With the rapid proliferation of electronics applications with more powerful embedded intelligence, demand for smarter, more efficient sensors is increasing to help devices connect to the world around them. As the semiconductor industry drives the future of connected technologies and sustainable solutions, it faces challenges in energy consumption, resource management, and ensuring data security.SEMI spoke with Simone Ferri, Vice President and General Manager at STMicroelectronics (ST), about current trends and challenges in the Micro-electromechanical Systems (MEMS) and imaging sensors market and how ST is driving innovation in this rapidly evolving industry. Ferri shared insights ahead of his keynote presentation at the SEMI MEMS Imaging Sensors Summit on November 14, 2024, in Munich. Registration is open.SEMI: Welcome, Simone, and thank you for sharing your perspective on the dynamics and trends for today’s MEMS and imaging sensors. To start, how would you describe the current market dynamics for these technologies, and what key factors are influencing these dynamics? Ferri: Right now, the MEMS and imaging sensors market is primarily driven by applications such as automotive electronics, consumer medical devices, AI-powered devices, and intelligent wake-up systems.According to Omdia, the MEMS market is projected to reach approximately $11 billion by 2027, with a CAGR of 2.8% from 2022 and 2027. Currently, automotive applications account for 50% of this market, with industrial at 15% and consumer at 35%. Notably, the automotive sector is the fastest growing, with a 5.4% CAGR, driven by the increasing use of inertial measurement units (IMUs) and microphones.In addition, Yole Group estimates that the imaging market, including optical sensing, will grow at a 4.7% CAGR between 2023 and 2029. Although mobile phone applications remain the primary driver of Complementary Metal-Oxide-Semiconductor (CMOS) image sensors (CIS) volumes, other sectors, including consumer electronics, automotive, and security imaging, are also contributing to the growth.Long-term forecasts for smartphone sales have been trending downwards, but mobile phones still remain a major driver of applications, innovation, and overall volume in the imaging market. Notably, the automotive imaging sector is one of the fastest growing markets and is expected to drive additional demand for CIS.Factors that influence the current market include global economic conditions, regulatory changes, geopolitical factors, technological innovations, and the emergence of new applications and use cases.SEMI: Can you elaborate on the growth strategies that STMicroelectronics is adopting to stay competitive in the MEMS and imaging sensors market? Ferri: ST has played a pivotal role in both the MEMS and imaging sensors markets for over two decades with its proprietary silicon technologies. We fully leverage our Integrated Device Manufacturer (IDM) business model, which allows us to support our customers through integrated capabilities for both design and manufacturing.To remain competitive, we are exploring new markets for MEMS sensors, particularly in digital healthcare with biosensors, where wearable devices are expected to exceed 500 million units per year by 2027.We’re focusing on the growing demand for automotive sensors such as accelerometers, Inertial Measurement Units (IMU), and pressure sensors, particularly with the rise of electric vehicles. We are enhancing the integration and synergy between automotive and personal devices. For example, we are combining high-g and low-g accelerometers within a single IMU, enabling accurate fall and crash detection, along with precise orientation and wake-up functionality.AI is another one of our priorities. In today's digitalized world, AI enables real-time, contextual understanding and the ability to make decisions that optimize and reduce the power consumption of the final device. Sensors are no longer merely for data collection. Thanks to AI, sensors can interact with their environment and significantly contribute to innovation and sustainability.We are also prioritizing low power consumption. Our MEMS technology operates in low-power mode with almost negligible energy use, activating only when necessary, without waking up the system to understand its environment or to be reconfigured.In addition, we’ve seen optical sensing continue to grow year over year. Optical sensing now offers features such as 3D capture, low-power and low-footprint computer vision, Near InfraRed (NIR) and even Short Wavelength InfraRed (SWIR).We are accelerating and leveraging our IDM model and broadband semiconductor supplier positioning to propose wider system offerings based on the array of sensors and microprocessors that ST develops. As the world shifts toward widespread use of sensors and data collection, the demand for secure sensing technologies is growing, extending beyond mobile and PC applications to spatial computing and AR/VR environments. For example, if we are talking about recognizing specific persons in an AR environment, we don't want the data related to these persons to be sent to the cloud before a decision is made about whether they are supposed to be there or not, as such information can be intercepted. We want all the data to be managed at sensor level and only a warning of rejection or acceptance to be transferred outside our secure sensor. SEMI: What are some of the latest technological innovations in MEMS and imaging sensors that are shaping the industry? Ferri: In MEMS, we're seeing significant advancements in three key areas:- In-sensor AI is integrating technologies in the sensors such as machine learning core (MLC), adaptive self-configuration (ASC), and intelligent sensor processing units (ISPU).- Open sensors are designed to interface seamlessly with other sensors, allowing third parties to benefit from on-sensor processing innovations, while building an ecosystem to create joint value with customers.- Accurate sensors are providing high-precision data, enabling better decision-making and smoother, more natural user interactions. These sensors also reduce factory calibration time and resources, leading to overall lower energy consumption. Because of their accuracy, onboard MLC, and ASC, the sensors can also reconfigure themselves without interaction with the processor, thus guaranteeing the proper accuracy at lower power consumption, at any time, under any condition.In the imaging sensor market, key trends include:- Higher Pixel performance is leading to improved signal-to-noise ratio (SNR), low light performance, better quantum efficiency (QE) and lower noise performance. Despite post processing, pixel performance remains the key factor as SNR performance must remain high while the pixel shrink roadmap advances.- Embedded Intelligence is providing local processing for local decision making, enhanced security, advanced image sensor processing (ISP) for improved image quality, and fusing sensor functions to deliver a better user-experience.- "Always on" capabilities are supporting mass sensorization and deployment of optical sensing solutions everywhere through specific low-power design techniques, process development, and overall system architecture optimization.SEMI: Looking toward the future, what trends do you anticipate will have the most significant impact on the MEMS and imaging sensors market? Ferri: Some macrotrends for sensors include:Electrification: Certain consumer and industrial applications are now being adopted in the automotive sector, especially with the rise of electric vehicles creating new opportunities for innovation and for new players to enter the market. As example, the predictive maintenance that has been developed for industrial electric motors is ported 1:1 to electric vehicles.AI: Regarding data transmission, distributed architecture will push AI towards edge computing, increasingly supported by advancements in 6G and foldable technologies. Additionally, as AI becomes more integrated, the maintenance and security for AI will require more attention.Smart home, buildings, and cities: As cities grow, the demand for smart homes and buildings rises, requiring more sensors to manage energy, security, and urban infrastructure efficiently. Over 55% of the global population and 70% of the EU population reside in cities. Urban areas generate more than 80% of the world’s GDP, and by 2030, it's anticipated that 68% of the global population will be urban dwellers, pointing to the growing need for smart cities.Aging population and digital health: The integration of biosensors with MEMS technology will be crucial for addressing the needs of an aging population.Overall, the use of image sensors for environmental sensing is steadily increasing. This is a major focus for ST, particularly in 3D sensing. New use cases, such as presence detection, are enhancing security and reducing power consumption due to efficient data processing. Additionally, the average number of cameras in smartphones, automobiles, and even in devices like robots and vacuum cleaners, continues to grow.SEMI: What has STMicroelectronics been working on, and what are your plans for the upcoming years? Ferri: To date, we have shipped over 23 billion MEMS sensors. Still, we remain committed to continuously improving our products and enhancing our MEMS technology in terms of affordability, miniaturization, performance, and novelty. We are striving to set the stage for a future defined by innovation and excellence with:Evolution of our current product portfolio by investing in lower power consumption, lower supply voltage, and additional and more sophisticated in-sensor AI for an effective distributed AI conceptNew sensors for presence detection, like infrared (IR) sensors, and health-focused sensors such as biosensors.MEMS sensors are also becoming increasingly accurate, open towards different ecosystems of technologies, and so intelligent that they can self-configure and reduce power consumption thanks to optimal data processing. These attributes allow us to provide meaningful and sustainable solutions across sectors such as automotive, industrial, infrastructure, and personal electronics, enabling us to improve energy efficiency, reduce waste, and support sustainable practices for a greener planet.For the past 10 years, ST has focused on depth sensing across multiple use cases. Today, ST is the number one in the world for time-of-flight solutions through our ST FlightSense product family. More recently, we launched our global shutter image sensors family, ST BrightSense, to address markets like personal electronics, automotive, industrial, communications equipment, and computers and peripherals.More specifically on the automotive side, we have the portfolio, customers, and customer program awards to lead the driver and occupancy monitoring market. We continue to secure design wins from our growing customer base while we expand our product portfolio and broaden our customer and application footprints.SEMI: What are some of the biggest challenges facing the MEMS and imaging sensors industry today, and how is ST addressing them? Ferri: