Silicon carbide (SiC) has become a cornerstone of next-generation power electronics, driving advancements in electric vehicles, renewable energy, and industrial applications. After several years of rapid capacity expansion, the SiC industry is now entering a new phase focused on optimization, quality, and long-term scalability.This transition reflects a broader realignment across the global semiconductor ecosystem. As new fabs come online and supply chains mature, the industry is prioritizing stability, cost efficiency, and technical excellence over sheer capacity growth. SiC has moved from being a niche technology to a critical enabler of the energy transition, and this maturity demands not only investment in tools and materials, but also in process knowledge, cross-industry standards, and long-term partnerships that can sustain innovation at scale.To understand how this shift is unfolding, SEMI Europe spoke with Dr. Mark Puttock, Senior Director, Technology and Innovation at Entegris. Puttock shared his perspective on the industry’s evolution and how strategic collaboration and process innovation are shaping the next chapter of SiC manufacturing.From Ramp-Up to RefinementThe early growth of SiC manufacturing was driven by surging demand for high-efficiency power devices, particularly in electric vehicles. According to Puttock, that expansion period has given way to a new focus on yield, uniformity, and process control.The industry is entering a stage of maturity where success depends on optimization rather than scale alone. Improving consistency across crystal growth, wafer, and device fabrication is becoming just as important as adding capacity. This refinement phase calls for closer integration between materials science and manufacturing technology to ensure reliability and cost efficiency.A Focus on Process and Materials InnovationAs SiC moves toward high-volume production, challenges related to contamination control, defectivity, and wafer uniformity are taking center stage. Puttock noted that addressing these issues requires collaboration between materials suppliers, equipment manufacturers, and device makers.Efforts across the industry are converging on similar goals: enhancing purity, improving process repeatability, and developing new methods to enable larger wafer formats. Moving from 6-inch to 8-inch SiC wafers, for example, is widely recognized as a key step toward higher throughput and cost efficiency. Puttock emphasized that innovation in materials science and manufacturing technology must go hand in hand to support this scaling trend.Insights from Cross-Industry CollaborationA recent Entegris blog post featuring insights from Volkswagen Group Components and Porsche Consulting explores how SiC adoption is reshaping manufacturing strategies beyond the semiconductor industry. The post also highlights the strategy paper developed by Porsche Consulting in collaboration with Entegris. This joint effort demonstrates the value of aligning semiconductor-grade precision with automotive manufacturing demands. By sharing perspectives across industries, partners can accelerate best-practice adoption and strengthen the overall ecosystem for wide-bandgap technologies.Building a Sustainable FutureSustainability remains an integral part of this optimization phase. SiC devices themselves enable energy efficiency in end applications, but the way they are manufactured is equally important. Optimizing material use, recycling process consumables, and improving chemical delivery efficiency all contribute to a smaller environmental footprint. As production scales, attention to both performance and sustainability will be key to long-term success.Looking ForwardThe transition from expansion to optimization marks a pivotal moment for SiC manufacturing. Industry focus is shifting from building capacity to mastering control, quality, and resource efficiency. Puttock sees the future of SiC as one shaped by deeper digital integration, data-driven process development, and continued collaboration across disciplines. These advancements will help enable more consistent, sustainable, and cost-effective production—laying the foundation for the next generation of high-performance power devices.At the same time, Entegris continues to invest in materials science, contamination control, and advanced process technologies that help its customers overcome the complex challenges of SiC manufacturing. By combining technical expertise with a collaborative approach, the company plays an active role in supporting the industry’s transition toward more efficient and sustainable production.James Lam is Business Development Manager at SEMI Europe.

The semiconductor industry is undergoing a rapid transformation. Artificial intelligence (AI) applications, such as agentic and physical AI, push compute demands to unprecedented heights, prompting the semiconductor industry to push the boundaries of 2nm technology and beyond. Yet, as we move to these advanced semiconductor technology nodes, it has become increasingly challenging for academic research to remain closely connected with the fast-evolving industrial developments, limiting academic researchers in driving innovation. Europe’s NanoIC pilot line, a pioneering European initiative, hosted by imec, is addressing this challenge by offering pathfinding process design kits (P-PDKs). To cover the potential of these P-PDKs and their impact on Europe’s semiconductor ecosystem, we sat together with Professor Mehdi Tahoori (professor at Karlsruhe Institute of Technology) and Anita Farokhnejad (DTCO Program Manager at imec).SEMI: What exactly is a P-PDK, and how does it differ from traditional PDKs?Farokhnejad: At its core, a process design kit (PDK) is a software environment that enables circuit designers to simulate, validate, and optimize chip designs using realistic models of chip technology. Consider it a blueprint or a simulation toolkit allowing chip designers to explore performance, power, and manufacturability of a new chip architecture in a virtual sandbox. What sets P-PDKs apart is that they anticipate future technologies. Unlike traditional PDKs, which are based on existing technologies, P-PDKs are built on predictive models of future nodes and architectures. This allows researchers to explore system-level trade-offs, assess architectural implications, and prepare design flows before a technology reaches maturity. SEMI: Why are they so crucial for academia?Tahoori: For decades, academic researchers could contribute to semiconductor innovation using abstraction layers that allowed them to design and test new architectures without direct access to the latest technologies. This approach worked well until the industry reached the 20-nanometer node. At that point, the complexity of semiconductor design increased, with the introduction of advanced device architectures like FinFETs, nanosheets, Forksheets, CFETs, and novel integration solutions such as 3D stacking and chiplet integration.Transistor scaling in the AI eraTraditional abstraction models could no longer keep up with these advances, and the gap between academic research and industrial practice began to widen. This growing gap started to limit academia’s ability to participate in semiconductor paradigm shifts, such as CMOS 2.0 and new computing architectures. P-PDKs, enabled by the NanoIC pilot line, aim to bridge this gap, restoring the connection between academic thinking and industrial progress.SEMI: How does this support semiconductor innovation in Europe?Tahoori: Universities are ideally positioned to drive out-of-the-box innovation and invent new paradigms for computing. This is where universities truly excel. But to do that, they need access to the latest technologies and tools. We see for example a strong focus on the AI revolution and how the microelectronics industry is enabling that transformation. To meet the demands of AI applications and the computing power they require, we need to design new computing architectures based on advanced technology nodes. This is precisely the academic area of expertise. To design these new AI computing architectures, however, we need the most advanced technologies available. The P-PDKs for advanced nodes provided by the NanoIC pilot line now make this kind of research possible at universities. Something that was not feasible before.Additionally, the P-PDKs also provide an important reference technology and platform