The European semiconductor ecosystem continues to evolve, driven by the ambitions outlined in the EU Chips Act. With goals to strengthen Europe’s technological leadership and double its semiconductor manufacturing market share to 20% by 2030, collaboration across the value chain is imperative. Heterogeneous Integration for Connectivity and Sustainability (HiCONNECTS), a Horizon Europe-funded project, exemplifies this collaborative spirit. The initiative aims to develop next-generation electronic components and systems using advanced heterogeneous integration core technology solutions.The HiCONNECTS consortium, comprising 65 partners with diverse expertise, is addressing key societal and industrial challenges. These efforts focus on advancing core technology solutions for energy-efficient, high-performance wireless and wired cloud and edge computing, as well as automotive radar systems.“Collaborating with 65 partners is no small feat—it’s akin to orchestrating a complex IT network,” says Ilan Englard, Coordinator of the HiCONNECTS project. “We streamline progress by creating local networks of partners, all interconnected through a central management framework of tasks, work packages, and coordination. Such large consortia form intricate systems where complexity fosters innovation, often leading to surprising and transformative outcomes.” As the three-year project progresses, HiCONNECTS is working to establish pilot lines focused on key areas:RF Electronic Heterogeneous IntegrationPhotonic Components for Heterogeneous IntegrationAdvanced Packaging for Heterogeneous IntegrationThese pilot lines, led by organizations such as the Ferdinand Braun Institute and imec, will develop systems and modules through advanced equipment development, manufacturing optimization, and integration of electronic and photonic components. Validation of equipment in integrated process flows will further enhance the heterogeneous integration landscape.Now in its third year, HiCONNECTS continues to welcome new members. This inclusiveness underscores the project’s flexibility and its commitment to incorporating fresh perspectives as new trends and challenges emerge. At the 12-month consortium meeting in Catania last February, Arbonaut was unanimously inducted to contribute to the forest fire use case, further expanding the project’s scope.“The upcoming months are critical, as we move closer to delivering modules, systems, and demonstrators,” says Englard. “Our goal is to heterogeneously integrate the next generation of RF, electronic, and photonic components into networking, telecom, and radar systems, with support from module and equipment makers.”HiCONNECTS members at the 12-month consortium meeting in Catania, February 2024As this ambitious work progresses, sharing project results and achievements remains a top priority for the consortium to ensure meaningful social, political, and economic impact. By drawing attention to the results of the project, the consortium enhances the visibility, comprehension, and implementation of these advancements. Recently, four partners—Excillum, TNO, SANLAB, and Centria University of Applied Sciences—participated in a webinar titled “Heterogeneous Integration for Future High Speed Communication,” organized by SEMI Europe. The webinar is now available on demand for viewers worldwide.The significance of HiCONNECTS was further highlighted at SEMICON Europa 2024, where seven consortium members presented progress on topics ranging from advanced packaging to photonic integration. At the TechARENA, representatives from SEMI Europe, Excillum, Centria, Arbonaut, AT S, imec, and Applied Materials showcased the project’s contributions to the semiconductor ecosystem. “I was thrilled to present at the TECHArena and engage with the HiConnects partners,” said Julius Hållstedt, Head of segment - Semi Electronics, Excillum. “I especially appreciated the high attendance at my talk, which validated the strong interest in X-ray solutions for semiconductor applications. The insightful discussions at the SEMICON Europa exhibition and advanced packaging conference was a rewarding bonus.”HiCONNECTS Speakers at SEMICON Europa 2024By disseminating research and breakthroughs across various channels, such as publications, webinars, and conferences, HiCONNECTS is promoting knowledge sharing and fostering collaboration across the semiconductor ecosystem. This openness accelerates the adoption of new technologies, ensuring that European industry players remain at the forefront of critical advancements. Furthermore, sharing these results strengthens Europe’s position as a hub for cutting-edge research and development, driving both economic growth and technological leadership on the global stage.SEMI Europe is proud to be a consortium member of HiCONNECTS under the Chips Joint Undertaking (Chips JU), which is funded by the EU Horizon Europe program and supported by numerous countries, including Austria, Italy, Germany, and Sweden.About HiCONNECTS:HiCONNECTS (Heterogeneous Integration for Connectivity and Sustainability) is a three-year project bringing together 65 partners to develop sustainable, energy-efficient cloud and edge computing platforms. The project focuses on high-performance computing, storage infrastructure, network interfaces, and real-time analysis of IoT sensors and big data.Kartikey Srivastava is Senior Specialist – Communications at SEMI Europe.

SEMI kicked off 2025 by hosting its annual Industry Strategy Symposium (ISS) gathering industry executives, government leaders, and research institutions to share insights on current and near-term business and market dynamics. Over the course of two and a half days, this key forum also provided valuable networking opportunities to foster collaboration.The event theme, Ready. Set. Ramp! aligns with the industry's goal of reaching $1T by 2030. While there is uncertainty due to global trade tensions, supply chain challenges, and talent shortages, AI-driven opportunities are proving to be a major growth driver. Another key highlight was the advanced packaging panel that reinforced the value of hybrid bonding and 3D device architectures playing a critical role in supporting AI and next-generation chips. The overarching sentiment from the event was that it's an exciting time to be in semiconductors, with unprecedented transformation and opportunities ahead. Collaboration across the industry is essential to overcoming technical challenges and accelerating innovation.SEMI leaders had the opportunity to speak with Francoise von Trapp of 3D InCites at the conclusion of ISS. Listen to the podcast to hear highlights from Joe Stockunas, President of SEMI Americas, along with market updates from SEMI’s Market Intelligence team members, with Inna Skvortsova covering semiconductor equipment and Christian Dieseldorff speaking on fab expansions. Looking aheadSEMI has many conferences and exhibitions scheduled throughout the year with opportunities for insights and networking. For the SEMI Americas region, don't miss the inaugural SEMIExpo Heartland on April 1-2 in Indianapolis, Indiana. SEMI is excited to host this event in the burgeoning Midwest U.S. region that is already seeing increased activity and opportunity for semiconductors, especially in areas around automotive electronics, smart manufacturing, machine learning, AI and workforce development. The expo is poised to spur collaboration among industry, government, and academia.A key change to note for Americas events this year is that SEMICON West is taking place in Phoenix, Arizona on Oct. 7-9. With over $100B in investments in motion, the greater Phoenix area is a growing manufacturing hub in the Southwest. There is already a lot of buzz and excitement with a sold-out venue and over 400 speakers lined up for the 3-day event. SEMICON West will return to San Francisco in October 2026 and will alternate between these two locations every other year through 2030.ResourcesPress Release: Eighteen New Semiconductor Fabs to Start Construction in 2025, SEMI ReportsPress Release: Global Total Semiconductor Equipment Sales Forecast to Reach a Record of $139 Billion in 2026, SEMI ReportsSEMI Market Intelligence ReportsSEMI ISS 2025: Ready, Set, Ramp! by Dean Freeman, 3D InCitesSEMI ContactSherrie Gutierrez, Marketing Communications ManagerEmail: [email protected]