The MEMS and imaging sensors industry faces several challenges, but with strategic planning and innovative solutions, companies can overcome these obstacles by focusing on the following:Integration: With our biosensors, we are doing more with less space. For example, in a standard accelerometer, we integrate an analog front end for electrocardiogram (ECG) analysis, enhancing functionality without increasing the device footprint.Performance enhancement: Ensuring high performance and reliability in various environmental conditions is crucial, especially in automotive and healthcare applications. To meet these demands, we deploy comprehensive testing protocols to ensure our sensors meet performance and reliability standards.Power efficiency: Reducing power consumption is vital, particularly for battery-operated devices like smartphones and IoT devices. We are developing low-power architectures to address this need.Data security: With the growing use of imaging sensors in surveillance and personal devices, data security and privacy have become paramount. Our solutions include encryption for data transmission and storage, as well as robust access control mechanisms to prevent unauthorized access to sensor data.Additionally, supply chain issues remain a significant challenge today. We believe our strategy and capacity as an IDM, combined with our strong innovation capabilities, give us a competitive edge in supply chain management.SEMI: What are you most looking forward to at the MEMS Imaging Sensors Summit, and what does it mean for the European semiconductor industry? Ferri: I look forward to the Summit as a valuable opportunity to connect with industry peers, share insights, and explore new collaborations. I encourage my peers to attend, as it’s a unique platform to collectively shape the future of our industry and sustain Europe’s leadership in semiconductor innovation. About Simone FerriSimone Ferri is Vice President of APMS Group and General Manager for MEMS sub-group at STMicroelectronics. Ferri began his career in STMicroelectronics in 1999 as an R D engineer before becoming a digital designer for the company’s audio division, leading into product management after 5 years. In 2014, ST entrusted Ferri with MEMS consumer sensors followed by global MEMS-sensor related Marketing and Application activities across all markets and segments, leading into his current role. Ferri graduated with a degree in microelectronics from Politecnico di Milano (Polytechnic of Milan), where he also completed his MBA. Sitong He is Marketing and Communications Manager at SEMI Europe.

Gone are the days when companies were said to go “beyond compliance” if they had sustainability ambitions and operated in a largely voluntary space.Corporate sustainability now sits in a tangle of business priorities, stakeholder expectations, and regulatory obligations. New landmark legislation and policies have changed the game in many markets where semiconductor value chain companies do business. Today, accuracy of information, threshold-setting, evaluation criteria, and due diligence are subject to scrutiny, fines, and litigation.A myriad of compliance risks are now linked to business actions that were historically voluntary in a sustainability context. Fueling the shift are regulations such as the EU’s Corporate Sustainability Due Diligence Directive (CSDDD) and Corporate Sustainability Reporting Directive (CSRD).Across the semiconductor value chain, it is crucial for companies to have a solid regulatory strategy for their sustainability activities. They must take into account, for example, mandatory rules that drive up risks from selectively taking action on some sustainability issues while demoting others.Semiconductor manufacturing and design firms, together with their business partners, face heightened pressure to navigate business and sustainability priorities around the climate transition, human capital management, supply chain management, and a host of other environmental, social, and governance issues that are high on regulatory agendas.The SEMI Sustainability Initiative hosts several working groups that bring to light common concerns and provide a forum for sharing response strategies. To sharpen the guidance that SEMI offers, the Sustainability Initiative is launching the webinar series, Global State of Play: Sustainability Regulations, Reporting, Incentives. This series offers semiconductor industry professionals the chance to learn from top-tier experts on the most pressing challenges in compliance, disclosure, and strategy for sustainable business.The first webinar, Developing a Regulatory Strategy for Sustainability: How to Navigate Key Sustainability Decisions, will feature Ashley Walter, Partner and Chief Sustainability Officer at Orrick Herrington Sutcliffe LLP.As the global business association for the electronics design and manufacturing value chain, SEMI is pleased to convene experts to address improving sustainability strategies for our industry. The SEMI Sustainability Initiative invites industry stakeholders to see the importance of building a regulatory strategy that coordinates across functions, from engineering to the boardroom.Learn more and register.Jordan Famularo, PhD, is Programs Manager, Sustainability at SEMI.

The Rising Stars: 20 Under 30 blog series celebrates the brightest young leaders shaping the future of the semiconductor industry. These exceptional individuals have earned the SEMI Europe 20 Under 30 Award for making a remarkable impact across the supply chain—whether in engineering, sales, marketing, or R D. The series spotlights these rising stars for their career achievements, commitment to innovation, leadership skills, and dedication to driving both business success and community growth.Follow their inspiring journeys, and discover how they are thriving and paving the way for future generations in the semiconductor world.Introducing Marieke Vermeulen: Product Quality Assurance Engineer at MelexisMarieke Vermeulen's journey into the semiconductor industry is a testament to curiosity, adaptability, and self-driven learning. With a background in classical philology, her entry into Melexis as a customer quality technician was unexpected, yet she quickly embraced the challenges of the industry. Through her commitment to growth and innovation, Marieke has risen to the role of Product Engineer, demonstrating leadership and a passion for continuous improvement. Her contributions, particularly in product ownership and driving business growth, highlight her as a dynamic force within Melexis, embodying both technical excellence and a collaborative spirit.SEMI: What inspired you to join the semiconductor industry? Vermeulen: My entry into the semiconductor industry was actually quite accidental. After completing my master’s degree in classical philology, I was still unsure about which direction I wanted my professional life to take. Then, an opportunity arose to join Melexis as a customer quality technician.I did not have anyone in my immediate circle with experience in the industry, so I entered the field without really knowing what to expect. I had only a vague idea of what a semiconductor company did. However, from those early days onwards, I have not looked back. It is my love of knowledge and the desire for a deeper understanding that continues to drive me in my role within Melexis’s quality department. During my literature studies, I was motivated by the idea that there is no absolute, uncontestable truth. Meaning will change with time and place. This perspective aligns closely with the mindset of the semiconductor industry. With new inventions and concepts constantly emerging, the industry is always evolving. We must challenge what we believe to be true yesterday and adapt to the discoveries and advancements for today.So, while there was no direct inspiration that led me to join, more of a stumble into the field, I have since developed a deep respect for how the industry operates. I In particular, I respect how people in the industry do not hesitate to question in order to keep pushing the boundaries of innovation.SEMI: How did your early experiences and education shape your career path?Vermeulen: There was no direct experience. During my school years, STEM was just beginning to earn its place in my educational framework, and we were only introduced to the basic principles. Fortunately, this has changed significantly since then. However, my background hasn’t held me back, in fact, quite the opposite.One main principle from my studies stands out: in language, nothing is set in stone. There is no single truth, no single solution and no single voice. At its heart, language is shaped by human interaction. My studies taught me to think critically and to understand that there is always more than one answer to a question. This approach directly influences the way we work in the product quality department. Our goal is to develop and produce products that meet a customer’s needs as closely as possible. But it is a continuous process and very rarely a straight line. We learn from our past experience to improve the next iteration, again and again. We regularly consult with our peers to gather different ideas, and we listen to the industry to understand where the needs are. Then, we translate those insights into an effective solution.SEMI: Can you share a professional accomplishment you’re most proud of, and explain why it’s significant to you?Vermeulen: Our products go through two main stages in their lifecycle: development and production. As a product engineer, I am responsible during the production stage. However, before we reach this point, there is a transition period where the development and production teams come together to prepare the product for the best possible launch. This period is often hectic, but it clearly demonstrates how much of a team effort our products represent. Every team member understands their role and works towards the collective goal. Being part of such a diverse team and seeing our products succeed is always a thrill for me. While the products are made with metals, silicon, and other elements, it is the human factor that truly brings them to life. The very first spark is always the idea to create. SEMI: As a young professional in the industry, what is your greatest challenge? Vermeulen: As a young woman in STEM, the most obvious answer is that I have to prove myself more than my male colleagues or more experienced peers. However, at Melexis, I have found strong support in overcoming this challenge. Our voices are heard, and we are an active and valued part of our teams. We can express our ideas freely, knowing they will be considered just as seriously as anyone else’s. I can only hope this trend continues throughout the industry.SEMI: What advice would you give to younger generations aspiring to make an impact in this industry?Vermeulen: To those who are unsure if STEM is truly for them, I would say: We need engineers, but we also need dreamers to bring the ideas to life. We need designers and coders who can make the device function, but we also need people who can