This year’s SEMICON West has new dates, a new location in a new city and a new addition to the program—design!
“The Convergence of Semiconductor Manufacturing and Design” will highlight the collaboration between semiconductor manufacturers and chip design teams to bring advanced systems to market. The three-hour session during SEMICON West will be held Tuesday, October 7, from 1-4 p.m. at the Phoenix Convention Center in Phoenix, Arizona.
Five 20-minute presentations will describe successful collaborations and address challenges and opportunities about design and manufacturing security, long-term reliability, system performance issues, and modeling and verification that encompass the entire system.
Attendees can expect to learn about the key drivers behind the need for collaboration that range from heterogeneous integration to advanced packaging technologies and applications such as automotive and medical.
Session moderators are Ming Zhang, PhD, Vice President of Fabless Solutions of PDF Solutions, and me. “As design and manufacturing complexity continues to grow, driven by applications like AI, it is becoming increasingly difficult to account for every manufacturing variation during design and at sign-off or to fully anticipate the entire design space at chip and system levels during manufacturing technology development,” said Zhang. “Achieving tighter integration between design and manufacturing through broader and deeper data and methodology collaboration will be critical to improving predictability, accelerating time to market and enabling the next generation of semiconductor innovation.”
It’s within this context that we selected the presenters who include:
- “Revolutionizing Silicon to Systems Design: Unlocking the Future with 2.5D and 3D Multi-Die Innovations” by Sutirtha Kabir of Synopsys.
- “Manufacturing to Development to Manufacturing for Circular Collaboration Leveraging AI and Other EDA Advances” with David Kelf from Breker Verification Systems.
- “Bridging the Silicon Divide: Converging Chip Design and Manufacturing in the Era of High Integration” from Lu Dai at Qualcomm Technologies.
- “3D and Chiplets Driving Moore’s Law into the Future” with Joe Kwan of Siemens EDA.
- “Multiphysics & Multiscale Challenges and Solutions for 3D Heterogenous Integration” by Sudarshan Mallu from Ansys, part of Synopsys.
The program concludes with a panel moderated by Zhang titled “The Convergence of Semiconductor Manufacturing and Design” and features the session presenters.
Join us to learn how the semiconductor manufacturing and design communities are collaborating to deliver advanced systems based on chiplets and rapidly emerging packaging technologies including 2.5D and 3D ICs and MCMs. Audience participation will be encouraged.
Also of interest to attendees is a SEMICON West keynote from John Kibarian, CEO, President and Co-Founder of PDF Solutions who is also co-chair of SEMI’s ESD Alliance Governing Council. Kibarian will address “Revolutionizing Semiconductor Collaboration: The Emergence of AI-Driven Industry Platforms” during the CEO Summit keynotes on Wednesday, October 8 at 10:20 a.m.
SEMICON West 2025 makes its debut in Phoenix, October 7-9 at the Phoenix Convention Center. This milestone event gathers global leaders across the microelectronics supply chain to explore transformative technologies, develop the future workforce and drive strategic collaboration. Moving SEMICON West to Phoenix highlights Arizona as a key hub for innovation and industry growth.
Visit the SEMICON West homepage for more details on full program, including “The Convergence of Semiconductor Manufacturing and Design” session, special features, sponsors and exhibits. Registration is open.
Robert (Bob) Smith is executive director of the ESD Alliance, a SEMI Technology Community.