As artificial intelligence (AI) continues to revolutionize industries, the technology behind AI chips is advancing at an unprecedented pace. Meeting the demands of faster processing, greater efficiency, and increased complexity requires cutting-edge solutions in semiconductor manufacturing. SEMI spoke with Kai Beckmann, Member of the Executive Board at Merck KGaA, Darmstadt, Germany and CEO of the Electronics business sector, who shared insights into Merck KGaA, Darmstadt, Germany's latest strategic move that underscores the company’s commitment to innovation in semiconductor and optics technologies. With the acquisition of Unity-SC, a leading provider of advanced measurement and inspection technology, this marks a significant milestone in the evolution of AI chip manufacturing and beyond by bridging expertise in electronics and optics to drive innovation.Strengthening AI Chip Manufacturing with Unity-SC On October 31, 2024, Merck KGaA, Darmstadt, Germany’s Electronics business acquired Unity-SC, a global leader in metrology tools for semiconductors. According to Beckmann, this acquisition not only enhances Merck KGaA, Darmstadt, Germany’s portfolio in advanced measurement and quality inspection but also bolsters its position in the development of AI chips. These chips, essential for driving AI, rely on cutting-edge manufacturing processes like advanced packaging and heterogeneous integration.“Unity-SC brings precision to the table,” Beckmann explained. “Its technology is vital for managing the complex production sequences involved in creating high-density, three-dimensional chip structures. Without this precision, the production of AI chips at the necessary scale and quality would be nearly impossible.”The expertise of Unity-SC is pivotal for ensuring reliability in semiconductor manufacturing, reducing waste, and optimizing performance. With Merck KGaA, Darmstadt, Germany’s established relationships with major chip manufacturers, the integration of Unity-SC's technology is set to create synergies that will benefit the entire industry.A New Era for Merck KGaA, Darmstadt, Germany: Electronics Meets OpticsThe acquisition of Unity-SC aligns with Merck KGaA, Darmstadt, Germany’s broader strategy of combining expertise in semiconductors and optics, a vision that includes rebranding its display business as Optronics. This move represents a transformation from a traditional display specialist to a pioneer in optical technologies that complement electronic advancements. “Integrating optics with electronics opens up vast opportunities,” Beckmann shared. He highlighted key areas of focus like silicon photonics, which is revolutionizing data transmission, and augmented reality, where lightweight, powerful headsets represent the next frontier.Merck KGaA, Darmstadt, Germany’s foray into these domains underscores the importance of merging light management and materials expertise. For instance, the precision metrology brought by Unity-SC dovetails with Merck KGaA, Darmstadt, Germany’s work in materials science, forming a foundation for advancements in next-generation technologies such as quantum computing and neuromorphic systems. Driving Innovation in AIAdvanced packaging and heterogeneous integration are at the core of today’s AI revolution. These technologies make it possible to stack chips in 3D configurations, reducing energy consumption and increasing processing power. “Unity-SC plays a crucial role in this process,” Beckmann noted, emphasizing that the precise measurement of intricate structures ensures the reliability and efficiency of these complex systems.By mastering these technologies, Merck KGaA, Darmstadt, Germany is positioning itself as a leader in both materials and metrology for semiconductor manufacturing. “Integrating metrology and inspection into our portfolio is a leap forward in aligning our expertise with the needs of the AI-driven semiconductor industry,” Beckmann said. Looking AheadMerck KGaA, Darmstadt, Germany’s combination of semiconductor and optics expertise is not just about advancing technology but about creating a stronger, more resilient organization capable of tackling future challenges. The integration of Unity-SC is a step toward achieving this vision, fostering innovation at the intersection of light and materials.“Working in the semiconductor industry has always been exciting,” Beckmann shared. “But now, with AI reshaping the landscape, the opportunities for innovation and growth are unparalleled. Together with Unity-SC, we’re not just keeping pace—we’re leading the charge.”Merck KGaA, Darmstadt, Germany’s strategic evolution signals a promising future for AI, semiconductors, and the broader field of optoelectronics, where the interplay of light and materials continues to unlock new horizons.Kai Beckmann is a Member of the Executive Board of Merck KGaA, Darmstadt, Germany and CEO of the Electronics business sector. Joining Merck KGaA, Darmstadt, Germany in 1989, he has held roles in IT, consulting, and international management, including as Merck KGaA, Darmstadt, Germany’s first CIO. Since 2017, he has led the Electronics sector (operating under the name EMD Electronics in the US and Canada), driving innovation in semiconductors and optics. Beckmann also oversees the Darmstadt site and co-determination in Germany. He holds a computer science degree from TU Darmstadt and a doctorate in economics earned in 1998.SEMI ContactMaria Daniela Perez, Communications ManagerEmail: [email protected]

Superconducting Naturally – Miassite is a naturally occurring mineral which scientists at Ames National Laboratory have identified as the first unconventional superconductor found in nature. Unlike conventional superconductors that follow the Bardeen-Cooper-Schrieffer (BCS) theory, minerals such as miassite exhibit unique properties outside of this framework. Made of rhodium and sulfur, miassite was initially recognized as a regular superconductor in 2010. Recent tests confirm it joins a small, exclusive group of unconventional superconductors previously limited to lab-made materials.Lab tests on miassite involved measuring magnetic reactions, inducing defects, and analyzing energy gaps, all confirming its unconventional behavior. While naturally occurring, samples are unlikely to be superconductive due to their disordered state, miassite’s lab-verified properties open doors to new research and highlight its unique duality as both a conventional and unconventional superconductor.Source: A Superconductor Found in Nature Has Rocked the Scientific WorldPheromones + vision = mate selection – When choosing a mate, Heliconius butterflies, despite their tiny brains can outperform current AI in multi-sensory decision-making by processing visual and chemical cues simultaneously. This discovery inspired Penn State researchers to develop a low-energy, multi-sensory AI platform using 2D materials. The device combines molybdenum sulfide (MoS2) to mimic visual capabilities and graphene to detect chemical signals like pheromones.The device could integrate visual and chemical cues, offering adaptability like a butterfly’s mating behavior. This innovation addresses limitations in current AI, which relies heavily on energy-intensive, single-sensory processes. Researchers aim to expand the device to process three senses, like crayfish using visual, tactile, and chemical cues. The work, supported by the U.S. Army Research Office and the U.S. National Science Foundation, could revolutionize applications in robotics, smart sensors, and critical environments, by enabling AI systems to detect issues using multiple sensory inputs efficiently. Imaging of Heliconius Butterfly A Butterfly Effect – Proving once again that there is a lot to be learned from nature, researchers from the Fraunhofer Institute for Solar Energy Systems ISE have developed innovative, colored