communicate these concepts to the world. Moreover, we need educators who can inspire and teach the next generations. There is a place for many different minds within the industry, so I encourage you to step in this direction. I’m sure you will find a place.And for those inspired by the semiconductor world and are sure this is where they want to be: don’t be afraid to look beyond the industry. Listen to those around you and take their ideas to heart. Be the inventor for those who cannot bring ideas to life, and offer solutions to those who feel stuck.Cooperation has made our industry great, and it is essential for building a strong foundation moving forward. SEMI: How do you envision future work environments?Vermeulen: The past few years have demonstrated how advanced technology has made the world much smaller. With just a click of a button, a camera, and a microphone, we can connect to the world, ignoring the constrains of time, space and borders. This accessibility opens the door for many more people to enter the industry from all around the globe. A hybrid and flexible work environment enhances this even further, accommodating those who might face physical or logistical restrictions. We need to continue on this path. By embracing diversity, we allow new ideas to emerge at the intersection of different minds. Why exclude a brilliant mind simply because they are on the other side of the continent? Why overlook someone whose mother tongue differs from yours when we can find a common language?At Melexis, we already welcome many different cultures, and it is amazing to see how vibrant this makes our offices. New team members bring their own experiences and blend them with ours. Just as alloys often retain characteristics of their base metals, these newly melded ideas will enrich our collective innovation.SEMI: What impact has the 20 Under 30 Award had on your career? Vermeulen: The award has connected me with wonderful peers and highlighted how we all strive to improve the industry, each in our own way and from our unique areas of expertise. It also has provided me an opportunity to demonstrate that the industry is welcoming to a variety of experiences and is willing to invest in its people. The goal was to foster connections, and it has truly jumpstarted this for me. Following 20 Under 30 JourneysMarieke Vermeulen's story is an inspiring example of how passion for learning and a willingness to embrace new challenges can lead to remarkable success. From her unexpected entry into the semiconductor industry to her achievements as a Product Engineer at Melexis, she has consistently demonstrated leadership, innovation, and dedication. Her journey highlights the importance of curiosity and adaptability in driving both personal and professional growth, making her a role model for others in the industry.The Rising Stars: 20 Under 30 blog series celebrates the exceptional talent and leadership driving the future of the semiconductor industry. Each of the young innovators honored is excelling in their respective fields while shaping the landscape of technology and business with their visionary approaches and dedication. Their stories exemplify the remarkable achievements and unwavering commitment that define the next generation of industry leaders. The series is intended to inspire and motivate future professionals to pursue their passions and embrace the opportunities within this dynamic industry. Stay tuned for more stories of rising stars who are paving the way for continued growth and innovation in the semiconductor world.Learn more about the SEMI Europe 20 Under 30 Award and the recipients honored at SEMICON Europa. For more information contact Maria Daniela Perez at [email protected] Daniela Perez is Communications Manager at SEMI Europe.

Verific Design Automation is an electronic design automation (EDA) developer of front-end software and a member of the Electronic System Design (ESD) Alliance. Verific is also viewed as a valued supplier to many EDA, field-programmable gate array (FPGA) and semiconductor companies –– some still around, some acquired by larger EDA companies, and some long gone –– for the past 25 years. With this backdrop, Bob Smith, executive director of the ESD Alliance, talks with Rob Dekker, Verific’s founder, president, and CTO, and Michiel Ligthart, its COO, about the evolution of the company and the industry over the last 25 years, the emerging EDA products space and what’s to come. Smith: This is the 25th anniversary of the founding of Verific. How did it get started? Dekker: The company I worked for before I started Verific was Exemplar Logic (now Siemens EDA), founded by Ewald Detjens in the 1990s. Exemplar started off making an RTL-to-Xilinx FPGAs path using the VHDL hardware description language (HDL) as the entry language. I worked on the VHDL language parser. As I was doing that work, I looked at the VHDL language reference manual and made sure that all the code complied with the rules set by the IEEE standards committee. I wondered why I was doing it for just one company, because it was and still is an IEEE standard language. Every tool vendor that wants to support VHDL would have someone like me looking at the language reference manual and building a language front-end that complies with all the rules in the standard. As I gained experience and finally left Exemplar, I already knew how to make a language front-end and started building a good one for the Verilog HDL. The initial idea was not to sell it to different companies but to build an equivalence checker formal verification tool that could be installed on every designer’s desktop, where they could check their designs at various stages in the design flow. I needed funding, and started selling the language front-end thinking that no one should have to rewrite a language front-end because it's already a standard. That's when the idea came to start Verific. I wanted to build a standard language front-end, with the possibility of creating a formal tool based on that front-end. The language front-end was popular among various EDA tool vendors and startup companies. Formal tools, synthesis tools, simulators or virtual prototyping tools, emulators, and so on all need a language front-end. I was starting to license the front-end and got so busy that I asked my good friend Michiel to run the business so I could focus on the technical side. After that, we started to grow, acquired an exceptional team in India run by my friend Abhijit Chakrabarty, and hired Rick Carlson as VP of sales. It quickly became a real company, and we started to license the language front-ends to the entire EDA industry. One company wanted to license our language front-end to build an equivalence checker. At that point, we had to decide whether to stay in the language front-end business or to make an equivalence checker and compete with our customers. We decided that competing was not a good idea and chose to focus on language front-end for the EDA industry. We have been doing this ever since for most EDA tools, from startup companies, all the way to large semiconductor companies. Their tools have been built with a language front-end developed at Verific, and we are proud of that. Smith: What have you seen change since you started? Have you seen any big changes that surprised you as the industry has evolved? Dekker: I wouldn't say big changes overall, but I've been impressed by the amount of innovation in the EDA industry. The industry is dynamic, with new tool vendors coming up and good ideas being explored. We are in a wonderful industry that is vibrant with innovation and talented people. This is what impressed me about the industry initially, and it still does. At Verific, we want to be an incubator for new innovations to flourish in an EDA industry dominated by a small number of large players. Ligthart: One change that had a significant impact on Verific specifically is the introduction of SystemVerilog. When Rob started out, there was Verilog 95 and VHDL. Verilog 95 was a relatively simple language. VHDL was complicated. We saw that early customers often wrote their own Verilog parser and came to Rob for the VHDL parser. In 2005, the IEEE 1800, also known as SystemVerilog, was introduced. That was a game changer, because suddenly, adopting SystemVerilog in the Verilog customer base required a new front-end that was as difficult to create as writing VHDL parsers. That was an inflection point for the company, and it started to grow. Before then, it was a nice company. After 2005, it became a growth company. Nowadays, we equally support SystemVerilog and VHDL. They're both complicated languages. People for the past 20 years have proclaimed the death of VHDL. It did not happen and will not happen. The two languages go hand in hand in different parts of the world. Most EDA companies support both because their end users require both. Smith: Verific coined the term “bespoke EDA.” How do you define it? Ligthart: For that, we need a bit of history. Fifty years ago, semiconductor companies started to write their own software tools to design their semiconductors. Those days, it was still called CAD, computer-aided design. Over time, we saw the introduction of EDA companies that tackled singular problems like simulation, place and route, or logic synthesis, and they started replacing in-house developed tools. In the past seven years, many of the larger semiconductor companies and system companies have started to develop in-house EDA tools again. Of course, they still license most of their design tools from EDA companies, but for certain design aspects, they develop their own design flow. They write their own internal EDA tools that are specific to that company, and they don’t go outside of that company. That's what we call “bespoke EDA.” Smith: These chip companies can afford to do this? Ligthart: Yes, because they are large enough and have the people to do it. They license their SystemVerilog and VHDL front-ends from us, so they do not have to invest five years of development for that piece of their flow. They take our parsers and elaborators and build something of their own — bespoke for their semiconductor design flow. Smith: It makes me think of Google, Meta. Ligthart: Let me put it this way. Of the magnificent seven technology stocks, six have a Verific license. Smith: How do you see AI changing EDA design tools? How will AI impact you? Dekker: This question about AI is coming up quite a bit, and I have a more conservative opinion. I don't know if AI is going to change EDA tools by themselves. EDA tools are highly optimized to do a particular task, it would be difficult for AI to beat that. If it did, it would surprise me. Outside of tools, like the design exploration phase for example, I think AI might make a humongous difference. AI could make it much quicker to explore different design alternatives. Right now, several AI-based companies are engaging with Verific, and they provide the design environment to do optimizations. AI could also help engineers improve their work. This would be more at the micro level, where individual engineers use ChatGPT type of