Veterans Day is a perfect time to not only recognize military veterans for their service but also for their ongoing contributions to society. The diverse and skilled population of military veterans, transitioning military personnel, reservists, and military spouses continue to contribute to the growth and innovation in broad range of industries—particularly in high-tech sectors like semiconductors.Since its inception in 2021, the SEMI VetWorks program has been dedicated to bridging the gap between military service and civilian careers by focusing on the recruitment, training, and retention of veterans in the semiconductor industry. By collaborating with military installations, veteran service organizations, and government agencies, the program helps veterans transition into meaningful careers within the semiconductor field, an industry that has driven technology innovation and transformed our lives at home, at work and on the go.I had the privilege of speaking with several veterans at different stages of their transition out of the military and into the semiconductor industry. These conversations highlighted the unique skills veterans bring to the table, their enthusiasm for the industry, and the opportunities that await them. The following are insights from three incredible veterans who have either recently transitioned into the industry or are in the process of doing so:LTC Joshua S. Ginn, U.S. Army Logistics Officer, is currently preparing for retirement after 24 years of service in the U.S. Army as the Soldier for Life Midwest and South Director. In seeking his next role, his military background in logistics, as well as his multifaceted experience in operations, supply, maintenance, and HR, has given him a solid foundation for his civilian career.Gomez: What attracted you to the semiconductor industry?Ginn: “I view the semiconductor industry as essential to the future of technology and the U.S. economy. The demand for semiconductors is on a growth trajectory as electronics become more ingrained in every facet of life. The industry is at a pivotal point, and it’s an exciting opportunity to contribute to something that will have long-lasting impact.”Ginn emphasizes that the semiconductor industry offers vast potential for veterans. He urges fellow veterans to take advantage of the current industry growth phase, describing it as a “foundational moment” for those looking to make a meaningful impact in the technology sector.Gomez: Can you provide advice for veterans looking for their next career?Ginn: “Get involved now, while the industry is expanding. There are opportunities at every stage of design and production. This is the time to make your mark, and the skills you’ve developed in the military are highly transferable to the semiconductor industry.”Ginn also shared his experience attending SEMICON West, where he spoke with over 100 companies eager to hire veterans, which reaffirmed his belief that this is an industry ripe with opportunity.Robert Sobeski, a U.S. Army veteran with seven years of service as an Infantry Officer, is currently participating in a DOD SkillBridge internship at Taiwan Semiconductor Manufacturing Company (TSMC) as a process integration engineer. In his role, he works with a team of engineers to drive process improvements and meet performance, reliability, yield, and cost goals for semiconductor products.Gomez: Why did you choose the semiconductor industry after leaving the military?Sobeski: “The semiconductor industry is fast-paced, complex, and full of learning opportunities. I was drawn to it because it’s a foundation for almost every other technology. There’s so much potential for growth, both for the industry itself and for my personal development.”Gomez: What advice do you have for companies looking to attract veterans?Sobeski: “I think companies can do a lot more to showcase their veteran-friendly culture. They can create dedicated website content for the veteran community to learn about the company, culture and opportunities to make a difference. They can attend career events at military installations to engage with transitioning service members. They should also think about leveraging the G.I. Bill by offering scholarships to veterans pursuing degrees in engineering or related fields—this not only builds a stronger workforce but also helps close the talent gap in this sector.”Sobeski’s experience at TSMC has shown him the immense potential of veterans in the semiconductor industry. He believes that with the right programs and partnerships, companies can tap into an underutilized pool of talent eager to make a difference.Dan Cochran, Semiconductor Workforce Leader and a U.S. Navy veteran who served as an H-46 Aircrewman, transitioned into the semiconductor industry in 2000. Starting as a repair technician at IBM, Cochran quickly rose through the ranks, moving from process operator to process integration engineer at NANTERO, and eventually to a leadership position at NY CREATES. As the Director of VET S.T.E.P., the Veteran’s Semiconductor Training and Experience Program, Cochran now recruits, trains, and mentors veterans and military spouses for careers in semiconductor repair and installation.Gomez: What attracted you to the semiconductor industry?Cochran: “Semiconductors were a great fit for my military experience and training. It provided good pay, work-life balance, and the opportunity to contribute to cutting-edge technologies. Working on processes that go into everything from smartphones to space exploration is a huge motivator for me.”Cochran’s story underscores the value of hands-on, technical skills acquired in the military. His journey demonstrates how veterans can leverage their technical expertise and leadership experience to thrive in the semiconductor sector.Gomez: What advice would you offer to veterans transitioning into civilian careers?Cochran: “Take the time to upskill, but don’t underestimate the experience you already have. The military teaches leadership, discipline, and problem-solving—skills that are incredibly valuable in the tech industry. Plus, there are plenty of programs like DOD SkillBridge and VET S.T.E.P. that can facilitate a smooth transition.”Cochran’s own success story is a testament to the potential for veterans in the semiconductor industry. Through the VET S.T.E.P. program, he’s helping the next generation of veterans follow in his footsteps and build rewarding careers in this high-tech field.A Bright Future for Veterans in the Semiconductor IndustryAs we’ve seen through the stories of these military veterans, the semiconductor industry is not only a vital component of the global economy but also an incredibly welcoming and rewarding field for veterans. The skills, leadership, and work ethic instilled through military service align perfectly with the demands of this high-tech industry.Any veterans reading this article should realize that their skills are not only needed but highly valued. For veterans considering a new career path, the semiconductor industry offers an array of opportunities—from engineering and process improvement to hands-on roles in equipment maintenance and repair. Learn where your military and other skills and interests align in this industry at careers.semi.org.This Veterans Day, let’s honor our military community—thank you for your service and for your continued dedication and contributions to fueling technology innovation! Melinda Gomez is Program Manager for Military Initiatives at the SEMI Foundation.

