At SEMICON Europa 2025, the Executive Forum programs brought together experts from across the semiconductor value chain to address two critical challenges shaping the industry’s future in Europe: the transformation of the automotive sector and the pursuit of smarter, more competitive manufacturing.Smart Mobility in a Changing MarketKnut Krümmel, Senior Partner Automotive at Porsche Consulting, set the tone with a stark question, “Are we facing a Detroit scenario in Europe, especially in Germany?” – a reference to the decline since the 1990s of the famous “Motor City.” He pointed out that all three of Germany’s giant OEMs, Volkswagen, Mercedes-Benz and BMW, are rapidly losing market share in China in the face of a destructive price war, and have suffered large declines in reported earnings. Krümmel outlined four strategic imperatives for Europe’s auto industry: reduce complexity and increase standardization, become software-defined, design regulation that supports innovation, and build stronger partnerships across the ecosystem. He emphasized, “A new mindset is needed—people need to be hungry to win and prepared to suffer in pursuit of victory.”Knut Krümmel, Senior Partner Automotive, Porsche Consulting GmbHAndreas Aal, Head of Semiconductor Strategy at Volkswagen AG and Chair of Europe at SEMI Smart Mobility Global Automotive Advisory Council (GAAC), introduced a proactive approach to redefine the market. He shared Volkswagen’s vision for mobility-as-a-service, exemplified by its roboshuttle pilot in Hamburg. “It is very difficult for a traditional OEM to go into the full digital services world. But this is what we want to do,” said Aal.Andreas Aal, Semiconductor Strategy Volkswagen AG and Chair of Europe GAAC, VolkswagenJan-Philipp Gerhmann, Vice President of Marketing and Strategy for Automotive at NXP Semiconductors, added that the traditional value chain is being upended. The industry is shifting from a hierarchical supply chain to vertical integration, with companies like Tesla designing their own chips. Gehrmann introduced NXP’s CoreRide platform, a modular “skateboard” architecture enabling plug-and-play Advanced Driver Assistance Systems (ADAS) and infotainment features for future vehicles.Jan-Philipp Gehrmann, Vice President of Marketing Strategy, NXPA perspective on the future of semiconductors in autonomous vehicles was provided by Dieter Hoffend, Business Director for Automotive at imec: “For autonomous vehicles, you need a higher-end compute capability, which needs a transition to smaller nodes – and that is very costly. In fact, semiconductor companies will not want to commit volume to automotive customers for their most expensive leading-edge ICs. This means that a chiplet architecture will be the most cost-effective approach for vehicles, and will provide the greatest supply chain resilience. To support this, imec’s vision is of an open chiplet marketplace of heterogeneous chiplets which are interoperable.”Dieter Hoffend, Business Director Automotive Sector, imecAchieving End-to-end Manufacturing ExcellenceThe Executive Forum then shifted to a discussion of smart semiconductor manufacturing. Giovanni Notarnicola, Partner at Porsche Consulting, highlighted the untapped potential of AI in fabs. “AI requires massive amounts of data—but fabs often don’t own or control their data. And second, AI talent doesn’t typically reside in semiconductor companies,” said Notarnicola. His recommendation: “AI is not an IT issue—it’s a cross-functional technology. Isolating AI in the IT department is an old-fashioned view which will deter AI talent from joining the industry.”And Notarnicola encouraged the industry to leverage the new white paper produced by SEMI End-to-End Smart Manufacturing Group, which provides an in-depth report on the application of AI in semiconductor fabrication. Giovanni Notarnicola, Partner, Porsche ConsultingOliver Aubel, Corporate Lead for Automotive Solutions at GlobalFoundries, echoed the opportunity. “We have 1 billion sensors in a fab, but 30% of the signals are statistical noise. AI could help us make better sense of the data.”Oliver Aubel, Corporate Lead for Automotive Solutions at GlobalFoundriesA session on smart manufacturing brought to light other proven methods for improving the performance of fabs. Dr. Holland Smith, Director of Data Science at INFICON, described fab control technology that INFICON had helped STMicroelectronics to deploy. As Thomas Gimmig, Director for Industry 4.0 at STMicroelectronics, said, “Our model was a highway control room – a place where a single person controls 220km of road monitored by 400 cameras, and handles one alert every three minutes on average. This is only possible with a huge amount of automation.”Left: Thomas Gimmig, Director for Industry 4.0 at STMicroelectronics; Right: Dr. Holland Smith, Director of Data Science at INFICONAt STMicroelectronics, the new fab control room mimics this model, automating anomaly detection and problem solving. Smith described how the system will not be limited to detecting and handling anomalies which have already occurred. “There is a plan to look ahead at problems which could emerge in future, and to configure it to make proactive suggestions which will prevent anomalies from occurring in the first place,” said Smith. Jamie Potter, co-founder and CEO of Flexciton, showcased how intelligent scheduling tools based on real-time fab capacity are transforming operations. “In the modern fab decisions must be made more frequently, with more intelligence and with fewer people. And that is why fabs need to be made more autonomous,” said Potter.Jamie Potter, CEO Cofounder, Flexciton Ltd“Our tool is based on a dynamic capacity model of the fab, so WIP optimization is based on knowledge of what the fab can actually do now, rather than – as is normally the case in fabs today – on an abstract algorithm which is derived from operational results observed in the past.” Potter said. Robert Wallace, Solutions Architect at Seagate, which has deployed the Flexciton technology, confirmed the impact: “We increased throughput without increasing cycle times, and saw a 30% drop in deviations from forecast completion times.” Robert Wallace, Solutions Architect at SeagateAntoine Amade, President (EMEA) of Entegris, emphasized the importance of benchmarking to guide performance improvements: “We have a robust library of fab case studies. These benchmarks can become the foundation for best practices.” Antoine Amade, President (EMEA) of EntegrisRegulatory Burdens and Regional Challenges In a panel session, the discussion turned to the issues that European semiconductor manufacturing faces in particular. Herbert Blaschitz, Executive Vice President of Advanced Technology Facilities at Exyte, put a strong emphasis on the drag that European regulation imposes on the construction of new fabrication plants: “There is three times more paperwork to complete in Europe than in Asia.” Blaschitz made the contrast with Taiwan, “where they have standard codes of regulation specifically for a wafer fab. In Europe, we have regulations for skyscrapers, we have regulations for building family homes. But we have nothing for wafer fabs.”It could be worse for companies building all new fabs. According to Stephen Rothrock, President and CEO of ATREG, “We are affected by permits and politics most of all when trying to push through the repurposing of fabs.”From Left to Right: Mark Puttock, Sr. Director - Technology and Innovation, Entegris; Giovanni Notarnicola, Partner, Porsche Consulting; Stephen Rothrock, President/CEO, ATREG; Jean-René Lèquepeys, Deputy Director and Chief Technology Officer, CEA-Leti; Herbert Blaschitz, Executive VP of Advanced Technology Facilities, Exyte; Oliver Aubel, Corporate Lead Automotive Solutions, GlobalFoundriesSustainable Manufacturing Practices: A Source of Competitive Advantage?The forum ended with a debate on the value of and problems with Europe’s commitment to sustainability. As Mark Puttock, Senior Director for Technology and Innovation at Entegris, acknowledged concerns that sustainability practices could raise costs and reduce process efficiency. But Jean-René Lèquepeys, Deputy Director and Chief Technology Officer at CEA-Leti, countered: “sustainability can be a competitive advantage. For instance, the industry is under pressure to eliminate PFAS from its processes. CEA-Leti is working on this problem, and the whole world is looking for a solution.”The event concluded with a moment of celebration: Ilya Zabelinsky, Co-founder of the International Subfab Research Labs (ISRL), won a diamond prize sponsored by Nanores Lab,Left: Jakub GawczyńskiJakub Gawczyński, Head of Nanores Lab; Right: Ilya Zabelinsky, Co-founder of the International Subfab Research Labs (ISRL)On behalf of SEMI, we extend our sincere gratitude to the speakers, sponsors, and participants who contributed their expertise and vision to the programs at SEMICON Europa 2025.SEMI ContactAna Bernardo, Senior Manager of Technology Programs SalesEmail: [email protected]