engines and language models to enhance their programming styles, algorithms, and implementations. At the micro level, I think AI has an impact. At the macro level outside of the tools, I think AI will also have an impact. I doubt AI will change anything with the tools themselves. Ligthart: I'm pretty much in line with everything Rob said. At the Design Automation Conference (DAC), we showcased our relationship with four EDA startups that are applying or are in the process of applying artificial intelligence to their design objectives. As Rob said, the first step is getting a Verific license so that they have SystemVerilog already in place. Then, they apply AI-based algorithms to tackle certain aspects of the semiconductor design cycle. In terms of how successful they are, that's up to them to prove, but we have a front-row seat to watch their progression and success. Smith: What trends in the industry are you seeing? Dekker: Niels Bohr, a renowned physicist of the 20th century, once said, "prediction is very difficult, especially if it's about the future." Our EDA industry is vibrant, and it’s hard to see where it's going. I think that the EDA industry is here to stay. EDA companies are becoming more and more popular in the stock market. This industry is 40 years old, but it’s still dynamic and still full of innovation. It's extremely important that we keep this industry open, that we share ideas with each other, and that we provide solutions for the increasing complexity of chip and system designs, especially as AI gains prominence. The industry will change, and as it changes, the requirements for EDA tools will also need to be adjusted and there's a range of directions that our industry can go in. Verific is here to support that. About Rob Dekker Rob Dekker is president, founder, CTO and principal developer of Verific’s HDL source code software. Prior to founding Verific, Dekker was a software developer, manager, and director at Exemplar Logic, where he was the architect and a primary developer of Leonardo. Dekker started his career with Philips Research in the Netherlands, where he worked on the testability of VLSI circuits. He graduated from Delft University of Technology, the Netherlands, with a Master of Science degree in electrical engineering. About Michiel LigthartMichiel Ligthart is Verific’s COO and has an extensive background in engineering, product marketing, and general management. Prior to Verific, Ligthart was vice president and general manager of west coast operations for Theseus Logic, a startup in asynchronous logic. Previously, he spent eight years with Exemplar Logic in engineering and marketing roles. Ligthart started his career with Philips Research Labs and was a visiting scholar at the Center for Integrated Systems at Stanford University. He has a Master of Science degree in electrical engineering from Delft University of Technology, the Netherlands. Robert (Bob) Smith is executive director of the ESD Alliance, a SEMI Technology Community.

The drive to scale nodes towards physical limits, known as "More than Moore," and the adoption of 3D architecture in chip integration strategies for advanced logic and memory applications has led to unprecedented demand for high-quality dependable materials solutions. With the aid of digital solutions, the process is expedited with higher quality and efficiency.SEMI spoke with Thorsten vom Stein, Director, Head of Process Design Semiconductor Materials at Merck KGaA, Darmstadt, Germany, about how materials innovations and advanced packaging can contribute to smarter supply chain solutions for a sustainable ecosystem.More insights into key aspects of 3D architecture in chip integration and heterogeneous integration will be shared at the Advanced Packaging Conference (APC) during SEMICON Europa 2024, Nov. 12-15 in Munich, Germany. Registration is open.SEMI: What makes the digitalization of chemical process design for semiconductor materials manufacturing so challenging at a technology level? Vom Stein: The primary challenge in digitalization of process design is achieving data rich experimentation and design flexibility from the start. When we begin the process design for a novel material solution, the freedom of design needs to be very high for optimal outcomes. For example, to identify the best sequence of unit operations to achieve best process intensification, do we need a distillation or extraction after the reaction to meet the purity requirements? At the same time, the samples from these early process trials need to have purity levels and process reliability standards for high-volume manufacturing of routine production in order to meet the requirements of our customers’ leading-edge chip integration strategies. We address this need by executing data rich experimentation starting with first trial, and thereby establish “production ready” data density in the lab.To avoid confining our design space, we therefore need highly “sensorized” and automated modular lab equipment that can give us the data density we need and flexibility at the same time.SEMI: Are data-driven approaches also applied to streamline manufacturing processes? Vom Stein: Yes, data-driven approaches are key to driving cost, quality, process reliability and sustainable excellence. As we scale up from lab experiments to high-volume manufacturing—often times increasing volumes by two or three orders of magnitude—we scale the process model virtually ahead of its physical twin to de-risk these major scale-up steps. An example of this is simulating the effect of reactor geometry on the impurity profile.Establishing this handshake between the physical asset and the process model early in the development has a lot of benefits for sustained cost efficiency of the future manufacturing process. For instance, it allows for optimization of yield and cycle times to the existing asset infrastructure. Furthermore, we can achieve quality reliability critical to our customers by establishing end-to-end correlation models that link the quality of incoming raw materials to finished good impurity profiles.Finally, we can achieve the lowest possible carbon footprint and minimize waste streams and energy intensity via process intensification by matching the unit operation sequence to the specific thermodynamics and kinetics of the process.SEMI: How can advanced packaging contribute to the pursuit of net zero? Vom Stein: Ultimately in a successful process design, we aim to achieve the maximum yield of value-added product with minimal input of resources and raw materials. So, there is an intrinsic synergy between highly intensified processes and their carbon footprint. The digitalization of process design allows us to track the CO 2 footprint during every iteration of the design. Establishing this tracking as a routine design KPI is one of the key initiatives to drive net zero semiconductor material solutions.In addition, advanced process design is a key enabler for circular value streams. We are currently working on multiple projects to recycle waste streams and re-feed them as raw materials in our processes. We are also exploring how our chemical process technology can aid our customers’ recycling efforts such as reusing lithography cleaning solvent waste streams.SEMI: In your previous talks, you emphasized the importance of diversity, equity and inclusion (DE I). How is this related to the digital revolution? Vom Stein: In the not-so-distant past, my team consisted mainly of process chemists and engineers. Now, we are working with data scientists, model developers, automation experts and many more substance matter experts on our projects. This work requires an inclusive culture to maximize the impact of these diverse sets of insights and disciplines.We also must acknowledge that, in many instances, we are exploring unchartered territory that requires a “leap of faith” culture trusting in digital models. Imagine, for example, a production plant director who is used to a stepwise physical scale-up, now being onboard with skipping physical scale-up steps by using predictive process models. It takes time to really establish a trust in the “power of data.” This type of culture is championed at Merck KGaA, Darmstadt, Germany on all levels: from CEO to the production operator. Our DE I Report showcases how we continuously build belonging for over 64,000 employees across the globe.SEMI: Merck KGaA, Darmstadt, Germany is a key contributor to semiconductor innovations. How important is it for Merck KGaA, Darmstadt, Germany to collaborate with other industry leaders to achieve goals in matters such as sustainability and DE I? Vom Stein: Collaboration with our customers and OEM partners is a key piece of achieving the molecular precision necessary to drive technology evolution that serves as the backbone to society. More and more, we need to link our material solution manufacturing process to the process parameters of the tools in the fab, ultimately improving the chip yield of our customers. To transition from the nanometer era to the angstrom era, we must establish these process correlations end to end along the value chain, which is why we are heavily engaged on our Athinia collaboration framework.Besides technology enablement, sustainability is the next avenue where cross value chain collaboration is a must to lower the CO 2 and energy footprint of our industry. To this end, we have started a joint program with Intel on AI-enabled sustainable semiconductor processes.The importance of industry collaboration is why I was so honored to participate at SEMICON Europa together with representatives from leading companies.SEMI: What did enjoy about SEMICON Europa 2023 that you would like to experience again in 2024? Vom Stein: I was really impressed by the SEMICON Europa 20 Under 30 recognition program launched during the show. The program honored the brightest young leaders who have demonstrated success in their careers in the microelectronics supply chain. We were very happy with the acknowledgement of one of our brightest minds at Merck KGaA, Darmstadt, Germany, Balazs Bordas, Digital Twin Implementation Lead. He has been instrumental for many of our pioneering efforts in this space.Such recognition programs are very important for our industry and can make a significant difference in the perception of the semiconductor industry and its ability to motivate and attract more talent. I personally hope to see similar programs in the years to come.Additional resources:Learn more about diversity and inclusion at Merck KGaA, Darmstadt, Germany.Learn more about Merck’s KGaA, Darmstadt, Germany modular lab automation approach.Merck KGaA, Darmstadt, Germany sponsored SEMICON Europa and SEMI Advanced Packaging Conference in 2023. Thorsten vom Stein is Director, Head of Process Design Semiconductor Materials at Merck KGaA, Darmstadt, Germany. Based in Darmstadt, Germany, he holds a PhD in Chemistry from the RWTH Aachen University and has extensive experience in Catalysis, Materials Science, Process Development and Value Chain Innovation.Serena Brischetto is Director of Marketing and Digital Engagement at SEMI Europe.

