategic and data-driven when you address the childcare needs of employees.We would love to help. Jeffrey Capizzano is President of the Policy Equity Group, LLC, a consultancy that helps organizations, childcare providers, and families leverage early childhood policies and programs and become stronger advocates for better early childhood systems. Mr. Capizzano is a nationally known advocate and researcher with both private and public sector experience. Prior to founding Policy Equity Group, he served as a Senior Policy Advisor at the Administration for Children and Families within the U.S. Department of Health and Human Services.Michelle Williams is Executive Director of the SEMI Foundation.

New pilot lines offer European innovators access to the most advanced semiconductor technologies for product development and validation.The global semiconductor landscape has undergone significant transformation in recent years. With disruptions such as the semiconductor supply chain crisis and the challenges it posed to the automotive sector, Europe’s dependence on external fabrication facilities, particularly in Taiwan, has become a pressing concern. In response, the European Union (EU) introduced the EU Chips Act, a comprehensive framework designed to reduce this reliance and boost Europe’s share of the global semiconductor market. ITF Chip into the Future, hosted by imec at SEMICON Europa 2024, was a pivotal event that brought together industry leaders, policymakers, and experts to explore the implementation of the EU Chips Act and the future of Europe’s semiconductor ecosystem. Jari Kinaret, Executive Director of the Chips Joint Undertaking (Chips JU)—the body overseeing the EU’s semiconductor investments—explained, “The Chips JU is about capacity building to drive semiconductor innovation in Europe. We will continue to be dependent on the rest of the world, but we want to make sure that the rest of the world depends on us as well.” Jari Kinaret, Executive Director, Chips JUEuropean research is driving progress towards sub-nanometer fabricationOne of the pilot lines, located at imec’s research center in Belgium, is focused on advancing methods that push Moore’s Law forward by achieving smaller and more efficient circuit features. As Luc Van den hove, President and CEO of imec, explained, “imec is now powering innovation for tomorrow’s chip designs, including stacked layers of chips, with each layer containing specific functionality implemented on chip processes optimized for each function. This allows us to scale much further than if all functionality had to be implemented on a single monolithic layer.”Luc Van den hove, President and CEO, imec Another pilot line, based in France and operated by CEA-Leti, is focused on pushing the limits of technology across multiple dimensions. CEA-Leti CEO, Sébastien Dauvé, explained that the goal of the FAMES pilot line is to advance “not only FD-SOI at 10nm and 7nm nodes, but also novel non-volatile memory technologies, RF components, 3D integration, and the development of small inductors for DC-DC converters.” Sébastien Dauvé, CEO, CEA-LetiAdvancements in 3D integration and chiplet technologies are closely tied to innovation in chip packaging. Christoph Kutter, Executive Director of Fraunhofer EMS, described how the Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems (APECS) pilot line in Germany is designed to meet the needs of industrial customers’ growing demand for advanced packaging solutions. Kutter noted “Customers told us that they needed to integrate logic and power, sensors and logic, and other combinations of functions. We have built the APECS pilot line to provide what they asked for.”Christoph Kutter, Executive Director, Fraunhofer EMSThe EU Chips Act is spurring investments not only in chip fabrication but also in the underlying technologies which support chipmaking. Emmanuel Sabonnadière, EVP at Soitec, highlighted how fabrication of advanced silicon carbide (SiC) power devices “is enabled by SmartSiC™ technology from Soitec – part of a built-in-Europe solution for silicon carbide.” Sabonnadière explained that SmartSiC technology “creates very thin layers of SiC material which make really differentiated substrates supporting the production of high-performance SiC devices.” Emmanuel Sabonnadière, EVP, SoitecInnovation in materials emerged as an important theme at ITF Chip into the Future. Julien Arcamone, Vice President of Corporate R D at ASM, described the critical role of materials for atomic layer deposition (ALD) in the advancing 3D semiconductor integration. Arcamone emphasized the importance of collaboration across the semiconductor value chain, describing ASM’s partnership with imec as part of “a win-win ecosystem.” Julien Arcamone, Vice President of Corporate R D, ASMDeveloping the skills to implement advanced semiconductor technologiesWhile the EU Chips Act is subsidizing the construction of new facilities including pilot lines needed for the hardware of the semiconductor industry’s expansion – the ITF speakers underlined the equally important “software” element of the semiconductor industry ecosystem: the knowledge and expertise of the people working in the industry. One of the biggest challenges in implementing the EU Chips Act is addressing Europe’s talent gap. Katrien Marent, Executive Vice President and Chief Marketing and Communications Officer at imec, said that the gap is in part “because students who graduate in STEM subjects are not trained in advanced semiconductor technologies.” From left to right: Katrien Marent, Executive Vice President and Chief Marketing and Communications Officer, imec; Julien Arcamone, Vice President of Corporate R D, ASM; Thomas Heurung, CEO, Siemens EDA; Frédérique Le Grevès, President STMicroelectronics France and Executive Vice President, Europe France Public Affairs, STMicroelectronics; Romano Hoofman, Director imec.IC-link, imec; and Christophe Frey, Vice-President of EU engagements Managing Director, ARM.Thomas Heurung, CEO of Siemens EDA, highlighted the need for educational reform in the electronics industry. He suggested that “we might not have the right degree-level curriculum for changing times in the electronics industry. We need to change the way that we train students at university, and we need more scope for early or mid-career training on specialist micro-curriculums aimed at a particular skill or knowledge set.”The industry also struggles to attract individuals. Frédérique Le Grevès, President of STMicroelectronics France and Executive Vice President, Europe France Public Affairs of STMicroelectronics, emphasizes the importance of rebranding the industry to