to benchmark and validate these innovations within a next-generation design roadmap. This means researchers can test their novel architectures against realistic process and performance metrics.SEMI: Are they only available for academia?Farokhnejad: The NanoIC P-PDKs are meant to be accessible to foster innovation across Europe’s semiconductor ecosystem. These advanced PDKs are therefore also available to European research organizations, startups, and industry partners. Access is facilitated through Europractice, where eligible users can apply by signing a Design Kit License Agreement (DKLA). Once approved, they gain access to the PDKs.SEMI: What other technology nodes are NanoIC’s PDKs addressing?Farokhnejad: The first P-PDK was released in June (first version of the N2) and supports frontside and backside routing with TSVM, standard cell libraries, and multiple VT flavors for early-stage design exploration. Upcoming releases include new versions of the N2 P-PDK, as well as A14 and A7 PDKs, eDRAM and SOT memory PDKs, and advanced interconnect solutions such as redistribution layers (RDL), hybrid bonding, and interposers.Those interested in learning more about the NanoIC ecosystem and the research enabled by the P-PDKs can meet representatives and partners of the NanoIC pilot line during SEMICON Europa, November 18-21 at booth C2417 in Messe Munchen. More information about the initiative is also available on the NanoIC website.BiosMehdi Tahoori, Professor Chair of Dependable Nano-Computing - Karlsruhe Institute of Technology Mehdi B. Tahoori is Professor and Chair of Dependable Nano-Computing at the Karlsruhe Institute of Technology (KIT), Germany, and guest professor at imec, focusing on CMOS 2.0 and future chip technologies. He previously worked at Xilinx (USA), Fujitsu Labs (USA), and served as a junior professor at Boston Northeastern University (USA) and as a visiting professor at the University of Tokyo (Japan). He earned his B.S. from Sharif University (Iran) and M.S./Ph.D. from Stanford (USA). Prof. Tahoori is Deputy Editor-in-Chief of IEEE Design and Test Magazine, is a former Editor-in-Chief of Elsevier Microelectronic Reliability and has chaired major IEEE symposia. His honors include multiple best paper nominations and conference awards, the US National Science Foundation Early Faculty Development (CAREER) Award (2008), an ERC Advanced Grant (2022), and an IEEE fellowship.Anita Farokhnejad, DTCO Program Manager - imec Anita Farokhnejad earned her PhD from Universitat Rovira i Virgili (Spain), specializing in FEOL and device modelling. She joined imec in 2021 as an R D Engineer, focusing on BEOL optimization and future roadmap development. Collaborating closely with integration and physical design teams, she develops models for PnR data analysis and BEOL optimization. Her recent work on the enhanced Ring Oscillator (eRO) model aids in the early assessment of new materials and BEOL boosters. In August 2023, she advanced to team lead for PDK Enablement, translating advanced semiconductor nodes into Pathfinding-PDKs. Farokhnejad is also dedicated to education, conducting courses that make sophisticated technological concepts accessible to both industry veterans and aspiring engineers. Currently, she serves as Program Manager of DTCO at imec, where her contributions continue to drive innovation in the semiconductor industry.AcknowledgementThis work was enabled by the NanoIC pilot line. The acquisition and operation are jointly funded by the Chips Joint Undertaking, through the European Union’s Digital Europe (101183266) and Horizon Europe programs (101183277), as well as by the participating states Belgium (Flanders), France, Germany, Finland, Ireland and Romania. For more information, visit https://www.nanoic-project.eu.DisclaimerFunded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or Chips Joint Undertaking. Neither the European Union nor the granting authority can be held responsible for them. SEMI ContactJames Lam, Business Development ManagerEmail: [email protected]

Every November, the U.S. pauses to honor those who have served our nation—the men and women whose dedication, discipline, and teamwork have safeguarded our freedom. The best way to thank veterans is not just with words. It’s with action.In the semiconductor industry, that action means creating pathways for veterans to build meaningful civilian careers where their skills, experience, and values are not only recognized, but celebrated. Through SEMI Foundation’s VetWorks initiative, companies across the industry are doing just that, working together to raise awareness, share best practices, and open doors for the military community.Through VetWorks, SEMI is proud to help veterans find new purpose in powering the technologies of tomorrow. And as more employers recognize the unmatched value of veteran talent, the industry will continue to grow stronger technically, strategically, and culturally.Why Veterans and Semiconductors Are a Natural MatchVeterans bring the kind of precision, accountability, and technical excellence that drive the semiconductor industry forward. From operating complex systems to leading diverse teams under pressure, veterans possess the same qualities that make this industry thrive.Kathy Garner, Director of Talent Acquisition at TEL (Tokyo Electron), notes:“Veterans are well-versed in cutting-edge technology. Today’s military is high-tech, state-of-the-art, and computer-based. Veterans are uniquely matched to our industry as their jobs are highly technical and safety-conscious; they appreciate guidelines, follow directions, and possess a strong sense of team.”This alignment of skills and culture makes veterans not just excellent employees, but invaluable contributors to the semiconductor industry’s mission of powering innovation and national competitiveness.Turning Appreciation into OpportunityAcross the VetWorks Employer Group, companies are transforming gratitude into action by recruiting, training, and supporting veterans and reservists as they transition to civilian careers.“I participate in VetWorks because I believe the brave men and women of our military deserve support and opportunities if they choose to enter the civilian workforce,” said Katie Maloney, Business Line Manager at Edwards Vacuum. “They have sacrificed for our country, and we can help connect them to a rewarding career in the semiconductor industry. This transition is often stressful for military members and their families, despite the fact that veterans are ideally suited for the many roles our industry needs to fill. As a Navy veteran, participation is a small way for me to pay it forward.”“The semiconductor industry is full of veterans,” said Curtis Geroy, Manager of Military Talent Acquisition at Applied Materials and a U.S. Navy Reserve Officer. “Serving as a reservist and having leaders who understand my commitment to duty gives me the extra support needed to meet my reserve obligations.”These stories reflect what’s possible when companies don’t just honor veterans but invest in helping them translate their service into purposeful, future-ready careers.An Industry-Wide EffortMany leading employers are already stepping up and partnering through SEMI VetWorks, including Applied Materials, ASM, ASML, Edwards Vacuum, EMD Electronics, Entegris, KLA, Lam Research, Micron, Polar Semiconductor, TEL, TSMC, and Western Digital, among others.Together, they form a growing network of organizations committed to building awareness within the military community, connecting veterans to open roles, and ensuring every company in the semiconductor ecosystem is ready to support them.Through joint events, outreach to bases, storytelling, and shared best practices, the VetWorks Employer Group is showing that this isn’t just a workforce initiative, it’s a movement to strengthen the entire industry while honoring those who have served.Join the EffortThis Veterans Day, let’s remember: saying “thank you” is important, but hiring, supporting, and championing veterans is even more meaningful.If your company is looking to start or grow its veteran hiring and support programs, SEMI VetWorks can help you connect with partners, share resources, and build sustainable pathways for veterans into your workforce. Download the Employer’s Guide to Military Hiring, learn more and get involved in the SEMI VetWorks initiative. Melinda Gomez is Manager of Military Initiatives at the SEMI Foundation.