SEMI Korea Members Day 2025 in September featured a wealth of insights on semiconductor industry market and technology trends. As the two-year semiconductor inventory correction eases, Soo-Kyoum Kim, vice president at International Data Corporation (IDC), provided a market update during his address to the event’s 400 attendees at the Suwon Convention Center. He highlighted that the semiconductor market is showing signs of gradual recovery, with growth predicted for the second half of 2024 and into 2025. This growth, he said, is being fueled by rising demand for artificial intelligence (AI) and high bandwidth memory (HBM). He projected that the total semiconductor market would grow to $779.8 billion in 2025, marking a 15.8% increase from this year's estimate of $673 billion. By next year, the memory market is expected to rise by 24%, largely driven by demand for AI. Although consumer demand will likely weaken due to a slowdown in the Chinese market, Kim shared that easing inventory adjustments will lead to a rebound during the second half of 2024, particularly in the growth of DRAM and NAND. Kim also predicted that the non-memory market, which reached $503.4 billion this year, will grow to $569.4 billion by 2025.Additionally, the compound annual growth rate (CAGR) for semiconductor network and data center sales is projected to be 26.4% and 16.2% by 2028, respectively. Kim explained that the strong demand for AI semiconductors in data centers and networks will help the semiconductor market maintain an 8% CAGR over the next five years, following the 2023 market adjustment.SEMI Korea Members Day HighlightsH.D. ChoThe AI-driven industrial transformation is demanding more advanced processes. To accommodate AI, the industry has shifted its focus away from miniaturization toward back-end processes. However, the challenges facing Korea's semiconductor industry have also intensified. Leading semiconductor research firms shared in-depth market forecasts and presented their latest semiconductor technology roadmaps, offering insights on business strategies for Korea’s semiconductor ecosystem.In his opening remarks, H.D. Cho, president of SEMI Korea, expressed deep gratitude for the exceptional resilience of SEMI Korea’s members, who continue to overcome roadblocks despite global uncertainties. He also highlighted the growth of SEMI Korea’s member companies, emphasizing their positive role in the global semiconductor supply chain, as well as SEMI's ongoing commitment in supporting their innovations.Call for Renewable Energy Policy Reform to Achieve Net ZeroBora Lee, leader of Solutions For Our Climate (SFOC), emphasized the strong correlation between the semiconductor industry and Korea's economic growth. Lee also outlined key factors contributing to the high costs that hinder renewable energy adoption in the semiconductor sector. "Korea's levelized cost of electricity (LCOE) for renewable energy is about 2-3 times higher than the global average," she said. "The establishment of a policy council involving semiconductor companies is a crucial step in developing cooperative strategies to promote the use of renewable energy." In addition, Lee stressed that collaboration among suppliers, consumers, and policymakers is necessary to address these barriers and accelerate the transition to renewable energy within the industry. AI is Reshaping the Global Memory MarketPeter Lee of CITI Group shared that the convergence of cloud and edge computing is helping support new demands from AI, the metaverse, and automotive applications. As a result, this will increase long-term demand for memory. "The growing demand for AI is diversifying the memory market," Lee said. "This includes products such as HBM, LLW, LPDDR5T, and CXL, all of which are expected to see increased adoption according to AI computing requirements."As the need for parallel processing in AI training and inference tasks grows, Lee predicted the demand for HBM3 and DDR5 will significantly rise. HBM's share of total DRAM revenue is expected to increase dramatically – from 11% in 2023, to 30% by 2027. Expected Growth of the GaN Power Semiconductor MarketHo-Young Cha, a professor at Hongik University and co-founder and CTO of ChipsK, highlighted that the GaN power semiconductor market is expected to see continuous growth due to its advantages over silicon-based devices. The expansion of GaN technology applications in various industries, including consumer electronics, automotive, and telecommunications, he said, will drive additional growth."The GaN power semiconductor market will grow from $180 million in 2022 to $2.04 billion by 2028," said Cha. Growth Outlook for the Semiconductor Equipment and Materials Market in 2025 Clark Tseng, director of the SEMI Market Intelligence Team, projected that the short-term outlook for the global semiconductor market will gradually recover due to improvements in end-demand for major electronic product sectors and surging demand for AI chips. "The equipment and materials markets are expected to show a slight improvement in 2024, with a strong recovery anticipated in 2025," Tseng stated. He noted that the equipment market would grow by approximately 3% in 2024 from $95 billion in 2023 and is expected to grow by 15% in 2025. Regarding wafer fab materials, the silicon wafer market is expected to decline from $14.1 billion in 2023 to $13.2 billion in 2024. However, recovery is anticipated to begin in the second half of 2024, with the market projected to reach a new record of $48 billion in 2025. For more insights on Korea and the industry, attend SEMICON Korea from February 19-21, 2025 at COEX Convention Exhibit Center. Visionaries and leaders will gather to discuss the latest developments, innovations, and business opportunities within the industry. As the region’s premier microelectronics event, SEMICON Korea 2025 is expected to host 70,000 attendees, 500 exhibitors, and 200 speakers. More event information, including registration details, will be available soon.Jaegwan Shim is Senior Specialist, Marketing at SEMI.

In the rapidly-evolving semiconductor industry, maintaining a competitive edge is crucial. To position Europe at the forefront of global semiconductor innovation, imec is leading the NanoIC pilot line initiative. Aligned with the European Chips Act, this initiative is a strategic move to bolster Europe's leadership in key markets like high performance computing, automotive, and healthcare.SEMI spoke with Srikanth Samavedam and Jo De Boeck from imec, Belgium, to learn more about the NanoIC pilot line and to better understand its goals, challenges, and prospects. From transitioning to gate-all-around (GAA) nanosheet devices, to developing advanced memory technologies and interconnects, this conversation highlights the cutting-edge advancements made possible through collaboration across the industry’s value chain.SEMI: How is the NanoIC pilot line working to revolutionize the semiconductor industry, and what are its main objectives?Samavedam: The NanoIC pilot line is a European initiative aimed at bridging the gap between R D and industrial innovation. The project is creating a beyond-2nm system-on-chip (SoC) pilot line, developing advanced logic, memory, and interconnect technologies. This effort supports the European Chips Act's vision for leadership and competitiveness in global semiconductor innovation, particularly in critical markets like high performance computing, communication, automotive, energy, and healthcare. However, advanced technologies come with more complexity, and addressing these complexity challenges requires more mature module baseline flows. By improving baseline flow repeatability and variability while reducing defectivity, we can accelerate the development of future technologies. The NanoIC pilot line is working to provide access to these advanced technologies and baselines to develop future compute systems. This will help ensure European competitiveness across the industry – from semiconductor materials, equipment and design to systems and applications.SEMI: Who are the core partners involved in this initiative?De Boeck: Key partners of the pilot line include CEA-Leti, Fraunhofer-Gesellschaft, VTT Technical Research Centre of Finland, Tyndall National Institute, and the Center for Surface Science and Nanotechnology of the University POLITEHNICA of Bucharest. This project is also supported by the Flemish government, other participating states, and the Chips Joint Undertaking of the EU Chips Act.These institutions and organizations bring a wealth of knowledge and resources, and imec compliments their efforts by providing access to its global partnerships with key industry leaders. The NanoIC pilot line is helping strengthen Europe’s global semiconductor industry leadership while aligning efforts with other regional Chips Acts. SEMI: Can you elaborate on the significance of transitioning from field-effect transistors (FinFETs) transistors to GAA nanosheet devices in CMOS technology?Samavedam: The transition from FinFETs to GAA nanosheet devices is a significant advancement in CMOS device technology. FinFETs have been the backbone of CMOS technology from the 22nm to the 3nm node. But starting at the 2nm node, nanosheet devices will need to be introduced. Nanosheet devices, including variants like Forksheet devices, are expected to drive scaling and performance through three generations – 2nm, A14, and A10. Complementary FET (CFET) architectures are also expected to be introduced around 2031 at the A7 node, which will represent another major inflection point in CMOS device design. This progression requires extensive research into new materials, process modules, equipment, and advanced patterning capabilities using high numerical aperture extreme ultraviolet (high NA EUV) lithography – all of which will be implemented on the NanoIC pilot line. FIGURE PROVIDED BY IMEC │ SCHEMATIC ILLUSTRATION OF A FUTURE COMPUTE SYSTEM. THE SYSTEM IS MADE OF LARGE MULTI-DIE ELECTRICAL-OPTICAL INTERPOSER PROVIDING ELECTRICAL AND OPTICAL INTERCONNECTS BETWEEN THE VARIOUS CHIPLETS (CPUS, GPUS, HBM). ALSO SHOWN ARE CONNECTIONS TO PACKAGE SUBSTRATE, AS WELL AS FIBER CONNECTORS AND AN INTEGRATED LASER SOURCE. CENTRAL PROCESSING UNIT (CPU); GRAPHICS PROCESSING UNIT (GPU); HIGH BANDWITH MEMORY (HBM); PROCESSING UNIT THAT CAN INCLUDE CPUS, GPUS, AND OTHER SPECIALIZED PROCESSORS (XPU); APPLICATION-SPECIFIC INTEGRATED CIRCUIT (ASIC); ELECTRONIC INTEGRATED CIRCUIT (EIC); FF-LEVEL: FEMTOFARAD-LEVEL; FIELD-PROGRAMMABLE GATE ARRAY (FGPA); GAAS QD: GALLIUM ARSENIDE QUANTUM DOT; INTEGRATED SILICON PHOTONICS PLATFORM 300MM (ISIPP300); REDISTRIBUTION LAYER (RDL); SILICON PHOTONICS (SIPHO); THROUGH PACKAGE VIA (TPV). SEMI: What are the key innovations necessary for advancing memory technology?Samavedam: As SRAM scaling slows, the exploration of novel, dense embedded memory concepts will become imperative. Technologies like spin orbit torque magnetic RAM (SOT-MRAM) and 2-transistor 0-capacitor (2T0C) embedded DRAM using deposited semiconductors like indium gallium zinc oxide (IGZO) are promising. These innovations address memory capacity and bandwidth challenges from new workloads in compute systems. Additionally, developing a 3D memory platform to explore future memory options will be essential for improving SRAM and DRAM. These advancements will help meet the demands of new applications like machine learning, augmented and virtual reality, and autonomous vehicles.SEMI: How do advanced interconnect technologies contribute to the future of semiconductor design?Samavedam: Advanced interconnect technologies, like chip-to-chip lateral (2.5D or interposer technologies) and vertical interconnects (3D technologies), play a crucial role in addressing memory capacity and bandwidth challenges. These technologies enable the partitioning of SoC functions into separate dies, allowing for more efficient and scalable designs. Advances like pitch scaling of micro-bumps and copper (Cu) hybrid bonding are facilitating this fine-grained partitioning of SoC functions. Additionally, optical interconnects and 3D interconnect-enabled co-packaging provide high-bandwidth and low-power connectivity at wafer scale. The rise of chiplet architectures and standardization will also increase the demand for low-cost, tight-pitch interconnect technologies like Cu/polymer redistribution layers.SEMI: How do your collaborators benefit from the NanoIC pilot line? De Boeck: One of the biggest collaborator benefits is the pilot line’s commitment to knowledge sharing through R D access and training. We invite foundries, IDMs, materials suppliers, equipment suppliers, and system companies/OEMs to jointly develop the materials, process modules, and integration flows to accelerate the development of beyond-2nm SoC technology pillars.Design pathfinding and system exploration process design kits (PDKs) will be available for start-ups, small- and medium enterprises, universities, and design and system companies to aid in prototyping and testing their designs. The NanoIC pilot line will also offer comprehensive training programs, including virtual PDK training, bootcamps for faculty, and internships and expert courses for students. To learn more, experts and key partners of the NanoIC pilot line will be presenting from 14 -16:40 at SEMICON Europa on November 12. imec’s program, ITF Chip into the Future, will highlight advancements in digital technology, capacity building through the European Chips Act, and the role of the NanoIC pilot line in accelerating beyond-2nm innovation. The conversation will also address industry requirements for pilot lines, emerging initiatives boosting Europe’s innovation and competitiveness, and perspectives on advanced materials and semiconductor equipment. Srikanth Samavedam, Senior Vice President of Semiconductor Technologies at imec, oversees programs in logic, memory, photonics, and 3D integration. Previously, he was a senior director at GlobalFoundries, leading 14nm FinFET technology into production and developing 7nm CMOS. Starting his career at Motorola, he worked on strained silicon and other advanced materials. He holds a Ph.D. in materials science and engineering from MIT and a master's degree from Purdue University. Jo De Boeck, Executive Vice President and Chief Strategy Officer at imec, oversees the company’s strategic direction and serves on its executive board. He joined imec in 1991 after earning his Ph.D. from KU Leuven and has since held various leadership roles, including head of imec’s Smart Systems and Energy Technology business unit and CTO. De Boeck is also a part-time professor at KU Leuven. Maria Daniela Perez / Communications Manager, SEMI EuropePhone: +49 160 2562977Email: [email protected]

With the rapid proliferation of electronics applications with more powerful embedded intelligence, demand for smarter, more efficient sensors is increasing to help devices connect to the world around them. As the semiconductor industry drives the future of connected technologies and sustainable solutions, it faces challenges in energy consumption, resource management, and ensuring data security.SEMI spoke with Simone Ferri, Vice President and General Manager at STMicroelectronics (ST), about current trends and challenges in the Micro-electromechanical Systems (MEMS) and imaging sensors market and how ST is driving innovation in this rapidly evolving industry. Ferri shared insights ahead of his keynote presentation at the SEMI MEMS Imaging Sensors Summit on November 14, 2024, in Munich. Registration is open.SEMI: Welcome, Simone, and thank you for sharing your perspective on the dynamics and trends for today’s MEMS and imaging sensors. To start, how would you describe the current market dynamics for these technologies, and what key factors are influencing these dynamics? Ferri: Right now, the MEMS and imaging sensors market is primarily driven by applications such as automotive electronics, consumer medical devices, AI-powered devices, and intelligent wake-up systems.According to Omdia, the MEMS market is projected to reach approximately $11 billion by 2027, with a CAGR of 2.8% from 2022 and 2027. Currently, automotive applications account for 50% of this market, with industrial at 15% and consumer at 35%. Notably, the automotive sector is the fastest growing, with a 5.4% CAGR, driven by the increasing use of inertial measurement units (IMUs) and microphones.In addition, Yole Group estimates that the imaging market, including optical sensing, will grow at a 4.7% CAGR between 2023 and 2029. Although mobile phone applications remain the primary driver of Complementary Metal-Oxide-Semiconductor (CMOS) image sensors (CIS) volumes, other sectors, including consumer electronics, automotive, and security imaging, are also contributing to the growth.Long-term forecasts for smartphone sales have been trending downwards, but mobile phones still remain a major driver of applications, innovation, and overall volume in the imaging market. Notably, the automotive imaging sector is one of the fastest growing markets and is expected to drive additional demand for CIS.Factors that influence the current market include global economic conditions, regulatory changes, geopolitical factors, technological innovations, and the emergence of new applications and use cases.SEMI: Can you elaborate on the growth strategies that STMicroelectronics is adopting to stay competitive in the MEMS and imaging sensors market? Ferri: ST has played a pivotal role in both the MEMS and imaging sensors markets for over two decades with its proprietary silicon technologies. We fully leverage our Integrated Device Manufacturer (IDM) business model, which allows us to support our customers through integrated capabilities for both design and manufacturing.To remain competitive, we are exploring new markets for MEMS sensors, particularly in digital healthcare with biosensors, where wearable devices are expected to exceed 500 million units per year by 2027.We’re focusing on the growing demand for automotive sensors such as accelerometers, Inertial Measurement Units (IMU), and pressure sensors, particularly with the rise of electric vehicles. We are enhancing the integration and synergy between automotive and personal devices. For example, we are combining high-g and low-g accelerometers within a single IMU, enabling accurate fall and crash detection, along with precise orientation and wake-up functionality.AI is another one of our priorities. In today's digitalized world, AI enables real-time, contextual understanding and the ability to make decisions that optimize and reduce the power consumption of the final device. Sensors are no longer merely for data collection. Thanks to AI, sensors can interact with their environment and significantly contribute to innovation and sustainability.We are also prioritizing low power consumption. Our MEMS technology operates in low-power mode with almost negligible energy use, activating only when necessary, without waking up the system to understand its environment or to be reconfigured.In addition, we’ve seen optical sensing continue to grow year over year. Optical sensing now offers features such as 3D capture, low-power and low-footprint computer vision, Near InfraRed (NIR) and even Short Wavelength InfraRed (SWIR).We are accelerating and leveraging our IDM model and broadband semiconductor supplier positioning to propose wider system offerings based on the array of sensors and microprocessors that ST develops. As the world shifts toward widespread use of sensors and data collection, the demand for secure sensing technologies is growing, extending beyond mobile and PC applications to spatial computing and AR/VR environments. For example, if we are talking about recognizing specific persons in an AR environment, we don't want the data related to these persons to be sent to the cloud before a decision is made about whether they are supposed to be there or not, as such information can be intercepted. We want all the data to be managed at sensor level and only a warning of rejection or acceptance to be transferred outside our secure sensor. SEMI: What are some of the latest technological innovations in MEMS and imaging sensors that are shaping the industry? Ferri: In MEMS, we're seeing significant advancements in three key areas:- In-sensor AI is integrating technologies in the sensors such as machine learning core (MLC), adaptive self-configuration (ASC), and intelligent sensor processing units (ISPU).- Open sensors are designed to interface seamlessly with other sensors, allowing third parties to benefit from on-sensor processing innovations, while building an ecosystem to create joint value with customers.