solar facade elements inspired by morpho butterfly mimicry. These panels are aesthetically pleasing, integrate seamlessly into building exteriors, and retain high efficiency, achieving 95% of the power output of uncoated panels. Using vacuum-applied 3D photonic structures like those on butterfly wings, the panels produce vibrant, angularly stable colors with minimal energy loss. This MorphoColor® technology addresses architects’ and building owners’ concerns about design, offering an efficient, visually appealing solution for building-integrated photovoltaics while surpassing other technologies currently available.Close up of a morpho butterfly wingSustainable Flight – The world’s fastest supercomputer, Frontier, located at Oak Ridge National Laboratory, enables unprecedented advancements in sustainable aviation technology. Capable of over a quintillion calculations per second, Frontier allows GE Aerospace to conduct full-scale simulations of its revolutionary Open Fan engine design, accelerating insights into aerodynamics and turbulence. This groundbreaking tool aids the CFM RISE program, which aims to cut fuel consumption and CO2 emissions by at least 20%. Frontier’s detailed simulations predict engine performance under real-world conditions, saving years of testing. The partnership between GE Aerospace and Oak Ridge is expanding, promising future collaborations in climate modeling and advanced simulation techniques.An Open Fan engine design developed as part of a new project led by GE AerospaceSource: https://www.geaerospace.com/news/articles/new-frontier-how-ge-aerospace-using-worlds-fastest-supercomputer-help-design-open-fanMargaret Kindling is Senior Program Manager at the SEMI Foundation. She promotes inclusive workplaces via initiatives like Women in Semiconductors, Semiconductor PRIDE and workforce development programming at SEMICON West and SEMIEXPO Heartland.

Even before the invention of the first semiconductor, women have been making significant contributions to technology. As of July 2024, 27.6% of the tech workforce identified as female. During the last 5 years, the percentage of women represented in tech increased by less than 3%. A bright spot is the semiconductor industry, where women comprise nearly 29% of the workforce. However, there’s still a long way to go until we see greater gender equity. Although women aren’t always highly visible in their roles, their achievements are significant. The slide show featured at the Women in Semiconductors (WiS) reception during SEMI’s Industry Strategy Symposium (ISS) 2025 earlier this month highlighted only a small number of the many women who have made a positive and lasting impact on technology. From Ada Lovelace, founder of scientific computing, to Lisa Su, AMD CEO who was named Time’s CEO of 2024, women have long been technology trailblazers and role models to inspire future female leaders.At this year’s WiS reception, attendees joined in a celebration of industry pioneers, both past and present. “When women come together, amazing things happen," said Shari Liss, SEMI Vice President of Global Workforce Development Initiatives. “The event was all about connection, mentorship, allyship, and lifting each other up. In a world that can feel heavy, it was a reminder of the strength we have when we support one another and work together to shape the future of our industry,” said Liss. WiS continues to be an important part of SEMI Foundation workforce development programming.Shari Liss, SEMI Vice President of Global Workforce Development and Initiatives at ISS 2025In her welcoming remarks, Debbie Gustafson, CEO of Energetiq Technology, Inc., a Hamamatsu Company and a member of the SEMI Foundation Board of Trustees, asked how many people in the audience feel that they can make a difference, and only half raised their hands. She shared a story of how she has made a difference by making her company realize the important role women play in bringing innovative solutions to today’s most pressing challenges. “Everyone can help improve the number of women in your companies by creating an effective place for women to have a personal life and also have a career!” Debbie Gustafson, CEO, Energetiq Technologies at ISS 2025This is the second year Energetiq has sponsored the WiS reception at ISS. “It’s a way to show my support for SEMI events and encourage men to attend as allies to women,” said Gustafson, as images of industry luminaries were projected on the screen behind her. She recalled her first ISS and how few women were in attendance. The gender gap has declined over the years, but the number of women, including speakers, at ISS and other SEMI programs remain low. “I hope that every one of the women and allies will volunteer and raise their voices,” urged Gustafson.Gustafson asked for additional comments from the audience, and SEMI President and CEO Ajit Manocha immediately volunteered to add his voice in support. “Our industry must do a better job of recruiting and retaining women – and most importantly – providing leadership opportunities,” said Manocha. “The benefits of diversity and female leadership to business operations and the bottom line are well documented. Women are crucial to narrowing the talent gap, and ultimately, to our industry’s future.”Celebrating Women in Semiconductors at ISS 2025Creating true inclusion and equity in the workplace is critical to everyone’s success. Since its inception almost a decade ago, Women in Semiconductors has highlighted women’s contributions and leadership in the semiconductor industry and recognizing the need to bridge the workplace gender gap. Our upcoming May 2025 program, which will be held in conjunction with ASMC, will highlight authentic stories to inspire and provide actionable insights. The agenda will include skills development which incorporates decision-making, strategic thinking, negotiation, as well as networking opportunities to connect aspiring leaders with experienced mentors who can provide guidance.In 2025, we’re excited to expand the WiS initiative to programs in Arizona, Michigan and Ohio with funding from the W.K. Kellogg Foundation and David and Lucile Packard Foundation. An important piece of this work is SEMI Foundation’s Chips Childcare program. Through Chips Childcare, SEMI Foundation partners with Policy Equity Group and other organizations across the country to support companies in designing stronger childcare plans and systems. Affordable, accessible, and quality childcare is a critical element of successful workforce development and paramount to not just helping families thrive, but ensuring that communities, cities, and the country can meet economic goals. Part of this program is providing industry awareness and outreach to women and parents who rely on childcare to work, and expanding Women in Semiconductors to new regions will support Chips Childcare goals. Learn more about the Chips Childcare program in SEMI’s blog: Affordable, Accessible, and Quality Childcare: A Critical Workforce Development Strategy for the Semiconductor Industry.”Companies that embrace inclusion, leveraging the strengths of all workers – including women – create dynamic and innovative work environments. We encourage everyone in the industry to focus on steps they can make, collectively or individually and regardless of position, to drive meaningful progress to advance women and a thriving semiconductor industry.The next WiS event will transition beyond discussions to providing practical strategies that can help women secure internal job opportunities and build skills needed for career advancement, and how can we empower changes that lead to meaningful improvements that drive lasting impact for everyone. Learn more about empowering change at Women in Semiconductors on May 8, 2025. For details, visit https://www.semi.org/en/connect/events/women-in-semiconductors-wisMargaret Kindling is Senior Program Manager at the SEMI Foundation. She promotes inclusive workplaces via initiatives like WiS, Semiconductor PRIDE and workforce development programming at SEMICON West and SEMIEXPO Heartland.