The GENESIS EU project is reshaping how Europe thinks about semiconductor manufacturing. Its goal is simple but ambitious: reduce usage of harmful chemicals from chip production, cut emissions and waste, and make the industry more circular and resilient.Launched on 1 May 2025, GENESIS – GENerate in Europe a Sustainable Industry for Semiconductor – is a research and innovation project co-funded by the European Union through Chips JU and its participating member states. In addition, Swiss partners are supported by the Swiss State Secretariat for Education, Research and Innovation (SERI).Coordinated by CEA-Leti in Grenoble, GENESIS brings together 58 partners from across the semiconductor value chain: materials and chemistry suppliers, equipment manufacturers, semiconductor fabs, research and technology organisations (RTOs), universities, small and medium-sized enterprises (SMEs), recycling specialists and communication experts. Together, they are working to build a resilient, circular and environmentally responsible microelectronics sector aligned with the European Green Deal and the European Chips Act.Mission and VisionGENESIS exists to future-proof the European semiconductor industry. The project focuses on:Eliminating or replacing per- and polyfluoroalkyl substances (PFAS) and other hazardous substances used in manufacturing processes;Reducing waste and greenhouse gas emissions throughout the production chain;Securing access to critical materials through smarter use, reuse and circular strategies;Deploying advanced monitoring and sensing solutions for gas and liquid environments in fabs.Six Work Packages, One Integrated ApproachTo reach its objectives, GENESIS is structured into six work packages.Work Package 1 – Management, Specifications, and MethodsLead: CEA-LetiWP1 keeps the project on track. It manages the technical, administrative and financial coordination of GENESIS and defines common specifications and methodologies. This includes setting technical recommendations and carrying out environmental impact assessments so that shared targets and consistent methods guide all subsequent work.Work Package 2 – Process, Monitoring Sensing Hardware and SolutionLead: CSEMWP2 develops real-time monitoring technologies capable of detecting and quantifying emissions from process gases such as NF₃, CF₄ or SF₆. By improving transparency and enabling process feedback, GENESIS contributes to the transition toward low-emission semiconductor fabs aligned with EU climate goals.Work Package 3 – Environmentally Friendly Materials AlternativesLead: imecWith global PFAS restrictions tightening, the semiconductor sector urgently needs high-performance, safe alternatives. GENESIS in WP3, is designing and qualifying materials for key manufacturing steps including lithography, etching, cleaning, deposition, and packaging, that reduce industry dependence on PFAS and higher GWP gases while ensuring compatibility with industry performance requirements.Work Package 4 – Minimisation of Waste and EmissionsLead: FraunhoferWP4 addresses the complexity of semiconductor waste streams and explores innovations to enhance abatement efficiency. GENESIS develops recycling, recovery, and closed-loop solutions for gases, slurries, and solvents, with the aim of significantly reducing waste across fabs.Work Package 5 – Materials Scarcity Impact MitigationLead: Università degli Studi di Roma Tor VergataEurope’s dependence on critical raw materials—including gallium, indium, and rare earth elements—represents both an environmental and strategic challenge. GENESIS in WP5 focuses on reducing CRM usage through process innovation and strengthening circularity to enhance supply chain resilience.Work Package 6 – Regulations, Dissemination, Communication and ExploitationLead: SEMI EuropeWP 6 is dedicated to ensuring that GENESIS creates meaningful and lasting impact beyond its technical achievements. It integrates regulatory monitoring, dissemination, communication, and exploitation activities to connect the project’s innovations with industry needs, European policy developments, and wider society. WP6 is coordinated by SEMI Europe, supported by expert partners across the consortium, and serves as the bridge between GENESIS’s scientific work and its real-world influence.Long-term strategyGENESIS is built with one goal in mind: making sure the work happening inside the project translates into real change across Europe’s semiconductor ecosystem. To support this, the project focuses on four key impact areas that help move ideas from research into industry, policy and long-term community engagement.Helping Industry Put Results to WorkA core part of GENESIS is understanding how each partner can use the project’s results in their own environment. Whether it’s new materials, smarter monitoring solutions or better waste-reduction approaches, partners define clear pathways for adoption so GENESIS innovations can move naturally into real industrial use.Staying Connected to Europe’s Policy AgendaSustainability and chemical regulations in Europe are evolving fast, and GENESIS stays close to these developments. The project brings technical insights to discussions around the Green Deal, PFAS regulation, and critical raw materials. This makes sure GENESIS is not only aligned with policy trends, but also contributes to shaping them.Making Knowledge Accessible and Future-FocusedOpen access is an essential part of GENESIS. The project shares its research outputs publicly and supports the creation of educational material for universities and training programmes. This helps the next generation of engineers and specialists build on GENESIS knowledge and carry it forward.Keeping GENESIS Visible and RelevantGENESIS maintains a strong presence across events, conferences, publications and expert discussions. This ongoing engagement ensures that project results remain visible, understood and connected to wider conversations on sustainable semiconductor manufacturing—helping extend the project’s influence well beyond its duration.Towards a Sustainable Semiconductor FutureGENESIS shows that high-performance chips and environmental responsibility can coexist. By uniting materials science, process engineering, monitoring technologies, environmental assessment and policy insight, GENESIS is helping define what responsible, future-ready semiconductor manufacturing will look like tomorrow.Jatin Mendiratta, Communications CoordinatorSEMI Europe Phone: +49 160 402 8899Email: [email protected]

