Electronic Design Automation (EDA) financial analyst Jay Vleeschhouwer, Managing Director of Software Research at Griffin Securities, carefully tracks the design portion of the semiconductor industry and offers insightful analysis used by this community. He also presents the State of EDA, a yearly report on EDA, during the Design Automation Conference (DAC). After this year’s presentation, he and I talked about trends, the difference between EDA and Architecture, Engineering, and Construction (AEC), security and chiplets. A condensed version of our talk follows. Smith: Now that the Synopsys-Ansys merger closed, what changes? Vleeschhouwer: Synopsys is now the largest company by revenue and backlog in all of Engineering Software, a well over $30-billion industry, including all the parts of that market—AEC, EDA and Technical Software. The pro-forma backlog, about $9.84 billion as of the most recently reported quarter, is the largest in the industry. An important question is how will Synopsys integrate, employ and leverage the four-fifths of Ansys that is not strictly EDA? That is, other than Ansoft and Apache, the two entities that mostly comprise Ansys' EDA, and that ties into the convergence theme. Also, the question in any acquisition is the balance between leaving the operations and the portfolios as they were, or not. In other words, let them continue doing what they were doing if they were doing it well or quickly absorbing, integrating and leveraging those portfolios into the buyer's portfolio. That roadmap is something that we would be interested in hearing more about in terms of its purely EDA aspects and as well the convergence aspects.Smith: Have you observed any new trends in 2025 that surprised you? Vleeschhouwer: The short answer is that it's more of the same in terms of the main technical and business trends. Of course, the most recent important exogenous effect is the advent of tariffs and new export restrictions, or the variability around export restrictions. That's perhaps the main thing that's occurred in the last few weeks and months. We're seeing a continuation of trends that have been in place for a number of years in terms of many of the technical and business results that we've highlighted in our reports. From industry data, there continues to be multiple EDA categories that are continuing to grow. It’s observable and important that we see this breadth of product adoption and growth across multiple categories. This has been beneficial to each of the four largest EDA companies. There have been compelling technical reasons for this, and I would expect it to remain the case. In terms of those significant multi-year trends, the answer would be no. Otherwise, in terms of 2025 specifically, the thing that was interesting about this year’s DAC was the presence of more startups, something that we've not seen in EDA for a long time. It's interesting that we are seeing startup activity not only in EDA, but even in one of the other areas of Engineering Software that we cover: AEC has little to do with semiconductors and electronic systems and it too has more startup activity than we've seen for about a quarter of a century. Although the rationales for the startups in these two different areas of Engineering Software are quite different. The rationale for the EDA startups is one set of rationales, whereas in the case of AEC, it's different, which to me is analytically interesting. Smith: What is the difference between the rationales for startup activity in EDA and AEC? Vleeschhouwer: AEC has to do with the design and construction of commercial buildings, residential buildings, infrastructure, meaning roads, bridges, airports, tunnels, civil engineering, public works. Among the companies that we follow in those markets are Autodesk and Bentley Systems. Autodesk has a small connection to EDA because one of their mechanical CAD products has some integration with some PCB design tools. In any case, the rationale for startups in AEC that we've seen has mostly to do with what has been some vocal dissatisfaction with the incumbent or large incumbent products. That's different from EDA, where we can’t make a case that there is dissatisfaction or sufficient dissatisfaction with the incumbent tools that would necessitate, or be a catalyst, for startups. What we're seeing here is the ongoing, complex, rapid evolution of semiconductor design and electronic systems design because of the unusual breadth of EDA tools and functions, far more so than in AEC. There's much more opportunity for niche products to perhaps complement existing tools. As you know, it can be difficult to dislodge an existing tool in EDA. The industry has become consolidated among the big four—Ansys, Cadence, Siemens EDA and Synopsys—and now three with Synopsys/Ansys merger. Backlogs have continued to grow and book-to-bill has been positive for 15 years. It’s hard to infer any dissatisfaction with incumbent tools or insufficient satisfaction showing up in the numbers. Whereas in AEC, it's different in terms of the profile of the customers or the way the tools are used. There are far more customers than in EDA—thousands upon thousands of architectural firms and construction firms and so forth. The installed base of the AEC software is an order of magnitude more than in EDA. It just so happens that there was one tool from Autodesk that has been getting considerable attention from customers in terms of how modern it is and so forth. This created an opening for some startups. Notwithstanding the nominal dissatisfaction with this tool, however, that particular brand continues to grow. It has the largest base in the industry. At the end of the day, the largest product of its kind in the market continues to grow at a decent rate. The vendor in this case, Autodesk, has acknowledged some of the things needed to do to improve the tool, and it's investing toward that. In any case, there are differences in why these startups exist, how they're approaching the market.Smith: The big topics now are 2D and 3D and chiplets. Where is the market relative to chiplet-based design? Vleeschhouwer: It’s still early, based on commentary from the EDA vendors, about developing and delivering the tools. I don't have a precise measure as to how much of the business is attributable to it. It’s still something that has a considerable runway, which is a good thing. As more tools that can enable it come together, then we'll continue to see this cycle of enablement and delivery. That phenomenon will continue to grow. We would love to hear the vendors’ provide more precise attribution in terms of how much of the business is coming from this. For investors, it will be incumbent upon the vendors to be more explicit about the contribution from the new technical phenomena because it is a new growth catalyst. Smith: The ESD Alliance is starting to see more interest in securing the design flow. This is a huge issue. The design flow is more complex and it's going to require cooperation, collaboration and new standards. Vleeschhouwer: Yes. Siemens EDA is the largest in classical product lifecycle management (PLM) or managing the whole process, an important issue for the industrial and manufacturing markets with its Teamcenter product. Interestingly, Siemens EDA still has work to do to integrate Teamcenter with Calibre, which would seem to have been a natural thing to have done, and I think still is. Teamcenter and Calibre are the two billion-dollar brands that Siemens Industry Software has as an entity. Calibre is by far the predominant product of its kind for semiconductor manufacturing. It's got at least two-thirds market share. Teamcenter is the market leader in classical PLM. The connection between those two brands, owned by the same company, would be an interesting executable to observe.About Jay Vleeschhouwer  Jay Vleeschhouwer, Managing Director of Software Research at Griffin Securities, has more than 40 years of research analyst experience in the technology sector, including software, semiconductors and computer hardware. Vleeschhouwer does a yearly presentation on the State of EDA during the Design Automation Conference (DAC). The slides can be found at: DAC presentation (June 2025) 2.pdf Note: The ESD Alliance will host a three-hour design track “The Convergence of Semiconductor Manufacturing and Design” Tuesday, October 7, from 1 p.m. until 4 p.m. during SEMICON West in Phoenix, Ariz. Robert (Bob) Smith is executive director of the ESD Alliance, a SEMI Technology Community. 