attract new talent. She remarked, “The word ‘semiconductor’ itself isn't very exciting—it’s even off-putting to some. By simply changing the name of educational programs, we’ve seen significant increases in enrollment. This demonstrates the power of language in shaping perceptions and interest.”Thomas Heurung of Siemens EDA also called for a stronger emphasis on entrepreneurship, noting “there is a big contrast between Europe and the US, particularly Silicon Valley.” He explained how his company’s Cre8Ventures unit had been set up to help start-ups through the key stages of creating a successful new company, including product development, attracting funding, and bringing the product to market. Thomas Fleischmann, Program Manager at Robert Bosch, explained how the EU Chips Act has accelerated the formation of the European Semiconductor Manufacturing Company (ESMC) joint venture, in which Bosch is a key stakeholder. ESMC is building a new semiconductor fabrication plant in Dresden, dedicated to producing chips for the automotive and industrial sectors. Fleischmann emphasized that ESMC will play a crucial role in helping Europe “scale advanced technologies to high volumes at a competitive cost.”In addition, the EU Chips Act also provides a broader platform for the expansion of Europe’s deep tech capacity. This includes the creation of five pilot lines, which will offer European companies access to manufacturing capacity for prototyping at the most advanced semiconductor technology nodes.Thomas Fleischmann, Program Manager, Robert BoschITF Chip into the Future at SEMICON Europa 2024 highlighted the broad scope of the EU Chips Act – not only supporting the building of advanced fabs but also providing the foundations for technology development, production, and marketing – all aimed at supporting semiconductor innovation in Europe. SEMI ContactMaria Daniela Perez, Communications ManagerEmail: [email protected]

Leaders in the semiconductor industry are finding ways to balance rapid demand growth with strategies to mitigate the risks of geopolitical uncertainty and a complex supply chain.At the CxO Summit during SEMICON Europa, industry leaders gathered to share insights into the immense opportunities ahead for the semiconductor sector, as well as the challenges that could impede growth. Laith Altimime, President of SEMI Europe, highlighted how discussions last year centered on reaching $1 trillion in global sales by 2030. “The conversation today is about how far above $1 trillion we will be in 2030,” said Altimime. “Artificial intelligence is an amazing and exciting technology, and the semiconductor industry is at the heart of it.”Laith Altimime, President, SEMI EuropeAjit Manocha, President and CEO of SEMI, described the current state of the semiconductor industry with one word – “unprecedented.” Emphasizing quantum computing as the next growth driver after AI, Manocha urged leaders to prepare for the next landmark - $4 trillion in global sales by 2040. However, the challenges facing the industry are equally unprecedented. Manocha identified four key obstacles: geopolitical volatility, the Net Zero challenge, the competition for top talent, and supply chain disruptions. “We need to work together to solve these challenges – we need unprecedented collaboration,” he explained. Ajit Manocha, President and CEO, SEMIA European Perspective on the Industry’s ChallengesWith the CHIPS Act in the US and the European Union (EU) Chips Act, the industry is also seeing unprecedented governmental engagement. Gustav Kolbe, Acting Director of Enabling and Emerging Technologies at Directorate-General for Communications Networks, Content and Technology of the European Commission, explained that Europe had been deeply impacted by the effect of trade tensions and supply chain disruptions. “In the field of semiconductors, we realized that we cannot keep doing business as usual and expect to achieve more resilience and reduced dependence on non-European supply chains,” Kolbe said. Gustav Kolbe, Acting Director of Enabling and Emerging Technologies, DG CONNECT, European CommissionJari Kinaret, Executive Director of the Chips Joint Undertaking (Chips JU), which is responsible for implementing EU Chips Act programs, described how its projects amplify the effect of EU funding by leveraging matching contributions from member states and participating companies. “This means that our budget of €4 billion actually produces investments in the semiconductor industry of about €11 billion,” he noted. Jari Kinaret, Executive Director, Chips JUThe Chips JU funded projects are designed to position Europe at the forefront of advanced semiconductor technology. Belgium’s imec, for example, is operating a Chips JU pilot line focused on leading-edge semiconductor innovation. Luc Van den hove, President and CEO of imec, highlighted the potential for 3D integration, “We can now combine multiple chips through silicon interposers with very fast connectivity between them. This allows us to build compute platforms which are far larger than what can be made with a single silicon chip,” he explained referring to this approach as “CMOS 2.0.” However, Van den hove warned that Europe cannot achieve its goals alone, emphasizing the complex semiconductor value chain and the need for collaboration. “Self-sufficiency leads to mediocrity,” he warned, advocating for a global approach that leverages the “best of the best.”Luc Van den hove, President and CEO, imecStephan Haferl, Chief Executive Officer of Comet Group, introduced the CA20, a tool designed to improve efficiency and quality in semiconductor manufacturing. The CA20 uses advanced imaging and AI to quickly identify and address production challenges, such as defects in solder bumps, without damaging components. Now fully automated, it integrates smoothly into factory workflows, providing real-time information to help manufacturers maintain high standards and increase production yields. This innovation highlights the role of new technologies in overcoming key obstacles and driving progress in the semiconductor industry.Left to right: Isabella Drolz, Vice President Marketing Product Strategy, Comet Yxlon; Laith Altimime, President, SEMI Europe; Stephan Haferl, Chief Executive Officer, Comet Group; and Dionys van de Ven, President, Comet YxlonCarlos Mazure, Chief Strategy Officer at Institute of Microelectronics – A*STAR in Singapore, illustrated this point by highlighting the institute’s focus on advanced packaging, a key Singaporean strength. “We have built a state-of-the-art 300mm prototyping line, enabling companies to implement wafer-to-wafer and chip-to-wafer bonding as well