In an era where performance and efficiency are essential, heterogeneous integration is rapidly becoming a foundational technology. The webinar “Heterogeneous Integration in Action: Powering the Next Era of Connectivity” featuring speakers from the HiCONNECTS project dives deep into the advances, challenges, and ecosystem-building necessary to bring next-generation integrated systems to life across Europe and beyond.HiCONNECTS (Heterogeneous Integration for Connectivity and Sustainability) brings together more than 60 partners across Europe under the Chips JU to explore how packaging, materials, architectures and software can be co-designed for industrial uptake.A Bold Ambition: Why This MattersConnectivity is the lifeblood of our digital age. From smart mobility and data centers to consumer electronics and factory automation, demands on performance, energy efficiency, miniaturization and flexibility keep growing.Heterogeneous integration offers a path to meet those demands by enabling dissimilar technologies, for example chips, sensors, RF, photonics, advanced packaging and AI accelerators to work together more seamlessly than ever before.Set against the backdrop of Europe’s broader ambitions under the EU Chips Act to strengthen its semiconductor ecosystem and technological leadership, projects like HiCONNECTS demonstrate how coordinated R D can translate into industrially relevant demonstrators and use cases.Key Themes from the WebinarBelow are some of the most compelling takeaways from the session:From Components to SystemsAcross all talks, one message was clear: heterogeneous integration is no longer just about better individual devices, it’s about system-level co-design.Speakers showed this in very concrete ways:In power device manufacturing, improving yield, process control and data correlation across the wafer line directly improves the reliability of integrated systems.In smart logistics and manufacturing, autonomous mobile robots combine LiDAR, cameras, 5G, on-board compute and collaborative AI to operate safely on factory floors.In life-science imaging, cryo-electron microscopes, AI-assisted screening and high-performance computing are tied together into a single workflow.In connected and autonomous mobility, radar, V2X modems, explainable AI software and human–machine interfaces form one integrated chain.You can no longer treat sensing, connectivity, compute and packaging in isolation – the value lies in how they are composed into complete systems.Ecosystem Consortium DynamicsTo realize heterogeneous integration, no single entity can go it alone. The webinar highlighted how large consortia such as HiCONNECTS bringing in universities, research institutes, packaging houses, system vendors, and tool suppliers are key. A strong theme: modularity and interfaces must be agreed upon early to allow parallel work across partners.Why Europe’s Timing is CriticalHiCONNECTS sits within a broader European push to strengthen the continent’s semiconductor capabilities and reduce systemic vulnerabilities in critical value chains. Europe already hosts strong players in photonics, packaging, system integration, robotics, automotive and research.What the webinar underscored is that coordination and shared infrastructure are now decisive:aligning manufacturing know-how with AI and data analytics,connecting application-driven demonstrators with underlying technology platforms, andensuring results can be replicated and scaled beyond a single lab or pilot line.Final ThoughtsThe “Heterogeneous Integration in Action” webinar was a timely, forward-looking snapshot of how Europe’s microelectronics ecosystem is moving from component-level innovation to system-level co-design, grounded in real industrial use cases.The journey is far from complete, but the payoff is clear: higher-performance systems, new classes of products in mobility, health and manufacturing, and a stronger, more resilient European position in semiconductors.Kartikey Srivastava, Manager, EU ProjectsSEMI Europe Phone: +49 151 1436 6324Email: [email protected]

The CxO Summit at SEMICON Europa 2025 spotlighted Europe’s ongoing efforts to build a resilient and globally competitive semiconductor industry, while calling for greater ambition, speed, and unity in execution. Following global disruptions with the automotive supply chain crisis, the European Union launched a continent-wide strategy through the EU Chips Act. While the Act has already spurred significant developments, including construction of the new ESMC fab in Dresden, Europe remains far from its goal of achieving a 20% share of global semiconductor production by 2030. The CxO Summit, part of the SEMICON Europa event in Munich, provided an opportunity for industry leaders to share ideas about how to catalyze the next phase of the European industry’s growth.Ajit Manocha, President and CEO of SEMI opened the summit by describing today’s industry landscape with one word: “unprecedented.” Manocha said, “The global growth of the industry is unprecedented, with 107 new fabs set to come online by 2028, but the uncertainties are unprecedented, from geopolitics to the talent shortage to environmental concerns. So we need unprecedented solutions.” Ajit Manocha, President and CEO, SEMILaith Altimime, President of SEMI Europe echoed the mood of uncertainty, describing Europe as caught “in a perfect storm.” Altimime said, “As we face a combination of internal challenges and intensifying external competition, collaboration is not optional — it is mission critical.” Laith Altimime, President, SEMI EuropePierre Chastenet, Head of the Unit for Microelectronics and Photonics, European Commission, highlighted the tangible progress made under the EU Chips Act. “We now have a proper toolbox to handle a future crisis in the supply chain. The Chips for Europe initiative has led to the creation of five pilot lines for advanced technologies such as FD-SOI and wide bandgap semiconductors.” Chastenet added, “Europe must now capitalize on its strengths, from materials and equipment to design tools and cutting-edge research emerging from our RTOs.”Pierre Chastanet, Head of the Unit for Microelectronics and Photonics, European CommissionEchoing the call for action, Oliver Schenk, Member of the European Parliament, urged stronger regional unity. “Europe must act together, act faster, and act with much bigger ambition,” Schenk said, reinforcing the need for cross-border commitment to strengthen the continent’s semiconductor position.Oliver Schenk, Member of the European Parliament, European ParliamentHighlighting Europe’s most critical technology gap, Luc Van den hove, President and CEO of imec, unveiled plans for a new advanced fab backed by €2.5 billion in investment from the EU, the Flemish government, and ASML. Van den hove urged Europe to commit wholeheartedly to advanced technologies: “We must be more ambitious, and focus on disruptive breakthroughs rather than incremental change if we want to ensure a prosperous future.”Luc Van den hove, President CEO, imecAt the CxO Summit, CEA-Leti and ASML signed a memorandum of understanding (MoU) to deepen their collaboration and accelerate innovation in mainstream semiconductor technologies. Building on promising results in hybrid bonding, the partnership will now target 'More-than-Moore' innovations, including heterogeneous integration and novel substrates like SiC and GaN. “We aim to combine ASML’s world-class lithography expertise with CEA-Leti’s system-level innovation,” said Sébastien Dauvé, CEO of CEA-Leti. The collaboration is set to strengthen Europe’s ecosystem by shortening the path from early research to industrial impact.Left: Anne Hidma, Senior Vice President EUR US, ASML; Right: Sébastien Dauvé, CEO, CEA-LetiTurning to Europe’s industrial base, Christian Senger, CEO of Volkswagen Autonomous Mobility, emphasized the need to shift from risk-aversion to opportunity. While the region’s automotive sector faces intense global competition, particularly from China, Senger highlighted that Europe has the potential to lead in new mobility markets. “The market for autonomous roboshuttles for people transport in large cities is forecast to be worth €400 billion in the US and Europe alone,” he said. With American firms like Waymo and Uber leading the robotaxi space, Senger stressed that Europe must “act swiftly to create an environment that supports an autonomous mobility industry here.”Christian Senger, Member of the Board for Fully Autonomous Mobility and Transport CEO of ADMT GmbH, VolkswagenEurope’s Potential to Create Advanced TechnologyOne of these RTOs, CEA-Leti, is responsible for the FAMES pilot line for FD-SOI technology. Sébastien Dauvé, CEO of CEA-Leti, agreed with Pierre Chastenet that the pilot lines show great promise. He