- Accurate sensors are providing high-precision data, enabling better decision-making and smoother, more natural user interactions. These sensors also reduce factory calibration time and resources, leading to overall lower energy consumption. Because of their accuracy, onboard MLC, and ASC, the sensors can also reconfigure themselves without interaction with the processor, thus guaranteeing the proper accuracy at lower power consumption, at any time, under any condition.In the imaging sensor market, key trends include:- Higher Pixel performance is leading to improved signal-to-noise ratio (SNR), low light performance, better quantum efficiency (QE) and lower noise performance. Despite post processing, pixel performance remains the key factor as SNR performance must remain high while the pixel shrink roadmap advances.- Embedded Intelligence is providing local processing for local decision making, enhanced security, advanced image sensor processing (ISP) for improved image quality, and fusing sensor functions to deliver a better user-experience.- "Always on" capabilities are supporting mass sensorization and deployment of optical sensing solutions everywhere through specific low-power design techniques, process development, and overall system architecture optimization.SEMI: Looking toward the future, what trends do you anticipate will have the most significant impact on the MEMS and imaging sensors market? Ferri: Some macrotrends for sensors include:Electrification: Certain consumer and industrial applications are now being adopted in the automotive sector, especially with the rise of electric vehicles creating new opportunities for innovation and for new players to enter the market. As example, the predictive maintenance that has been developed for industrial electric motors is ported 1:1 to electric vehicles.AI: Regarding data transmission, distributed architecture will push AI towards edge computing, increasingly supported by advancements in 6G and foldable technologies. Additionally, as AI becomes more integrated, the maintenance and security for AI will require more attention.Smart home, buildings, and cities: As cities grow, the demand for smart homes and buildings rises, requiring more sensors to manage energy, security, and urban infrastructure efficiently. Over 55% of the global population and 70% of the EU population reside in cities. Urban areas generate more than 80% of the world’s GDP, and by 2030, it's anticipated that 68% of the global population will be urban dwellers, pointing to the growing need for smart cities.Aging population and digital health: The integration of biosensors with MEMS technology will be crucial for addressing the needs of an aging population.Overall, the use of image sensors for environmental sensing is steadily increasing. This is a major focus for ST, particularly in 3D sensing. New use cases, such as presence detection, are enhancing security and reducing power consumption due to efficient data processing. Additionally, the average number of cameras in smartphones, automobiles, and even in devices like robots and vacuum cleaners, continues to grow.SEMI: What has STMicroelectronics been working on, and what are your plans for the upcoming years? Ferri: To date, we have shipped over 23 billion MEMS sensors. Still, we remain committed to continuously improving our products and enhancing our MEMS technology in terms of affordability, miniaturization, performance, and novelty. We are striving to set the stage for a future defined by innovation and excellence with:Evolution of our current product portfolio by investing in lower power consumption, lower supply voltage, and additional and more sophisticated in-sensor AI for an effective distributed AI conceptNew sensors for presence detection, like infrared (IR) sensors, and health-focused sensors such as biosensors.MEMS sensors are also becoming increasingly accurate, open towards different ecosystems of technologies, and so intelligent that they can self-configure and reduce power consumption thanks to optimal data processing. These attributes allow us to provide meaningful and sustainable solutions across sectors such as automotive, industrial, infrastructure, and personal electronics, enabling us to improve energy efficiency, reduce waste, and support sustainable practices for a greener planet.For the past 10 years, ST has focused on depth sensing across multiple use cases. Today, ST is the number one in the world for time-of-flight solutions through our ST FlightSense product family. More recently, we launched our global shutter image sensors family, ST BrightSense, to address markets like personal electronics, automotive, industrial, communications equipment, and computers and peripherals.More specifically on the automotive side, we have the portfolio, customers, and customer program awards to lead the driver and occupancy monitoring market. We continue to secure design wins from our growing customer base while we expand our product portfolio and broaden our customer and application footprints.SEMI: What are some of the biggest challenges facing the MEMS and imaging sensors industry today, and how is ST addressing them? Ferri: The MEMS and imaging sensors industry faces several challenges, but with strategic planning and innovative solutions, companies can overcome these obstacles by focusing on the following:Integration: With our biosensors, we are doing more with less space. For example, in a standard accelerometer, we integrate an analog front end for electrocardiogram (ECG) analysis, enhancing functionality without increasing the device footprint.Performance enhancement: Ensuring high performance and reliability in various environmental conditions is crucial, especially in automotive and healthcare applications. To meet these demands, we deploy comprehensive testing protocols to ensure our sensors meet performance and reliability standards.Power efficiency: Reducing power consumption is vital, particularly for battery-operated devices like smartphones and IoT devices. We are developing low-power architectures to address this need.Data security: With the growing use of imaging sensors in surveillance and personal devices, data security and privacy have become paramount. Our solutions include encryption for data transmission and storage, as well as robust access control mechanisms to prevent unauthorized access to sensor data.Additionally, supply chain issues remain a significant challenge today. We believe our strategy and capacity as an IDM, combined with our strong innovation capabilities, give us a competitive edge in supply chain management.SEMI: What are you most looking forward to at the MEMS Imaging Sensors Summit, and what does it mean for the European semiconductor industry? Ferri: I look forward to the Summit as a valuable opportunity to connect with industry peers, share insights, and explore new collaborations. I encourage my peers to attend, as it’s a unique platform to collectively shape the future of our industry and sustain Europe’s leadership in semiconductor innovation. About Simone FerriSimone Ferri is Vice President of APMS Group and General Manager for MEMS sub-group at STMicroelectronics. Ferri began his career in STMicroelectronics in 1999 as an R D engineer before becoming a digital designer for the company’s audio division, leading into product management after 5 years. In 2014, ST entrusted Ferri with MEMS consumer sensors followed by global MEMS-sensor related Marketing and Application activities across all markets and segments, leading into his current role. Ferri graduated with a degree in microelectronics from Politecnico di Milano (Polytechnic of Milan), where he also completed his MBA. Sitong He is Marketing and Communications Manager at SEMI Europe.

Gone are the days when companies were said to go “beyond compliance” if they had sustainability ambitions and operated in a largely voluntary space.Corporate sustainability now sits in a tangle of business priorities, stakeholder expectations, and regulatory obligations. New landmark legislation and policies have changed the game in many markets where semiconductor value chain companies do business. Today, accuracy of information, threshold-setting, evaluation criteria, and due diligence are subject to scrutiny, fines, and litigation.A myriad of compliance risks are now linked to business actions that were historically voluntary in a sustainability context. Fueling the shift are regulations such as the EU’s Corporate Sustainability Due Diligence Directive (CSDDD) and Corporate Sustainability Reporting Directive (CSRD).Across the semiconductor value chain, it is crucial for companies to have a solid regulatory strategy for their sustainability activities. They must take into account, for example, mandatory rules that drive up risks from selectively taking action on some sustainability issues while demoting others.Semiconductor manufacturing and design firms, together with their business partners, face heightened pressure to navigate business and sustainability priorities around the climate transition, human capital management, supply chain management, and a host of other environmental, social, and governance issues that are high on regulatory agendas.The SEMI Sustainability Initiative hosts several working groups that bring to light common concerns and provide a forum for sharing response strategies. To sharpen the guidance that SEMI offers, the Sustainability Initiative is launching the webinar series, Global State of Play: Sustainability Regulations, Reporting, Incentives. This series offers semiconductor industry professionals the chance to learn from top-tier experts on the most pressing challenges in compliance, disclosure, and strategy for sustainable business.The first webinar, Developing a Regulatory Strategy for Sustainability: How to Navigate Key Sustainability Decisions, will feature Ashley Walter, Partner and Chief Sustainability Officer at Orrick Herrington Sutcliffe LLP.As the global business association for the electronics design and manufacturing value chain, SEMI is pleased to convene experts to address improving sustainability strategies for our industry. The SEMI Sustainability Initiative invites industry stakeholders to see the importance of building a regulatory strategy that coordinates across functions, from engineering to the boardroom.Learn more and register.Jordan Famularo, PhD, is Programs Manager, Sustainability at SEMI.