The SEMI Career Apprenticeship Network (SCAN) is SEMI Foundation's flagship initiative that supports customized training programs for microelectronics employers and semiconductor career awareness activities to students throughout the country. SCAN Michigan, launched in partnership with the Michigan Economic Development Corporation in 2022, is a powerful collaboration born out of Michigan’s commitment to invest in a talent pipeline to fill current and future roles within the chip industry. The SCAN Michigan team has developed a broad range of partnerships with employers, higher education institutions, community-based organizations, and PK-16 schools and has participated in over 30 unique outreach and education events in Michigan since launching “Chips in Michigan,” a career awareness campaign, in the Fall of 2023. These events have created strong connections between students, prospective employees, academia, and industry, and are excellent examples of the potential for SCAN to make a strong impact in building the next-generation workforce. Highlighted below are initiatives, events, and educator trainings from SCAN Michigan 2024 which can be replicated in other regions. SEMICONDUCTOR DAYOn October 22 and 29, 2024, SCAN Michigan welcomed nearly 350 students to its first Semiconductor Day events in Michigan held at Oakland University and Wayne State University. Eleven Michigan companies participated in Semiconductor Day events including Altair Engineering, Design Systems, Ford Motor Company, General Motors, Hemlock Semiconductor, Infineon, KLA, k-Space, and SK Siltron CSS. Students and community members learned how to prepare for careers in the semiconductor industry. Semiconductor Day showcased the advancements and career opportunities within the semiconductor and mobility sectors and highlighted the importance of collaboration between industry leaders, academic institutions, and emerging talent.View this video summarizing Semiconductor Day Events in Michigan. “The Semiconductor Day program was an exceptional opportunity for students and stakeholders to gain insights into the industry directly from professionals. This event was more than just a career fair; it was a comprehensive experience. Many individuals I spoke with expressed that they learned a great deal and showed increased interest in the field.”–Jenny Geno, Ed.S., Workforce Development Specialist at Hemlock Semiconductor SEMI Foundation staff members Rick Vanittersum, Bia Hamed, Ph.D., and Jeana Harper-Kirkland, along with graduate assistant Kaityn Tracy, enjoyed a day of networking at Semiconductor Day.Participants at Wayne State University’s “Day in the Life” session listened to industry experts describe their day-to-day activities.SEMICONDUCTOR DAY JR.On October 22, SCAN Michigan hosted Semiconductor Day Jr. for 76 high school students from Oakland County in partnership with Oakland University's School of Engineering and GEAR UP program. Students in attendance were from three underserved high schools: Pontiac High School, Oak Park High School, and International Technology Academy.During this program, faculty members Amanpreet Kaur, Ph.D. and Hongwei Qu, Ph.D. (along with their graduate students) presented hands-on programming around semiconductors and demonstrated the high-tech equipment used in the on-campus cleanroom. Check out the video from the event.High school students worked on a STEM project involving breadboards.iDRAW DAYOn November 1, the SEMI Foundation Michigan Team hosted 100 Detroit high school students at the University of Detroit Mercy’s Campus. The students came from three inner city high schools: Martin Luther King Jr. Senior High School, Mumford High School, and Cesar Chavez Academy. Students learned about what a semiconductor is and how it is used in products that impact our daily lives. They learned about the need for skilled workers at every level of manufacturing to produce semiconductors. The students were also taught the basics of coding by using the SEMI Foundation’s High Tech U micro:bit STEM kits, and each student took a micro:bit and a flash drive with micro:bit resources home to further their learning.SEMI Foundation Program Navigator, Jeana Harper-Kirkland, helps participants try their hand at coding using the SEMI Foundation-sponsored micro:bit STEM kits.Washtenaw Community College - From Classroom to CleanroomIn June of 2024, 15 Ypsilanti area middle school teachers spent a week learning about the semiconductor industry so they could share their insights with students in their classrooms. Math and science teachers gained foundational knowledge and participated in four days of hands-on learning with SEMI Foundation-sponsored STEM kits which they deployed in classrooms in the Fall. The training was hosted in partnership with Washtenaw Community College and was funded by the Michigan Economic Development Corporation. On the final day, teachers were taken on tours of the University of Michigan’s Lurie Nanofabrication Facility and semiconductor partner KLA’s second North American world headquarters, both in Ann Arbor, Michigan. The teachers who attended this program will share this training and career awareness with more than 1,800 students in the region.Watch this video to learn more about the teacher trainings: “The SEMI Foundation’s expertise, passion for advancing the semiconductor industry, and enthusiasm for sharing that knowledge were invaluable. With hundreds of students set to benefit from the program, the impact is profound. We deeply value SEMI Foundation’s creativity, enthusiasm, industry knowledge, and shared commitment to inspiring the next generation, and we look forward to future collaborations.”–Alison Petersen, Director of Mobility Initiatives at Washtenaw Community College An industry panel at the WCC event featuring Mahmoud Al-Nasour, Automotive Tech Advisor, Cre8vantage; Shari Liss, Vice President, Global Workforce Development and Initiatives, SEMI; John McLaughlin, Site Lead, KLA; and Mike Bertan, Senior Manager, Operations MACOMTeachers enjoying a tour of KLA’s second world headquarters in Ann Arbor, Michigan. They are joined by Cheryl Gee, Vice President Global Talent Acquisition for KLA.DIGITAL DIVAS DIGITAL DUDESDigital Divas and Digital Dudes at Eastern Michigan University are long-standing programs promoting STEM to middle and high school students in Southeast Michigan. These programs allow students to explore STEM at college campuses and to learn from women and men in STEM careers. The program was created to give underserved students an engaging, hands-on opportunity to hear about and experience various STEM majors. While the students engaged in STEM learning, the SEMI Foundation team conducted a teacher training program for the instructors. The programs depict a near-peer mentoring model by having college students lead the program as speakers. Check out the Digital Divas and Dudes video. “Digital Divas” and a “Digital Dude” learn about electricity and circuits with Circuit Scribe kits provided by the SEMI Foundation.During the trivia lunchtime game session at Digital Dudes, participants were able to test their knowledge of what they learned about the semiconductor industry.We had a strong 2024 and look forward to more collaboration with our partners in the semiconductor ecosystem. These events, trainings, and partner collaborations are scalable nationwide, and we will continue to work with our valued partners to create more avenues for integrating the semiconductor industry into the great state of Michigan. The SEMI Foundation is committed to connecting students and workers to careers that promote a wonderful quality of life for all Michiganders. We extend our heartfelt thanks to the Michigan Economic Development Corporation and all our partners who help make this work possible.SCAN MICHIGAN 2024 BY THE NUMBERS:24,375 – Students reached through in-person STEM and career exploration events469,182 – Individuals reached through media campaigns and other events585 – Current employer ecosystem contacts receiving regular updates on SCAN70 – Educators in Michigan engaged with SEMI Foundation programming13 – Michigan employers participating in at least one SEMI Foundation event or initiative in 2024If your company or organization is interested in participating in industry awareness activities in Michigan or in other locations around the world, or if you’d like information on SCAN’s customized training programs, find out more at semiscan.org or reach out to us at [email protected] year, SEMI will be hosting its inaugural SEMIEXPO Heartland event on April 1-2, 2025 in Indianapolis, Indiana. Whether you’re a student, active military, veteran, re-entering the workforce, or looking to change jobs, each day in the WFD pavilion illuminates a different pathway to success. SEMI members from across the microelectronics industry, including HR professionals and talent recruiters, can connect with job seekers and future talent during Day in the Life, Ask an Expert/Flash Mentoring and Resume Review sessions. We hope you join us for this event to learn more about the semiconductor expansion and opportunities for growth in the U.S. Midwest: https://semiexpo.semi.org/Bia Hamed, Ph.D., is Program Manager for Global Education Initiatives at the SEMI Foundation, focusing on educational programming that supports workforce pipeline building nationally and internationally. Jeana Harper-Kirkland is the SCAN Michigan Program Navigator at the SEMI Foundation, focusing on K-16 educator resource management and Educational Research and Dissemination.Rick Vanittersum is the Program Manager SCAN Michigan at the SEMI Foundation, focusing on developing apprenticeships and similar earn-and-learn training programs and connecting companies with tools to grow their workforce.

Electronic Design Automation (EDA) is essential for the entire semiconductor design-to-manufacturing process. EDA tools streamline the design process, speed up development cycles, and ensure higher precision in chip design. Accellera Systems Initiative, an independent standards body, focuses on standards for system-level design, modeling and verification used extensively in the EDA ecosystem. These standards facilitate industry-wide collaboration and accelerate innovation, working closely with many members of the Electronic System Design (ESD) Alliance.Bob Smith, Executive Director of the ESD Alliance, recently talked with Lu Dai, Senior Director of Technical Standards at Qualcomm and Chair of Accellera Systems Initiative about Accellera’s new and future standards, and its successful global Design Verification Conference (DVCon) events.Smith: What’s new in Accellera’s standards effort since we last spoke?Dai: We are working on two new initiatives. The first and biggest initiative is our recently formed Federated Simulation User Group. Our members requested an end-to-end simulation environment or models that can be plugged into a system-level simulation environment. This challenge triggered industry-wide discussions among Qualcomm, NXP and many other semiconductor companies, especially those from Europe tied to auto and avionics industries.The need for this new standard effort is being driven by industries such as automotive where tiny microcontroller chips are traditionally used. The automotive industry has some existing simulation standards that include physical devices. With autonomous vehicles, systems on chips (SoCs) are replacing microcontrollers and handling system-level features that require rigorous system-level simulation. The user group is tasked with reviewing current automotive industry simulators and discovering how our traditional register transfer level (RTL) code- or emulation-based simulations could work with them via an interface.This effort has attracted new companies outside of the traditional EDA world. Ford, for example, is now an Accellera member and has a seat on our board. It’s exciting to see this collaboration.Functional safety is another initiative that we started a few years ago, also driven by the advancements in autonomous vehicles. Accellera’s focus is to define functional safety as a format that can be carried through the design stages from intellectual property (IP) to SoC, and from front-end design to back-end. Across the different stages of design and verification, an engineer can then confirm that the functional safety goal is maintained. We’ve published resources including whitepapers and are currently working on developing the language format. Smith: Where do you see Accellera’s next standards efforts?Dai: We have a mixed-signal standard coming out soon. It adds a mixed-signal interface to the SystemVerilog standard, currently under IEEE management because Accellera donated it to IEEE.A common question we’re asked is, “What are you doing with AI?” Accellera is a heavily EDA-centric standards body, and EDA tools are increasingly incorporating AI. AI consumes and outputs large amounts of data. A challenge is how to ensure the AI work output from one vendor’s EDA tool can propagate to another EDA tool. Accellera may look at defining an AI data format for EDA. It comes with a unique challenge because AI data is highly proprietary, both from the vendor’s and customer’s perspectives, so a robust security solution is needed. We may need to consider an interface standard, because companies may not be willing to share data, even with other groups that are in the same company. among their partners. They might need to hide the data and have a special interface to extract the data that they are willing to share. Accellera could investigate how to make AI deployment cross-vendor while allowing vendors and customers to protect their IP. Another area for potential new standards is around supply chain security challenges. This is a global issue driven in part by the COVID experience and geopolitical concerns. One possible approach is to use tagging. When a chip comes out of the fab, it would have a tag designating where it was designed and manufactured, and where the tooling is from. The tag would also include data about the regions or countries the design traveled through during the entire flow from design to manufacturing. Smith: Is Accellera looking into any standards or addressing any open-source design and verification flows?Lu: Accellera has been in the open-source domain for quite some time. Accellera has a language reference manual, user guides and reference implementations. Because many Accellera standards are related to language, we often work on libraries when a new language comes out and reference implementations to help our community deploy that standard. Reference implementation libraries are open source, as is our SystemC material. We have an active open-source SystemC community.Smith: I hear that the DVCon conferences are expanding globally. What’s driving that?Dai: Engineers enjoy attending conferences in person where they can reconnect with peers, build new connections and foster collaboration. We have regional DVCon events to bring information to our community and make Accellera more accessible to them. We now host several DVCon conferences in North America, Europe and Asia. Our next DVCon will be held in San Jose, Calif., from Feb. 24-27.Smith: How can readers of this blog post get more information about Accellera?Dai: For up-to-date information about Accellera’s activities, please visit our website: https://accellera.org/. Lu Dai is Senior Director of Technical Standards at Qualcomm and is a leader in semiconductor standards and industry organizations including Accellera. Dai holds a Master of Science degree in Electrical Engineering from Cornell, and a Bachelor of Science degree in Electrical Engineering and Computer Science from UC Berkeley.Robert (Bob) Smith is executive director of the ESD Alliance, a SEMI Technology Community.