said, “FD-SOI is a big trend in semiconductors, because it enables very low power consumption in embedded devices. We think that adoption of the technology will grow in the coming years, and that is good, because most of the technology is produced in Europe.”Sébastien Dauvé, CEO, CEA-LetiEurope is also widely recognized to be the leading global voice on sustainability – a huge issue of concern to the semiconductor industry. Henri Berthe, President of the Semiconductor and Battery Segment at Scheider Electric, told the summit that 500 million tonnes of CO2 emissions per year are attributable to the semiconductor industry – “more than the whole of Mexico emits!” he said. “We need to make fabs more efficient, and that is why Schneider Electric has launched a new playbook with Applied Materials for sustainable energy abundance for the industry.”Henri Berthe, President of the Semiconductor Segment, Schneider ElectricAnother aspect of Europe’s playbook is support for new fabs. The flagship is ESMC, the joint venture between TSMC, NXP Semiconductors, Bosch, and Infineon. Christian Koitzsch, president and managing director of ESMC, reported to the summit that the project to build in Dresden a 12nm FinFET foundry and a 28nm CMOS line, requiring a total investment of €10bn, is on schedule. “We are now developing local supply chains, hosting a series of ESMC Supplier Days which are open not only to German but generally to European suppliers,” said Koitzsch.Christian Koitzsch, President and Managing Director, European Semiconductor Manufacturing Company (ESMC)As Manfred Horstmann, General Manager and Senior Vice President of Global Foundries, pointed out, the building of the ESMC fab means that Dresden is established as the center of a cluster of semiconductor industry companies. “Global Foundries has its Fab 1 and a mask center in Dresden. In fact, one-third of the chips produced throughout the whole of Europe now comes from Dresden.”Manfred Horstmann, General Manager and Senior Vice President, GlobalFoundriesAn example of ambition was given by Terence Gan, Executive Director of the Institute of Microelectronics of Singapore. Gan told the summit how Singapore has used pilot lines to stimulate research and development in new technologies. He said: “We started research into advanced packaging as long ago as 2011. Most people thought we were mad! But today, there is strong demand for our advanced packaging capabilities because of the rise of AI and its need for high-performance computing.”Terence Gan, Executive Director, Institute of MicroelectronicsBreaking Barriers to ProgressDespite momentum, bureaucratic inefficiencies continue to hamper progress. Narjiss Haddaoui, Managing Director of European Economics called for faster decision-making: “In global competition, speed is a decisive factor. To act fast enough, the EU must change its ‘software’ - the processes by which it considers and makes decisions.” Narjiss Haddaoui, Managing Director, European economicsThe stifling character of European bureaucracy is reflected in the region’s approach to building fabs. Herbert Blaschitz, Executive Vice President of Advanced Technology Facilities at Exyte, compared fab construction timelines: 20 months in Taiwan, 34 in Europe, and 38 in the U.S., attributing delays in Europe to paperwork bottlenecks.Herbert Blaschitz, Executive VP of Advanced Technology Facilities, ExyteFabio Gualandris, President for Quality, Manufacturing and Technology at STMicroelectronics raised another concern — 100% of raw materials used in European fabs come from outside the region. Christophe Frey, Vice-President for EU Engagements at Arm France, added that geopolitical tensions are clouding the path forward: “We are a bit lost in the smoke from the big fire in the world’s semiconductor industry.” Fabio Gualandris, President Quality, Manufacturing Technology, STMicroelectronics Christophe Frey, Vice-President of EU Engagements, Arm FrancePlaybooks For Future SuccessSo amid the uncertainty and global tension, what lessons can the industry learn from successful regional examples? Tuomas Korpela, Business Development Senior Manager at Nokia, credited Finland’s strategic procurement and policy tools with enabling a vibrant semiconductor ecosystem: “Finland creates demand for advanced chips using industrial policy tools, alongside strategic procurement in sectors such as defense and aerospace, and connectivity.” Tuomas Korpela, Business Development Senior Manager - Corporate Development Organization, NokiaAt a regional level, Joerg Schulze, Director of the Bavarian Chips Alliance, said that his organization was supported by the Bavarian State Ministry of Economic Affairs, as well as by companies and universities. “We help semiconductor companies to establish themselves and grow here through help with site searches, networking and contacts, funding and support, and talent acquisition,” said Schulze.Joerg Schulze, Spokesperson for the Bavarian Chips Alliance, Director of the Fraunhofer IISB, Bayern Innovativ GmbHCompanies in the European semiconductor supply chain also provided the summit with their insights into the roots of global success. André Grede, Chief Technology Officer of Comet, described how his company’s strategy is not to wait for customers to tell it what they need, but to be “ahead of the curve.” Grede said: “Is staying in sync with the customer enough? Not for us - we are deeply embedded with our customers, and constantly looking to broaden our relevance to them.”André Grede, CTO, CometChristophe Maleville, Chief Technology Officer of Soitec, provided a real-world example of how this is done. He said: “Our engineered substrates using RF-SOI technology reduce the drain on a mobile phone’s battery power, and cut our customers’ board footprint thanks to RF front end integration. As a result, our products are now in 100% of 5G smartphones.”Christophe Maleville, CTO, SoitecAnne Hidma, Senior Vice-President for Europe and the US at ASML, shared the company’s success formula: “The reasons for ASML’s success include customer focus – decide which markets you are going to be in, and which you are not. We are also all-in on innovation. We nurture an ecosystem, which for us includes imec and CEA-Leti, as well as partnerships with academia. And lastly, we have a strong supply base, which is a core strength of Europe.” In a time marked by both uncertainty and opportunity, the example of ASML shows how the European semiconductor supply chain can survive and thrive.Anne Hidma, Senior Vice President EUR US, ASMLEurope’s Path ForwardThe CxO Summit made one thing clear: Europe has world-class innovation, policy momentum, and industrial commitment. What’s needed now is faster execution, deeper collaboration, and the courage to invest in the technologies of tomorrow. As the industry heads toward the $1 trillion milestone, the decisions made today will shape Europe’s place in the semiconductor world for decades to come.On behalf of SEMI, the SEMI Europe team would like to express appreciation to the industry leaders for sharing their visions and readiness to collaborate during the CxO Summit.SEMI ContactLaith Altimime, President SEMI [email protected]