“In today's ever-evolving professional landscape, empowering women and fostering their success is not just necessary—it's essential," said Caryn Veach, a long-time Women in Semiconductors (WiS) committee member. Veach is a strategic account manager at Kokusai Electric Corporation, which sponsored the WiS program in Albany, New York in May. Additional sponsors included Axcelis, Energetiq (a Hamamatsu Company), IBM, Nikon Precision and Onto Innovation.This year’s WiS theme, "Empowerment in Action: Real Strategies for Women’s Success," was designed to provide all attendees with actionable strategies to support women's career growth and representation, as well as lead to greater talent retention and workforce stability. The program, which was open to everyone at the co-located SEMI Advanced Semiconductor Manufacturing Conference, was co-chaired by Joy Racowski, PhD., Strategic Account Sales Engineering Manager - Delivery Systems Services at EMD Electronics and Rosanna Robert, ES Process Engineer ll at TEL Technology Center America.Keynote speaker Jennifer Lynn, Cybersecurity Leader and Research Security Program Manager at IBM Semiconductors emphasized the significance of community in driving change. She stressed the role of Employee Resource Groups (ERGs) as a collective voice to advocate for safer and welcoming workspaces where all individuals feel respected and valued. Some key takeaways from Lynn’s address: champion supportive career initiatives, become a mentor or find a mentor, and be an ally in support of peer success. Shari Liss, Vice President of Global Workforce Development and Initiatives at SEMI, moderated a panel which also highlighted real strategies for women’s success. Panelists from EMD Electronics, Entegris, TEL Technology Center of America and University at Albany focused on actionable strategies which everyone, not only women, can implement to navigate corporate environments. They encouraged WiS participants to challenge norms which penalize specific employees. Panelists invited attendees to discover and embrace what makes them unique and use that as a strength for themselves as well as others. (l-r) WiS panel: Shari Liss, SEMI; Jennifer Braggin, Director, Technology, Office of the CTO, Entegris; Daniel Drellich, Managing Director Sr. Vice President of Business Partnering, EMD Electronics; Kathleen Dunn, PhD, Professor of Nanoscale Science and Engineering, University at Albany; Alex Oscilowski, President, TEL Technology Center AmericaImposter Syndrome is a common challenge to women and those who are new in their career or leadership role. Panelists advised everyone to push through it and support others who might feel this way. Assertiveness is an area which should be seen as a strength rather than a disadvantage, especially for women; it’s important that different voices and opinions are heard. Finally, panelists urged everyone to give credit where it is due and actively support team members and peers.The program concluded with an interactive workshop facilitated by Debbie Gustafson, CEO of Energetiq Technology. Attendees were invited to craft an elevator pitch which could be used when networking or applying for a new job or position. Common elements of a pitch include a concise description of oneself, a unique value proposition and a call to action for one’s audience or employer. WiS was an empowering experience with excellent opportunities to network with female business leaders from around the country as well as recent college graduates and industry professionals from major semiconductor manufacturers. There is something uniquely impactful about coming together with other women and peers who understand the challenges and opportunities of our industry. These events create space for honest conversations, meaningful networking, and a sense of community. It is a reminder that that together we can drive change and support one another in powerful ways. Through grants from the W.K. Kellogg Foundation and the David Lucille Packard Foundation, the SEMI Foundation is expanding Women in Semiconductors programming to several regions around the country. In addition to an event in San Jose, California there will be programs in Arizona, Michigan and Ohio in the second half of 2025. For information on WiS in Michigan, visit https://semiscan.org/event/women-in-semiconductors/.Empowering women in the workplace requires persistent effort and community support. By embracing these strategies and advocating for necessary changes, organizations can pave the way for a more equitable future. And just like the Kokusai Electric embrace of Tai-wa, a Japanese word meaning "synergistic discourse", WiS encourages face-to-face conversations and a willingness to understand others with a sense of empathy and respect for everyone.Margaret Kindling is Senior Program Manager at the SEMI Foundation. She has promoted inclusive workplaces via initiatives like WiS, Semiconductor PRIDE and workforce development programming at SEMICON West, SEMICON India and SEMIEXPO Heartland. After a combined 37 years at SEMI and the SEMI Foundation, she will be retiring in August 2025.