The Rising Stars: 20 Under 30 blog series celebrates the brightest young leaders shaping the future of the semiconductor industry. These exceptional individuals have earned the SEMI Europe 20 Under 30 Award for making a remarkable impact across the supply chain—whether in engineering, sales, marketing, or R D. The series spotlights these rising stars for their career achievements, commitment to innovation, leadership skills, and dedication to driving both business success and community growth.Follow their inspiring journeys and discover how they are thriving and paving the way for future generations in the semiconductor world.Introducing Raphael Hardegger: Product Manager Advanced Products at VATRaphael Hardegger is a Product Manager at VAT, where he leads the development of innovative atomic layer deposition (ALD) valve technology. Starting his career in 2009 as a design engineer apprentice at VAT, Raphael has since gained diverse experience, including entrepreneurial ventures and a role in MedTech. Today, he focuses on shaping product strategy, aligning solutions with customer needs, and driving impactful advancements in the semiconductor industry.SEMI: What inspired you to join the semiconductor industry? Hardegger: I joined the semiconductor industry, and VAT in particular, at the young age of 15. Back then, I started as a design engineer in VAT’s apprenticeship program. Growing up in the beautiful VAT region, my entry into the industry was somewhat by chance – but I’m incredibly glad it happened! After gaining foundational knowledge at VAT, I pursued studies in mechanical engineering, worked in various other roles and companies, and then completed a master’s in business innovation. About 3.5 years ago, the semiconductor industry pulled me back in, and I haven’t looked back since. What keeps me excited about VAT and the industry as a whole is its sheer complexity. Every day, we have the opportunity to innovate with small components that have a significant impact on a huge industry. It’s such a multifaceted field that I’m confident I’ll continue learning something new every day for the rest of my career.SEMI: How did your early experiences and education shape your career path?Hardegger: In Switzerland, the apprenticeship model uses a results-oriented work style from an early age. The lessons I learned during my four years as an apprentice at VAT continue to influence my daily work life. The mechanical foundation I built during that time remains a tremendous asset in my career. When combined with my studies in systems engineering and business innovation, this foundation has allowed me to make a meaningful impact both at VAT and within the broader industry.SEMI: Can you share a professional accomplishment you’re most proud of, and explain why it’s significant to you? Raphael Hardegger in the VAT office of San Jose, California, USA, holding the new product he worked on.Hardegger: When I rejoined VAT as a product manager, I was given the opportunity to manage a new product that wasn’t even on the market yet. This product was a key part of VAT’s strategy to outpace market growth by expanding into new product segments beyond our core offerings. I had the privilege of collaborating with some of VAT’s most talented engineers, who developed an incredible product. Together, we learned a great deal through our initial interactions with customers, refining the product to meet stringent requirements. This year, we successfully qualified the product for use in the industry’s most challenging semiconductor processes. It’s a testament to how dedication, customer-focused engineering and exceptional teamwork can make a significant impact. What makes me proud is not just working on innovative concepts, but creating products that truly excite our customers and contribute to meaningful growth for VAT.SEMI: As a young professional in the industry, what is your greatest challenge? Hardegger: I turned 30 this year, so I suspect I was one of the oldest 20 under 30 winners last year. One challenge I’ve faced — not only in this industry, but across others — is impatience. As a young professional with high aspirations, it’s easy to feel that things aren’t moving fast enough. We often expect early promotions, annual salary increases, and quick recognition for our efforts. What changed my perception on this was a conversation with a senior manager at VAT shortly after I joined. I asked him what steps I should take to move closer to my next career goal, such as earning a management position. His response was simple and direct: Focus on making an impact in your current role. Build a strong track record and demonstrate your skills. Everything else will follow. I took his advice, and I'm glad I did. No, I didn't get promoted immediately, but I learned the value of patience, doing my best every day, and finding satisfaction in the process.Career progression isn’t just about motivation and talent — it’s also about timing and aligning with the business needs. Being impatient or pushing for premature career moves can often backfire, leaving you in a worse position than before. By focusing on making a genuine impact and building a solid track record, you create a strong foundation for a fulfilling and sustainable career.SEMI: What advice would you give to younger generations aspiring to make an impact in this industry?Hardegger: You're in a great place — right where you need to be. Be curious and explore as much of the semiconductor industry as you can. During my training as a design engineer, I wasn't deeply involved in understanding the customer applications our valves were serving. My focus was primarily on developing vacuum valves based on product management requirements and manufacturing needs. Since I returned, I've learned the importance of understanding what our customers truly need and translating those needs into product requirements.This shift has not only helped me and the team create better products, but also made the work much more enjoyable! While I'd still like to deepen my understanding of customers' processes, it's already fascinating to learn more about their goals and see how our products can make a real difference. If I could go back to my apprenticeship or just starting this industry, my advice to myself — and to anyone starting out — would be to stay as curious as possible. Take every opportunity to learn what customers are trying to achieve with the products you help create. That curiosity will guide you to make a meaningful impact.SEMI: How do you envision future work environments? Hardegger: To me, having a clear customer focus in every aspect of a company's efforts is essential. At the end of the day, someone needs to want to buy our products for us to remain profitable and continue to grow. That’s why maintaining a customer-centric approach in all aspects of product development and management is critical. At the same time, the people who work in such companies need to be happy and fulfilled to create great products. I appreciate the recent trends we’re seeing to improve the corporate culture, such as embracing hybrid working models. These approaches provide a healthy balance between in-office collaboration and focused work from home, helping employees maintain productivity and well-being.SEMI: What impact has the 20 Under 30 Award had on your career? Hardegger: While I deeply appreciate the recognition that comes with such awards, I believe my career should ultimately be defined by the impact I make in my field. That said, I do hope the award inspires other young professionals to explore this exciting industry and build meaningful careers here! Following 20 Under 30 JourneysRaphael Hardegger’s journey in the semiconductor industry is a testament to the power of curiosity, dedication, and a customer-centric approach. From his early days as a design engineer apprentice to his current leadership in product innovation, Raphael continues to drive meaningful change at VAT Group. His story inspires young professionals to embrace continuous learning, focus on making a real impact, and contribute to the growth and success of the semiconductor industry.The Rising Stars: 20 Under 30 blog series celebrates the exceptional talent and leadership driving the future of the semiconductor industry. Each of the young innovators honored is excelling in their respective fields while shaping the landscape of technology and business with their visionary approaches and dedication. Their stories exemplify the remarkable achievements and unwavering commitment that define the next generation of industry leaders. The series is intended to inspire and motivate future professionals to pursue their passions and embrace the opportunities within this dynamic industry. Stay tuned for more stories of rising stars who are paving the way for continued growth and innovation in the semiconductor world.Learn more about the SEMI Europe 20 Under 30 Award and the recipients honored at SEMICON Europa. SEMI ContactMaria Daniela Perez, Communications ManagerEmail: [email protected]