As the world enters a new era of deep tech innovation, fields such as AI chips, Advanced Computing, Autonomous Vehicles, Smart Manufacturing, and MedTech have become strategic priorities for global investors and corporate venture capital (CVC). This momentum has accelerated collaboration between startups and the semiconductor supply chain, transforming innovative ideas into scalable market solutions.As part of its effort to foster global startup engagement, SEMI connects global innovators through two key platforms — the Silicon Startups Zone and the IC Taiwan Grand Challenge (ICTGC) — to accelerate innovation across the semiconductor ecosystem.Silicon Startups Zone: A Global Stage for Semiconductor Innovation The Silicon Startups Zone serves as a gateway for global startups and investors exploring opportunities in semiconductor innovation. Launched at SEMICON Taiwan 2025, the Silicon Startups Zone is organized by SEMI with support from the National Science and Technology Council (NSTC). It features over 20 startup teams from Taiwan and around the world, showcasing advancements in AI chips, advanced packaging, EDA tools, and sustainable solutions.Through UPNext Stage presentations and live technology showcases, startups engage directly with investors, chip designers, and technology providers. SEMICON Taiwan attracts over 100,000 industry professionals, fostering new partnerships, investment discussions, and collaborations — reinforcing Taiwan’s pivotal role in connecting global innovation with the semiconductor supply chain. The Silicon Startups Zone is more than just an exhibit space — it is a starting point for collaboration and commercialization. By leveraging SEMI’s global network and Taiwan’s world-class manufacturing ecosystem, the platform accelerates startup growth and builds a sustainable pathway for next-generation innovation.The 2026 Silicon Startups Zone welcomes qualified startups to participate, offering a dedicated showcase area, UPNext Stage speaking opportunities, and exclusive marketing and media exposure. For more details, please contact Sophie Chen at [email protected] Taiwan Grand Challenge (ICTGC): Precision Scouting for Global Deep Tech Collaboration Organized by the NSTC and promoted by SEMI, the IC Taiwan Grand Challenge (ICTGC) is a global competition focused on Deep Tech innovation — based in Taiwan and open to the world. With the theme “Prototyping to Production,” ICTGC identifies startups and innovators in five key areas: AI Chip Technology, Smart Mobility, Smart Manufacturing, MedTech, and Green Technology. The program invites global startups, research institutions, and entrepreneurial teams to apply. Selected winners receive up to US $30,000 in prize funding, along with technical mentorship and access to semiconductor manufacturing resources, including EDA tools, wafer fabrication, and packaging technologies. The 2026 Call for Proposals are open now through February 28, 2026. More than a competition, ICTGC serves as a platform for collaboration — connecting the semiconductor supply chain, academia, and venture partners to help startups accelerate development and market entry. For more details on the call proposals, please contact Sophie Chen at [email protected] or submit via the Google form.Two Platforms, One Mission: Connecting Innovation for the Future Together, the Silicon Startups Zone and IC Taiwan Grand Challenge (ICTGC) create a pathway for Deep Tech startups — from discovery to collaboration and growth. Through these initiatives, SEMI connects global innovators with the semiconductor ecosystem, driving cross-border partnerships and accelerating next-generation technologies. Please click here for more information.SEMI Contact Sophie Chen, Coordinator, Technical Projects Email: [email protected]

The SEMICON West 2025 design program “The Convergence of Semiconductor Manufacturing and Design,” organized by the ESD Alliance (ESDA), a SEMI Technology Community, featured presentations about successful collaborations between the design and manufacturing markets. The three-hour program in a packed conference room included plenty of great material that we’re using as the basis for a blog series that you will see over the next several months. I’m working on them now based on my conversations with four of the speakers where we discuss key drivers behind the need for collaboration and what’s ahead.I’m starting with Dave Kelf, CEO of Breker Verification Systems, a company steeped in front-end chip verification, who describes an actual circular collaboration that effectively leverages AI and other electronic design automation (EDA) advances. We recently talked about collaboration, integrated design and manufacturing flows and AI.Smith: How does Breker define collaboration between design and manufacturing? Kelf: In general, at a technical level, we would define this collaboration as the sharing of data, methodology and/or information that improves both processes. As semiconductors become more complex, this sharing process is increasingly important to effectively manage the overall complexity of today’s chip designs.Smith: What trends are driving the need for this collaboration?Kelf: Apart from the ever-increasing size and density of semiconductors, there are specific trends that require more interaction between design, verification and manufacturing. Obvious developments include the advent of chiplets, given the changes in performance of signal paths, and 3D devices driving complex packaging, power dissipation and other issues. Design issues such as the increased need for SoC coherency testing and complex device structures such as multi-core processors, also play a role. With many of these issues, design and verification (D/V) trade-offs have an impact on manufacturing, and vice versa. For example, differing delays on a Universal Chiplet Interconnect Express (UCIe) interface—an open specification for a die-to-die interconnect and serial bus between chiplets—will have an impact on hazard testing in coherency verification. As another example, thermal hotspots on some parts of a chip package might need additional testing during the verification phase. Smith: What trends and challenges are preventing a fully integrated design and manufacturing design flow?Kelf: Traditionally, the D/V and manufacturing teams have remained separate in most organizations, as well as between the two industries. EDA companies sell primarily to the design teams, although they do interact with the foundries at the back end of the process. Manufacturing companies work directly with different teams at the foundries and not with the D/V teams at all. New relationships need to be built up. The general know-how in these disciplines is different, and methodology approaches tend to be disconnected. The tradition is to separate the processes and use standardized interfaces for communication that leaves little room for improvisation. All this needs to change so that teams can begin to work more closely.Smith: What is circular EDA-manufacturing collaboration and vertical integration?Kelf: In past EDA flows, we have seen disparate tools performing specific functions. As semiconductors got smaller, their physics changed and this led to the design process absorbing new characteristics. For example, abstract designs were run through synthesis to create gates connected by wires. This format was then passed to place and route (P R) tools that would lay out the gates in terms of transistors and interconnects on the silicon wafer. On large devices, the gate level signal delays were larger than the interconnect, allowing design to be separated from layout. As silicon became denser, the interconnect delays became the dominant factor, and the layout of the device impacted the design synthesis process. The two tools required forward integration—synthesis projected layout rules to P R, and a reverse integration where layout characteristics were sent back to synthesis for redesign where required delays could not be handled during P R. The methodology went from a simple flow to a circular design approach as synthesis and P R cooperated. The same is now true of design and manufacturing where solving the problems noted above requires this same circular cooperation. Smith: What will it take to have an integrated design and manufacturing flow?Kelf: A lot of cooperation between different groups. As we reach limits in areas such as signal integrity and thermal management that will squeeze silicon efficiency improvements, these methodology linkages will be required for continued progress and growth. The industry (both design and manufacturing) will be highly motivated to make this happen. Smith: From a personnel perspective, who (on both sides) are the typical touchpoints? Kelf: It will be the engineering staff from both the design side and manufacturing that work closely to develop technical solutions. Executive-level support is, of course, needed to cement the collaboration. Smith: Where does AI fit?Kelf: AI will have a role to play in