as fanout chip packaging,” Mazure said. Carlos Mazure, Chief Strategy Officer, Institute of Microelectronics – A*STARTurning back to Europe, Pierre Barnabé, CEO of Soitec, highlighted materials science as a regional strength. Soitec’s engineered substrates are driving energy efficiency breakthroughs in electronic, acoustic, and photonic applications. “We can bond anything to anything, creating advanced substrates for any active layer,” Barnabé explained. Pierre Barnabé, CEO, SoitecKai Beckmann, Member of the Executive Board and CEO Electronics at Merck KGaA, Darmstadt, Germany, also emphasized the role of materials in enabling sustainable growth. “The semiconductor industry faces a challenge with the contribution of process gases to its total greenhouse gas emissions. We hope to solve the problem by using AI to support materials research, and to design new molecules – an approach we have learned from the pharmaceuticals industry,” Beckmann shared. Kai Beckmann, Member of the Executive Board and CEO Electronics, Merck KGaA, Darmstadt, GermanyCollaboration Strengthens the Semiconductor Supply Chain Despite the breadth of enabling technologies emerging from Europe, the rapid growth in semiconductor demand has not always been matched by a secure supply. Barbara Frenkel, Member of the Executive Board Purchase at Porsche, shared that the company is collaborating with the industry to improve its access to the chips needed for automotive electrification. This includes joining industry groups such as the SEMI Global Automotive Advisory Council (GAAC) and, as she said, “learning your language.” Frenkel added, “Porsche aims to emulate Apple’s approach with Intel and Motorola to drive innovation – we will do the same with suppliers of automotive chips.”Barbara Frenkel, Member of the Executive Board Purchase, PorscheAnother solution to supply constraints is to widen the supply pipeline. John Behnke, General Manager for Smart Manufacturing at Inficon, described how smart technology can significantly improve efficiency and output. “A semiconductor fab is 100 times more complicated than anything else in the world – it is a mathematical nightmare to model it. That gives massive opportunities for improved productivity if we can implement smart control technologies,” Behnke explained. John Behnke, General Manager for Smart Manufacturing, InficonThe Challenge of Achieving Sustainable GrowthWhile the prospect of exceeding $1 trillion in annual sales energizes the industry, there is widespread recognition that growth must not come at the expense of environmental responsibility. As the industry doubles in size in the 2020s, it cannot afford to double its use of resources, such as energy or greenhouse gas emissions. Frédéric Godemel, Executive Vice President for Power Systems and Services at Schneider Electric, shared that the biggest impact on sustainability could come from “energy frugality” – using energy more efficiently. He explained that implementing data fusion in a semiconductor fab – combining detailed analysis of the operation of chillers with external data sets, such as weather conditions to allow for more efficient use – results in energy savings of 10%. “This approach saved costs, reduced CO2 emissions, and provided a financial payback in less than one year,” Godemel said.Frédéric Godemel, Executive Vice President for Power Systems and Services, Schneider ElectricThe value of smart control in fab operations was also highlighted by Katharina Westrich, Global Vice President of Electronics, Semiconductors Simulation Digital Industries at Siemens. She described how Siemens makes digital twins of factories before they are built. “This is an approach that the semiconductor industry can also adopt,” Westrich said. “A digital twin enables more efficient allocation of resources to the fab and sub-fab, allowing simulation of fab operation and optimization of processes and resources.”Katharina Westrich, Global Vice President of Electronics, Semiconductors Simulation Digital Industries, SiemensThe semiconductor industry faces a future full of opportunity, yet also marked by significant obstacles—ones that delegates at the CxO Summit are now better equipped to tackle head-on.On behalf of SEMI, the SEMI Europe team would like to express appreciation to the industry leaders for sharing their visions and readiness to collaborate during the CxO Summit.SEMI ContactCassandra Melvin, Senior Director of Business Development and OperationsEmail: [email protected]

As the demand for more powerful and efficient chips continues to grow, and the pace of semiconductor manufacturing in Arizona rapidly expands, so does the need for a highly skilled workforce capable of meeting these challenges. The SEMI Foundation’s SEMI Career and Apprenticeship Network (SCAN) Arizona Team is committed to building a robust workforce pipeline through strategic partnerships and initiatives that connect industry to education. These initiatives include fostering science, technology, engineering, and math (STEM) enthusiasm in K-12 (kindergarten through high school) classrooms to creating earn-and-learn opportunities through apprenticeships and collaborations with leading semiconductor companies. The Foundation’s Arizona team has coordinated key events and initiatives in the state that showcase a holistic approach to addressing workforce challenges, many of which could be expanded and replicated throughout the US and even globally.Arizona SciTech STEM and Innovation Summit: Fostering STEM Enthusiasm The Arizona SciTech STEM and Innovation Summit has long been a hub of innovation, offering students, educators, and the community an immersive experience in STEM. This year’s summit was no exception. Showcasing hands-on activities, workshops, and demonstrations, the event connected STEM industries with Arizona's next generation of talent.The SEMI Foundation Arizona team led activities and sessions demonstrating the Foundation’s work with educators and workforce experts to explore how semiconductor curricula can be integrated into classrooms. Through engaging workshops featuring SEMI Foundation High Tech U Micro:bit STEM kits and Baltu Technologies, and a panel discussion with educators talking about the importance of industry in the classroom, participants explored exciting careers and how to introduce industry opportunities to students. These interactions emphasized the real-world applications of classroom learning, showing the path to careers in high-tech industries.Teachers students participate in a hands-on Micro:bit STEM Kits workshop during AZ SciTech STEM and Innovation Summit held on October 22, 2024. Panelists discuss the future