Last month, leading-edge equipment company ASML announced a surprising €1.3 billion investment into French AI company Mistral. The two companies touted stronger collaboration and the desire to “innovate faster together.” Even though some observers were skeptical, the commitment of one European tech champion into an aspiring European tech firm in the world’s hottest industry made plenty of sense. Writing for Bloomberg, columnist Lionel Laurent noted that such a deal was “a win for Europe’s tech ambitions” and that Mistral would have increased credibility in an AI race dominated by the United States and China.Europe’s tech prowess indeed lags behind its global rivals. ASML is, perhaps surprisingly (or not, depending on your vantage point), Europe’s largest tech giant by market cap at $406 billion. Europe boasts no tech goliaths the size of Amazon or NVIDIA and is often left following the lead of American tech firms as they chart the commercialization of new technologies. In the semiconductor industry, Europe’s chip manufacturers comprise only 9% of global market share today compared to 44% in 1990. Despite the bleak reality that Europe’s tech ecosystem finds itself in, there are reasons to believe that the nadir of recent years is slowly giving way to a more robust and respected innovation landscape. This piece will focus specifically on semiconductor manufacturing, demonstrating how Europe is taking its technological future seriously, and how, despite the challenges that remain, ultimately Europe is poised to succeed.Three Shocks – How We Arrived At This MomentThough Europe may not have been satisfied with the technological balance of power of recent decades, such an arrangement was largely tenable in a globalized world which prioritized free markets and international security in the aftermath of the Cold War. Though numerous cracks appeared in previous decades, the last five years in particular have given way to three shocks which have awoken European policymakers.The first, of course, was the COVID pandemic and the decimation of supply chains that caused a rapid seesaw in chip inventories – from extreme shortage to extreme oversupply – that companies in the automotive and industrial sector are just now recovering from. One senior German official was quoted as saying, “We lost 1-1.5% of our GDP in 2021 because of a lack of semiconductors – or about €40 billion.”Only two years later would come Russia’s unthinkable invasion of Ukraine, an unwelcome new reality which has forced Europe to reckon with its defense posture and supply chain. Semiconductors, again, play a key role here – Europe is reliant on China’s legacy chip production, meaning that low-tech chips often find their way into strategic weaponry.Lastly, a second Trump administration has surprised and rallied European governments to respond to “America first” rhetoric. Combined with the aforementioned shocks, recent events have convinced even Europe’s most ardent globalists that the continent must now invest where necessary in order to protect its borders and foster a competitive and sovereign technology ecosystem.The Underwhelming Response So FarFast forward to today where Europe’s COVID supply chain disruptions quickly gave way to ambitious policy in the form of the €43 billion European Chips Act intended to stimulate private investment to complement public capital and push Europe’s chip manufacturing market share to 20%. In the more than two years since the legislation’s passing, however, announced projects have underwhelmed. Big splashes from Intel and Wolfspeed have failed to materialize due to overambitious market expectations. Today, you can almost count the key recipients on one hand – STMicroelectronics, Infineon, TSMC, GlobalFoundries, Silicon Box, and amsOSRAM.Despite the sense of cynicism from some corners, however, understanding the slow progress to this point helps to unlock the right strategies moving forward. Already, many industry stakeholders and policymakers have questioned if attracting manufacturing full stop is the right strategy. Peter Wennink, former CEO of ASML, called the European Commission’s target to secure 20% of the global chip market by 2030 “totally unrealistic,” emphasizing that Europe’s current share is “8% at best.”Even if Wennink’s conclusion is too harsh, the tangible lack of investment over the past couple of years paired with the urgent need for Europe to maintain and grow its semiconductor prowess in response to concerns of security and sovereignty still demands a workable solution. The answer lies in building upon Europe’s very real strengths in the chip industry, narrowing the scope of investment to key strategic areas and in continuing to prioritize collaboration at all costs. How Europe Can Still Meet The MomentAny conversation about Europe’s contributions to the global semiconductor industry should begin with its unparalleled research ecosystem, and there’s no better place to start than with Belgium’s imec, one of the foremost research institutions chip companies depend on. Earlier this year, imec’s President and CEO Luc Van den hove emphatically reminded his audience that “you can’t make an advanced chip without European technology.” Van den hove’s point was that Europe should be leaning into its strengths as a research powerhouse rather than trying to chase leading-edge nodes. The FAMES Pilot Line is one example of what that research prowess looks like in practice. Funded with €830 million via the EU Chips Act, the initiative brings together Europe’s leading research institutions (imec, Fraunhofer, CEA-Leti, and Tyndall) to develop open access to several key microelectronic technologies, with a strong emphasis on low-power applications for markets such as automotive, IoT, and mobile devices. Central to FAMES is its “open access” policy which enables European manufacturers to use its pilot line to develop prototypes and evaluate next-generation technologies. Chip companies without any manufacturing presence in Europe stand on the outside looking in, risking technological inferiority.While Europe flexes its academic prowess, however, it is increasingly recognizing its vulnerability when it comes to more mature-node technologies and production. Investments such as ESMC – TSMC’s joint-venture with regional champions Bosch, Infineon, and NXP – are a good start, but Europe fundamentally needs more mature tech, particularly for defense. In a recent piece for Foreign Affairs Magazine, authors Chris Miller and John Allen argued that Europe indeed has a promising semiconductor opportunity ahead of it, but only if it enhances cooperation with the United States. The fact that the two regions have similar goals and geopolitical rivals is an opportunity for Europe to attract greater chip investment from U.S. firms looking for Europe’s leading research capabilities and defense customers. The authors implore European policymakers to:“ensure that their chip companies can capitalize on the surge in defense spending by investing more in new defense technologies and fostering connections between large chip firms and small defense start-ups. European chip companies that have previously focused on civilian markets must realize that the defense industry, and particularly the drone sector, will drive growth and technological change.”Targeting these investments intelligently remains to be seen, but there can be no doubt that Europe is taking the funding challenge seriously. Germany, France, Italy, and the United Kingdom have all raised their defense spending as a percentage of national income, with Germany announcing plans to double its defense spending to €650 billion over the next five years.Securing Position In Europe's Semiconductor RenaissanceEurope’s semiconductor future will not be built by mimicking Taiwan’s fabrication prowess or outspending America’s subsidies. Instead, success lies in doubling down on what Europe already does exceptionally well – world-class research infrastructure, strategic positioning in mature and specialty nodes, and an increasingly robust defense industrial base hungry for secure semiconductor supply. As European chip subsidies continue and defense budgets surge across the continent and geopolitical fractures deepen, the strategic calculus is clear – semiconductor companies without meaningful European capacity risk ceding ground to competitors who recognized the shift early. The question is no longer whether Europe matters in the global chip ecosystem, but rather which companies will position themselves to capitalize on its inevitable growth.About Stephen M. RothrockStephen Rothrock founded ATREG in 2000 to help the world’s advanced technology companies divest and acquire infrastructure-rich manufacturing assets, including wafer fabs (front- and back-end) as well as MEMS, solar, display, and R D facilities. Over the last 25 years, his firm has completed 40% of all global operational wafer fab sales in the semiconductor industry, a total of 60 transactions. Recent global acquisitions and dispositions have involved Allegro MicroSystems, Bosch, Elmos, Fujitsu, GlobalFoundries, IBM, Infineon, Japan Display (JDI), Micron, NXP, onsemi, Qualcomm, Renesas, Sony, Texas Instruments, and VIS to name just a few. Prior to founding ATREG, Rothrock established Colliers International’s Global Corporate Services initiative and headed the company’s U.S. division based in Seattle, WashBefore that, he worked as Director for Savills International real estate brokerage in London UK, establishing their global corporate services platform serving large multinationals, many of whom were leading technology companies. Rothrock also served on the UK-listed property company’s international board. He spent four years near Paris, France working for an international NGO. Rothrock holds an MA degree from the University of Hull, UK and a BA degree in Business Commerce from the University of Washington in Seattle, USA.