SEMI High Tech U is making waves around the world, introducing students and educators to the fascinating world of microelectronics through hands-on, experiential STEM learning kits. The SEMI Foundation started the program in the U.S., aiming to spark interest in semiconductors and technology, and High Tech U has expanded across borders to reach students in Europe and Southeast Asia. Recently, young learners in Germany and Malaysia participated in the SEMI program, diving into circuits, coding, and connecting their learning to the ever-evolving semiconductor industry.One of the core goals of High Tech U is to empower educators and students with tools that make microelectronics accessible and engaging. Since 2022, thanks to support from sponsors like KLA, Nordson, Western Digital, STMicroelectronics, Applied Materials, Broadcom, Infineon, and Qorvo, the program has reached over 5,500 students across multiple states and countries.MichiganStudents in Ypsilanti creating circuits with various materials.In the summer of 2024, SEMI Foundation partnered with Toyota and Washtenaw Community College to provide a free three-day summer program at Parkridge Community Center in Ypsilanti, Michigan. Dozens of Ypsilanti middle school and elementary school students engaged in active, hands-on learning about circuits using everyday materials such as playdough, copper tape, and batteries. The students built basic circuits on paper, created light-up greeting cards, and sculpted figures illuminated with tiny LED bulbs. This learning opportunity taught students and their counselors how circuits and semiconductors are an integral part of everyday life.MalaysiaStudents, staff, and teachers from ST Muar GEMS program.In 2023, STMicroelectronics Muar sponsored High Tech U kits for local schools as part of their Girls in Engineering, Mathematics Science (GEMS) STEM Lab program. SEMI Foundation staff collaborated with the GEMS program and provided a live international train-the-trainer session where teachers familiarized themselves with the High Tech U kits and accompanying curriculum. This session ensured that STMicroelectronics partners from the Muar Primary School were prepared to implement the program and make the connections between student learning and the work of the microelectronics industry.The STMicroelectronics Muar GEMS program has since educated many students in the local area on circuits, coding, and the basics of semiconductors. This partnership continues to blossom as STMicroelectronics aims to expand the implementation of the successful GEMS program. Moving forward in 2024 and beyond, GEMS students will apply their newfound skills in a friendly competition to solve real-world problems, showcasing how knowledge of circuits and coding can make a difference in creating a better world.GermanyStudents from SEMI Europe’s inaugural High Tech U program in Berlin.The SEMI Europe team has also recently launched their first High Tech U program in partnership with the Micro:bit Educational Foundation. Through a series of hands-on STEM activities, SEMI introduced a 4th-grade class in Germany to the fascinating world of microelectronics. Students were able to explore the fundamentals of coding and electronics through building a codable guitar using cardboard, aluminum foil, and electrical clips.The program continues to grow in Europe, providing students opportunities for interactive projects like crafting dice, programming melodies, and building smart sensors. The students’ enthusiasm and curiosity has shown the possibilities of engaging young minds in the world of microelectronics.Expanding Opportunities for Industry InvolvementSEMI invites you to take part in attracting, developing, and retaining the microelectronics talent of the future. Join us in this critical work while strengthening your company’s impact on your local communities. Learn more about High Tech U and opportunities for companies to get involved around the globe by contacting Bia Hamed at [email protected]. Berton Mahardja is the Director of Global Education Initiatives at SEMI Foundation. Prior to joining SEMI, Berton served in various roles across K-12 education. He is passionate about programs that support equitable industry access for students and adults.