of the semiconductor industry incorporated into students’ education. From left to right: Dee Pinkston (Chicanos por la Causa), Raquel Diaz (Trevor G. Browne High school), Rachna Mathur (ASU prep, ASU, STEMology), Kenneth Mims (Science Prep Academy Neurodiversity Education Research Center). Apprenticeship 101: A Guide to Workforce ReadinessIn a landscape where technical skills are increasingly critical, the Apprenticeship 101 workshop provided a crucial introduction to the benefits of how earn-and-learn programs are transforming careers in semiconductors and beyond. Hosted by: Arizona Commerce AuthorityArizona@Work SEMI Foundation Federal/State Apprenticeship Developer Scott EllsworthSEMI Foundation SCAN Arizona team The City of Phoenix This event gave attendees an overview of apprenticeship opportunities in fields like semiconductors and advanced manufacturing.Participants learned how these programs build bridges between education and employment, offering both practical experience and a clear path to career advancement. A notable highlight was the emphasis on underrepresented groups, showcasing how apprenticeships can empower individuals to succeed in high-demand fields.Panelists highlighting pathways to careers in semiconductors with a focus on earn-and-learn opportunities. From left to right: Nick Irigoyen (SEMI Foundation), Michael Rosas (Arizona Commerce Authority), Scott Ellsworth (SEMI Foundation), Joan Bueno (Arizona Apprenticeship Office), James A. Montoya (ARIZONA@WORK), Stephanie Varela (City of Phoenix) Apprenticeship 101 Panelists. From Left to Right: Nick Irigoyen (SEMI Foundation), Scott Ellsworth (SEMI Foundation), Joan Bueno (Arizona Apprenticeship Office), Stephanie Varela (City of Phoenix), Perla DeBaggis (SEMI Foundation), James A. Montoya (ARIZONA@WORK) Intel Apprenticeship Program Support: A Step Toward Workforce Expansion Intel’s apprenticeship announcement signaled a transformative step for Arizona’s tech industry. With a focus on diversity and inclusion, Intel’s initiative aims to recruit participants from all backgrounds, ensuring a broad and equitable talent pool. Their current cohort of apprenticeships started with 9 women from the Fresh Start Foundation. The team worked with Arizona@Work representative Stephanie Varela to provide the apprentices with an overview session of the workforce innovation and opportunity act resources available to them. These kinds of resources provide alignment and improvement of employment, training, and education programs to promote individual growth. By investing in the workforce of tomorrow, Intel underscored its commitment to Arizona’s economic growth and technological leadership.Intel apprentices Gabriella Medina and Laura Jabalera are paving the way for women in the industry. Learn more about their inspiring journey here. TSMC Apprenticeship Announcement: Driving Innovation and InclusionSimilarly, TSMC’s apprenticeship program launched on November 19, 2024, bringing excitement and opportunity to the state. The program offers specialized training for individuals seeking careers in semiconductor manufacturing, a vital industry for Arizona’s economy.TSMC’s announcement emphasized collaboration with educational institutions, including community colleges and universities, to ensure apprentices receive both technical training and academic support. TSMC Arizona is investing more than $5 million in this program representing on-the-job training hours and education tuition support for its apprentice employees.The SEMI Foundation SCAN Arizona team joins TSMC apprentices on November 19, 2024 to celebrate the launch of TSMC's groundbreaking apprenticeship programs. Trevor G. Browne High School AET Assembly: Inspiring Young InnovatorsAt Trevor G. Browne High School, the Advanced Engineering and Technology (AET) Assembly served as a rallying point for students interested in high-tech careers. The SEMI Foundation Arizona Team joined their assembly to celebrate the potential of Arizona’s youth, sharing stories of innovation and success in the semiconductor sector.Students gained valuable insights into the industry’s evolving landscape, learning about the impact semiconductors have in cutting-edge technologies and career pathways in engineering and manufacturing. The assembly highlighted the importance of programs like SCAN-AZ and other local initiatives happening in 2025, which aim to bridge the gap between classroom learning and real-world opportunities.Micro:bit Competition: Sparking Innovation in Arizona's ClassroomsThe launch of SEMI Foundation - Arizona’s first Micro:bit Competition is bringing creativity and technology together in K-12 classrooms statewide! Designed to inspire innovation, this competition challenges students to use Micro:bit to develop projects that showcase their technical skills and imagination.From robotics to sustainability solutions, students are exploring real-world applications of STEM through hands-on projects. With categories like Innovation in Education and Creative Arts, the competition encourages participants to think outside the box. This initiative not only highlights the SEMI Foundation’s commitment to STEM education but also fosters the next generation of problem solvers and innovators. The Micro:bit Competition is more than just a contest—it’s a stepping stone for students to explore their potential in high-tech industries.Stay tuned as we celebrate the incredible projects and the bright young minds behind them!ASU Preparatory South Elementary, Grades 3-6 Teacher Michael Grant (Left) receiving his Micro:bit STEM kits for his participating classroom from Perla DeBaggis SEMI Foundation (Right)The SEMI Foundation’s efforts in Arizona exemplify the power of strategic partnerships and innovative programs to build a stronger, more diverse pipeline for the semiconductor workforce. By engaging educators, students, and industry leaders, we are creating pathways that connect education to employment, fostering a future-ready workforce. These initiatives serve as a blueprint for workforce development that can be adapted and scaled nationwide, empowering communities to thrive in the evolving high-tech economy. The SEMI Foundation is thrilled to continue this momentum and expand our impact even further in 2025! Co-Author Perla DeBaggis is the Senior Specialist for Career and Industry Awareness at the SEMI Foundation, focusing on bridging the gap between education and industry. Co-Author Nick Irigoyen is the Project Manager for Project Manager, Workforce Development Apprenticeships at the SEMI Foundation, focusing on initiatives aimed at strengthening the semiconductor talent pipeline in Arizona.