The Rising Stars: 20 Under 30 blog series celebrates the brightest young leaders shaping the future of the semiconductor industry. These exceptional individuals have earned the SEMI Europe 20 Under 30 Award for making a remarkable impact across the supply chain—whether in engineering, sales, marketing, or R D. The series spotlights these rising stars for their career achievements, commitment to innovation, leadership skills, and dedication to driving both business success and community growth.Follow their inspiring journeys, and discover how they are thriving and paving the way for future generations in the semiconductor world.Introducing Marieke Vermeulen: Product Quality Assurance Engineer at MelexisMarieke Vermeulen's journey into the semiconductor industry is a testament to curiosity, adaptability, and self-driven learning. With a background in classical philology, her entry into Melexis as a customer quality technician was unexpected, yet she quickly embraced the challenges of the industry. Through her commitment to growth and innovation, Marieke has risen to the role of Product Engineer, demonstrating leadership and a passion for continuous improvement. Her contributions, particularly in product ownership and driving business growth, highlight her as a dynamic force within Melexis, embodying both technical excellence and a collaborative spirit.SEMI: What inspired you to join the semiconductor industry? Vermeulen: My entry into the semiconductor industry was actually quite accidental. After completing my master’s degree in classical philology, I was still unsure about which direction I wanted my professional life to take. Then, an opportunity arose to join Melexis as a customer quality technician.I did not have anyone in my immediate circle with experience in the industry, so I entered the field without really knowing what to expect. I had only a vague idea of what a semiconductor company did. However, from those early days onwards, I have not looked back. It is my love of knowledge and the desire for a deeper understanding that continues to drive me in my role within Melexis’s quality department. During my literature studies, I was motivated by the idea that there is no absolute, uncontestable truth. Meaning will change with time and place. This perspective aligns closely with the mindset of the semiconductor industry. With new inventions and concepts constantly emerging, the industry is always evolving. We must challenge what we believe to be true yesterday and adapt to the discoveries and advancements for today.So, while there was no direct inspiration that led me to join, more of a stumble into the field, I have since developed a deep respect for how the industry operates. I In particular, I respect how people in the industry do not hesitate to question in order to keep pushing the boundaries of innovation.SEMI: How did your early experiences and education shape your career path?Vermeulen: There was no direct experience. During my school years, STEM was just beginning to earn its place in my educational framework, and we were only introduced to the basic principles. Fortunately, this has changed significantly since then. However, my background hasn’t held me back, in fact, quite the opposite.One main principle from my studies stands out: in language, nothing is set in stone. There is no single truth, no single solution and no single voice. At its heart, language is shaped by human interaction. My studies taught me to think critically and to understand that there is always more than one answer to a question. This approach directly influences the way we work in the product quality department. Our goal is to develop and produce products that meet a customer’s needs as closely as possible. But it is a continuous process and very rarely a straight line. We learn from our past experience to improve the next iteration, again and again. We regularly consult with our peers to gather different ideas, and we listen to the industry to understand where the needs are. Then, we translate those insights into an effective solution.SEMI: Can you share a professional accomplishment you’re most proud of, and explain why it’s significant to you?Vermeulen: Our products go through two main stages in their lifecycle: development and production. As a product engineer, I am responsible during the production stage. However, before we reach this point, there is a transition period where the development and production teams come together to prepare the product for the best possible launch. This period is often hectic, but it clearly demonstrates how much of a team effort our products represent. Every team member understands their role and works towards the collective goal. Being part of such a diverse team and seeing our products succeed is always a thrill for me. While the products are made with metals, silicon, and other elements, it is the human factor that truly brings them to life. The very first spark is always the idea to create. SEMI: As a young professional in the industry, what is your greatest challenge? Vermeulen: As a young woman in STEM, the most obvious answer is that I have to prove myself more than my male colleagues or more experienced peers. However, at Melexis, I have found strong support in overcoming this challenge. Our voices are heard, and we are an active and valued part of our teams. We can express our ideas freely, knowing they will be considered just as seriously as anyone else’s. I can only hope this trend continues throughout the industry.SEMI: What advice would you give to younger generations aspiring to make an impact in this industry?Vermeulen: To those who are unsure if STEM is truly for them, I would say: We need engineers, but we also need dreamers to bring the ideas to life. We need designers and coders who can make the device function, but we also need people who can communicate these concepts to the world. Moreover, we need educators who can inspire and teach the next generations. There is a place for many different minds within the industry, so I encourage you to step in this direction. I’m sure you will find a place.And for those inspired by the semiconductor world and are sure this is where they want to be: don’t be afraid to look beyond the industry. Listen to those around you and take their ideas to heart. Be the inventor for those who cannot bring ideas to life, and offer solutions to those who feel stuck.Cooperation has made our industry great, and it is essential for building a strong foundation moving forward. SEMI: How do you envision future work environments?Vermeulen: The past few years have demonstrated how advanced technology has made the world much smaller. With just a click of a button, a camera, and a microphone, we can connect to the world, ignoring the constrains of time, space and borders. This accessibility opens the door for many more people to enter the industry from all around the globe. A hybrid and flexible work environment enhances this even further, accommodating those who might face physical or logistical restrictions. We need to continue on this path. By embracing diversity, we allow new ideas to emerge at the intersection of different minds. Why exclude a brilliant mind simply because they are on the other side of the continent? Why overlook someone whose mother tongue differs from yours when we can find a common language?At Melexis, we already welcome many different cultures, and it is amazing to see how vibrant this makes our offices. New team members bring their own experiences and blend them with ours. Just as alloys often retain characteristics of their base metals, these newly melded ideas will enrich our collective innovation.SEMI: What impact has the 20 Under 30 Award had on your career? Vermeulen: The award has connected me with wonderful peers and highlighted how we all strive to improve the industry, each in our own way and from our unique areas of expertise. It also has provided me an opportunity to demonstrate that the industry is welcoming to a variety of experiences and is willing to invest in its people. The goal was to foster connections, and it has truly jumpstarted this for me. Following 20 Under 30 JourneysMarieke Vermeulen's story is an inspiring example of how passion for learning and a willingness to embrace new challenges can lead to remarkable success. From her unexpected entry into the semiconductor industry to her achievements as a Product Engineer at Melexis, she has consistently demonstrated leadership, innovation, and dedication. Her journey highlights the importance of curiosity and adaptability in driving both personal and professional growth, making her a role model for others in the industry.The Rising Stars: 20 Under 30 blog series celebrates the exceptional talent and leadership driving the future of the semiconductor industry. Each of the young innovators honored is excelling in their respective fields while shaping the landscape of technology and business with their visionary approaches and dedication. Their stories exemplify the remarkable achievements and unwavering commitment that define the next generation of industry leaders. The series is intended to inspire and motivate future professionals to pursue their passions and embrace the opportunities within this dynamic industry. Stay tuned for more stories of rising stars who are paving the way for continued growth and innovation in the semiconductor world.Learn more about the SEMI Europe 20 Under 30 Award and the recipients honored at SEMICON Europa. For more information contact Maria Daniela Perez at [email protected] Daniela Perez is Communications Manager at SEMI Europe.