Maheen Hamid is a co-founder of Breker Verification Systems, supplier of functional verification solutions for complex chip design challenges, and serves as its COO and CFO. She is also Co-Chair of the ESD Alliance and member of the SEMI North America Advisory Board (NAAB).Given her background, roles within the industry and interests, it seemed like a good time for me to reach out for her perspective and market analysis. During our discussion, she offered up some great observations, identified trends, pointed to areas in need of attention and ways for the industry to better collaborate. We ended by talking about AI’s role today.Smith: How do you track where the semiconductor industry is going?Hamid: Business and macro strategies have always been interesting to me. In recent years, with the increasing global importance of silicon sovereignty, it is necessary to track the pulse of initiatives across various channels in multiple geographies. Starting with policy discussions at SEMI to media coverage of the semiconductor value chain to EDA specific news, I read voraciously and listen in on disparate discussions. There is no denying that it is impossible to envision the boundaries of where the semiconductor industry could go, particularly in design innovation. Smith: Nonetheless, what trends have you identified?Hamid: Global trade wars are creating as many roadblocks as they are creating opportunities. It is fascinating to watch the incredible innovation led by the U.S. for decades in semiconductor design be challenged as technology and access to technology gets democratized across the board. Maintaining thought leadership is a demanding task and no longer contained to an individual company’s cleverness. Crafting an effort that is coordinated with national interests has become compulsory. Separately, developments in AI are creating a new wave of complex chip designs that are redefining hardware investments. Data centers are becoming as ubiquitous as the personal computers of the ‘80s. While advanced chip designs forge ahead and additional classes of chips such as memory become truly commoditized, the need for efficiency in the full flow from design to manufacturing becomes imperative to protect margins for relevant players.Smith: The need for industry collaboration appears to be a trend that is an essential part of the industry’s evolution. How do you see that developing in chip verification?Hamid: RISC-V has given rise to many new design starts by companies that do not have the legacy verification frameworks owned by the NVIDIAs and Intels of the world. Several of these larger customer companies are investing heavily in their own complex chip designs, creating interesting opportunities for a collaborative approach to enabling internal innovations. As well, this new class of customers is less married to enterprise flows from large EDA companies and prefer to invest in best-of-breed solutions. This is driving necessary collaborations across EDA vendors in chip verification. Driven by mutual customer demand, we have recently modified several of our arrangements with other EDA players.Interestingly, the momentum in the RISC-V ecosystem is also driving new initiatives in the more traditional flows. This is a necessary shake-up in how business needs to be done in an increasingly, globally competitive landscape. Smith: What area do you see that needs more attention?Hamid: It is imperative to keep the business climate conducive for innovation and thought leadership. Policy debates impacting the chip industry are getting more heated and controversial. We need more concerted collaboration among the players in the chip ecosystem to help influence this policy in a way that allows U.S. companies to thrive. We need to promote more opportunities that bring disparate companies together to build clever flows that increase our silicon sovereignty. Smith: AI is playing in the design and design tools area. What about other parts of an organization, such as finance or operations and marketing?Hamid: AI efficiencies can help with predictive analysis for large companies in these core functions such as finance, operations and marketing, but for smaller, nimble companies, the human element still rules. Our strategic marketing, as an example, is defining industry-leading initiatives. AI does not have access to language models to automate any of what we need to invent in communicating new ideas. LLMs do provide a good sounding board though. It’s interesting to “discuss” ideas with ChatGPT and pull templates of successful implementations in unrelated industries that could be a blueprint for how we approach next steps.About Maheen HamidMaheen Hamid is the co-founder CFO and COO at Breker Verification Systems, bringing a wealth of financial engineering experience from investment banking and small business management. Hamid has been instrumental in establishing Breker as an important stakeholder in the EDA industry, running its business side and driving operational growth as it thrives as an established software supplier. She plays an active role in defining the company’s strategic direction, corporate communications and branding. Hamid holds a BBA from North South University and an MBA from the University of Texas at Austin.Robert (Bob) Smith is executive director of the ESD Alliance, a SEMI Technology Community. 

The 2025 SEMICON West Market Symposium brought together leading analysts and strategists to decode the powerful forces shaping the global semiconductor market. Building on last year’s focus on fabless growth and workforce initiatives, this year’s sessions centered on the rising influence of geopolitics, trade policy, and AI-driven investment. Experts from SEMI, Integrated Insights, Boston Consulting Group, Kearney, PwC, WSTS and TechSearch shared perspectives on how global shifts from tariffs to technology races are redefining supply chain resilience and regional competitiveness.On October 6 in Phoenix, Arizona, Clark Tseng, Senior Director of SEMI Market Intelligence, hosted the symposium and presented along with industry experts on the current trade environment from various angles. Discussions ranged from the effects of U.S. tariffs across the globe, to sector-specific considerations and market growth areas. US Trade Dynamics in Semiconductors As the geopolitical landscape in the U.S. becomes more complex, Iacob Koch-Weser, Associate Director, Global Trade Investment at Boston Consulting Group outlined the impact that tariffs are having on the U.S. industry. The average American tariff, he said, is higher than any time in the last 75 years. Although the semiconductor industry is less affected by high tariffs than other sectors, Koch-Weser noted that might change with the administration’s expanded Section 232 Tariff that imposes 50% tariffs on steel, aluminum, and their derivatives on nearly all trading partners. To explain, he described four potential Section 232 tariff scenarios, underscoring limited Section 232 enforcement as the ideal approach.Tariffs may be deprioritized in favor of chips incentivesThere may be targeted carveouts for alliesThe administration may impose high tariffs with limited exceptionsThere may be a 100% tariff rate To cope with tariff uncertainty, Koch-Weser recommended that companies consider reshaping policies, mastering trade compliance, and reconfiguring supply chains if possible. He also shared four potential outcomes for the future of U.S. trade that could take effect within the next 18-24 months. The U.S. may run its own system while the rest of the world aligns to World Trade Organization (WTO) rules.North American countries may form a stronghold, leaving all other countries to choose between the North American alliance and WTO standards.Countries may form new blocs and preferential agreements, creating multiple economic spheres worldwide.Global cooperation could break down, forcing countries to fend for themselves.With everything considered, he reinforced that the U.S. is still an attractive place for semiconductor investment. The current administration, he said, recognizes the importance of bringing advanced technologies back to the U.S. Navigating Uncertainty: AI-Driven Growth and the U.S. Semiconductor Manufacturing RenaissanceContinuing discussions on tariffs, SEMI’s Clark Tseng painted a picture of the current U.S. semiconductor industry. He divided his presentation into four key areas: near-term economic uncertainty, AI changes everything, semiconductor market equipment forecast, and material market outlook.Near-term economic uncertainty: U.S. tariff policies are contributing to inflationary pressures and altering global trade patterns, leading to cross-border uncertainty that is slowing investment. U.S. tariff revenue, he said, has expanded from $7 billion in January 2025 to $29.5 billion by August, forcing companies to sacrifice margins to compensate. AI changes everything: By 2030, Tseng noted that nearly half of the semiconductor industry’s capital expenditure will be driven by AI, pointing to sustained growth in AI-driven cloud infrastructure spending through 2028 forecasts. AI is also moving beyond data centers into edge computing and endpoint devices.Semiconductor market equipment forecast: Tseng reported that the outlook for the equipment market remains strong over the next three years. However, the biggest risk to the market is a potential slowdown in AI investment and adoption. Additionally, U.S. export controls and changes in regional supply chains present some challenges. Last year, China was the largest market for semiconductor equipment, but Tseng expects continued normalization amid broader market adjustments. Taiwan and South Korea experienced the strongest year-over-year growth, driven by demand for AI chips and high-bandwidth memory (HBM). Material market outlook: Silicon wafer shipments grew strongly in Q2 of 2025, but Tseng flagged this as unexpected