In Q2, the SEMI International Standards Program made progress on several emerging initiatives. Together, we reached a critical milestone for one of our data standards initiatives with Document 6938C recently passing Technical Committee review in mid-June 2025. Ballot 6938C, which provides guidance on how to identify manufacturing equipment data provided by the equipment supplier that can be used in equipment engineering or analysis applications, is slated to join SEMI E190 and E190.1 in providing industry-enabling data standardization.In addition, we began major revisions to SEMI Standards S2, S8, and S10. These standards govern environmental, health, and safety (EHS) considerations, equipment user fatigue and injury reduction, and equipment risk assessment and evaluation, respectively. In our recently concluded North America Standards Summer 2025 Meetings, the NA EHS Technical Committee Chapter approved a revision ballot to SEMI S10. The ballot (7169) proposed several major revisions to the SEMI S10 Safety Guideline on risk assessment which included changes to references to equipment to objects under consideration. Other changes also included the relocation of the assessment of the risk of harm to property other than the OUC to a Related Information section. Additional details are provided below.We’re eagerly preparing for this year’s SEMICON West event, taking place for the first time ever in Phoenix, Arizona. We are also pleased to announce the return of the SEMI Global Standards Summit taking place Tuesday afternoon, October 7 at SEMICON West. Our inaugural Summit was held last year at SEMICON Japan 2024 last December. The Summit aims to identify standards-critical areas and work towards an industry standardization strategy for the next 3- and 7-year time horizons. This year's Global Standards Summit will feature sessions on Supply Chain Traceability as well as Environmental Sustainability. Similarly, as cybersecurity considerations become more complex, SEMICON West will host a dedicated Cybersecurity Forum from October 7-9 to address today’s most pertinent challenges. More detailed program information will be available soon. Finally, we’re looking forward to our SEMI Standards + Award Ceremony Networking Event at SEMICON West. Following the International Standards Meeting and Standards Summit on Tuesday, October 7, join us for appetizers, drinks, and great conversation from 6-7:30 p.m. In the meantime, learn more about becoming a member of the SEMI International Standards Program.Balloting for Document 6938Document 6938C introduces a new potential standard – Guide for Equipment Edge Data Governance. Under development by the Equipment Edge Data Governance (EEDG) Task Force since 2021, Document 6938C was balloted in Cycle 3-2025 and approved during the Information Control Taiwan Technical Committee (TC) Chapter meeting held on June 12, 2025. It has since received approval by the International Standards Committee Audits and Reviews Subcommittee and is now undergoing final processing for publication by SEMI. As manufacturing equipment offers more accessible data than ever, poor communication, inconsistent expectations, and data security concerns continue to halt or slow factory integration efforts. If passed, this new standard will help organize the information that supports smart manufacturing efforts at the edge. In addition, the EEDG Guide will provide a comprehensive set of best practices to both users and suppliers to increase the value of existing equipment data. Update on Revisions to SEMI S2, S8, and S10 Safety GuidelinesOur 2025 Q1 Standards Watch newsletter announced a significant overhaul for SEMI Standards S2, S8, and S10.S2, SEMI’s standard for performance-based environmental, health, and safety (EHS) considerations for semiconductor manufacturing equipment, is undergoing discussions on redefining safety interlock systems. The S2 task force will issue an informal ballot to the general audience for feedback. The results then will be used to develop a formal letter ballot.First developed in 1995, SEMI Standard S8 works to reduce fatigue and injury by matching equipment to the user’s size, strength, and range of motion. Although this safety standard has been periodically updated since its inception, its last substantial revision was in 2018. The ballot to revise S8 ultimately failed the EH S TC Chapter review at this year’s Winter Meeting. With 214 comments and negatives to consider, the task force is revising the ballot and plans to reissue in Cycle 7 of August 2025.Finally, SEMI Standard S10 is moving through ballot 7169. This standard defines a consistent means of risk estimation that other SEMI Safety Guidelines can invoke. Ballot 7169 will separate facility and building risk assessment to a non-normative portion of the document, ensure EHS risks are separately calculated from commercial object risks, and clarify risk assessment of observed events from risk assessment of foreseen events. Ballot 7169 results were reviewed on June 5 during the North America Standards Summer meetings. The document was approved and is being processed for publication by SEMI.Cybersecurity Forum at SEMICON West 2025This year’s SEMICON West will feature a dedicated Cybersecurity Forum to address the semiconductor industry’s rapidly-changing cybersecurity landscape. The SEMI Cybersecurity Forum will gather industry experts to share knowledge and experience on the following topics. The goal is to develop actionable strategies and a deeper understanding of current and future cybersecurity risks. Cybersecurity in Legacy Semiconductor ToolsEmerging and Existing Cybersecurity Legislation and ComplianceCybersecurity in Maintenance and ManufacturingImpact of Cybersecurity Events on Semiconductor Manufacturing OperationsSupply Chain SecurityThreat Landscape in Semiconductor ManufacturingThe 2025 call for abstracts is now closed. Speakers will be announced in Q3.SEMI E187 Compliance Guidance White PaperThe SEMI Semiconductor Manufacturing Cybersecurity Consortium (SMCC), in collaboration with industry experts, is pleased to announce the release of the SEMI E187 Compliance Guidance Whitepaper. This comprehensive resource is designed to support semiconductor equipment suppliers and device manufacturers as they work to meet the requirements of the SEMI E187 0122 Standard - The Specification of Cybersecurity of Fab Equipment.Professionals involved in tool development, manufacturing, operations, and security will find the guidance particularly relevant and actionable. It provides guidance to address all twelve SEMI E187 requirements and focuses on new to fab equipment.Download the Whitepaper for freeSEMI Standards North America Summer MeetingsThis year’s SEMI Standards North America Summer Meetings were held from June 2-5 at SEMI’s headquarters in Milpitas, California. The meetings convened 11 committees and 40 task forces to discuss topics ranging from EHS to facilities, 3D packaging, MEMS, and more. In addition to the results of ballot 7169, technical changes to ballot 6601B, New Standard: Guide for Meeting IRDS Yield Table Recommendations for High Purity Polymer Materials and Components Used in Ultrapure Water, was also approved by the Liquid Chemicals North America TC Chapter, since the activity began in 2019. A Ratification Ballot will be issued in Cycle 7-2025 to verify the changes. In total, over 15 activities, ranging from Auxiliary Information, Reapprovals, and Line-Item ballots, also recently passed Procedural Review by the International Standards Committee (ISC) Audits Reviews Subcommittee and will be forwarded to Publications for final processing. The next SEMI International Standards Meeting will be held at SEMICON West from October 7-9 at the Phoenix Convention Center. Some technical committees and task forces may meet virtually outside of this meeting set, so be sure to check the SEMI Standards calendar of events for updates. Standards Introduced in Q2 2025New and revised standards released in Q2. April 2025 standards: https://store-us.semi.org/collections/standards/stdpbc-0425May 2025 standards: https://store-us.semi.org/collections/standards/stdpbc-0525June 2025 standards: https://store-us.semi.org/collections/standards/stdpbc-0625Get InvolvedSEMI Standards development activities take place throughout the year in all major manufacturing regions. To participate, join the SEMI International Standards Program.SEMI Standards are available through individual download purchases or online via SEMIViews. Sign up for a 30-day SEMIViews trial.For more information, please visit the Standards website and events page. For any questions regarding SEMI Standards activities, please contact your local SEMI Standards staff. Paul Trio is Director of Standards at SEMI.