In 1992, speaking in front of several fabless CEOs, AMD’s CEO, Jerry Sanders, notoriously remarked: “Now hear me and hear me well; real men have fabs!” However, by 2008, AMD had divested its manufacturing assets, becoming one of hundreds of semiconductor design firms embracing a new reality – the growing bifurcation of chip design and manufacturing.Today, this bifurcation continues to intensify. Global market intelligence firm IDC estimates that fabless revenue as a percentage of the semiconductor market is expected to reach a high of 62% in 2028, up from 30% in 2019. While foundry champions like TSMC represent a large part of this, they’re only one answer to the urgent question asked by governments and car companies alike. How do we secure chip capacity? Shocks like the COVID-19 pandemic and Russia’s invasion of Ukraine have refocused attention on the critical process of making semiconductors, forcing companies to consider how they can secure semiconductor capacity short of owning and operating a fab.Source: IDC, SEMICON West, July 2024Since Jerry Sanders’ proclamation, the risks of going fabless have drastically decreased, but they have not been eliminated entirely. Here are three models companies can implement to become less dependent on single sourcing and regain control over their supply chain at a lower cost.Option 1 – Develop a Captive Capacity CorridorMany companies have been choosing a captive capacity model to better balance risks and avoid being put on allocation. In this model, companies seek guaranteed manufacturing capacity through ownership of only part of the manufacturing process while defraying other costs to fab operators.For most companies, the supply chain risk of surrendering control over manufacturing is more than mitigated by eliminating the expense of the physical infrastructure required to make modern-day chips. According to a report from Boston Consulting Group (BCG), a brand-new greenfield fab in 2026 could carry a 10-year total cost of ownership (TCO) between $35 and $43 billion, which is 33% to 66% higher than in 2023. It’s no wonder that several companies opt to have someone else make chips for them. Source: Construction Physics, How to Build a $20 Billion Semiconductor Fab, May 3, 2024Captive capacity corridors can take many forms. For example, some companies are willing to make capital commitments for tooling early during an engagement, with the expectation of later receiving discounted wafers. This guarantees their ownership over part of the chip manufacturing process without worrying about owning the physical fab infrastructure or hiring fab operators.Such an arrangement can also be equally beneficial for foundries and integrated device manufacturers (IDMs). Companies often take full ownership of these tools over the long term, enabling them to service new customers.Option 2 – Establish a Joint-Venture Investment PartnershipInvesting in a new fab can be daunting even for major IDMs, leading to an increase in synergistic co-investment. In August 2023, TSMC announced a partnership with European IDMs, Bosch, Infineon, and NXP, to jointly construct a 300mm fab in Dresden, Germany that’s expected to cost upwards of €10 billion. In this arrangement, TSMC retains 70% ownership, and each other company has a 10% stake. A little more than a year later, NXP doubled down on its joint-venture playbook, announcing a $7.8 billion joint-venture with a different Taiwanese foundry, Vanguard International Semiconductor (VIS), to build a 300mm fab in Singapore. Partnering with proven foundries relieves potential concerns about efficacy, giving companies greater certainty that their investment will be maximized. Foundries also benefit by subsidizing construction and tooling costs for additional capacity while securing dedicated customers at the same time. Companies may also seek a capital injection without the complexity of having to share fab space with other manufacturers. Intel has been the focal point of this strategy over the last couple of years with two major announcements. First, the company signed an agreement with Brookfield Asset Management in August 2022, providing Intel with a new and expanded pool of capital for manufacturing build-outs. Under the agreement, the companies will jointly invest up to $30 billion in Intel’s manufacturing expansion at its Chandler, Arizona campus, with Intel funding 51% and Brookfield funding 49% of the total project cost. Intel will retain majority ownership and operating control of the two new leading-edge chip factories in Chandler, which will support long-term demand for Intel’s products and provide capacity for Intel Foundry Services (IFS) customers. Intel did this again recently, announcing a joint venture for Fab 34, a 300mm facility based in Leixlip, Ireland. Intel has agreed to sell a 49% stake to investment firm, Apollo Global Management, for $11 billion. Under this agreement, Intel will retain full ownership and operational control of the assets.Option 3 – Lease Third-Party Fab SpacePerhaps the least flashy option is to simply lease space at underutilized fabs. However, this path will often depend on market conditions that dictate available capacity. On the supply side, this is an appealing option for foundries and IDMs that suffer from underutilization. On the demand side, it can be a way to secure short-term capacity without the burden of long-term commitments.As part of the sale of its 200mm Dortmund wafer fab to Littelfuse, Elmos agreed to enter into a multi-year capacity-sharing arrangement, with Elmos buying defined volumes of wafers produced at the fab. Under this agreement, Elmos retains ownership of the fab while Littelfuse leases a portion of the manufacturing facility to fulfill the terms of the supply agreement. This arrangement allows Littelfuse to control its manufacturing space while Elmos maintains a presence at its headquarters.Another example occurred recently when Skorpios Technologies moved to a former Infineon 150mm fab in Temecula, California. The new facility provides Skorpios with a more modern cleanroom and space for future growth, and the company entered a 15-year lease with two 10-year options for the facility. Securing capacity is not a new problem for chip companies, but it has become more complicated as semiconductor manufacturing costs have skyrocketed. TSMC, with more than 60% of global foundry revenues, has propelled the chip industry forward and expanded capacity, enabling many companies to become fabless in the process. Despite its ubiquity, TSMC is not the full story. Plenty of companies, both fabless and IDMs, need to solve the problem of dedicated capacity in a landscape of escalated costs. Captive capacity corridors, joint ventures, and even traditional lease structures all signal that the future of securing chip capacity will likely be influenced by the creativity of corporate development and finance teams. 2025 is going to be an interesting year. I am excited to see what’s next!About Stephen M. RothrockStephen Rothrock founded ATREG in 2000 to help global advanced technology companies divest and acquire infrastructure-rich manufacturing assets, including wafer fabs (front-and back-end) as well as MEMS, solar, display, and R D facilities. Over the last 25 years, his firm has completed 40% of all global operational wafer fab sales in the semiconductor industry, totaling 60 transactions. Recent global acquisitions and dispositions have involved onsemi, Allegro Microsystems, Fujitsu, GLOBALFOUNDRIES, IBM, Infineon, Matsushita (Panasonic), Maxim, Micron, NXP, Sony, Qualcomm, Renesas, Texas Instruments, VIS, and more. Before founding ATREG, Stephen established Colliers International’s Global Corporate Services initiative and headed the company’s U.S. division based in Seattle. Before that, he worked as Director for Savills International commercial real estate brokerage in London, establishing their global corporate services platform that serves large multinationals and many leading technology companies. Stephen also served on the UK-listed property company’s international board and spent four years near Paris working for an international NGO. Stephen holds a master’s degree in political theology from the University of Hull, U.K., and a bachelor’s degree in business commerce from the University of Washington in Seattle.