and cited tariffs as a possible explanation. He noted the 300mm wafer segment is expected to grow 7% in 2025, while 200mm is projected to decline. The total wafer material market, he said, is also expected to grow by 6% this year. Additionally, wet chemicals experienced a 16% expansion in 2025, while silicon wafers, photolithography materials, and CMP materials are in recovery. Semiconductor Market – Status Outlook Tobias Pröttel (or Proettel), CEO of World Semiconductor Trade Statistics (WSTS), reported that the industry’s rebound remains firmly on track, with the latest WSTS statistics confirming a 19% year-over-year increase in global semiconductor sales during the first half of 2025. Total revenue reached $346 billion over the period, supported by strong demand for AI-driven infrastructure and next-generation data centers. Based on this solid first-half performance, WSTS has raised its full-year 2025 forecast to $728 billion, representing 15% annual growth, and now expects the market to reach around $800 billion in 2026, keeping the industry on course toward the $1 trillion milestone before the decade’s end.Logic and Memory continue to lead the expansion, driven by GPUs, AI accelerators, and high-bandwidth memory (HBM), while other product categories are showing steady recovery after the recent downturn. Pröttel noted that this growth is not confined to a single region: the Americas, China, and Asia Pacific are all posting double-digit gains, reflecting strong global momentum across the semiconductor value chain.Strategic Approaches to Semiconductors by Major Economies Following Pröttel, Kearney’s Vice President, PERLab, Sanjay Kumar outlined the semiconductor investment climates in South Korea, Japan, Taiwan, and India. South Korea is currently focused on maintaining its lead in memory, diversifying into logic, localizing its supply chain, developing advanced packaging capabilities, and investing in startups. Kumar also noted the Korean approach of offering loans, as opposed to the U.S. strategy of providing direct grants. In addition, Kumar said the Korean government plays an active role in how it wants its companies to grow, whereas the U.S. takes a more passive approach in this regard.Japan is also honing its leadership in key areas like materials and memory, and Kumar also pointed to the country’s efforts to build additional advanced packaging capacity. Japan, he said, aims to grow its industry though a mix of grants, loans, and tax credits. Among the country’s notable subsidies include a 50% subsidy for TSMC – its largest so far – as well as a $4 billion subsidy for Rapidus. Taiwan’s semiconductor industry is critical for protecting its national security. As a region with limited land, power, and water, Kumar noted that Taiwan is currently focused on developing its talent base. Its government is offering tax credits for R D and equipment and up to a 50% cost share for R D projects. India, he said, has one of the most ambitious incentive programs in the world. Through its India Semiconductor Mission (ISM), the country offers a 50% federal subsidy, in addition to a 20-30% state subsidy in its quest to cover the entire semiconductor ecosystem. Kumar also spotlighted some of India’s successes – like the joint venture between Renesas, CG Power and Industrial Solutions, and Stars Microelectronics – to build a new OSAT facility.Adapting to New Policy and Navigating the U.S. Semiconductor Landscape – Insights from Taiwan Taiwan is a critical trade partner of the U.S., ranking fourth in total trade volume as of July 2025. With Taiwan’s stronghold on the U.S. chip ecosystem, Paul Poliakov, Senior Manager, International Tax Services, CPA at PwC Taiwan detailed both the bottlenecks and developments regarding Taiwan companies’ investments in the U.S. Among the investment bottlenecks he highlighted were higher costs of building facilities in the U.S., multiple layers of compliance requirements that may be intimidating for new market entrants, and complex visa and tax regulations. In addition, Section 232 investigations on semiconductors are ongoing, with several potential policy changes that could take effect. The pending United States-Taiwan Expedited Double-Tax Relief Act could help ease burdens, he said, but it has yet to pass in the U.S. Senate as of October 2025. If it passes, it will integrate benefits for Taiwanese individuals and businesses into the U.S. tax code, which could substantially benefit Taiwanese investment in the U.S., including manufacturing, services, distribution, and a wide variety of other industries. Furthermore, Poliakov suggested that businesses maintain flexibility in their investment strategies, engage with U.S. state and local governments that can offer investment incentives, and work with professionals to ensure regulatory compliance. Geopolitical Shifts in Advanced Packaging AssemblyIn the final presentation of the 2025 Market Symposium, Jan Vardaman, Founder and President of TechSearch International provided an overview of the current advanced packaging market. Although advanced packaging represents the highest growth area in the industry, Vardaman highlighted that packaging complexity is also soaring. R D, testing, and equipment support infrastructure, she said, are becoming more critical for meeting future packaging needs. Even though assembly is mostly done in Asia, new U.S.-based advanced packaging facilities from Amkor, TSMC, and others represent signs of change. Still, Vardaman noted that the U.S. has almost no capability to produce advanced IC substrates using build-up film, which are needed to support high density applications. In addition, she highlighted that building more silicon fabs on U.S. soil won’t solve its national security or supply chain concerns.For the U.S. to create a sustainable packaging ecosystem, Vardaman concluded that support of assembly facilities is crucial. Ultimately, businesses must be willing to pay more for U.S.-based packaging in favor of potential supply chain resilience and national security benefits. SEMI would like to thank all speakers, sponsors, and attendees for the success of this year’s Market Symposium. Explore the latest SEMI Market Intelligence reports, covering historical reporting, actionable foresight into emerging trends and technology investments to make confident, forward-looking decisions across the semiconductor and microelectronics value chain.Clark Tseng is Senior Director, Market Intelligence Team at SEMI. Nishita Rao is Director, Product Marketing at SEMI.

SEMI has submitted comments to the U.S. Department of Commerce’s Bureau of Industry and Security (BIS) in response to its Section 232 National Security Investigation of Imports of Robotics and Industrial Machinery.The submission highlights the vital role robotics and precision machinery play in semiconductor fabrication, packaging, and inspection and emphasizes the need for a balanced, risk-based approach to any future trade actions that strengthen U.S. national security while preserving access to robotics and industrial machinery essential to expanding the domestic semiconductor industry. SEMI RecommendationsSEMI outlined five key recommendations to the Administration.Encourage Investment and Maintain Existing Competitiveness. SEMI recommends excluding essential robotics and industrial machinery where domestic sourcing is not yet viable. If trade actions are taken following the investigation, SEMI recommends providing tariff reductions or waivers for companies investing in U.S. manufacturing capacity. SEMI emphasized protecting small and medium suppliers that keep the ecosystem running.Avoid Stacking Tariffs. Coordinate Section 232 actions across potentially overlapping actions and ongoing investigations, such as on imports of steel and aluminum, semiconductors, critical minerals, and polysilicon. This will help prevent duplicative or compounding tariffs that could raise costs and slow U.S. capacity building.Implement Adjustment Periods and Sunset Provisions. SEMI recommends any trade actions should phase in gradually to allow for domestic adaptation and include regular review mechanisms to recalibrate as the market evolves.Pair Trade Actions With R D, Workforce, and U.S.-Allied Collaboration. Strengthen domestic capacity through targeted federal research and development (R D) programs, workforce training, and deeper partnerships with trusted U.S. allies to build resilient technology ecosystems.Develop a National Robotics Strategy. Given robotics’ foundational role across semiconductor and advanced manufacturing sectors, SEMI recommends that the Administration develop a National Robotics Strategy. The strategy should align federal programs including those at NIST, NSF, and Department of Energy to accelerate robotics innovation, update technical standards, and drive U.S. leadership in automation and manufacturing competitiveness.The Global ContextWorldwide installations of industrial robots surpassed 540,000 units in 2023, with the market projected to exceed $73 billion in 2025.Robotics and industrial machinery are integral to semiconductor production ensuring cleanroom integrity, precision, and throughput. Broad or overlapping tariffs could raise costs and undermine U.S. competitiveness at a time when historic investments in domestic semiconductor manufacturing are taking hold.Next StepsSEMI looks forward to working with the Department of Commerce and other federal partners to ensure that Section 232 policies enhance both U.S. national security and the industry’s global competitiveness.Read SEMI’s full submission on Regulations.gov by searching Section 232 Investigation of Imports of Robotics and Industrial Machinery (XRIN 0694-XC138).Visit SEMI Global Advocacy to learn more about public policy efforts and developments as well as how your company or organization can get involved.Marc Coldiron is Director, Global Public Policy Advocacy at SEMI.