The semiconductor industry continues to push the envelope to meet demands of key applications such as advanced computing, consumer electronics, and defense, as well as environmental sustainability. There remain several critical challenges that our industry is working diligently to address, but how can these issues be tackled more effectively and at a pace that can keep up with this ever-evolving landscape?SEMI sat down with Supika Mashiro, Advisor at Tokyo Electron, where she shares her perspective on the importance of strengthening industry collaboration and what SEMI is doing through its first-ever SEMI Global Standards Summit – “Innovating Tomorrow: Standards for Future Factories” – of which she chairs the Planning Committee responsible for organizing this Summit.Trio: What is the SEMI Global Standards Summit and why is this event timely?Mashiro-san: Topics such as advanced packaging, cybersecurity, as well as supply chain and materials innovation (and their impact to the environment) are considered strategic areas requiring more industry collaboration. Many of these areas also greatly benefit from standards, and the next generation specifications and guidelines will need to be engineered to meet the technical challenges we face today and in the future. The magnitude of these standardization efforts will require engagement from all stakeholders in the design-to-manufacturing value chain as well as multiple Standards Developing Organizations (SDOs) coordinating and collaborating with each other.This is the driving force behind the Summit, and the need to bring together industry stakeholders to identify standards-critical areas and align on developing an industry standardization strategy for the next 3- and 7-year time horizons. We are excited to host this inaugural event on December 12, 2024, in conjunction with SEMICON Japan 2024. Trio: What is the focus of the Summit?Mashiro-san: The Global Standards Summit will cover three main themes: Smart Manufacturing for Future Factories, Packaging Architectures Materials, Environmental Sustainability.Factories are increasing their use of digital twins, predictive maintenance, and AI/ML to improve productivity and yield across the entire manufacturing environment. To take full advantage of these approaches, factories must reduce cybersecurity risks and secure the transfer of “smart” data across the entire supply chain while protecting IP. There is a need for standards to address these risk areas, as well as help diverse advanced analytics systems interoperate to assist personnel in increasing factory productivity. In the Smart Manufacturing for Future Factories session, we will be focusing on autonomous fabs, cybersecurity, and flow-oriented manufacturing.Similarly, packaging technologies have been progressing since the early stages of semiconductor device development more than 70 years ago. More recently, where packaging occurs in the semiconductor process has evolved, and some of the packaging processes are now done as an extension of front-end manufacturing. Moving forward, packaging architecture and materials are becoming increasingly important, driven by the adoption of heterogenous integration to address demands for more complex functionality and reduced power consumption as well as enabling chiplet integration. In the Packaging Architecture Materials session, we will discuss what kind of standardization our industry requires for copper-copper (Cu-Cu) direct interconnection, hybrid bonding, and panel-level packaging. We will also explore glass substrates as well as standards needed to enable semiconductor assembly and test automation.Our third session recognizes that the semiconductor industry is heading into an era of NetZero, in which quantification of environmental performance can have meaningful financial impact. The methods of measuring and accounting the environmental impact such as carbon emissions and the presence of substances of concern in manufacturing and products are not uniformly consistent across the industry. In order for the semiconductor industry to better navigate and make a positive impact in this arena, a consistent set of standards will be crucial. In the Environmental Sustainability session, thought leaders will present on communicating substance of concern (SOC), reporting of process emissions from factories, as well as lifecycle assessment of materials and substances used in semiconductor manufacturing, including equipment.Last but not the least, we will feature a panel session where we will explore all of these topics in a discussion with our panelists.Trio: Who should attend the Summit and why?Mashiro-san: The Summit is intended for leaders who are interested in these standardization topics to come and engage. Attendees will hear and learn about the issues critical to the future advancements of semiconductor manufacturing, what’s happening to address them, as well as new standards development. Attendee engagement is critical as we want our participants to influence and be able to contribute to the direction of standards development by providing valuable insights to help optimize future factories. To facilitate industry collaboration, we have organized networking events with other stakeholders from suppliers and solutions providers to end customers. The Summit is just one of many compelling reasons for industry stakeholders and thought leaders to come to SEMICON Japan. There are several sessions on many related topics that we are covering in the Global Standards Summit. Ultimately, at the conclusion of the Summit, we expect to have identified lists of critical standards areas, and we would like for those leaders to be able to assign and dedicate resources to these standardization efforts.For more information about the inaugural SEMI Global Standards Summit, please visit the SEMICON Japan 2024 site and register today!Supika Mashiro works as an Advisor for Strategic Planning of Industry Initiative Group at Tokyo Electron Limited.She has been involved in Factory Integration (FI) IFT of IRDS since its inauguration in 2016 and a co-chair since 2017. Her area of interest and involvement encompasses “smart” technology applications in manufacturing equipment, its co-optimization with Fab operation as well as ESH/S (Environment, Safety, and Health/ Sustainability) road-mapping and related industry standard development. For the latter, she has taken a couple of leadership roles in SEMI Standards Program as well as IEC TC/44.Paul Trio is Director of the SEMI Standards program.