The SEMI Foundation is undertaking a bold, novel approach to ensuring that the semiconductor industry has the skilled talent it needs to thrive. With a $40 million initial award from the U.S. National Science Foundation together with the U.S. Department of Commerce, and up to $160 million additional funds over the next five years, we have launched the National Network for Microelectronics Education (NNME), which is designed to reshape the landscape of microelectronics education and industry career awareness. The NNME is a federal effort to develop, connect and multiply workforce development activities throughout the nation to meet the needs of the semiconductor industry. The SEMI Foundation now serves as the Operating Hub of the NNME and will support large, multi-state regional coalitions of workforce development performers, called Regional Nodes. Collectively, the Hub and the Nodes will work to transform semiconductor industry training and awareness to provide pathways toward economic opportunity for American workers, and to provide industry the workforce it needs to grow to $1 trillion by the early 2030s.Join the NNMEOn July 16, 2025, we will begin accepting Letters of Interest (LOI) from institutions interested in leading or joining a Regional Node. Read on and visit www.nnme.org for more details.The ChallengeThe semiconductor industry has layered workforce development challenges, including: Greying workforce, with 30% of our workers over 50Aging infrastructure and a significant instructor shortageMicroelectronics curriculum that is often outdated and not aligned with industry needs, leading to critical gaps in learner knowledgeNo standardization of microelectronics learning across the fieldDuplicative and disconnected educational efforts nation-wideAn industry largely invisible to many students and jobseekersThe new industry investments spurred by the CHIPS and Science Act mean tremendous economic opportunity for more workers, bolstered American manufacturing, and a stronger U.S. microelectronics sector. None of this can be fully realized without a much larger and highly skilled workforce trained in today’s and tomorrow’s technologies.There have been numerous local, state, and federal workforce development initiatives to address some of these issues, and highly successful programs in various regions; but these have never been connected in a systemic way. This means people and institutions across the country are working separately to solve a collective problem. The NNME will connect and support these efforts, facilitate cross-regional learning, and braid together resources to illuminate the industry to students and jobseekers nationwide.The Solution“Talent is infrastructure,” said Shari Liss, Vice President of Global Workforce Development and Initiatives of SEMI. “We need skilled and job-ready talent at all educational levels to power the semiconductor industry. We have been working for years with educational and workforce leaders to design this national collective effort and we are thrilled to finally launch this transformative work.”The NNME is designed not as a series of isolated interventions, but as a cohesive, forward-looking national strategy. Grounded in the realities of a high-growth industry and an underprepared workforce system, NNME’s goals respond directly to the needs expressed by semiconductor employers, policymakers, educators, and learners. The NNME will:Design, develop, modernize, and disseminate industry-aligned curricula and share best practices across the networkDevelop regional partnerships and local workforce pipelines including colleges, universities, workforce development programs, labor, community-based organizations, and industry to create a national technical workforce that meets the evolving needs of industryFacilitate apprenticeships, internships, and other applied learning experiencesBuild, host, and update an open-source digital portal that houses the updated industry-aligned curricula for adoption in training programs nationwideConduct a major industry awareness, microelectronics education, and career opportunity campaign including PreK-12 schools and STEM organizationsThe NNME will be comprised of the Coordinating Hub (operated by the SEMI Foundation) and Regional Nodes which will be funded by the Hub. Regional Nodes will be comprised of workforce development performers – industry members, academic institutions, training providers, community-based organizations, and more. Collectively, the Hub and Nodes will execute the above activities with a commitment to information sharing and collaboration, transparency, responsiveness and agility, excellence, and accountability. Finally, the NNME is committed to expanding access to microelectronics careers for Americans from every region and walk of life. NNME initiatives are designed to open doors to technical training and career exploration for high school students, veterans, people returning to work, college students, and others seeking high-quality jobs in this critical industry, as well as provide opportunities for current professionals looking to grow their careers. Call for ParticipationThe SEMI Foundation is soliciting LOIs for performers interested in leading or joining a Regional Node. Information on node requirements and performer eligibility can be found on the NNME website at www.nnme.org. The solicitation goes live on Wednesday, July 16. An informational webinar will be held on Wednesday, July 23, and LOIs will be due on Friday, August 8 at 5 p.m. EDT. The NNME envisions a future in which every American, regardless of where they live or how they start their journey, can pursue a rewarding, well-paying career in microelectronics. The NNME will be instrumental in helping to build a robust and vibrant semiconductor industry by fueling it with a wide range of skilled workers and creating a broad pipeline of future talent. Our intention is to serve as the nation's premier resource for microelectronics education and training, connecting learners to employers, programs to successful outcomes, and empowerment to opportunity. We invite industry members and other workforce partners to join us in this work. Together, we will strengthen the talent pipeline that powers American leadership in semiconductors and advanced manufacturing. For more information, contact us at [email protected] or visit www.nnme.org. Michelle Williams is Executive Director at the SEMI Foundation.