This year’s SEMICON West brought together industry experts from around the world to share insights on three of today’s most pressing topics: geopolitics, sustainability, and the semiconductor supply chain. From October 7-8, leaders from each field offered updates during SEMICON West’s Executive Panel Series, with each topic explored in its own hour-long session.Strategic Silicon: Geopolitics Shaping the Future of Semiconductors SEMICON West’s Executive Panel Series began on Tuesday, October 7, with a discussion on today’s geopolitical ecosystem and its impact on the semiconductor industry. Speakers compared the U.S. semiconductor landscape with China’s, highlighted supply chain strategies to mitigate disruption, and defined what it means to “win” the AI race. Mackenzie Hawkins from Bloomberg News moderated the panel, which featured Vince Jesaitis from Arm, Frank Heemskerk from ASML, Olivier Blachier from Entegris, Sarah Kemp from Intel, and Rich Ashooh from Lam Research.First, the panelists mentioned the U.S. CHIPS Act and the legislation’s attempt to diversify the semiconductor supply chain. Jesaitis added that countries are prioritizing supply chain resiliency, to which Kemp pointed to rising customer willingness to pay premiums for stronger supply chains. But what does it take to strengthen a supply chain? According to the panelists, a prevailing approach has been to regionalize operations. More regionalized supply chains can better withstand policy changes overall, but Ashooh noted that government regulations often can’t keep pace with innovation demands. China, in particular, may have key advantages in this respect. “The U.S. remains the most innovative environment in the world,” said Ashooh. “But if the Chinese government declared something a priority, the support will be there for it.” He also mentioned this arrangement allows China to advance in spurts.Kemp also stated that even with U.S. innovation and government incentives, the country faces longer construction times and greater policy complexity. Meanwhile, China is doubling down on its industry with resources and clear intent. Ashooh also added that China has more leverage in 2025 than it did during the first Trump administration. To address this, the panel recommended policy refinement to make U.S. trade relations more seamless. Furthermore, Heemskerk stated that the best government policies are often boring, advising governments to be predictable and reliable.The discussion concluded with mention of the AI race. Amidst discussion about what it means to “win,” Ashooh offered a simple explanation. Winning, he said, is seeing only customers in front of you instead of competitors. Sustainability Panel: Path to Success—The Semiconductor Industry Leads the WayAfter the Geopolitics panel, the stage swiftly transitioned to a new discussion centered on sustainability. Speakers included Elena Kocherovsky from Applied Materials, Beth Elroy from Micron, Joshua Kang from Qualcomm, and Sanchali Bhattacharjee from Google. SEMI’s Mousumi Bhat moderated this session.It may come as no surprise to learn that sustainability is reaching a critical juncture. According to the Climate Clock, the world has just under four years to address climate change before it becomes irreversible. Bhat pointed to this figure, emphasizing the mounting importance of industry-wide collaboration to make a tangible difference. With such a tight window for change, the panelists explained what’s being done to address these issues. Using AI to strengthen climate data, for example, came up several times. For instance, Sanchali mentioned that AI can bring in new data parameters to solve issues much faster. “We’re sitting at an inflection point where we have to harness the power of data,” she said.Elroy also shared opportunities to replace aging infrastructure with more sustainable equipment, as well as creating products that consume less energy from the start. However, distraction from climate goals is still a significant risk. Kocherovsky highlighted the industry’s limited resources, underscoring the importance of allocating them to efforts that move the needle. She cited clean energy adoption, noting that 80% of the industry’s emissions come from electricity. Fortunately, mitigation efforts are underway. Kang pointed to Qualcomm’s sponsorship of AI-powered air quality monitoring devices in Thailand, while Kocherovsky also touched on Applied Materials’ new sustainability projects. These efforts, while substantial, are nowhere near exhaustive. Tangible work is being done across the entire semiconductor ecosystem to make its solutions more sustainable, but it’s only the beginning. Charting the Course: Futureproofing Your Supply ChainsAs supply chain security has risen in priority, Wednesday’s panel detailed the industry’s efforts to strengthen it. Although COVID-19 exposed the urgent need for more resilient semiconductor supply chains, core issues have existed long before then. To explore this topic, I engaged speakers from across the value chain, including EMD’s Steven Johnston, AltaScient’s Rekha Menon-Varma, GlobalFoundries’ Roger Kao, Polar Semiconductor’s Surya Iyer, and Cisco’s Aman Aflaki. Today’s supply chain risks are enormous. From geopolitical tensions to natural disasters and cybersecurity threats, the semiconductor supply chain must withstand several intense and ongoing conditions. Because of this, the panel stressed the importance of early warning awareness and building buffers to counter setbacks. Creating buffers, Aflaki said, leads to necessary redundancies like using digital twins when feasible or engaging with second-and third-tier suppliers. Today’s customers, he said, also tend to be more focused on resilience and risk management rather than cost. Another emerging risk management solution is to use AI to build scenario models before incidents happen. As AI technology advances, companies that adopt it sooner rather than later could gain a competitive advantage. Johnston also added that AI could lead to more efficient R D and material sourcing. In addition, the panel pointed to the growing worldwide shift to regionalize supply chains. Menon-Varma highlighted that each country is approaching this in its own way, with many new global partnerships arising due to U.S. tariffs and export controls. Kao also reinforced today’s “local-for-local” supply chain trend.Finally, the panel ended with a discussion on collaboration. Although most leaders cite collaboration as crucial for the industry’s future, Johnston noted that working together is often halted by IP concerns. To address this, Iyer pointed to organizations like SEMI that unite key players to solve industry-wide problems.SEMI would like to thank all speakers, sponsors, and attendees for the success of this year’s Executive Panel Series. Bettina Weiss is Chief of Staff Corporate Strategy at SEMI.

SEMICON West 2025 marked a year of many milestones. Not only was it the first SEMICON West ever to take place outside of San Francisco Bay Area, but it was also its largest exhibition in over 18 years. This year saw a 45% increase in booths, along with a 60% surge in registrations over 2024. The CEO Summit Keynote Series also returned to SEMICON West, featuring 14 unique presentations from October 7-9 at Arizona’s Phoenix Convention Center. Top leaders from both government and industry shared insights on a range of pertinent topics, from technology innovations, to emerging partnerships, sustainability and supply chain initiatives, and more. The keynote series began with opening remarks from SEMI’s President and CEO, Ajit Manocha, who urged audience members to focus on strategies that drive the industry forward and reinforced the importance of collaboration. He also outlined SEMI’s current priorities, including mitigating talent shortages, environmental disruptions, and geopolitical volatility.For those who missed the CEO Summit Keynote Series, this blog offers a summary of each presentation. The State of Arizona“In Arizona, vision becomes opportunity, and opportunity becomes action.” – Katie HobbsSEMICON West’s keynote series kicked off with Arizona Governor, Katie Hobbs, who underscored the expansive growth of Arizona’s semiconductor industry. She highlighted TSMC’s $165 billion investment in Arizona, the largest foreign direct investment in the state’s history, as well as more than 60 other semiconductor expansions that have taken place in the state. There are several reasons, Hobbs said, why Arizona has become an attractive place for semiconductor companies. The local talent base is one, with Arizona ranking among the top five states in the country in this area. Hobbs also highlighted Phoenix’s reliable energy grid, pro-business climate, and 100-year plan for water.AI in Every Layer: Future-Ready Strategies for Technology and Talent“This much disruptive innovation can’t be done by any one company. It requires a broad collaboration ecosystem.” – Sesha Varadarajan Following Hobbs, Sesha Varadarajan from Lam Research discussed AI-related challenges and budding solutions that address them. With AI setting the pace of industry innovation, Varadarajan emphasized the need for clarity for device-specific roadmaps. For example, logic is transitioning from FinFET to Gate-All-Around, DRAM is moving toward 3D architectures, and advanced packaging innovations are enabling continued scaling. Ultimately, Varadarajan concluded that device roadmaps would come down to three things: thinner materials, taller structures, and smaller features. Lastly, he noted that workforce development training often lags behind industry demand, highlighting Lam Research’s Semiverse education platform as a solution. Stronger Together - Building a Resilient Future for Semiconductors“When you’re working at an atomic level of precision, every detail matters.” – Jon KempDupont’s Jon Kemp offered insight into how the