The silicon wafer market showed promising signs of recovery in Q2 2024, bouncing back after a prolonged downturn. The growth is fueled by seasonal factors and strong demand from investments in AI data centers, however, the consumer, automotive, and industrial segments are experiencing a slower pace of recovery. Historically, year-over-year (YoY) growth in semiconductor equipment investments tends to hit a low point before rebounding and typically contributing to an upward trend in wafer shipments. Figure 1 depicts this trend since 2001, with the only exceptions to wafer shipments following the rebound of fab equipment spending coming in the periods of the second and third quarters in 2002 and 2013, which are highlighted in gray. Figure 1* Notes 1) Data source: SEMI WWSEMS and SMG wafer shipments data 2) For semiconductor equipment spending, data from 2001 to 2024 is based on WWSEMS wafer processing equipment billing data 3) Equipment spending is updated through August 2024 This pattern underscores the crucial role of equipment investments in expanding production capacity and driving wafer demand. Following the rebound in equipment investment growth rates observed in 2024, projections indicate continued growth into 2025. This recovery in investments is expected to translate into increased wafer shipments, reinforcing a positive outlook for the silicon wafer market’s sustained growth.Additionally, the influence of DRAM Blended ASP (Average Selling Price) growth trends on wafer demand is significant. The historical data in Figure 2 shows that when DRAM ASP growth rates peak and then decline, wafer shipment growth tends to slow down after a lag. Figure 2* Remarks 1) Data source: SEMI SMG wafer shipments data and the Bank of Korea 2) DRAM ASP is updated through September 2024. With DRAM pricing potentially entering a downward trend in early 2025, this poses a key risk to the pace of the wafer market’s recovery. Looking ahead, wafer shipment growth is expected to vary by wafer type and diameter, with low to mid-double-digit growth projected for 2025, mid-to-high single-digit growth for 2026, and a notable slowdown in 2027. This forecast reflects evolving demand dynamics and ongoing market adjustments.In conclusion, the sustained recovery of the silicon wafer market hinges on a combination of increasing semiconductor equipment investments, the stabilization of raw material inventory levels among chipmakers, and careful monitoring of DRAM pricing trends. While the current upward trend in equipment investments is a positive driver for wafer shipments, the potential deceleration of DRAM Blended ASP growth poses a significant downside risk. If DRAM pricing exerts a sustained negative influence, it could shorten both the amplitude and duration of the current wafer market upcycle more than anticipated. This report not only examines these key investment and shipment dynamics but also provides an in-depth analysis of broader market trends, including supply-demand balances and pricing dynamics. By addressing these interconnected factors, it offers a comprehensive and forward-looking perspective on the long-term growth potential of the silicon wafer market.SEMI’s Silicon Wafer Market Monitor Report offers unique insights into global silicon wafer shipments, supply and demand dynamics, and average selling price (ASP) projections. This comprehensive quarterly report breaks down silicon shipments by region and wafer size, including 300mm, 200mm, and 150mm wafers, providing a detailed view of the market landscape.Semiconductor manufacturers, investors, and industry analysts rely on this report as an essential tool for making informed business decisions and exploring the latest data and trends shaping the future of the semiconductor industry.Download a sample of the Semiconductor Manufacturing Monitor report. For more information on the report or to subscribe, please contact the SEMI Market Intelligence Team at [email protected]. Details on SEMI market data are available at SEMI Market Data. Sungho Yoon is Principal Analyst on the SEMI Market Intelligence team.

How Cool is That - Northrop Grumman’s “World’s Fastest Microchip” won the 2024 “Coolest Thing Made in California” contest, organized by the California Manufacturers Technology Association (CMTA). Public votes were cast for 138 California-made products in four rounds, culminating in this microchip—boasting speeds up to 1 terahertz—being crowned the winner. Manufactured in Redondo Beach, CA, the chip is 1,000 times faster than smartphone processors and represents California’s cutting-edge manufacturing sector. The contest and award ceremony were celebrated during CMTA’s MakingCA Conference, honoring manufacturing’s $310 billion contribution to the state’s economy. Doing the Green Wave - NIST scientists have successfully created a compact, full-spectrum laser covering the green-yellow-orange wavelengths, long considered challenging to produce. Traditional semiconductor lasers struggled with green wavelengths due to material limitations, so NIST turned to nonlinear optics, producing different wavelengths by adjusting silicon nitride device geometry and laser input. This breakthrough enables more precise, pure wavelengths ideal for quantum computing, medical devices, and underwater communications. Their method combines pump laser tuning and device adjustments, achieving 150+ wavelengths, demonstrating a significant advancement in accessible, high-quality lasers.Source: NIST’s Compact Green Semiconductor Laser - IEEE SpectrumEnergy Hero - At the 2024 ITF World conference, AMD CEO Lisa Su spotlighted a new goal: a 100x boost in computing efficiency by 2027. As shrinking transistor sizes yield diminishing returns, materials innovation has become essential for boosting performance and efficiency. Applied Materials has responded with advanced materials engineering solutions, harnessing exotic elements and 3D chip designs to improve efficiency. For instance, Applied’s Integrated Materials Solution™ combines six process technologies to reduce chip wiring resistance by 25%, a critical advance as semiconductor nodes shrink to the atomic scale. These methods promise breakthroughs in power efficiency across AI, personal electronics, and more. Building Automation of the Future - Imagine a future where every device in newly built structures— from HVAC systems and appliances to light switches and sensors—is equipped with a microprocessor and linked through a reliable communication network. This could transform how buildings operate, yielding substantial benefits across various sectors. Chip manufacturers would see new growth opportunities, while builders could offer smarter, more efficient homes. Consumers would gain convenience and comfort, as buildings could dynamically adjust to personal preferences and real-time needs. For instance, rooms would automatically adapt their temperature as people move through them, making manual thermostat adjustments obsolete. This automated approach wouldn’t just create a more comfortable environment but would also optimize energy use, potentially lowering costs and benefiting the environment.Source: Building Automation of the Future - EE TimesDo you have a fun fact to share? We invite SEMI members to share fun facts about the industry or their company. We’ll consider your tidbits for inclusion in future blog articles and or posting on social media. Complete our survey form or email [email protected]. Learn more about the SEMI Foundation and its initiatives to promote industry awareness and help provide a path for those interested in rewarding careers in microelectronics. Follow the SEMI Foundation on LinkedIn, Instagram, X and Facebook. Margaret Kindling is Senior Program Manager for Diversity, Equity, and Inclusion at the SEMI Foundation. She promotes inclusion and belonging via Women in Semiconductors, Semiconductor PRIDE and SEMICON West Workforce Development Pavilion programming.