Verific Design Automation is an electronic design automation (EDA) developer of front-end software and a member of the Electronic System Design (ESD) Alliance. Verific is also viewed as a valued supplier to many EDA, field-programmable gate array (FPGA) and semiconductor companies –– some still around, some acquired by larger EDA companies, and some long gone –– for the past 25 years. With this backdrop, Bob Smith, executive director of the ESD Alliance, talks with Rob Dekker, Verific’s founder, president, and CTO, and Michiel Ligthart, its COO, about the evolution of the company and the industry over the last 25 years, the emerging EDA products space and what’s to come. Smith: This is the 25th anniversary of the founding of Verific. How did it get started? Dekker: The company I worked for before I started Verific was Exemplar Logic (now Siemens EDA), founded by Ewald Detjens in the 1990s. Exemplar started off making an RTL-to-Xilinx FPGAs path using the VHDL hardware description language (HDL) as the entry language. I worked on the VHDL language parser. As I was doing that work, I looked at the VHDL language reference manual and made sure that all the code complied with the rules set by the IEEE standards committee. I wondered why I was doing it for just one company, because it was and still is an IEEE standard language. Every tool vendor that wants to support VHDL would have someone like me looking at the language reference manual and building a language front-end that complies with all the rules in the standard. As I gained experience and finally left Exemplar, I already knew how to make a language front-end and started building a good one for the Verilog HDL. The initial idea was not to sell it to different companies but to build an equivalence checker formal verification tool that could be installed on every designer’s desktop, where they could check their designs at various stages in the design flow. I needed funding, and started selling the language front-end thinking that no one should have to rewrite a language front-end because it's already a standard. That's when the idea came to start Verific. I wanted to build a standard language front-end, with the possibility of creating a formal tool based on that front-end. The language front-end was popular among various EDA tool vendors and startup companies. Formal tools, synthesis tools, simulators or virtual prototyping tools, emulators, and so on all need a language front-end. I was starting to license the front-end and got so busy that I asked my good friend Michiel to run the business so I could focus on the technical side. After that, we started to grow, acquired an exceptional team in India run by my friend Abhijit Chakrabarty, and hired Rick Carlson as VP of sales. It quickly became a real company, and we started to license the language front-ends to the entire EDA industry. One company wanted to license our language front-end to build an equivalence checker. At that point, we had to decide whether to stay in the language front-end business or to make an equivalence checker and compete with our customers. We decided that competing was not a good idea and chose to focus on language front-end for the EDA industry. We have been doing this ever since for most EDA tools, from startup companies, all the way to large semiconductor companies. Their tools have been built with a language front-end developed at Verific, and we are proud of that. Smith: What have you seen change since you started? Have you seen any big changes that surprised you as the industry has evolved? Dekker: I wouldn't say big changes overall, but I've been impressed by the amount of innovation in the EDA industry. The industry is dynamic, with new tool vendors coming up and good ideas being explored. We are in a wonderful industry that is vibrant with innovation and talented people. This is what impressed me about the industry initially, and it still does. At Verific, we want to be an incubator for new innovations to flourish in an EDA industry dominated by a small number of large players. Ligthart: One change that had a significant impact on Verific specifically is the introduction of SystemVerilog. When Rob started out, there was Verilog 95 and VHDL. Verilog 95 was a relatively simple language. VHDL was complicated. We saw that early customers often wrote their own Verilog parser and came to Rob for the VHDL parser. In 2005, the IEEE 1800, also known as SystemVerilog, was introduced. That was a game changer, because suddenly, adopting SystemVerilog in the Verilog customer base required a new front-end that was as difficult to create as writing VHDL parsers. That was an inflection point for the company, and it started to grow. Before then, it was a nice company. After 2005, it became a growth company. Nowadays, we equally support SystemVerilog and VHDL. They're both complicated languages. People for the past 20 years have proclaimed the death of VHDL. It did not happen and will not happen. The two languages go hand in hand in different parts of the world. Most EDA companies support both because their end users require both. Smith: Verific coined the term “bespoke EDA.” How do you define it? Ligthart: For that, we need a bit of history. Fifty years ago, semiconductor companies started to write their own software tools to design their semiconductors. Those days, it was still called CAD, computer-aided design. Over time, we saw the introduction of EDA companies that tackled singular problems like simulation, place and route, or logic synthesis, and they started replacing in-house developed tools. In the past seven years, many of the larger semiconductor companies and system companies have started to develop in-house EDA tools again. Of course, they still license most of their design tools from EDA companies, but for certain design aspects, they develop their own design flow. They write their own internal EDA tools that are specific to that company, and they don’t go outside of that company. That's what we call “bespoke EDA.” Smith: These chip companies can afford to do this? Ligthart: Yes, because they are large enough and have the people to do it. They license their SystemVerilog and VHDL front-ends from us, so they do not have to invest five years of development for that piece of their flow. They take our parsers and elaborators and build something of their own — bespoke for their semiconductor design flow. Smith: It makes me think of Google, Meta. Ligthart: Let me put it this way. Of the magnificent seven technology stocks, six have a Verific license. Smith: How do you see AI changing EDA design tools? How will AI impact you? Dekker: This question about AI is coming up quite a bit, and I have a more conservative opinion. I don't know if AI is going to change EDA tools by themselves. EDA tools are highly optimized to do a particular task, it would be difficult for AI to beat that. If it did, it would surprise me. Outside of tools, like the design exploration phase for example, I think AI might make a humongous difference. AI could make it much quicker to explore different design alternatives. Right now, several AI-based companies are engaging with Verific, and they provide the design environment to do optimizations. AI could also help engineers improve their work. This would be more at the micro level, where individual engineers use ChatGPT type of engines and language models to enhance their programming styles, algorithms, and implementations. At the micro level, I think AI has an impact. At the macro level outside of the tools, I think AI will also have an impact. I doubt AI will change anything with the tools themselves. Ligthart: I'm pretty much in line with everything Rob said. At the Design Automation Conference (DAC), we showcased our relationship with four EDA startups that are applying or are in the process of applying artificial intelligence to their design objectives. As Rob said, the first step is getting a Verific license so that they have SystemVerilog already in place. Then, they apply AI-based algorithms to tackle certain aspects of the semiconductor design cycle. In terms of how successful they are, that's up to them to prove, but we have a front-row seat to watch their progression and success. Smith: What trends in the industry are you seeing? Dekker: Niels Bohr, a renowned physicist of the 20th century, once said, "prediction is very difficult, especially if it's about the future." Our EDA industry is vibrant, and it’s hard to see where it's going. I think that the EDA industry is here to stay. EDA companies are becoming more and more popular in the stock market. This industry is 40 years old, but it’s still dynamic and still full of innovation. It's extremely important that we keep this industry open, that we share ideas with each other, and that we provide solutions for the increasing complexity of chip and system designs, especially as AI gains prominence. The industry will change, and as it changes, the requirements for EDA tools will also need to be adjusted and there's a range of directions that our industry can go in. Verific is here to support that. About Rob Dekker Rob Dekker is president, founder, CTO and principal developer of Verific’s HDL source code software. Prior to founding Verific, Dekker was a software developer, manager, and director at Exemplar Logic, where he was the architect and a primary developer of Leonardo. Dekker started his career with Philips Research in the Netherlands, where he worked on the testability of VLSI circuits. He graduated from Delft University of Technology, the Netherlands, with a Master of Science degree in electrical engineering. About Michiel LigthartMichiel Ligthart is Verific’s COO and has an extensive background in engineering, product marketing, and general management. Prior to Verific, Ligthart was vice president and general manager of west coast operations for Theseus Logic, a startup in asynchronous logic. Previously, he spent eight years with Exemplar Logic in engineering and marketing roles. Ligthart started his career with Philips Research Labs and was a visiting scholar at the Center for Integrated Systems at Stanford University. He has a Master of Science degree in electrical engineering from Delft University of Technology, the Netherlands. Robert (Bob) Smith is executive director of the ESD Alliance, a SEMI Technology Community.