semiconductor industry can usher in a new wave of transformation. To achieve this, he highlighted three strategic priorities: supply chain, sustainability, and AI. Kemp emphasized bringing manufacturing closer to customers, designing products for energy efficiency, and creating new AI architectures that address mounting performance expectations. He also announced that Qnity, an integrated material solutions provider, will be spinning out of DuPont on November 1, 2025. Where Vision Meets Execution: Global Executive Summit (GES) Unites Industry Leaders“[There has been] lots of progress so far, and we want to build on that momentum.” – Carolin Seward. Carolin Seward from Google took the stage to discuss the upcoming Global Executive Summit (GES) from December 15-16 in Tokyo. This invitation-only meeting will convene industry executives to discuss core sustainability issues, like advancing abatement, pursuing gas substitution, driving green materials, and enabling low-carbon energy. Closer to Home: Costa Rica as a Partner for Successful Operations in the Western Hemisphere“Costa Rica is ready to become part of the solution.” – Manuel Tovar RiveraManuel Tovar Rivera discussed Costa Rica’s efforts to bolster its semiconductor industry. With its close proximity to the U.S., three decades of advanced manufacturing experience, and free trade, Rivera also explained the benefits of U.S. and Costa Rica collaborations. To meet the needs of its trade partners, Costa Rica is developing its local talent base, attracting foreign professionals, offering incentives for R D and startup investment, and streamlining its regulatory processes. Advancing 3DIC Technologies to Propel AI Innovations“Our best day is still ahead of us.” – Jun HeClosing out the Tuesday keynote series was TSMC’s Jun He, who spoke about the packaging innovations that are pushing the world closer to more advanced AI. The key benefit of advanced packaging, he said, is to enhance AI performance and efficiency–but excellent yield is a nonnegotiable requirement. He underscored the growing importance of CoWoS, or Chip-on-Wafer-on-Substrate packaging structures, as well as fluxless thermocompression bonding, to help meet demand for AI. AI Supercomputing for Next Generation Semiconductor Design and Manufacturing“AI factories transform electricity into intelligence.” – Timothy CostaNIVIDA’s Timothy Costa began the Wednesday keynote series by highlighting physical AI as “the next trillion-dollar industry,” and outlined how the company is helping the industry get closer to that benchmark. Costa noted the three NVIDIA computers being used to train physical AI models – Omniverse for simulation, DGX for training, and Jetson AGX for deployment. All of these, he said, need to work together to deliver on physical AI promises, like robotics, autonomous vehicles, and others. Executive Panel – Powering the Next Decade: AI’s Impact on Semiconductor Infrastructure and Market“We’re living in the most exciting time in the world of computing.” – Mukesh KhareFollowing Costa, the CEO Summit Keynote stage transitioned into a panel discussion with industry-leading AI experts – including Laura Matz from Merck KGaA, Darmstadt, Germany, Mukesh Khare from IBM Research, Mark Dougherty from TEL, and Angada Sachid from ASM. The panel was moderated by David Anderson, President of NY CREATES. Although there was much said during this 50-minute panel, a few key points were emphasized. First, Khare highlighted open chip design activities for AI models as a way to alleviate cost burdens. Design costs for more advanced nodes, he said, can be greater than $500 million. Matz also outlined the urgent need to develop PFAS-free materials without sacrificing yield. Currently, there are several areas where the industry doesn’t have a solution for PFAS, but AI models may be able to help.Sachid also mentioned power challenges, pointing to how one or two misplaced atoms can be the difference between a power-efficient versus a power-hungry chip. Deposition needs to be perfect at 10 trillion separate locations, and he pointed to AI as an emerging solution for this as well. However, despite the promises of AI, the panelists underscored that people are still a company’s most valuable asset. Revolutionizing Semiconductor Collaboration: The Emergence of AI-Driven Industry Platforms“You can make better decisions with more information.” – John KibarianWhile nearly every session touched on the need for industry-wide collaboration, John Kibarian from PDF Solutions focused on making this feasible. In today’s highly complex semiconductor supply chain, every point is critical, from fabless companies, to foundries, OSATs, and external vendors. To make industry-wide collaboration practical without compromising IP, he noted the importance of secure infrastructure, automated orchestration, and robust AI agents to assess and analyze the raw data that often goes unused. Kibarian highlighted PDF Solutions’ secureWISE system as a tool that’s already in place to address these needs. Shaping the Future of Semiconductors in the U.S.“The specific things that drove growth were the evolution of new applications.” – Giel RuttenAs the semiconductor industry continues its journey to $1 trillion in annual industry revenue, Amkor’s Giel Rutten provided an update on the U.S. market. Because OSATs are heavily concentrated in Asia, this poses a significant challenge for reshoring U.S. manufacturing. Most OEMs, he said, are looking to OSATs to handle several of their processes because it’s cheaper than doing it themselves. Rutten detailed the mounting complexities of backend assembly, including rising demand for multiple, high-bandwidth memory stacks that traditional SoCs can’t accommodate. This is pushing the industry toward heterogeneous integration, which further complicates the supply chain. Rutten concluded by emphasizing the importance of industry-wide collaboration, and noted that Amkor’s Arizona fab will offer a complete, turnkey supply chain in the U.S. Fireside Chat – Harnessing Digital Transformation to Empower People and Accelerate Precision“The more we double down on technology, the more we should also elevate humanity and double down on our values.” – Khadija Ben HammadaWith a strong emphasis on AI during the 2025 keynote series, the final discussion on Wednesday brought humans back into the spotlight. Khadija Ben Hammada from Merck KGaA, Darmstadt, Germany and Daniel Drellich from EMD Electronics (the electronics business of Merck KGaA, Darmstadt, Germany), joined Jon Krohn on stage for an insightful talk on empowering employees in today’s AI era. Of the many things discussed, both Hammada and Drellich underscored the need to build trust with employees, as many of them fear being left behind by the technology. While it’s true that companies have invested heavily in AI, such investments also require them to educate teams on how to use it. This can best be achieved through a culture, they said, where people feel comfortable enough to learn in the first place. The panelists also highlighted the importance of finding the right AI tools for specific purposes, instead of blindly choosing the most sophisticated solution. Partnering to Serve the Demands of the AI Era“A foundry business is a trust business.” – Kevin O’BuckleyAlthough there’s no shortage of discussion about the industry’s road to $1 trillion, Intel’s Kevin O’Buckley shared where that trillion-dollar value is being realized. Based on recent projections, the simple breakdown he presented shows that 50% is generated by fabless companies, 25% by suppliers, and 25% by foundries and OSATs. With the rise of fabless companies, he highlighted the need for foundries to provide value to customers, including better power delivery solutions and predictable execution on customer projects. He also shared Intel’s efforts, like bringing its 18A node into production, its PowerVia for backside power delivery, and new slurry formulations for delicate wafers. Bridging the Talent Gap: Accelerating Workforce Solutions for Semiconductors“We're building opportunity and innovation into the semiconductor workforce.” – Shari LissShari Liss, VP of Global Workforce Development and Initiatives at SEMI, detailed the current state of the industry’s workforce needs. More than 170,000 new workers, she said, will be needed in the U.S. in the next five years. To help close the talent gap, Liss shared a roadmap of the SEMI Foundation’s efforts, ranging from awareness programs that target children as young as seven, to apprenticeship programs for adults. So far, the SEMI Foundation has reached 1.25 million students through its apprenticeship and certification programs, 3,300 people through its expanded childcare access, and 7,000 people through its SEMI U courses. Liss also highlighted the SEMI Foundation’s operator role in the newly established National Network of Microelectronics Education (NNME) — a national program that aims to build regional centers around the U.S. for microelectronics education and training. Requests for proposals are now open, and applications are due in December. American Chip Revival and the Trusted Tech Imperative“Trust is the most important word in any language.” – Keith KrachThe 2025 keynotes series concluded with Purdue University’s Keith Krach and former undersecretary of state. During his time as undersecretary, he emphasized the importance of building trust to rebuild the U.S. semiconductor supply chain. Through his trust-first approach, Krach helped secure TSMC’s presence in Arizona, leading to better jobs and a stronger domestic chip ecosystem. In addition, he was instrumental in creating a clean 5G network that later became the xGTT, or the Global Trusted Tech Standard. SEMI would like to thank all speakers, sponsors, and attendees for the success of this year’s CEO Summit Keynote Series. Joe Stockunas is President, SEMI Americas.