In an era where technology permeates every aspect of our lives, the semiconductor industry serves as the backbone of innovation. From IoT devices to data centers, every piece of technology relies on integrated circuits (ICs) such as intellectual property (IP) cores and system on chips (SoCs). As these technologies become increasingly pervasive, the importance of hardware security assurance in the design and development of IP and SoCs cannot be overstated. Evolving cyber threats and sophisticated attacks make it essential for vendors to integrate advanced security measures into their workflows.Market Pressures Driving Demand for Enhanced Hardware Security The semiconductor market is projected to reach $1 trillion by 2030. At the same time, semiconductor devices and system designs are becoming increasingly complex. With that complexity comes the added difficulty and effort required to conduct thorough security analyses. Additionally, competitive pressure to reduce time-to-market means that vulnerabilities can be more easily overlooked or exploited, making it crucial for the industry to adopt automated security solutions. As more products are deployed in critical systems, from consumer electronics to national infrastructure, the stakes become even higher, underscoring the necessity for robust security measures.According to the SEMI Electronic Design Market Data (EDMD) report, in 2023, the electronic design automation (EDA), semiconductor IP, and related services market reached $17.1 billion, fueled by the increasing complexity of semiconductor designs and the growing emphasis on security. While the overall EDA market is growing at a 7.4% compound annual growth rate (CAGR), the semiconductor IP segment is expanding at 9.7%, and in comparison, the logic verification tools market alone is surging ahead at 24.2%. Deeper verification processes and tools are needed to not only handle the rising complexity of semiconductor designs, but also to support the growing emphasis on secure-by-design principles to ensure robust and reliable products in an evolving technological, security, and threat landscape. As a result, the market for logic verification tools — a key component of the EDA market — is surging. The Rising Cost of Cyber Threats from Data Breaches and Architectural Flaws Pavani Jella, Silicon AssuranceThe average cost of a data breach is $4.88 million1, encompassing lost business, regulatory fines, legal fees, and damage to brand reputation. As the semiconductor market grows, the potential financial impact of security breaches due to hardware vulnerabilities also escalates. Companies must invest in robust security measures to mitigate these risks and protect their financial health.Cyber threats from the exploitation of architectural flaws are another threat. Plundervolt is one example of an architectural flaw that could lead to hardware exploitation. Discovered by ethical hackers, Plundervolt is the name of an attack that exploited voltage fault injection to compromise the security of Intel processors. By manipulating the voltage supplied to the CPU cores, attackers could induce errors in the SGX enclave, allowing them to leak sensitive data or even bypass security protections intended by the enclave. This flaw was particularly concerning because it operated at the hardware level, making traditional software security measures ineffective. The attack leveraged the SoCs’ power management features, specifically dynamic voltage and frequency scaling (DVFS), to achieve its malicious objectives.Exploiting such a vulnerability could lead to the exposure of sensitive data, such as cryptographic keys and proprietary information, compromising the confidentiality of secure enclaves. This breach could erode trust in an IP or SoC provider’s security features, particularly in environments that rely on using the IP or SoC for protecting critical data. In cloud environments, a successful exploit could result in multi-tenant data breaches, impacting numerous users.The vulnerability also poses risks to secure applications, potentially leading to manipulated outcomes and decrypted communications. Businesses could face significant financial losses, operational disruptions, and regulatory consequences due to such an attack. It is a stark reminder of how architectural flaws in SoCs can be exploited, leading to severe security breaches that are challenging to mitigate without hardware-level fixes.Industry Believes Hardware Security Assurance Is a Key Priority A majority of security professionals from a diverse group across industry, defense, government, and academia rate hardware Trojan detection, IP piracy protection, and SoC vulnerability assessment as high priorities. This prioritization reflects the industry's awareness of the critical importance of security measures in maintaining the integrity and reliability of semiconductor products.As a result of this awareness, investments in cybersecurity are expected to reach $345.4 billion by 2026, growing at a CAGR of 9.7%2. This substantial investment demonstrates the global commitment to enhancing security measures across all industries, including semiconductors, to combat the escalating threat landscape.New EDA Tools and Investments Needed to Combat Cyber Threats The adoption of new EDA solutions is essential, despite the initial costs. Costs can range from $100,000 to $1 million per license for general EDA design and verification tools, depending on the complexity and capabilities of the software. Pre-silicon security EDA tools can detect vulnerabilities early in the design phase, significantly reducing the risk of exploitation and the need for costly post-production fixes while enhancing product reliability. Secure-by-design principles ensure that security measures are integrated throughout the development process, rather than added as afterthoughts.Integrating these new tools also requires investment in training and potential adjustments to existing workflows. However, the improved security and efficiency provided by these tools can offset these initial costs.While the costs of acquiring advanced EDA tools and deploying them in the workflow is significant, the investment is justified by the long-term benefits of enhanced security and reduced risk of costly breaches. Secure-by-design practices can prevent significant financial losses from security breaches, offering substantial long-term savings. Companies that invest in robust security measures are better positioned to demonstrate market leadership and build customer trust and loyalty, while avoiding the reputational and financial damage associated with breaches.ConclusionThe semiconductor industry is at a critical juncture where the application of advanced EDA solutions for hardware security is not just beneficial, but essential. The time to act is now.The increasing sophistication of cyber threats and the financial repercussions of security breaches make it imperative for IP and SoC vendors to adopt advanced EDA security assurance solutions to secure their designs. By investing in cutting-edge EDA tools and prioritizing security from the earliest stages of design, vendors can safeguard their products, maintain market competitiveness, and protect against the ever-evolving landscape of cyber threats.References1. IBM Cost of a Data Breach Report 20242. KPMG 2024 Global Semiconductor Industry OutlookPavani Jella is the Vice President of Business Development at Silicon Assurance, a member of the Electronic System Design Alliance (ESDA) a SEMI Technology Community. Silicon Assurance specializes in hardware security assurance solutions. With a strong background in the semiconductor and EDA industries, Pavani plays a pivotal role in driving strategic growth and fostering innovative partnerships. Passionate about the intersection of technology and security, she helps organizations adopt state-of-the-art solutions that ensure the resilience and trustworthiness of their hardware systems.

The semiconductor industry, once a hidden force in technology, is now recognized as a pivotal driver of the modern economy. As the engine behind everything from smartphones to smart cities, semiconductors fuel innovation and shape how students learn, play, and engage with the world, making chips a crucial factor in shaping our collective future as the climate changes.In line with SEMI Sustainability Initiative participation at Climate Week NYC, we are preparing a groundbreaking pilot program at the intersection of youth empowerment, workforce development, and climate action. To help the semiconductor industry develop a climate-literate workforce, the SEMI Climate Equity Social Impact Working Group and the SEMI Foundation have partnered to develop a global K-12 program open to all SEMI members for participation and sponsorship. The program will share best practices and resources such as those that follow in this article.SEMI will announce the program at the 29th United Nations Climate Change Conference, more commonly known as COP29, which will be held in Baku, Azerbaijan from November 11-22, 2024. SEMI members are encouraged to become partners and help shape the program ahead of COP29. Contact us to learn more and participate in the announcement.The Opportunity for Semiconductor Industry Climate Leadership It’s not enough for students to simply be aware of climate change and the United Nations Sustainable Development Goals. Awareness alone won’t protect communities or help solve the problems we may all face in the future. We must prepare the next generation to be climate-literate — providing them with the knowledge, tools, and skills to understand complex issues, work collaboratively across the globe, and develop practical, real-world solutions. With this foundation in place, young people become proactive global citizens with the skills to solve problems.The semiconductor industry doesn’t need to reinvent the wheel or build new networks to drive partnership at the intersection of sustainability and workforce development. Companies in our value chain are already well positioned to scale equitable opportunities, promote STEM and AI skills, and empower students to tackle real-world climate challenges as we help prepare them for future careers. Global networks of sustainable schools focused on climate action are well-established in key semiconductor regions. In Taiwan alone, over 330,000 students will participate this year.Sustainable schools networks engage teachers and students with programs that are fun, motivating, and spark curiosity by providing ownership over solving real-world challenges. These mostly free programs can also help drive gender and racial equity into the tech, science and engineering fields for communities and schools that might otherwise be left behind.Examples of programs with youth-designed climate actions are all around us. Students in one New Taipei City, Taiwan school conducted their own energy audits to reduce energy consumption in their medium-income community. Students in a North Pennsylvania, U.S. school of limited resources created a community garden that sparked interest in biodiversity and STEM.Our industry has a unique opportunity to tap into existing sustainable schools networks and help them grow, while amplifying youth-led climate action. These efforts will empower the next generation to drive meaningful change in their communities and inspire young people of every demographic to see the semiconductor industry as a place where they can build impactful careers.Leading the Way: Why the Semiconductor Industry is PivotalGiven the essential role of semiconductor companies in the global electronics design and manufacturing value chain, industry leaders have a unique opportunity to lead the way in cultivating a climate-literate generation of students for the future workforce. Early education on sustainability and technology integration is crucial, positioning leading companies and their partners to shape the emerging global workforce. The long-term semiconductor workforce development effort must cultivate global citizens who understand how to apply their skills in solving challenges. Opportunities for All Schools: Making Climate Education InclusiveWhile some high-resource schools may be able to integrate advanced environmental science and technology projects, it’s