The future of technology depends on cultivating a strong and skilled talent pipeline. According to McKinsey Company, the global semiconductor industry could grow to $1 trillion by 2030, driven by surging demand across sectors like automotive, consumer electronics, AI, and clean energy technologies. That’s why the SEMIquest Pop-Up Exhibition at SEMICON West, October 8-9, 2025 in Phoenix, AZ, will bring the semiconductor story to life through immersive, hands-on learning experiences for students, educators, families, and the general public.What Is SEMIquest? SEMIquest is an engaging, interactive experience designed to introduce students in grades 7-12 to the world of semiconductors. The program features hands-on activities, direct interaction with industry professionals, and workshops for educators aimed at highlighting the essential role semiconductors play in everyday life and future career opportunities. Key Program Components:Students trying on NXP bunny suits at Semiconductor Adventure DayIndustry Engagement – Offering students the opportunity to interact with industry through the interactive exhibition space.Hands-On Activities – Highlighting careers in semiconductors and promoting STEM education for students.Educator Engagement – Offering teachers training and resources to carry lessons back into their classrooms.Field Trip to SEMICON West 2025 – Providing students an opportunity to attend SEMICON West 2025 at the Phoenix Convention Center in Arizona, with complimentary admission and curated tours that offer a behind-the-scenes look at the global semiconductor industry.Students from ASU Preparatory Poly Tech Campus Participating in Semiconductor Adventure Day and event led by the Semi Foundation and ASU PreparatoryThe program culminates in an on-site learning experience at the Arizona Science Center, located adjacent to SEMICON West 2025—where students can explore exhibits, engage with companies, and witness the semiconductor ecosystem firsthand.Projected Reach: In its inaugural year, SEMquest aims to engage 500-1000 students in grades 7-12, with a national expansion plan already in motion.Impact Goal: Reach 60,000 families and students during a 4-month Pop-Up exhibition in Arizona through targeted programming and outreach.Why This Work Matters: The Semiconductor Industry Needs TalentSemiconductors are the foundation of modern life—from smartphones to satellites, healthcare tech to AI applications, and more. Yet, many students are unaware of what semiconductors are or how to pursue a career in the field.The Semiconductor Industry Association (SIA) estimates the U.S. could see a shortfall of 67,000 skilled workers by 2030 in key roles that require postsecondary education.A 2023 Deloitte report warns of a global shortfall of 1 million skilled workers in the semiconductor industry by 2030 if proactive steps aren’t taken.Semiconductor Research Corporation 2023 findings indicate that while 577,000 students pursue four-year STEM degrees annually, only about 19,000 enter the semiconductor industry each year. This disparity underscores a significant gap between STEM education and semiconductor industry employment.SEMI's American Semiconductor Academy (ASA) Vision Paper highlights the importance of raising student awareness through educational and industry collaboration, offering hands-on experiences and real-world applications.Image Source: Photo courtesy of SRC (Semiconductor Research Corporation).The SEMIquest Pop-Up Exhibition tackle this urgent gap through meaningful engagement, accessibility, and experiential learning—helping students envision themselves as future leaders in the field.What Sets SEMIquest ApartReal Industry Involvement – Students interact directly with professionals, tools, and environments used in the field.National Scalability – While beginning in Arizona, the program is structured for national rollout.Cross-Sector Collaboration – A unique fusion of education and industry.Integrated Learning Model – Teachers and students learn together, amplifying classroom impact.Join the Movement: Shape the Future of InnovationWe’re calling on partners across the country to join this work. Whether you’re an industry leader, educator, or community-based organization, your involvement is essential to inspiring and preparing the next generation of innovators.Industry Partners – Showcase your work, engage directly with students, and contribute resources to the traveling Semiconductor Pop-Up Exhibition.Schools Educators – Bring your students, co-host hands-on workshops, and integrate real-world tech experiences into your curriculum.Foundations Funders – Support the expansion of this scalable model and help bring it to communities nationwide.Join us at SEMIQuest! To get involved or learn more, contact Perla DeBaggis at [email protected]. Perla DeBaggis is Sr. Specialist, Career Industry Awareness at the SEMI Foundation.

On July 7, President Trump issued an executive order (EO) extending the ten percent baseline tariff rate through August 1, 2025. In addition, the EO suspends the variable "reciprocal" tariffs imposed under the International Emergency Economic Powers Act (IEEPA) until August 1. The order applies to nearly all countries except Mexico, Canada, and China. These changes do not impact separate reciprocal tariff actions on China or alter existing Section 232 measures on steel, aluminum, autos, and their derivative products. At the time of this posting, letters had been sent to 20 trading partners outlining expected tariff rates if no agreement is reached by August 1; bilateral negotiations are ongoing. Eleven of the 21 countries received rate cuts compared to the "Liberation Day" announcements on April 2, ranging from one to 13 percent. President Trump indicated rates could rise around 25 percent if trading partners retaliate. Next Steps: The extension offers short-term stability for SEMI member companies to assess supply chain exposure. SEMI continues to monitor bilateral trade and tariff policy negotiations, including for discussion related to the semiconductor supply chain. We aim to keep member companies informed of relevant tariff escalations. If your company is directly impacted by a country-specific rate shift, please reach out to your region’s SEMI Global Advocacy contact with any feedback on how these tariffs are affecting your operations.Visit SEMI Global Advocacy to learn more about public policy efforts and developments as well as how your company or organization can get involved.Scarlett Bickerton, Manager, Federal State Affairs at SEMI.

Under the Greenhouse Gas Protocol (GHGP), all companies are required to calculate and report their emissions, including those of all members of their downstream and upstream supply chains. These are called Scope 3 emissions, and are divided into 15 Categories, including Category 11 - Use of Sold Products, a heavy lift for many small (and often large) companies. Measurement and improvements in vendor Scope 3 emissions are already influencing vendor selection and sourcing decisions, and experts agree that this will continue to increase. Upstream suppliers have typically relied on broad GHGP guidance to follow in making their calculations. For the semiconductor sector, and its well-documented, incredibly complex supply chain, there was no guidance accounting for the nuances within the industry to standardize calculations. Work began a year-and-a-half ago to change that.The Semiconductor Climate Consortium (SCC)’s Scope 3 Working Group compiled, verified and published a guidance document for calculating Scope 3, Category 11 emissions. The guidance document helps standardize emissions reporting and calculation methods and accounts for the unique requirements and circumstances of the semiconductor value chain.The SCC 3.11 guidance explicitly highlights where it maintains consistency with the existing guidance (e.g., GHG, SBTi, US EPA) and where it expands on that guidance to close a gap relevant to one or more of the semiconductor industry segments. The document was developed with the help of the Sustainability Consulting Group ERM, as well as excellent participation from the Scope 3 Working Group members, including representation from every segment of the semiconductor value chain from IDMs to foundries, fabless companies, chemical gas and materials companies, OSATS, and equipment manufacturers.Some of the significant areas considered while compiling the guidance included:Boundaries, especially around products and direct use-phase emissionsProduct lifespan, especially across the different sectors of the value chainMarket based emissions guidanceIncorporating grid decarbonization into the inventory and calculationsThe document includes several useful calculation examples, including direct use phase emissions and direct and indirect energy consumption. The examples help to make the guidance more tangible and practical in real world application.We were pleased to collaborate with our industry colleagues on developing this guidance as we work to align with others in the industry and minimize our reporting via efforts by the SCC. Download the Guidance Document.For further insights into the Guidance, the authors, including experts from ERM recently hosted a webinar. Register to watch the recording. Sara Turner is Climate Program Manager at Lam Research, and Mike Halblander is Product Marketing Manager at Teradyne. Both Turner and Halblander lead the SCC’s Scope 3 Working Group.