With increasing demand for personalized smart devices, the MEMS and sensor market is undergoing rapid transformation. MEMS sensors are the backbone of smart wearable devices, seamlessly integrating multiple functions to monitor and simplify our day-to-day activities. As applications in healthcare, environmental tracking, and AR/VR expand, the need for ultra-compact, energy-efficient, and intelligent sensors is more critical than ever.In an exclusive conversation with SEMI, Stefan Finkbeiner, CEO of Bosch Sensortec, shared his perspective on the dynamic landscape of MEMS sensor technology. From Bosch’s evolution to a solutions provider with a focus on sustainability and market-driven innovations, Finkbeiner offered a deep dive into how Bosch Sensortec is positioning itself at the forefront of the industry. “We have to think in terms of the end application and determine what the right hardware and software configuration should be in order to provide solutions with the greatest benefit and flexibility.”Further insights into the future of MEMS and sensor technology will be shared by Finkbeiner during his keynote at the SEMI MEMS Imaging Sensors Summit on November 14, 2024, in Munich, Germany. Registration is still open.SEMI: Welcome, Stefan, and thank you for sharing your insights on advanced sensor technologies. Let’s start with a personal question: What motivates and inspires you about working in sensor technology?Finkbeiner: Sensor technology is very diverse and has significant impacts on consumers. We take pride in prioritizing consumers’ needs and benefits. True to the Bosch motto, “Invented for life,” we are committed to making life better, easier and healthier. This is demonstrated in our sensing solutions, which provide valuable data for fitness tracking in smartwatches, enhance the audio experience in hearables, and enable real-time monitoring of air quality to help individuals make informed decisions for a healthier environment. I am fascinated by technology advancements that are enabling the scaling of sensors—and the processing power and intelligence packed into these increasingly compact devices. For instance, our latest acceleration sensors for hearables are the smallest in the world and are nearly invisible at just 1.2 x 0.8 x 0.55 mm³.We leverage innovative wafer level chip scale packaging (WLCSP) to achieve this reduced form factor. These compact, feature-rich, high-performance accelerometers are easier to integrate in the latest generation consumer products where size and functionality are critical requirements.SEMI: How has Bosch Sensortec’s approach evolved over the years and what is the company’s primary focus today? Finkbeiner: We began our success story a few years ago as a hardware supplier, with one of our first applications being the 'Portrait-Landscape' function in smartphones. Over time, we’ve evolved into one of the leading providers of MEMS sensors.Today, we no longer see ourselves purely as a sensor manufacturer, but as a technology solutions provider. Our focus has shifted to think in terms of the end application and determine what the right hardware and software configuration should be to provide solutions with the greatest benefit and flexibility.Achieving this requires significant software and artificial intelligence (AI) development. In essence, we are optimizing software through self-learning models. Hardware remains essential for optimizing power consumption, with most sensors integrating a controller alongside the ASIC to enable seamless software integration.This unique software and hardware configuration unlocks exciting possibilities and broadens our market reach. We see significant growth in head-mounted devices, and we are actively working on related acoustics solutions.SEMI: Looking ahead, what trends do you anticipate will have the most significant impact on the MEMS sensors market?Finkbeiner: We see several trends that will significantly impact the MEMS sensor market. First, there is growing demand for personal health monitoring in consumer and mobile electronics. Wearable devices, in particular, are becoming essential tools for individuals to track their health and fitness status. This trend requires MEMS sensors to become even more accurate, with solutions that include sophisticated software algorithms to ensure reliability, accuracy, and reproducibility. As a result, AI and machine learning (ML) technologies will play a crucial role in enhancing sensor performance.A second important trend is the continued miniaturization of MEMS sensors. To meet customer demands, sensors must integrate more functionality, including edge-processing capabilities. For example, what once may have been a simple accelerometer with a step-counting algorithm is now evolving into a 6-axis Inertial Measurement Unit (IMU) with an integrated microcontroller and advanced AI/ML software. A great example of this is in True Wireless Stereo (TWS) earphones, where the IMU not only tracks steps but also enables complex tasks like dead reckoning and supports 3D audio—all within the tight constraints of a small TWS earbud housing. Low power consumption, as always, is a critical factor for these mobile devices to meet CE (Conformité Européenne) standards.Finally, we believe that smart glasses, augmented reality (AR) and virtual reality (VR) devices are poised to become the “next big thing.” These devices require advanced image projection optics that offer excellent optical quality, low weight, and ease of use to ensure consumer adoption. We believe our MEMS-based LBS (Laser Beam Scanning) solution is ideal for these applications. Additionally, the successful adoption of smart glasses hinges on high-performance MEMS sensors that are compact, accurate, and power-efficient—critical requirements for all-day wearability and functionality.These trends underscore the need for MEMS technology to evolve, integrating greater functionality, precision, and efficiency to meet the demands of next-generation consumer devices.SEMI: What are some of the biggest challenges facing the MEMS sensors industry today, and how can companies overcome them?Finkbeiner: One key challenge is that the smartphone market—arguably the most attractive market for a variety of MEMS and MOEMS sensors—has become more or less saturated. To stay competitive, MEMS companies must innovate existing products while also developing new, differentiated sensors and actuators for next-generation mobile products.SEMI: How is Bosch Sensortec supporting sustainability initiatives?Finkbeiner: We are helping to mitigate climate change with our low carbon footprint solutions.Up to 20% of annual global carbon emissions are caused by forest fires. This is equivalent to carbon dioxide emitted by all the vehicles driven worldwide. Our sensors can detect forest fires before they develop into wildfires by measuring various gases such as carbon monoxide and hydrogen. In parallel, we are working with our production partners to reduce our carbon footprint over the coming years, while also replacing or minimizing the use of environmentally hazardous chemicals, such as PFAS.SEMI: What are you most excited about for the MEMS Imaging Sensors Summit, and how do you think it will impact the European semiconductor industry?Finkbeiner: The European semiconductor industry has deep expertise in MEMS and sensor technologies, positioning it to make a significant impact in markets such as consumer health, optical sensing, and AR displays. By continuing to focus on sustainable solutions, we can drive even greater impact for the broader industry and secure Europe’s leadership in these growth sectors.I look forward to collaborating with industry peers at the Summit to define next steps needed to advance Europe’s leadership. The MEMS Summit is an invaluable opportunity to collaborate and drive progress, and I warmly invite my colleagues to join us in shaping the future of the European semiconductor industry.Dr. Stefan Finkbeiner Dr. Stefan Finkbeiner has been CEO and General Manager at Bosch Sensortec GmbH since 2012. He was born in 1966 in Freudenstadt, Germany. Stefan Finkbeiner held various senior positions at Bosch including Director of Sensor Marketing, Director of Corporate Research in microsystems technology, and Vice President of Sensor Engineering. He looks back on almost 30 years in semiconductor industry working in different positions related to sensor research, development, manufacturing, and marketing. Due to his wide experience in semiconductor and sensor industry, Stefan Finkbeiner is a recognized guest in panel discussions and as keynote speaker. SEMI ContactSitong He / Communications Manager, SEMI EuropeEmail: [email protected]: +49 151 5546 2638