this. Estimating the factors that drive efficient design to manufacturing to design flows is a critical step in speeding interaction and providing sensible estimated starting points. AI can process the large amounts of data necessary to provide these estimates as we now see complex chips that contain billions of transistors. AI will be needed to accelerate the interactions for different tools through the development process.As design and manufacturing collaboration becomes a critically important industry strategy, companies are turning to SEMI and its Technical Communities such as the ESDA and their wide-ranging initiatives. For details and to get involved, visit the ESDA website at https://www.semi.org/en/communities/esda. To learn more about Breker and its solutions that provide test content portability and reuse to solve complex semiconductor challenges across the functional verification process, go to: https://brekersystems.com.About Dave KelfDave Kelf holds the position of CEO of Breker Verification after serving as its Chief Marketing Officer responsible for all aspects of Breker’s marketing activities, strategic programs and channel management.Earlier, he served as vice president of worldwide marketing solutions at formal verification provider OneSpin Solutions, was president and CEO of Sigmatix, Inc., and held senior positions at Cadence, Synopsys and Springsoft. Kelf holds a Bachelor of Science degree in Electronic Computer Systems from the University of Salford and a Master of Science degree in Microelectronics from Brunel University, both in the U.K., and an MBA from Boston University.Robert (Bob) Smith is executive director of the ESD Alliance, a SEMI Technology Community. 

As Europe’s microelectronics industry enters a new era of growth, one question stands out: do we have the talent pipeline to match our ambitions? The European Chips Skills Academy (ECSA), coordinated by SEMI Europe, is addressing this challenge through coordinated action, insightful research, and strong collaboration between industry and academia. Why Talent and Skills Matter The semiconductor sector in Europe is undergoing rapid transformation, driven by the European Chips Act and large-scale investments in design, manufacturing, and packaging. This momentum creates significant demand for engineers, technicians, and specialists across the electronics value chain.However, Europe faces a growing structural challenge. An ageing workforce, modest growth in technical graduates, and limited public awareness of semiconductor careers are widening the talent gap.The ECSA Skills Strategy 2024, published in November 2024, provides a detailed overview of this situation. The updated Skills Strategy 2025, released in November 2025, reinforces the urgency with new data and recommendations.According to the latest report, around 30% of Europe’s current semiconductor workforce will retire by 2030, while the inflow of graduates is increasing by less than 1% per year. This creates an annual shortfall of approximately 10,800 skilled professionals across the European value chain. Read the full report, available to download on the ECSA website.Without decisive action, this shortfall could limit Europe’s ability to meet its strategic goals in semiconductors, electronics, and digital technologies.What is European Chips Skills Academy (ECSA)?ECSA connects industry, academia, training providers, and policymakers to create a sustainable and inclusive skills ecosystem for the electronic components and systems (ECS) sector.Its core objectives are:To attract new talent into semiconductor and ECS careers.To upskill and reskill professionals for emerging roles.To build a long-term, future-ready talent pipeline across Europe.Through this initiative, SEMI Europe is leading the conversation on talent and skills, turning awareness into action and strategy into measurable results.Key ECSA Initiatives:1. ECS Summer School The annual ECS Summer School invites STEM students from across Europe to explore careers in microelectronics through lectures, workshops, and hands-on learning.The 2024 edition took place in Bertinoro, Italy, while the 2025 edition was hosted by the Budapest University of Technology and Economics in August 2025, under the theme “Fascinating Electronics for a Cool World.”The 2026 edition will return to Bertinoro, Italy on August 23-26. These events give students a first-hand look at the semiconductor ecosystem, helping them connect with experts and understand how their studies translate into real-world careers.Read more about the 2025 Summer School.2. “Day in a Fab” WebinarsThe “Day in a Fab” series offers students and young professionals the opportunity to interact directly with experts from semiconductor fabs, design houses, and equipment manufacturers.These webinars provide practical insights into various career paths within the ECS industry, helping participants better understand the range of opportunities beyond traditional engineering roles.By bridging the gap between academia and industry, these sessions help students envision a future within the European semiconductor ecosystem.See upcoming events on the ECSA website.3. Skills Strategy ReportsECSA’s Skills Strategy Reports (2024 and 2025) form the backbone of Europe’s talent development roadmap.They provide:Quantitative forecasts of job demand, workforce needs, and potential skill shortages.Insights from over 130 industry and academic experts.Recommendations for training, mobility, and reskilling programmes.The 2024 Skills Strategy Report can be accessed here, while the 2025 update is available here.These reports help policymakers, companies, and educators align their efforts to strengthen Europe’s competitiveness and ensure a resilient talent ecosystem.SEMI Europe’s Leadership in Talent and SkillsAs the global industry association for electronics manufacturing and design, SEMI Europe plays a central role in addressing the talent challenge.Through ECSA, SEMI Europe:Validates industry needs to ensure training and education are aligned with real-world demand.Connects universities and training providers with semiconductor companies to co-develop curricula.Promotes visibility and inclusion across the ECS community.Supports mobility and collaboration to create a Europe-wide approach to skills development.This leadership transforms the skills agenda from a background issue into a strategic pillar of Europe’s semiconductor ecosystem.Looking AheadThe European semiconductor industry is entering a decisive decade. The technology and investment potential are enormous, but they depend on a skilled and motivated workforce.ECSA’s work from the Skills Strategy reports to the Summer School and student engagement activities is creating a structured, evidence-based approach to developing that workforce.The path forward is clear: attract, train, and empower the next generation of engineers and innovators. With SEMI Europe’s guidance, the European Chips Skills Academy is ensuring that Europe’s ambitions in chips and microelectronics are matched by the people who will make them possible.The European Chips Skills Academy (ECSA) is a pan-European initiative coordinated by SEMI Europe and co-funded by the European Education and Culture Executive Agency (EACEA) under project number 101110124.Learn more about ECSA’s mission.SEMI ContactJatin Mendiratta, Communication CoordinatorEmail: [email protected]