The SEMI Startups for Sustainable Semiconductors (S3) program, now in its 4th year of inviting startups to apply, is pleased to announce the 35 startups chosen to move to the semi-finalist virtual pitch event happening July 31 and August 1. From this pool, 10-12 finalists will be chosen and invited to pitch to a live audience at SEMICON West 2025 in Phoenix, AZ, October 7-9, 2025. The committee, made up of experienced Corporate Venture Capitalists (CVCs) from the global semiconductor industry, received impressive submissions in all three categories identified for 2025:Sustainable Semiconductor ManufacturingSustainable Data CenterGen AI for Sustainable DesignLed by Applied Materials this year, the program’s strongest feature is the exposure to the CVCs, as well as the personal mentoring each semi-finalist receives. The mentoring topics are tailor made to align with the greatest need of the startup and can range from basic introduction to semiconductor manufacturing, to connecting them to funding sources. A full analysis of the program kicked off this year’s efforts. The program saw a 100% increase in applications to 145 this year and thus the pool of semifinalists expanded from 30 to 35. While geographically diverse, the semi-finalists all share their solutions for the building and use of more sustainable electronics. Are you an investor and would like to receive notice of the virtual and live pitch events around S3? Register your interest here.2025 S3 Semifinalists3D Architech, Inc.Boston, MA, USA 3D Architech develops and commercializes advanced cooling devices for AI chips using a proprietary gel-based metal 3D printing technology. Unlike conventional methods limited to 100-micron structures, our technology enables highly complex microstructures at 10-micron precision, achieving up to 60% improvement in cooling efficiency. Actasys Inc.Brooklyn, NY, USAActasys has developed a precision cooling solution designed for thermal bottlenecks in semiconductor-driven systems such as networking cards (NICs), DPUs, switches, and optical transceivers. Instead of cooling entire racks or server rooms ActaJet™ targets localized hotspots at the device level, delivering scalable, high-efficiency airflow through a compact, adaptive, and electronically controlled actuator system. AlixLabs ABLund, SwedenAlixLabs AB is developing a disruptive semiconductor manufacturing technology based on Atomic Layer Pitch Splitting (APS). It enables cost-effective and environmentally sustainable scaling of transistor architectures by doubling pattern density without requiring advanced lithography. The core product includes both the APS process and customized etching equipment that integrates into existing semiconductor fab workflows, reducing complexity, cost, and environmental impact.AllonniaBoston, MA, USAAllonnia™ Surface Active Foam Fractionation (SAFF) unit is a turnkey PFAS remediation system engineered for on-site deployment. The system employs foam fractionation to physically separate PFAS from contaminated water streams, including both long- and short-chain compounds. SAFF arrives in a standard container and requires only electrical power, influent, and effluent hookups, and is telemetry-enabled for remote monitoring and control.Alloy EnterprisesBurlington, VT, USAAlloy Enterprises develops and manufactures cold plates, manifolds, and integrated thermal solutions for liquid cooling GPUs, CPUs, and other high-performance components in data centers and semiconductor equipment. Alloy utilizes a patented Stack Forging® process to enable direct-to-chip cooling to improve thermal performance and reduce pressure drop by up to 40 times, enabling data centers to run 44°C water and reduce pumping power.AlsemySeoul, South KoreaAlsemy is building an AI-powered platform that bridges Manufacturing Execution Systems (MES) and EDA domains enabling fabless engineers to reflect manufacturing data characteristics in their chip designs, while process engineers can make data-driven decisions to optimize manufacturing processes for maximum chip performance. By connecting these traditionally siloed areas, a feedback loop is created to drive efficiency and innovation across the semiconductor value chain.Arieca IncPittsburgh, PA, USAArieca's adaptable Liquid Metal Embedded Elastomer (LMEE) technology, which blends liquid metal and polymer, delivers both thermal performance and mechanical reliability. LMEEs are a cost-effective, dispensable emulsion that is compatible with existing high volume manufacturing tools and allows for low pressure spreading and excellent wetting. Atomos 3DWest Lafayette, IN, USAAtomos 3D offers low temperature transistor technology for monolithic 3D chip integrationCoflux Purification, IncHouston, TX, USACoflux Purification is developing a modular, point-of-use reactor system that both captures and destroys PFAS in semiconductor wastewater using our patent-pending Covalent Organic Frameworks (COFs). These materials serve as photocatalytic adsorbents, combining high surface area, tunable porosity, and chemical stability to enable efficient PFAS adsorption and UV-driven degradation within a compact, modular system ensuring smooth operational deployment. CoolSem TechnologiesEindhoven, The NetherlandsCoolSem is developing a breakthrough thermal management technology for semiconductor devices. The Wafer Level Thermal Interface Stack (WLTIS) enables 1) up to 15x better thermal management; 2) 25-55°C lower chip temperatures; 3) 2-4° increase in device performance, reliability, and lifespan; and 4) up to 30-50% reduction in cooling energy needs. CoolSem help handle the exploding demand for AI training and inference without proportional increases in power usage or carbon footprint.CuspAICambridge, UKCuspAI is building an engine that combines Gen AI models, virtual twins, and active learning pipelines for simulation to develop sustainable materials solutions that address critical environmental challenges, including, environmentally-friendly etching reagents, specialized sorbents for emissions capture, and novel catalysts for manufacturing waste remediation. The engine has already proven successful in designing metal-organic frameworks (MOFs) for carbon capture and PFAS removal from water.FlexiramicsEnshede, The NetherlandsFlexiramics® is a flexible, 100% ceramic fiber material engineered as a drop-in replacement for PCB substrates. It dramatically improves heat dissipation and signal integrity in high-performance electronics, enabling faster, cooler, and more reliable semiconductor systems.FluorityxWatertown, MA, USAFluorityx is commercializing a portable low-cost polymer sensor for PFAS. This fast and efficient system will be able to measure low concentrations of PFAS and replace expensive equipment and does not require highly trained staff to operate and maintain the equipment.Forever AnalyticalSouth Bend, IN, USAForever Analytical is developing a field-deployable sensor capable of providing real-time total fluorine (TF) mass-balance information. The company is also developing a mass-spectroscopy based solution that can be coupled with the sensor to provide information on the specific PFAS molecules present in the waste stream and can be adapted to measure other contamination of interest, such as heavy metals, lead, and copper.Gallox Semiconductors Inc.Ithaca, NY, USAGallox Semiconductors is dedicated to commercializing beta-gallium oxide (Ga2O3)-based transistors and diodes. Our patented device topologies take advantage of Ga2O3's large bandgap (~4.8 eV), which enables lower conduction losses and higher voltage handling compared to SiC. Higher voltage operation means greater power densities and system-level efficiency, effectively generating less waste heat and reducing both energy loss and cooling burdens.IC Recovery, a Division of Greene Lyon Group, Inc.Beverly, MA, USAIC Recovery's multi-patented CHIP-RENEW® technology uses a proprietary process to apply a