Q3 2025 was packed with activity. From finalizing the Standards program for SEMICON West, to organizing the event’s corresponding Global Standards Summit (GSS), the Standards team is excited to share its most recent quarterly developments.On Tuesday, October 7, leaders from across the industry convened in Phoenix, Arizona, for the second annual GSS. This half-day summit focused on future standardization needs for supply chain traceability and environmental sustainability. In addition, the Standards team conducted two workshops at SEMICON West. The first, SEMI Liquid Chemicals Analytical Workshop, detailed recent advances in analytical methodology and instrumentation related to particle measurement, trace metals, and organics in liquid chemicals. The second, Enhancing Voltage Sag Immunity: SEMI F47 Standards Updates Insights Workshop, offered a forum for sharing improvements to SEMI Standard F47 to further enhance tool performance and reliability. Finally, Q3 saw the official introduction of SEMI Standards T26 and E195. SEMI T26-0925, Specification for Electronic Supply Chain Traceability Using Distributed Ledger Technology, will be crucial for improving security and transparency for the industry’s supply chain. Additionally, SEMI E195-0925 is now available for purchase. This standard, Test Method Using Adhesive Replacement Substrates to Assess Particulate Surface Contamination on Critical Chamber Components, offers a testing approach for measuring the ISO 14644-9 cleanliness of a critical chamber component.To participate in upcoming standard developments, learn more about becoming a member of the SEMI International Standards Program. Global Standards Summit The SEMI GSS made its North American debut at this year’s SEMICON West in Phoenix. Building on its inaugural event at SEMICON Japan 2024, GSS is a strategic forum dedicated to creating an industry-wide standardization roadmap for the next three and seven-year benchmarks. The 2025 GSS continued conversations from SEMICON Japan on environmental sustainability, while expanding its program to include supply chain traceability. As geopolitical tensions, mounting cybersecurity threats, and rising technological demands continue testing the limits of the industry’s supply chain, the need for global standardization is becoming increasingly apparent. The 2025 GSS program addressed these concerns and others across multiple sessions, offering insight on how these challenges are being addressed in the industry while highlighting critical areas still in need for standards development. Key outcomes from the GSS program include: Addressing data sharing across multiple supply chain tiers while protecting IP rights and a call for harmonization across standards. The presentation by Randy Hall from the Provenance Chain Network, offered approaches on how data owners can share information with authorized users without compromising sensitive manufacturing details. While there are standards gaps that hinder broader adoption, there is opportunity to address insufficient visibility across the industry’s supply chain amid ongoing cybersecurity threats by harmonizing across existing standards implementations. An integrated modeling framework for informing energy efficiency and carbon reduction approaches. Developed by the International Roadmap for Devices and Systems (IRDS) Environmental Sustainability for Semiconductor Facilities (ESSF) team, this effort helps address demands for maintaining rapid technological progress while still meeting the industry’s ambitious sustainability goals.Standardization opportunities for improving sustainability within manufacturing facilities. Nate Monosoff from Jacobs offered insight into the decision-making tradeoffs that balance sustainability with other facility performance areas, focusing on standard methods for calculating ESG performance. GSS concluded with a panel discussion that featured leaders from AMD, FTD Solutions, Intel, The Provenance Chain Network, Jacobs, Qualcomm, and Tokyo Electron. In this session, our thought leaders discussed the fundamental importance of standardization for our industry, standards adoption, incentivizing stakeholders, and how standards can be designed to remain flexible and adaptive as technologies and regulatory landscapes evolve. SEMI Standard T26In line with the 2025 GSS theme of supply chain traceability, the Standards team is pleased to introduce SEMI T26, Specification for Electronic Supply Chain Traceability Using Distributed Ledger Technology. This standard was published in September to define a secure and decentralized traceability system that all members of the electronics supply chain can safely share. This system is based on distributed ledger technology to improve industry-wide reliability assurance.Update on Document 7130CIn February, Document 7130C was approved during the North America Metrics Technical Committee Chapter Meeting. The document officially became SEMI E195 - Test Method Using Adhesive Replacement Substrates to Assess Particulate Surface Contamination of Critical Chamber Components in September.SEMI E195 describes a quantitative method for measuring the ISO 14644-9 surface cleanliness for particle concentration of a critical chamber component (CCC), by means of an adhesive replacement substrate. The purpose of this standard is to ensure measuring and reporting consistency across CCCs or processing equipment manufacturers. To help acquaint the industry with this standard, SEMI offered a combined, in-person course on SEMI E194 and SEMI E195 during SEMICON West. The course provided fundamental information on each standard, in addition to other process approaches for improving reliability and yield.Other SEMI Updates:SEMI Preventive Maintenance Automation White Paper SEMI Korea conducted a Global PM Automation Survey in August to better understand today’s preventive maintenance readiness issues for autonomous fabs. The results will be included in SEMI’s upcoming PM Automation Whitepaper and will ultimately guide future developments for related SEMI Standards. Standardized Semiconductor Cyber Assessment FrameworkIn Q3, the Semiconductor Manufacturing Cybersecurity Consortium (SMCC) released its Standardized Semiconductor Cyber Assessment (SSCA) framework. This document provides a detailed cybersecurity readiness plan for semiconductor companies across the supply chain. Its goals are to standardize industry-wide cybersecurity risk evaluations, establish and accelerate the adoption of best practices, and improve information sharing and collaboration. Download the SSCA framework for free.New Data Standard for Equipment Edge Governance In June, Document 6938C was approved during the Taiwan Information Control Technical Committee Chapter Meeting. The document officially became SEMI E196 - Guide for Equipment Edge Data Governance. SEMI E196 provides guidance for identifying equipment data supplied by manufacturers that can be used in equipment engineering or analysis applications.New Guide to Meet IRDS Yield Table RecommendationsAt the NA Summer Meetings, Document 6601B passed TC Chapter review with technical changes and a Ratification Ballot was issued in Cycle 7-2025. Pending final Procedural Review, Guide for Meeting IRDS Yield Table Recommendations for High Purity Polymer Materials and Components Used in Ultrapure Water, will cover areas that establish criteria for allowable contribution by critical components used for UPW treatment plant and distribution system. This document will be proactively updated to manage the risks associated with the high purity polymer materials used in the semiconductor process. The biggest challenges today are metals and particles and certain organics.Flex Standards Meeting at FLEX 2026Meet the leaders of the SEMI Standards Flexible Hybrid Electronics (FHE) Task Forces at Flex 2026, in Arizona, February 24-26, and learn about ongoing FHE standardization efforts!Standards Introduced in Q3 2025New and revised standards released in Q3. July 2025 StandardsAugust 2025 StandardsSeptember 2025 Standards Get InvolvedSEMI Standards development activities take place throughout the year in all major manufacturing regions. To participate, join the SEMI International Standards Program.SEMI Standards are available through individual download purchases or online via SEMIViews. Sign up for a 30-day SEMIViews trial.For more information, please visit the Standards website and events page. For any questions regarding SEMI Standards activities, please contact your local SEMI Standards staff. Paul Trio is Director of Standards at SEMI.