The semiconductor industry continues to push the boundaries of innovation, making quality management more critical than ever. To address these challenges, SEMI Quality Benchmarking Consortium (QBC) brings together leading companies to share best practices, benchmark performance, and drive collective improvement across the global semiconductor ecosystem.The latest QBC meeting was hosted by Roberto Lissoni of STMicroelectronics at their Agrate site near Milan, Italy. Representatives from Bosch, GlobalFoundries, Infineon, Micron, NXP, and Texas Instruments gathered for two days of deep discussion and knowledge exchange. (From Right to Left) – Roberto Lissoni (STMicroelecetronics), Giorgio Cesana (STMicroelectronics), Fern Yoon (Texas Instruments), Jens Luepke (Infineon), Mark da Silva (SEMI), Kerstin Nocke (Bosch), John Lepper (GlobalFoundries), Bill Lechten (Micron), Lou Cerra (NXP)With over 5,000 employees, ST’s Agrate facility is the company’s largest in Italy, with a strong commitment to innovation through university collaborations. The site includes both 200mm and 300mm wafer fabs, R D centers, and product development teams. STMicroelectronics Agrate, ItalyThe QBC operates on a “Give-to-Get” philosophy: members must actively contribute survey responses and participate in open discussions to access shared benchmarking data. This meeting focused on four topics: zero defect customer satisfaction, safe launch, knowledge management, and organizational comparisons. Participants presented their approaches, shared lessons learned, and engaged in roundtable discussions to identify best-known methods and address common challenges. Zero Defect and Continuous ImprovementParticipants explored the evolving definition of “zero defect,” emphasizing that it’s not about literal perfection, but about meeting customer commitments and requirements. Quality programs are multi-year, cross-functional initiatives, often embedded in broader operational excellence campaigns. Companies leverage KPIs such as parts per million, cost of nonconformance, and customer satisfaction. They tie these metrics to incentive programs and executive reporting. Continuous improvement is driven by Lean, Six Sigma, and employee engagement, with a strong focus on early detection (“shift left”), cross-functional teams, and digital tools for analytics and feedback. Customer Satisfaction and ScorecardsCustomer scorecards and surveys are central to measuring satisfaction, with processes varying by region and account type. Most organizations use a mix of manual and automated systems to collect, review, and act on scorecard data, supplementing these with relationship and transactional surveys. AI and predictive analytics are emerging tools for anticipating customer feedback and improving proactive management, though data security remains a priority. Safe Launch and Risk ManagementThe QBC companies shared decision criteria, risk assessment methodologies (FMEA, TRA), and enhanced control plans for new products and technologies. Cross-functional collaboration is key, with product quality managers accountable for planning and reporting. Digitalization and integration with manufacturing execution systems (MES) are advancing, and there’s growing interest in leveraging AI for risk assessment and process optimization. Knowledge Management and Lessons LearnedKnowledge management remains a challenge, with most companies relying on distributed databases, expert teams, and informal networks. They are piloting structured lessons learned forums, audit systems, and semantic search tools to improve findability and reuse. Effective knowledge management happens when insights are embedded directly into business processes, supported by continuous review and governance. Looking Ahead: AI, Predictive Quality, and ExpansionThe consortium plans to explore topics such as artificial intelligence, predictive quality management, and secure data sharing through dedicated sessions and working groups, with a focus on practical applications and insights from external subject matter experts.Read about the first QBC meeting hosted by Infineon here. Sarah Shen is Senior Coordinator, MEMS Sensors Industry Group at SEMI.

The Rising Stars: 20 Under 30 blog series celebrates the brightest young leaders shaping the future of the semiconductor industry. These exceptional individuals have earned the SEMI Europe 20 Under 30 Award for making a remarkable impact across the supply chain—whether in engineering, sales, marketing, or R D. Nominations for the 2025 20 Under 30 Award are now open, providing the opportunity to recognize and honor the next wave of industry trailblazers.The series spotlights these rising stars for their career achievements, commitment to innovation, leadership skills, and dedication to driving both business success and community growth.Follow their inspiring journeys and discover how they are thriving and paving the way for future generations in the semiconductor world.Meet Anne-Mary Yeboah, Technology Manager at SoitecWith a background in materials science and a strong interest in technology, Anne-Mary Yeboah has built a career that connects the worlds of engineering and management. After earning her degree in engineering, she deepened her understanding of business through a Specialized Master’s in Management—an experience that broadened her perspective and prepared her for the challenges of a global, fast-moving industry.Today, as Technology Manager at Soitec, Yeboah leads projects that contribute to the next generation of semiconductor innovations. Her journey reflects a balance of technical curiosity, leadership growth, and a belief in the power of inclusion. In this interview, she shares her thoughts on career development, the importance of diversity, and how young professionals can find their voice in a rapidly evolving industry.SEMI: What inspired you to join the semiconductor industry? Yeboah: I’ve always been fascinated by technology, and semiconductors are at the core of innovation today. They are everywhere, from smartphones to electric vehicles, and being part of this field means contributing directly to the technologies shaping our lives and future.SEMI: How did your early experiences and education shape your career path?Yeboah: My engineering studies led me to specialize in materials science, which naturally included semiconductors. Later, I decided to expand my knowledge by pursuing a Specialized Master’s in Management. This combination of technical and business perspectives shaped my career path and ultimately brought me to Soitec, where I now connect both worlds as a Technology Manager.SEMI: Can you share a professional accomplishment you’re most proud of, and explain why it’s significant to you?Yeboah: I’m especially proud of starting my career directly as a Technology Manager. This role has allowed me to contribute to complex, strategic projects and collaborate with teams across functions. Working on products that will drive future innovations is deeply fulfilling and gives meaning to my work every day.SEMI: As a young professional in the industry, what is your greatest challenge? Yeboah: One of the biggest challenges has been finding my voice in a highly experienced environment. It can be intimidating at first, but I’ve learned to turn it into an opportunity to ask questions, learn quickly, and build confidence in my contributions. It has pushed me to develop a broad skill set and become an effective collaborator across teams.SEMI: What advice would you give to younger generations aspiring to make an impact in this industry?Yeboah: Dare to step forward and don’t create your own limits. Ask questions, even when you’re surrounded by experts, curiosity is a strength. Also, be patient. Building credibility and seeing your impact takes time, but each experience helps you grow and move closer to your goals.SEMI: How do you envision future work environments?Yeboah: I see the workplaces of the future as more innovative, inclusive, and collaborative. Diversity should be central, everyone should feel that their voice and perspective matter. At Soitec, initiatives like Women@Soitec are great examples of how gender equality and inclusion can empower people to thrive. I also believe technology and flexibility will continue to reshape how we work, helping us achieve both high performance and balance.SEMI: What impact has the 20 Under 30 Award had on your career? Yeboah: Receiving the 20 Under 30 Award has been a true honor and a wonderful source of motivation. It gave me a moment to reflect on how far I’ve come and to feel proud of my journey. The recognition has boosted my confidence, increased my visibility, and encouraged me to continue pushing forward in my career.Following 20 Under 30 JourneysAnne-Mary Yeboah’s story highlights the determination and adaptability driving today’s new generation of semiconductor professionals. Her ability to bridge science and management reflects the diverse skill sets shaping the industry’s future.The Rising Stars: 20 Under 30 blog series celebrates the exceptional talent and leadership driving the future of the semiconductor industry. Each of the young innovators honored is excelling in their respective fields while shaping the landscape of technology and business with their visionary approaches and dedication. Their stories exemplify the remarkable achievements and unwavering commitment that define the next generation of industry leaders. The series is intended to inspire and motivate future professionals to pursue their passions and embrace the opportunities within this dynamic industry. Stay tuned for more stories of rising stars who are paving the way for continued growth and innovation in the semiconductor world.Learn more about the SEMI Europe 20 Under 30 Award and the recipients honored at SEMICON Europa. SEMI ContactJames Lam, Business Development ManagerEmail: [email protected]