The drive to scale nodes towards physical limits, known as "More than Moore," and the adoption of 3D architecture in chip integration strategies for advanced logic and memory applications has led to unprecedented demand for high-quality dependable materials solutions. With the aid of digital solutions, the process is expedited with higher quality and efficiency.SEMI spoke with Thorsten vom Stein, Director, Head of Process Design Semiconductor Materials at Merck KGaA, Darmstadt, Germany, about how materials innovations and advanced packaging can contribute to smarter supply chain solutions for a sustainable ecosystem.More insights into key aspects of 3D architecture in chip integration and heterogeneous integration will be shared at the Advanced Packaging Conference (APC) during SEMICON Europa 2024, Nov. 12-15 in Munich, Germany. Registration is open.SEMI: What makes the digitalization of chemical process design for semiconductor materials manufacturing so challenging at a technology level? Vom Stein: The primary challenge in digitalization of process design is achieving data rich experimentation and design flexibility from the start. When we begin the process design for a novel material solution, the freedom of design needs to be very high for optimal outcomes. For example, to identify the best sequence of unit operations to achieve best process intensification, do we need a distillation or extraction after the reaction to meet the purity requirements? At the same time, the samples from these early process trials need to have purity levels and process reliability standards for high-volume manufacturing of routine production in order to meet the requirements of our customers’ leading-edge chip integration strategies. We address this need by executing data rich experimentation starting with first trial, and thereby establish “production ready” data density in the lab.To avoid confining our design space, we therefore need highly “sensorized” and automated modular lab equipment that can give us the data density we need and flexibility at the same time.SEMI: Are data-driven approaches also applied to streamline manufacturing processes? Vom Stein: Yes, data-driven approaches are key to driving cost, quality, process reliability and sustainable excellence. As we scale up from lab experiments to high-volume manufacturing—often times increasing volumes by two or three orders of magnitude—we scale the process model virtually ahead of its physical twin to de-risk these major scale-up steps. An example of this is simulating the effect of reactor geometry on the impurity profile.Establishing this handshake between the physical asset and the process model early in the development has a lot of benefits for sustained cost efficiency of the future manufacturing process. For instance, it allows for optimization of yield and cycle times to the existing asset infrastructure. Furthermore, we can achieve quality reliability critical to our customers by establishing end-to-end correlation models that link the quality of incoming raw materials to finished good impurity profiles.Finally, we can achieve the lowest possible carbon footprint and minimize waste streams and energy intensity via process intensification by matching the unit operation sequence to the specific thermodynamics and kinetics of the process.SEMI: How can advanced packaging contribute to the pursuit of net zero? Vom Stein: Ultimately in a successful process design, we aim to achieve the maximum yield of value-added product with minimal input of resources and raw materials. So, there is an intrinsic synergy between highly intensified processes and their carbon footprint. The digitalization of process design allows us to track the CO 2 footprint during every iteration of the design. Establishing this tracking as a routine design KPI is one of the key initiatives to drive net zero semiconductor material solutions.In addition, advanced process design is a key enabler for circular value streams. We are currently working on multiple projects to recycle waste streams and re-feed them as raw materials in our processes. We are also exploring how our chemical process technology can aid our customers’ recycling efforts such as reusing lithography cleaning solvent waste streams.SEMI: In your previous talks, you emphasized the importance of diversity, equity and inclusion (DE I). How is this related to the digital revolution? Vom Stein: In the not-so-distant past, my team consisted mainly of process chemists and engineers. Now, we are working with data scientists, model developers, automation experts and many more substance matter experts on our projects. This work requires an inclusive culture to maximize the impact of these diverse sets of insights and disciplines.We also must acknowledge that, in many instances, we are exploring unchartered territory that requires a “leap of faith” culture trusting in digital models. Imagine, for example, a production plant director who is used to a stepwise physical scale-up, now being onboard with skipping physical scale-up steps by using predictive process models. It takes time to really establish a trust in the “power of data.” This type of culture is championed at Merck KGaA, Darmstadt, Germany on all levels: from CEO to the production operator. Our DE I Report showcases how we continuously build belonging for over 64,000 employees across the globe.SEMI: Merck KGaA, Darmstadt, Germany is a key contributor to semiconductor innovations. How important is it for Merck KGaA, Darmstadt, Germany to collaborate with other industry leaders to achieve goals in matters such as sustainability and DE I? Vom Stein: Collaboration with our customers and OEM partners is a key piece of achieving the molecular precision necessary to drive technology evolution that serves as the backbone to society. More and more, we need to link our material solution manufacturing process to the process parameters of the tools in the fab, ultimately improving the chip yield of our customers. To transition from the nanometer era to the angstrom era, we must establish these process correlations end to end along the value chain, which is why we are heavily engaged on our Athinia collaboration framework.Besides technology enablement, sustainability is the next avenue where cross value chain collaboration is a must to lower the CO 2 and energy footprint of our industry. To this end, we have started a joint program with Intel on AI-enabled sustainable semiconductor processes.The importance of industry collaboration is why I was so honored to participate at SEMICON Europa together with representatives from leading companies.SEMI: What did enjoy about SEMICON Europa 2023 that you would like to experience again in 2024? Vom Stein: I was really impressed by the SEMICON Europa 20 Under 30 recognition program launched during the show. The program honored the brightest young leaders who have demonstrated success in their careers in the microelectronics supply chain. We were very happy with the acknowledgement of one of our brightest minds at Merck KGaA, Darmstadt, Germany, Balazs Bordas, Digital Twin Implementation Lead. He has been instrumental for many of our pioneering efforts in this space.Such recognition programs are very important for our industry and can make a significant difference in the perception of the semiconductor industry and its ability to motivate and attract more talent. I personally hope to see similar programs in the years to come.Additional resources:Learn more about diversity and inclusion at Merck KGaA, Darmstadt, Germany.Learn more about Merck’s KGaA, Darmstadt, Germany modular lab automation approach.Merck KGaA, Darmstadt, Germany sponsored SEMICON Europa and SEMI Advanced Packaging Conference in 2023. Thorsten vom Stein is Director, Head of Process Design Semiconductor Materials at Merck KGaA, Darmstadt, Germany. Based in Darmstadt, Germany, he holds a PhD in Chemistry from the RWTH Aachen University and has extensive experience in Catalysis, Materials Science, Process Development and Value Chain Innovation.Serena Brischetto is Director of Marketing and Digital Engagement at SEMI Europe.