The sensor revolution is shaping the future of connectivity, with innovation in MEMS and imaging technologies paving the way for a smarter and more integrated world.As the world becomes increasingly interconnected, MEMS and imaging sensor technologies are driving transformative changes across industries, shaping the future of connectivity, intelligence, and sustainability. Powered by advances in miniaturization, AI integration, and sustainable design, MEMS and imaging technologies are enabling groundbreaking applications—from autonomous vehicles to wearable health devices—while addressing urgent global challenges like climate change and energy efficiency. At the MEMS Imaging Sensors Summit 2024, Laith Altimime, President of SEMI Europe, emphasized the pivotal role of MEMS and imaging technologies. Setting the stage for discussions on technological breakthroughs and market trends, Altimime remarked, “Sensors are at the heart of the next wave of innovation, enabling unprecedented levels of intelligence that are transforming industries and fostering a smarter, more sustainable, and seamlessly connected future.”Laith Altimime, President, SEMI EuropeStefan Finkbeiner, CEO of Bosch Sensortec, underscored in his opening keynote how advanced sensor technologies are enabling life-changing use cases. “Sensors are all around us, though we don’t always notice them,” emphasizing sensors’ ubiquitous role in smartphones, wearables, and hearables. Finkbeiner highlighted miniaturization as a key challenge, noting that even as sensors continue to shrink, they are increasingly integrated with edge AI to enable efficient, local decision-making.Stefan Finkbeiner, CEO, Bosch SensortecSimone Ferri, APMS Group Vice-President and MEMS Sub-Group General Manager at STMicroelectronics, highlighted the pivotal role of sensors as a bridge between the physical and digital world, noting “the most sophisticated machine is the human – so it is best to emulate human capabilities to enable the next generation of devices to accurately measure the parameters of your body.” Ferri stressed the importance of sustainability, advocating for smart, transformative, and precise sensors that provide meaningful data with optimal efficiency. By aligning technological innovation with environmental responsibility, Simone Ferri demonstrated how sensorization can enhance lives while enabling a net-zero transition across industries.Simone Ferri, APMS Group Vice-President and MEMS Sub-Group General Manager, STMicroelectronicsMEMS Growth Fueled by Piezo Materials and ElectrificationJean-Christophe Eloy, CEO and President of Yole Group, grounded the discussion in market data, forecasting a 5% CAGR for the MEMS market, which is set to exceed $20 billion by 2029. He highlighted key trends such as the increasing sophistication of automotive sensors—more cameras, higher resolution—and the impact of electrification. On the technology front, Eloy noted a “strong shift towards piezoelectric (piezo) MEMS,” driven by advancement in new materials like Lead Zirconate Titanate (PZT), Aluminum Nitride (AIN), and Scandium-doped Aluminum Nitride (ScAIN).Jean-Christophe Eloy, CEO and President, Yole GroupAlissa Fitzgerald, CEO of A.M. Fitzgerald Associates explored the expanding roles of MEMS technology in new domains, such as fiber optics for data centers. “Photonics is in the news,” she remarked, highlighting its potential to deliver 40% power savings compared to copper technologies. “MEMS manufacturing is set to evolve by 2030 and beyond,” said Fitzgerald, emphasizing the continued innovation in traditional wafer-based processes through the adoption of advanced thin-film materials like piezoelectrics and GaN. Furthermore, Fitzgerald discussed emerging manufacturing techniques such as 3D-printed MEMS and biodegradable materials to enable low-cost, sustainable sensors.Alissa Fitzgerald, CEO of A.M. Fitzgerald AssociatesAdding to the conversation on manufacturing, Jessica Gomez, CEO of Rogue Valley Microdevices, shared her perspective on how 300mm-capable MEMS foundries could “change the game,” improving production efficiency and lowering costs. Gomez also outlined the unique challenges of MEMS manufacturing, including the need for custom processes and the high-mix, low-volume nature of production.Advancing Smart Mobility Through Interoperable NetworksSmart mobility gained significant traction as Patrice Ancel, In-Vehicle Technologies Leader at BMW, tackled the intricacies of in-vehicle networking. Ancel shed light on the complexities of today’s vehicles, which contain 20,000 components and over 100 electronic control units (ECUs) from multiple suppliers. His message was clear: “Interoperability is key for us; without interoperability, none of this will happen.” Ancel’s call for collaboration resonated throughout the summit, highlighting the critical role of teamwork in driving innovation and progress within the automotive industry.Patrice Ancel, In-Vehicle Technologies Leader, BMWA Vision for the Future: Sustainability, Collaboration, and InnovationThe MEMS Imaging Sensors Summit demonstrated how collaboration, sustainability, and innovation are driving the sensor industry forward. From addressing market trends to tackling manufacturing challenges, the discussions revealed a shared commitment to creating a smarter, more connected world.On behalf of SEMI, the SEMI Europe team would like to thank the industry leaders whose expertise and enthusiasm made this summit a resounding success. SEMI ContactAna Bernardo, Manager of Technology ProgramsEmail: [email protected] Mobile: +49 175 4129 764Sitong He, Communications Manager Email: [email protected]: +49 151 5546 2638