unique thermal fluid to the surface of PCBs until the solder alloy attaching chips and other components to the board substrate reaches temperature liquidus. At that point, we can selectively recover functionally valuable chips for renewal and reuse, and/or harvest all other chips and components on the board in order to concentrate their content for subsequent, sustainable refining.icspiKitchener, ON, CanadaIcspi has created a complete atomic force microscope (AFM) scan head on a 1 mm x 1 mm chip - 1 million times smaller than traditional AFMs and the future of nanoscale semiconductor metrology and inspection powered by arrays of thousands of micro-AFM devices. The technology boosts wafer coverage and speeds time-to-yield and reduces scrap. Kelvin Cooling Inc.Berkeley, CA, USAKelvin Cooling introduces high-efficiency nano-film evaporation cooling technology - enhancing thermal management by increasing heat transfer efficiency while reducing power consumption. This thin-film evaporation system enables direct-to-chip cooling, in a compact, scalable, and energy-efficient platform.LinqueMunich, GermanyLinque provides an integrated photonic switch (IPS) enabling AI-capable network nodes with reconfigurable all-optical routing for high data-rate channels with ultra-low latencies suitable for scale-out and scale-up layers of data center networks.Makr MicrosystemsBangalore, IndiaMakr Microsystems has developed a novel approach to AcousticAtomic Force Microscope (AFM) that uses common AFM instrumentation and simplifies interpretation, with a modified probe geometry that enables both acoustic transduction and sensing. We have demonstrated nanometer scale imaging from samples with shallow and deep subsurface structures.MatnexLondon, UKMatnex platform uses AI to rapidly scan the periodic table, allows input of objectives (functional electronic, optical, or mechanical properties) and constraints (element exclusions, intrinsic price, emission limits, etc.), and then searches a proprietary database to identify suitable stable candidates and their production methods. This provides fit-for-purpose materials that reduce environmental impact, improve the bottom line, and open new markets with technological breakthroughs.Mixx Technologies, Inc.San Jose, CA, USAMixx Technologies is a deep-tech startup building next-generation optical interconnect solutions to deliver non-blocking, energy-efficient data movement. The advanced 3DS platform enables petabit level end-to-end connectivity for AI workloads resulting in sustainable, efficient, and cost-effective scaling. The 3DS platform comprised of the engine, package and system, enables seamless deployment of the optical IO chiplet.Nano Performance Technologies Ltd.Coquitlam, BC, CanadaNano Performance Technologies (NPT) is developing next-generation nanomaterials, specifically, Tellurene and Bismuthene (2D materials) and ultra-pure gold nanoparticle, for use in semiconductors, quantum computing, and advanced biosensing. The innovation is the scalable production and commercialization of these materials. The platform combines IP from Purdue University with in-house lab capabilities, enabling a supply of application-ready nanomaterials to R D and manufacturing partners.NextGO EpiBerlin, GermanyNextGo Epi delivers high-quality and large-scale Gallium Oxide epiwafer for high-voltage (up to 10kV-level) applications that are durable in high-temperature operations and environments with high radiation levels.NextoarBangalore, IndiaNextoar is a deeptech AI startup, focused on using AI to train the frontline fab technicians, equipment engineers, maintenance engineers, test engineers, service engineers, etc., and others closest to the action. The system will make them part of the innovation engine by, augmenting frontline workers, amplifying their business impact and creating continuously innovating organizations.PhysicsXNew York, NY, USAThe PhysicsX platform is an AI-driven simulation software stack designed to speed up traditional numerical simulations, optimizes components within defined constraints, and generate innovative geometries using generative Large Geometry Models (LGMs). The technology seamlessly integrates into enterprise engineering workflows, driving tangible improvements in product design, manufacturing, and operations and has several successful implementations in the electronics ecosystem.Point2 TechnologySan Jose, CA, USAPoint2 designs and manufactures mixed-signal interconnect SoCs for terabit data transmission, to overcome the barriers of copper and optical cabling to accelerate AI interconnect in GPU cluster scale-up. e-Tube technology uses an RF Transmitter SoC to convert data from the electrical to the RF domain for transmission over plastic waveguides, with the RF Receiver SoC converting the data from the RF domain back to the electrical domain.PROUDLausanne, SwitzerlandPROUD's patented diamond-layer technology with the highest heat dissipation capacity ( 1000 W/m.K) of any existing material, deposited on chips, allows a direct upgrade in heat extraction, power output and efficiency.Scrona AGZurich, AustriaScrona has developed a scalable multi-nozzle electrohydrodynamic (EHD) inkjet printhead for additive microfabrication in semiconductor and electronics manufacturing. This MEMS-based 128-nozzle printhead enables sub-10 nm resolution, ultra-low material use, and wide material compatibility, including metals, dielectrics, and polymers. It replaces wasteful lithography and etching with direct-write precision printing, significantly reducing energy, water, and chemical consumption in an automation-ready format.SKYRE, Inc.East Hartford, MA, USASKYRE develops and manufactures products for on-site purification and pressurization of process hydrogen and makes it available for reuse at the fab facility. The hardware is highly reliable with low maintenance costs with equal or better quality and lower cost than merchant hydrogen or onsite hydrogen generation.SyentaSydney, AustraliaSyenta has developed LEM - Localized Electrochemical Modelling - a process for depositing metal patterns using a local electrochemical process. The pattern is created on a stamp, which then prints the pattern on the substrate in an additive process.Terecircuits CorporationMountain View, CA, USATerecircuits develops advanced material solutions for heterogeneous assembly of small, fragile, and thinned components, Chiplets, sensors, power devices, and passives. The process is ideal for achieving scale with reduced waste; while meeting critical assembly challenges such as 3D assembly, silicon carbide die attach, flexible circuits, and optics. Vertical HorizonsCambridge, MA, USAVertical Horizons is a fabless semiconductor company commercializing vertical gallium nitride (GaN) power transistors to revolutionize energy efficiency. Vertical GaN reduces energy losses by up to 30% and doubles power density, enabling a 50% reduction in system footprint. This innovation tackles the urgent need for a new generation of power infrastructure designed to scale AI, and high-density and high-power applications.Vionano Innovations IncSt. Paul, MN, USAVioNano Innovations is building a patterning platform to enable advanced feature scaling using self-assembling polymer brush materials. The system enables polymers over 193 nm DUV lithography patterns to double feature density without requiring ALD/CVD or etch steps. The result is a low-energy, high-resolution process for sub-20 nm features using existing infrastructure.XLYNX MaterialsVictoria, BC, CanadaXLYNX designs and manufactures a revolutionary family of polymer crosslinkers. These reagents are uniquely able to cure virtually ANY aliphatic polymer, by harnessing high-yielding insertions to carbon-hydrogen bonds. Curing can be triggered thermally (at temperatures as low as 80°C) or photochemically (using either UV or blue light). Heidi Hoffman is Senior Director, Marketing Sustainability at SEMI.