important to ensure that all students have access to meaningful climate learning opportunities. For example, students at schools with fewer resources can engage in projects like programming inexpensive micro:bit sensors to measure local water quality or sample moisture levels in their community gardens. Projects such as these are affordable, scalable, and can be implemented in any school, providing students with hands-on experience in environmental science and technology.More importantly, they build critical thinking and problem-solving skills that empower students to take ownership of climate issues affecting their communities.Additional powerful examples already in existence that provide a basis for scalable teaching, learning and partnership for schools globally include:1. Global Climate Pathways (GCP) is a program where various middle schools around the world work together to solve climate problems. Schools that participate receive learning opportunities and tangible STEM learning tools, including STEM kits. These innovative tools provide learning opportunities in coding and circuits.2. EcoSchools U.S. is a global sustainability education program run by the National Wildlife Federation (NWF). This transformative program is student-led, integrating green STEM through project-based learning. It provides opportunities for students to take ownership of their learning by addressing real-world challenges, drives student and teacher engagement, and creates tangible sustainability impacts across school communities. EcoSchools US fosters the development of transferable skills highly valued by employers, such as problem-solving, critical thinking, and interpersonal skills.3. Global Classroom Project is an initiative by Fairfax County Public Schools in Virginia, USA, designed to enhance students' global awareness and cultural understanding. It typically involves integrating international perspectives and global issues into the curriculum, promoting cross-cultural exchanges, and connecting students with peers from around the world.New Jersey Institute of Technology President Teik C. Lim hosts an exchange of Taiwan educators during their visit to advance global collaboration for students.A Common Ground for All Stakeholders: Education with a PurposeA challenge in K-12 engagement is the differing perspectives on its purpose among stakeholders. Companies in the semiconductor value chain may view this student outreach as a way to develop technical talent, while green nonprofits often emphasize climate education and sustainability.Bridging these perspectives requires building a platform that any classroom or school can access if they choose. Adopting a public-private partnership approach brings together corporate, government, and nonprofit stakeholders around a shared set of values. This collaborative effort aims to create opportunities and solutions for communities globally.By investing in early education, the semiconductor industry will not only prepare young people to tackle environmental and technical challenges but also ensure they are ready for future job opportunities and educational pathways. These efforts will help attract students to become part of an industry that values their contributions and future, shaping a workforce equipped to lead and innovate in a rapidly evolving world.This is the moment for companies in the semiconductor value chain to lead by example, demonstrating their investment not just in technology but in the sustainability and health of our planet. By supporting K-12 education with a focus on climate literacy, international partnership, sustainability, and STEM, companies in our value chain can build a brighter, more sustainable future for us all—while ensuring that today’s students are prepared to address the challenges of tomorrow. Justin Harris is Senior Advisor for Climate Equity Social Impact at SEMI, Bia Hamed, Ph.D. is Program Manager, Global Education Initiatives at the SEMI Foundation, and Marley Hauser is senior coordinator for the Climate Equity Collaborative. Acknowledgements Partners We thank our first round of partners for the SEMI global K-12 climate engagement program for their contributions of time and thought leadership to this effort: SEMI members, Climate Equity Collaborative, National Wildlife Federation, ARCedTech, Fairfax County Public Schools, Kaohsiung City Education Bureau, U.S. Environmental Protection Agency, Taiwan Ministry of Environment, Sustainable Jersey for Schools, New Jersey Department of Education, Dr. Prabhakar Shrestha of New Jersey Institute of Technology (NJIT), Dr. Tim Hsu of Global Environmental Enhancement (GEE) in Taiwan, New Jersey Audubon, and the students of NJIT and Readington Middle School in Whitehouse, New Jersey. Special thanks to Shari Liss, Vice President for Workforce Development at SEMI Foundation, and Dr. Mousumi Bhat, SEMI Vice President for Sustainability.

The Rising Stars: 20 Under 30 blog series celebrates the brightest young leaders shaping the future of the semiconductor industry. These exceptional individuals have earned the SEMI Europe 20 Under 30 Award for making a remarkable impact across the supply chain—whether in engineering, sales, marketing, or R D. The series spotlights these rising stars for their career achievements, commitment to innovation, leadership skills, and dedication to driving both business success and community growth.Follow their inspiring journeys, and discover how they are thriving and paving the way for future generations in the semiconductor world.Introducing Kai Hahn: Project Manager R D at Comet, Industrial X-Ray Systems DivisionKai Hahn’s journey began when he joined the company as a bachelor’s thesis student. His early drive and exceptional contributions quickly set him apart, earning him a role as a cooperative student while simultaneously serving as a "Change Manager." In this capacity, Hahn led high-impact business excellence initiatives, overseeing cross-functional projects at the executive level. Now, as a Project Manager in R D, Hahn leads agile teams developing cutting-edge automated inspection solutions. His leadership, marked by a commitment to innovation, collaboration, and customer satisfaction, drives both personal and organizational growth, making him a standout in the semiconductor industry.SEMI: What inspired you to join the semiconductor industry? Hahn: I didn't actively choose the semiconductor industry; rather, I grew into it together with our brands Comet Yxlon Dragonfly. Beyond the pioneering spirit our X-Ray System division has, what excites me the most is our direct connection to semiconductors. From turning off your morning alarm to driving to work, staying connected with friends and family, or watching a sports game on TV — semiconductors are everywhere and shape our daily lives. Working in this industry is both exciting and challenging. Every day, I look forward tackling new projects that push the boundaries of innovation. But what inspires me the most is the transformation that our division is undergoing. We are continuously adapting our processes and procedures to meet the growing demands of the market and our customers. Being part of this dynamic evolution is rewarding and exhilarating. SEMI: How did your early experiences and education shape your career path?Hahn: With my degree in business and engineering, I chose a program that covered a wide range of subjects. While I gained knowledge from a broad field, by the end of my bachelor's degree, I realized I lacked practical experience and a clear direction for my career.Joining Comet as an intern during my final year helped me anchor my career path. I decided to pursue my master's degree while working part-time for the company. This decision allowed me to gain relevant professional experience early on and apply the knowledge from my studies directly to real-world challenges. SEMI: Can you share a professional accomplishment you’re most proud of, and explain why it’s significant to you?Hahn: Combining the strengths of Comet Yxlon’s software and Dragonfly’s AI powerhouse — I was the dedicated project manager to support the global technological cooperation of our two software environments to accelerate the 3D IC go to market challenge. My goal was to facilitate methodological collaboration to develop new software inspection workflows for the semiconductor industry.Looking back, I am proud of what we accomplished: building a cohesive team from different cultures, working across time zones, adapting to various working styles, and successfully launching our first product.SEMI: As a young professional in the industry, what is your greatest challenge? Hahn: One of the biggest challenges is the rapid pace of industry change. For development teams, this means shorter development cycles and closer collaboration with international customers. For young professionals, it's essential to maintain a continuous learning cycle to stay current and develop the ability to work effectively across diverse cultures. This ensures we understand the different customer requirements and can implement them effectively.SEMI: What advice would you give to younger generations aspiring to make an impact in this industry?Hahn: Gaining practical experience alongside your studies as early as possible is crucial. Internships or working student positions offer valuable opportunities, and sometimes, it’s beneficial to proactively reach out to companies, even if no vacancies are advertised. For me, these experiences made my studies more engaging by linking theory to real-world applications and deepening my understanding of the subjects. Beyond acquiring practical skills and expanding your network, this approach helps clarify the career path you want to pursue after graduation.SEMI: How do you envision future work environments? Hahn: Working from home has increasingly become the standard in recent years. While offering many advantages, a significant challenge for companies is maintaining a sense of community. This is easier to achieve when employees are physically present, as in-person interactions tend to be more impactful. It raises the question of how companies can foster a strong sense of community and belonging in the long term without requiring workers to be physically present in the office.SEMI: What impact has the 20 Under 30 Award had on your career? Hahn: Overall, this recognition has been both a validation of my efforts and a source of inspiration to continue pushing the boundaries in my work. Beyond the recognition of my contributions and achievements, the award provided a platform to engage with like-minded young professionals beyond my usual network.Following 20 Under 30 JourneysKai Hahn’s journey from a bachelor’s student to a leading Project Manager at Comet, Industrial X-Ray Division is a testament to his dedication, innovation, and leadership in the semiconductor industry. His achievements in integrating teams, developing cutting-edge solutions, and driving organizational transformation highlight the significant impact young professionals can make. Hahn’s story is an inspiring example of how passion and perseverance can lead to remarkable accomplishments. As he continues to push boundaries and shape the future, SEMI looks forward to seeing the continued influence of his work in the semiconductor field.The Rising Stars: 20 Under 30 blog series celebrates the exceptional talent and leadership driving the future of the semiconductor industry. Each of the young innovators honored is not only excelling in their respective fields but also shaping the landscape of technology and business with their visionary approaches and dedication. Their stories exemplify the remarkable achievements and unwavering commitment that define the next generation of industry leaders. The series is intended to inspire and motivate future professionals to pursue their passions and embrace the opportunities within this dynamic industry. Stay tuned for more stories of rising stars who are paving the way for continued growth and innovation in the semiconductor world.Learn more about the SEMI Europe 20 Under 30 Award and the recipients honored at SEMICON Europa 2023. Nominations for the 20 Under 30 program at SEMICON Europa 2024 close on September 30.Maria Daniela Perez is Communications Manager at SEMI Europe.