In today’s rapidly evolving semiconductor industry, ensuring both precision and efficiency in manufacturing has become an increasing challenge, particularly as advanced technologies like MEMS and AI chips push the boundaries of design and production. Inspection methods that were once sufficient are now falling short, making room for cutting-edge solutions powered by artificial intelligence (AI). The introduction of AI-driven 3D X-ray inspection technologies is transforming the landscape, offering manufacturers a sophisticated tool to ensure quality control, while driving sustainable production strategies.SEMI spoke with, Joscha Malin, Product Manager, and Daniel Stickler, R D Expert for X-ray Imaging at Comet AG, Industrial X-Ray System Division, to explore how AI-powered 3D X-ray inspection technologies are shaping manufacturing. They delve into how these technologies address critical challenges during inspections and defect analysis, using tools such as Dragonfly 3D World software for user-friendly, AI-driven insights that facilitate effective decision-making.Further insights into the application of AI-powered 3D X-ray inspection technologies and their role in advancing MEMS manufacturing will be presented by Stickler at the SEMI MEMS Imaging Sensors Summit on November 14, 2024, in Munich, Germany. Registration is now open.SEMI: Thank you both for agreeing to share your insights. To start, can you explain the importance of inspection strategies in the context of MEMS manufacturing?Malin: As MEMS devices become increasingly miniaturized and complex, effective inspection strategies are crucial. These strategies not only accelerate the wrap-up of production processes, but also significantly enhance product yield. With tighter tolerances and various materials involved, ensuring the integrity and functionality of each component is more critical than ever. A robust inspection strategy allows us to catch potential defects early, which can save time and costs associated with rework or scrap.Stickler: The evolution of MEMS technology, particularly in AI chips, demands a higher level of inspection sophistication. Traditional methods may fall short in providing the necessary detail and speed, which is why we’re focusing on advanced solutions like our AI-powered 3D X-ray inspection.SEMI: Could you elaborate on how the 3D X-ray technology differs from conventional inspection methods? Stickler: The 3D X-ray technology we utilize acts as a bridge between traditional optical methods and standard 2D X-ray inspection. It offers high-resolution, three-dimensional images without damaging the samples. 3D X-ray technology emphasizes three main benefits: clarity, efficiency, and actionable insights. This means we can obtain detailed images that help us analyze components more effectively, allowing for real-time decision-making.Malin: Moreover, the clarity and detail provided by the 3D X-ray images are critical when it comes to defect analysis in MEMS devices. They allow us to assess mechanical, electrical, and assembly errors in ways that conventional methods simply cannot. This leads to a more reliable production process.SEMI: What specific MEMS defects can be effectively analyzed using this technology?Stickler: There are several types of defects we can analyze. For instance, we can detect mechanical defects such as stiction or fractures, as well as electrical failures like short circuits. The 3D X-ray inspection allows us to visualize these defects in detail. Additionally, we can monitor assembly errors, which are particularly important in complex MEMS devices where misalignments can lead to significant issues.Malin: I’d like to add that early detection of these defects is paramount. The faster we identify issues, the quicker we can implement corrective actions, thereby improving overall yield and reducing production costs.SEMI: You mentioned yield improvement earlier. Can you explain how your technology contributes to that?Malin: Our approach supports process optimization by providing information on product characteristics and, for example, allows us to identify trends early on that may lead to yield issues later. We also aim to accelerate new product introduction in the early phase by rapid feedback, saving time and cost. This is crucial because many defects may not be apparent until later stages of production. With our technology, we can monitor samples in real-time, allowing us to react promptly to emerging challenges.Stickler: By integrating this feedback loop, we can significantly shorten the time to market for new products. This is particularly beneficial in industries where speed and efficiency are essential.SEMI: Can you tell us about Dragonfly 3D World software and its role in this process?Malin: Dragonfly 3D World is a user-friendly software that leverages AI and, specifically, deep learning for image processing. It enables users to efficiently perform bump metrology and defect identification, for example, without needing extensive expertise in the field. The software makes complex processes manageable, even for operators who may not be specialists in image processing.Stickler: Beside MEMS and advanced packaging in GPU production, this software is indeed an “AI-for-AI” application. By utilizing deep learning, users can train models that adapt to various imaging tasks, making the entire inspection process more efficient. The insights generated from the 3D X-ray images are automated, enhancing usability and streamlining workflows.SEMI: In conclusion, what are the key takeaways you’d like to share?Malin: The key takeaways are that AI-driven 3D X-ray inspection is transformative for the MEMS manufacturing process, enhancing inspection strategies and defect detection significantly. By integrating advanced technologies, we can ensure higher product quality and efficiency.Stickler: Yes, and I would emphasize the importance of powerful monitoring and non-destructive test tools. Our innovative solutions not only improve yield, but also pave the way for sustainable practices in manufacturing, ultimately benefiting the industry. Dr. Daniel SticklerDirector X-ray Technology Components at Comet AG, Industrial X-Ray System Division. Based in Hamburg, Germany, he holds a PhD in Physics from the University of Hamburg and has extensive experience in X-ray imaging, semiconductor X-ray applications and product innovations. Joscha MalinDirector Product Marketing Software Products at Comet AG, Industrial X-Ray System Division. Based in Hamburg, Germany, he holds a degree in Electrical Engineering with specialization in Semiconductors and profound experience in the industry. For over a decade, he has focused on developing X-ray inspection and metrology solutions, especially for the Semiconductor industry. SEMI ContactSitong He / Communications Manager, SEMI EuropeEmail: [email protected]: +49 151 5546 2638