The Rising Stars: 20 Under 30 blog series celebrates the brightest young leaders shaping the future of the semiconductor industry. These exceptional individuals have earned the SEMI Europe 20 Under 30 Award for making a remarkable impact across the supply chain—whether in engineering, sales, marketing, or R D. Nominations for the 2025 20 Under 30 Award are now open, providing the opportunity to recognize and honor the next wave of industry trailblazers.The series spotlights these rising stars for their career achievements, commitment to innovation, leadership skills, and dedication to driving both business success and community growth.Follow their inspiring journeys and discover how they are thriving and paving the way for future generations in the semiconductor world.Meet Eloise Bond, Senior Etch Process Engineer at KLA Corporation (SPTS Division)Eloise Bond studied Physics at Swansea University before joining KLA in 2019 as an Etch Process Engineer. Since then, she has worked on cutting-edge semiconductor applications while actively promoting STEM through local outreach programs like Generation Tech.A proud recipient of the SEMI Europe 20 Under 30 Award, Bond shares how the recognition boosted her confidence and expanded her network, enabling her to take on new challenges. In her interview, she reflects on overcoming imposter syndrome, the value of flexible work, and the unexpected opportunities that shaped her career. Outside of work, Bond enjoys camping and bouldering.SEMI: What inspired you to join the semiconductor industry? Bond: I’ve always had a passion for science, so pursuing a career in a related field was natural. However, I wasn’t aware of the semiconductor industry until I began studying Physics at Swansea University, which has strong research ties with local semiconductor companies like KLA. Now that I am in the industry, I enjoy the hands-on aspects of my job. I find working with different materials and equipment is more engaging to me than an office-based job. SEMI: How did your early experiences and education shape your career path?Bond: STEM activities during my childhood and visits to museums with my parents sparked my interest in science and the physical world. That curiosity lead me to study physics at Swansea University, which ultimately paved the way to my current role at KLA. As I mentioned earlier, a career in semiconductors wasn’t really a conscious choice until relatively late in my education; I simply followed my passion for science. Today, I’m involved in many of the STEM outreach programs at KLA, helping to promote the semiconductor industry to young children so they can discover the same opportunities that I was fortunate to have had exposure to earlier in my life.SEMI: Can you share a professional accomplishment you’re most proud of, and explain why it’s significant to you?Bond: One accomplishment I’m particularly proud of is building strong customer relationships with a volume production fab in Korea. It was my first experience with direct customer interactions, which felt quite daunting at the time. I was invited to support a tool installation on-site, which allowed me to travel the furthest from the UK I had ever gone. Seeing firsthand how our tools fit into the wider industry gave me valuable context for my day-to-day responsibilities and made my work feel even more impactful. SEMI: As a young professional in the industry, what is your greatest challenge? Bond: Imposter syndrome has been a significant challenge for me. I often find myself in meetings with more senior colleagues and fear I am not performing well enough. However, over time, I have learned that my input is valid and that having multiple perspectives often leads to better outcomes.SEMI: What advice would you give to younger generations aspiring to make an impact in this industry?Bond: To make a difference, you first need to be part of the industry, just getting involved puts you in the room where conversations and decisions happen that you might not otherwise be exposed to.If an opportunity comes your way, take it. I entered this industry due to an opportunity presented to me at the end of my university career. KLA was my first real interview, and I honestly thought my chances were slim. I approached it as a ‘trial run’ and five years later, I’m still here. SEMI: How do you envision future work environments?Bond: I envision a new generation of management that places greater value on work-life balance. In many industries, senior management seem to have a relatively poor work-life balance, such as constantly doing business in the same way they’ve done for the past 40+ years – with constant business travel, working on holidays and long hours in the office. There is still an expectation for younger, ambitious employees to emulate this corporate culture, which creates barriers for those with caregiving responsibilities or other important commitments outside work. I believe a younger, more vocal generation of managers will drive positive changes in how we work. We will see more adoption of fully flexible working and 4-day weeks – happy employees lead to better work outcomes. I also think the technological advances which enabled the rapid switch to “working from home” during the COVID pandemic have permanently reshaped what is possible in terms of flexibly and efficiently.SEMI: What impact has the 20 Under 30 Award had on your career? Bond: This award has given me greater confidence to step outside of my comfort zone. It has also allowed me to increase my network to include colleagues I would have no reason to speak to previously. As a result, I have gained broader knowledge of how KLA operates as a whole and have been able to initiate small cross departmental projects I would not have been possible to before. Following 20 Under 30 JourneysEloise Bond’s journey highlights the passion, resilience, and forward-thinking mindset that characterize today’s emerging leaders in semiconductors. Her dedication to both technical excellence and community engagement showcases how rising stars are not only advancing the industry but also inspiring the next generation.The Rising Stars: 20 Under 30 blog series celebrates the exceptional talent and leadership driving the future of the semiconductor industry. Each of the young innovators honored is excelling in their respective fields while shaping the landscape of technology and business with their visionary approaches and dedication. Their stories exemplify the remarkable achievements and unwavering commitment that define the next generation of industry leaders. The series is intended to inspire and motivate future professionals to pursue their passions and embrace the opportunities within this dynamic industry. Stay tuned for more stories of rising stars who are paving the way for continued growth and innovation in the semiconductor world.Learn more about the SEMI Europe 20 Under 30 Award and the recipients honored at SEMICON Europa. SEMI ContactMaria Daniela Perez, Communications ManagerEmail: [email protected]