Silicon carbide (SiC), with its wide band gap and high thermal conductivity, is increasingly favored for semiconductor power applications across several fast-growing industries. Its ability to operate at higher voltages and frequencies enables significant efficiency gains, particularly in e-mobility, where SiC offers key advantages in size, weight, and speed compared to traditional silicon-based power devices.However, as promising as SiC is, the industry still faces critical challenges in scaling to meet growing demand. Key barriers include cost, reliability, and manufacturing capacity, all of which must be addressed for SiC to fully mature.SEMI spoke with Entegris Senior Director - Advanced Technology Engagements, Office of the CTO Mark Puttock, Ph.D., to discuss the challenges of scaling SiC power chip manufacturing from a material supplier’s perspective. Puttock shared insights ahead of his presentation at the Entegris session, Cultivating a Thriving SiC Market: Tackling Key Challenges Across the Value Chain, taking place on November 14, 2024, at SEMICON Europa in Munich, Germany. Don’t miss the opportunity to engage with experts from Entegris and other industry leaders. Registration is now open. SEMI: Global megatrends like environmental crises and AI drive the necessity for SiC power semiconductors. What is the current status? Puttock: The increasing demand for efficient power electronics — fueled by global megatrends such as vehicle electrification, environmental de-carbonization, and the rise of power-hungry AI chips — drives the necessity of wide bandgap semiconductors. SiC offers advantages of weight, size, and speed over traditional silicon (Si) solutions, which are particularly vital in automotive applications 600V and above. However, SiC chip manufacturing has not reached the maturity of silicon-based processing. Greater maturity will help reduce costs, which will accelerate adoption in the market.SEMI: What are the main challenges in scaling SiC?Puttock: Challenges in scaling SiC power chip manufacturing to high volumes are not surprising. That’s because high volume producers have not been operating long enough to resolve early-stage issues. From a material perspective, SiC is more challenging to manage compared to Si. The challenges we identify include:Chemical Mechanical Planarization (CMP): SiC is nearly as hard as diamond and significantly harder than Si, making it challenging to achieve a high removal rate while maintaining both planarity and low defectivity. This step is crucial toward the end of the wafering process and before the epitaxial growth of device layers.Handling: SiC is more brittle than Si, making it more susceptible to damage or breakage.Implantation: SiC is more difficult to implant than Si, requiring higher temperatures and the use of aluminum instead of boron as a P-type implant species. Additionally, it is a significant challenge to achieve a reliable aluminum source with a long and stable lifetime.Thermal Processing for Wafer Growth and Epitaxy Processes: SiC processes run hotter than Si ( 2000° C for wafering, 1500° C for epitaxial growth), demanding resilient chamber parts to achieve good lifetimes.Sustainability: Because SiC is extremely hard, the CMP process requires significant amounts of slurry. Improving slurry recycling and wastewater management continues to be a challenge.On October 29, we will address these issues in our webinar, “Challenges in Scaling SiC Power Chip Manufacturing: A Material Supplier's Perspective” This session will provide valuable insights and considerations for advancing maturity in high-volume SiC power chip manufacturing. SEMI: Can you elaborate on the challenges associated with CMP for SiC wafers? Puttock: SiC wafers are challenging to process, requiring specialized materials and methods compared to traditional silicon. Defects in the SiC wafer crystal during non-optimized CMP processing can propagate into the device epitaxial layers. This leads to yield loss, increased electrical resistance, reduced performance, and wasted power.SiC wafers must be cut, ground, lapped, and polished to create the necessary surface properties before depositing active layers. As the demand for these devices grows, optimizing the CMP process is essential to ensure the desired surface quality and planarity required for device fabrication. For a deeper understanding of these challenges, we recommend downloading our latest white paper, “Solving CMP Challenges in High-Volume SiC Production,” which covers:Achieving maximum smoothness with high removal ratesReducing the total cost of ownership Optimizing CMP slurry and pads for the unique wafer chemistry and topology of SiC wafersSEMI: What do you mean by optimizing slurry for SiC CMP?Puttock: CMP slurry typically consists of abrasive nanoparticle powder dispersed in a chemically reactive solution. The objective is to achieve a smooth, defect-free surface (less than 1 A Ra) with a high removal rate (greater than 7 µm/m).Traditionally, achieving high removal rates and smooth surfaces required two separate slurries. This approach sometimes forced SiC wafer manufacturers to choose a defect-free surface over a faster, more efficient CMP process, depending on their fab capabilities. Today, optimization allows SiC wafer manufacturers to achieve both high polishing capacity and good final surface quality using a single slurry.Additionally, while the slurry is the most critical part of the CMP process, the pad must be compatible with the application. This ensures the desired planarity while also preventing scratches or contamination of the SiC wafer surface. Research shows that optimized thermoplastic polyurethane CMP pads outperform traditional thermoset polyurethane pads. The optimized pads minimize surface damage and enhance removal rates due to their bulk hardness.SEMI: What are the future challenges for SiC devices? Puttock: SiC devices are increasingly favored for their superior energy efficiency and reduced environmental impact. However, the SiC manufacturing process presents challenges due to its high-temperature operations, which consumes significant amounts of energy and shortens the lifespan of chamber components. To address this, improving efficiency in these processes will be crucial in the coming years.Recycling is another important challenge. For example, CMP slurries present an opportunity for water recycling and conservation. At Entegris, we are committed to this issue and are actively collaborating with key industry players to enhance material circularity and prioritize sustainability in our new product development.SEMI: How is Entegris contributing to advancements in SiC technology, and what initiatives or partnerships do you have planned for the near future? Puttock: Entegris is an active member of the SEMI Global Automotive Advisory Council (GAAC) and participates in a working group focused on SiC with key industry leaders such as Volkswagen, BMW, Porsche Consulting, onsemi, Infineon, STMicroelectronics, and others. Our engagement spans the entire semiconductor supply chain, collaborating with integrated device manufacturers and original equipment manufacturers in fabs worldwide. Additionally, we recently announced our latest long-term agreement with onsemi, which underscores our commitment to advancing SiC technology.SEMI: What are your expectations regarding your participation at SEMICON Europa? Puttock: SEMICON Europa is a unique platform to connect with the semiconductor and automotive ecosystems. Last year, we organized a highly successful SiC session in collaboration with SEMI at both SEMICON West and SEMICON Europa, focusing on “Connecting the Automotive Ecosystem Towards More Mature SiC Manufacturing.”This year, we will continue the discussion with industry leaders during our session, “Cultivating a Thriving SiC Market: Tackling Key Challenges Across the Value Chain.” Our goal is to provide insights and propose solutions that will enable SiC power chips to achieve their anticipated role in future technology ecosystems.We will present alongside Porsche Consulting, and the talks will be followed by a panel discussion that will explore the current state and future prospects of SiC technology in power electronics. We invite visitors to join us at the Executive Forum on Thursday, November 14, from 1:40 – 3:00 p.m. and to visit us at Silicon Saxony booth 219 in Hall C1.About Mark PuttockMark Puttock, Ph.D., is the senior director of advanced technology engagements in the office of the CTO at Entegris. He has worked in the semiconductor industry for over 30 years with a background in physics and plasma processing. As a team member of the Entegris CTO office since 2014, Mark has followed technology trends and collaborated with Entegris’ global product development teams to develop timely and differentiated new materials, chemistries, and components for all the world’s semiconductor manufacturers. Maria Daniela Perez is Communications Manager at SEMI Europe.