SEMI High Tech U is making waves around the world, introducing students and educators to the fascinating world of microelectronics through hands-on, experiential STEM learning kits. The SEMI Foundation started the program in the U.S., aiming to spark interest in semiconductors and technology, and High Tech U has expanded across borders to reach students in Europe and Southeast Asia. Recently, young learners in Germany and Malaysia participated in the SEMI program, diving into circuits, coding, and connecting their learning to the ever-evolving semiconductor industry.One of the core goals of High Tech U is to empower educators and students with tools that make microelectronics accessible and engaging. Since 2022, thanks to support from sponsors like KLA, Nordson, Western Digital, STMicroelectronics, Applied Materials, Broadcom, Infineon, and Qorvo, the program has reached over 5,500 students across multiple states and countries.MichiganStudents in Ypsilanti creating circuits with various materials.In the summer of 2024, SEMI Foundation partnered with Toyota and Washtenaw Community College to provide a free three-day summer program at Parkridge Community Center in Ypsilanti, Michigan. Dozens of Ypsilanti middle school and elementary school students engaged in active, hands-on learning about circuits using everyday materials such as playdough, copper tape, and batteries. The students built basic circuits on paper, created light-up greeting cards, and sculpted figures illuminated with tiny LED bulbs. This learning opportunity taught students and their counselors how circuits and semiconductors are an integral part of everyday life.MalaysiaStudents, staff, and teachers from ST Muar GEMS program.In 2023, STMicroelectronics Muar sponsored High Tech U kits for local schools as part of their Girls in Engineering, Mathematics Science (GEMS) STEM Lab program. SEMI Foundation staff collaborated with the GEMS program and provided a live international train-the-trainer session where teachers familiarized themselves with the High Tech U kits and accompanying curriculum. This session ensured that STMicroelectronics partners from the Muar Primary School were prepared to implement the program and make the connections between student learning and the work of the microelectronics industry.The STMicroelectronics Muar GEMS program has since educated many students in the local area on circuits, coding, and the basics of semiconductors. This partnership continues to blossom as STMicroelectronics aims to expand the implementation of the successful GEMS program. Moving forward in 2024 and beyond, GEMS students will apply their newfound skills in a friendly competition to solve real-world problems, showcasing how knowledge of circuits and coding can make a difference in creating a better world.GermanyStudents from SEMI Europe’s inaugural High Tech U program in Berlin.The SEMI Europe team has also recently launched their first High Tech U program in partnership with the Micro:bit Educational Foundation. Through a series of hands-on STEM activities, SEMI introduced a 4th-grade class in Germany to the fascinating world of microelectronics. Students were able to explore the fundamentals of coding and electronics through building a codable guitar using cardboard, aluminum foil, and electrical clips.The program continues to grow in Europe, providing students opportunities for interactive projects like crafting dice, programming melodies, and building smart sensors. The students’ enthusiasm and curiosity has shown the possibilities of engaging young minds in the world of microelectronics.Expanding Opportunities for Industry InvolvementSEMI invites you to take part in attracting, developing, and retaining the microelectronics talent of the future. Join us in this critical work while strengthening your company’s impact on your local communities. Learn more about High Tech U and opportunities for companies to get involved around the globe by contacting Bia Hamed at [email protected]. Berton Mahardja is the Director of Global Education Initiatives at SEMI Foundation. Prior to joining SEMI, Berton served in various roles across K-12 education. He is passionate about programs that support equitable industry access for students and adults.

In an era where technology permeates every aspect of our lives, the semiconductor industry serves as the backbone of innovation. From IoT devices to data centers, every piece of technology relies on integrated circuits (ICs) such as intellectual property (IP) cores and system on chips (SoCs). As these technologies become increasingly pervasive, the importance of hardware security assurance in the design and development of IP and SoCs cannot be overstated. Evolving cyber threats and sophisticated attacks make it essential for vendors to integrate advanced security measures into their workflows.Market Pressures Driving Demand for Enhanced Hardware Security The semiconductor market is projected to reach $1 trillion by 2030. At the same time, semiconductor devices and system designs are becoming increasingly complex. With that complexity comes the added difficulty and effort required to conduct thorough security analyses. Additionally, competitive pressure to reduce time-to-market means that vulnerabilities can be more easily overlooked or exploited, making it crucial for the industry to adopt automated security solutions. As more products are deployed in critical systems, from consumer electronics to national infrastructure, the stakes become even higher, underscoring the necessity for robust security measures.According to the SEMI Electronic Design Market Data (EDMD) report, in 2023, the electronic design automation (EDA), semiconductor IP, and related services market reached $17.1 billion, fueled by the increasing complexity of semiconductor designs and the growing emphasis on security. While the overall EDA market is growing at a 7.4% compound annual growth rate (CAGR), the semiconductor IP segment is expanding at 9.7%, and in comparison, the logic verification tools market alone is surging ahead at 24.2%. Deeper verification processes and tools are needed to not only handle the rising complexity of semiconductor designs, but also to support the growing emphasis on secure-by-design principles to ensure robust and reliable products in an evolving technological, security, and threat landscape. As a result, the market for logic verification tools — a key component of the EDA market — is surging. The Rising Cost of Cyber Threats from Data Breaches and Architectural Flaws Pavani Jella, Silicon AssuranceThe average cost of a data breach is $4.88 million1, encompassing lost business, regulatory fines, legal fees, and damage to brand reputation. As the semiconductor market grows, the potential financial impact of security breaches due to hardware vulnerabilities also escalates. Companies must invest in robust security measures to mitigate these risks and protect their financial health.Cyber threats from the exploitation of architectural flaws are another threat. Plundervolt is one example of an architectural flaw that could lead to hardware exploitation. Discovered by ethical hackers, Plundervolt is the name of an attack that exploited voltage fault injection to compromise the security of Intel processors. By manipulating the voltage supplied to the CPU cores, attackers could induce errors in the SGX enclave, allowing them to leak sensitive data or even bypass security protections intended by the enclave. This flaw was particularly concerning because it operated at the hardware level, making traditional software security measures ineffective. The attack leveraged the SoCs’ power management features, specifically dynamic voltage and frequency scaling (DVFS), to achieve its malicious objectives.Exploiting such a vulnerability could lead to the exposure of sensitive data, such as cryptographic keys and proprietary information, compromising the confidentiality of secure enclaves. This breach could erode trust in an IP or SoC provider’s security features, particularly in environments that rely on using the IP or SoC for protecting critical data. In cloud environments, a successful exploit could result in multi-tenant data breaches, impacting numerous users.The vulnerability also poses risks to secure applications, potentially leading to manipulated outcomes and decrypted communications. Businesses could face significant financial losses, operational disruptions, and regulatory consequences due to such an attack. It is a stark reminder of how architectural flaws in SoCs can be exploited, leading to severe security breaches that are challenging to mitigate without hardware-level fixes.Industry Believes Hardware Security Assurance Is a Key Priority A majority of security professionals from a diverse group across industry, defense, government, and academia rate hardware Trojan detection, IP piracy protection, and SoC vulnerability assessment as high priorities. This prioritization reflects the industry's awareness of the critical importance of security measures in maintaining the integrity and reliability of semiconductor products.As a result of this awareness, investments in cybersecurity are expected to reach $345.4 billion by 2026, growing at a CAGR of 9.7%2. This substantial investment demonstrates the global commitment to enhancing security measures across all industries, including semiconductors, to combat the escalating threat landscape.New EDA Tools and Investments Needed to Combat Cyber Threats The adoption of new EDA solutions is essential, despite the initial costs. Costs can range from $100,000 to $1 million per license for general EDA design and verification tools, depending on the complexity and capabilities of the software. Pre-silicon security EDA tools can detect vulnerabilities early in the design phase, significantly reducing the risk of exploitation and the need for costly post-production fixes while enhancing product reliability. Secure-by-design principles ensure that security measures are integrated throughout the development process, rather than added as afterthoughts.Integrating these new tools also requires investment in training and potential adjustments to existing workflows. However, the improved security and efficiency provided by these tools can offset these initial costs.While the costs of acquiring advanced EDA tools and deploying them in the workflow is significant, the investment is justified by the long-term benefits of enhanced security and reduced risk of costly breaches. Secure-by-design practices can prevent significant financial losses from security breaches, offering substantial long-term savings. Companies that invest in robust security measures are better positioned to demonstrate market leadership and build customer trust and loyalty, while avoiding the reputational and financial damage associated with breaches.ConclusionThe semiconductor industry is at a critical juncture where the application of advanced EDA solutions for hardware security is not just beneficial, but essential. The time to act is now.The increasing sophistication of cyber threats and the financial repercussions of security breaches make it imperative for IP and SoC vendors to adopt advanced EDA security assurance solutions to secure their designs. By investing in cutting-edge EDA tools and prioritizing security from the earliest stages of design, vendors can safeguard their products, maintain market competitiveness, and protect against the ever-evolving landscape of cyber threats.References1. IBM Cost of a Data Breach Report 20242. KPMG 2024 Global Semiconductor Industry OutlookPavani Jella is the Vice President of Business Development at Silicon Assurance, a member of the Electronic System Design Alliance (ESDA) a SEMI Technology Community. Silicon Assurance specializes in hardware security assurance solutions. With a strong background in the semiconductor and EDA industries, Pavani plays a pivotal role in driving strategic growth and fostering innovative partnerships. Passionate about the intersection of technology and security, she helps organizations adopt state-of-the-art solutions that ensure the resilience and trustworthiness of their hardware systems.