The semiconductor industry faces an uncomfortable contradiction. Markets are expanding and demand continues rising, but the talent pool is shrinking.By 2030, the industry will need to add 1 million skilled workers globally, with shortages of over 100,000 engineers in Europe and more than 200,000 engineers in Asia-Pacific. This expansion requires at least 100,000 second-line leaders and 10,000 third-line leaders—many of whom must come from outside the industry.Markets Keep Growing, Leadership Doesn'tThe industry's outlook remains optimistic. Nearly one in five (19%) semiconductor executives anticipate continued demand growth without inventory excess in the next four years. Global sales hit $627.6 billion in 2024—a 19.1% increase driven by AI advancements, consumer electronics demand, 5G adoption, and automotive innovation.Governments are backing this growth with large investments too. The European Chips Act aims to double the EU's production share to 20% by 2030 with €43 billion. Companies like NXP Semiconductors, Infineon Technologies, and STMicroelectronics are expanding. Taiwan Semiconductor Manufacturing Company (TSMC) remains the world's largest contract chipmaker. The UK government unveiled a £1 billion strategy over 10 years, while the CHIPS and Science Act allocated $52.7 billion for US manufacturing and research.But there aren't enough semiconductor leaders to manage this growth.The Education CrisisThe talent shortage begins in universities. Electrical engineering and computer science enrollment has been declining for years. Germany saw 6.5% fewer STEM students in 2021 than the previous year.An analysis of recent data shows concerning patterns. While Germany had 81,934 electrical engineering students in 2018, Ireland had only 742 new electrical engineering students in 2017. The United States awarded just 13,767 bachelor's degrees in electrical engineering in 2018.Retirement and Skills GapsWhile universities produce fewer graduates, experienced leaders are retiring. One-third of US semiconductor employees are 55 or older. In Germany, one-third of the workforce will retire within the next decade.The job itself is also changing. Artificial intelligence and machine learning have surpassed systems architecture as the most sought-after skills in European markets. Software engineers specializing in embedded programming are becoming more important than traditional design engineers.Competition and TurnoverThe semiconductor industry competes with other tech sectors for talent, and ninety-two percent of tech leaders report challenges finding skilled workers.Employee turnover is accelerating as well. Fifty-three percent of semiconductor workers were expected to resign in early 2024, compared to 40% in 2021. Top reasons include lack of career development (34%) and insufficient workplace flexibility (33%).Geographic ChallengesManufacturing concentration creates additional problems. Taiwan handles 65% of global manufacturing, China 15%, South Korea 12%, and the US 12%. Despite this, U.S.-based companies hold roughly 46.3% of global market share.Each region has developed different skill sets, making it difficult to move leaders across markets.What Companies Are DoingAbout 60% of senior executives believe semiconductor companies have weak employer brands compared to higher-profile tech companies. Many are working to change this through competitive compensation, improved work-life balance, and better career opportunities.Some companies are expanding their search beyond traditional candidates, too. Seventy-three percent now use skills-based hiring, focusing on capability rather than traditional backgrounds. Others target adjacent tech sectors for executives with transferable skills.Retention has become more important as well. With the tech industry's 13.2% attrition rate, companies are investing in career progression and workplace flexibility.Diversity initiatives are also still gaining traction worldwide. Women represent only 17% of semiconductor tech roles, compared to 23% in the industrial sector.The semiconductor industry's future depends on solving this talent paradox. Companies that act decisively to attract, develop, and retain leadership talent will be best positioned to capitalize on market opportunities.About the AuthorJan-Bart Smits is Managing Partner at Stanton Chase Amsterdam and Global Subsector Leader for the Semiconductor industry.

In a letter sent to the United States Congress, SEMI, the leading industry association serving the global electronics design and manufacturing supply chain, and 16 member companies urged Congress include in reconciliation an expansion and extension of the Advanced Manufacturing Investment Tax Credit. The letter calls for the expansion of eligibility for the federal investment tax credit (ITC) to make the entire semiconductor manufacturing supply chain, as well as R D and design expenditures eligible for the ITC and extend the credit beyond the current 2026 expiration date—to allow sufficient time to plan and execute investments. The U.S. semiconductor market is growing to meet the needs of critical technology applications like artificial intelligence (AI), telecommunications, and bioengineering that rely on semiconductors. That growth requires increased investment for upstream materials, chemicals, and electronic design automation (EDA), which are currently excluded from receiving the tax credit (also known as Sec. 48D). Excluding these critical manufacturing and R D projects undermines domestic investment efforts potentially ceding U.S. leadership and competitiveness. Semiconductor infrastructure requires billions of dollars in upfront investment, and tax incentives are essential to help offset these exorbitant costs. A competitive tax environment encourages semiconductor companies to invest in the U.S., strengthening domestic manufacturing and innovation while helping the U.S. meet its goals of maintaining global leadership with lower-cost regions also providing incentives.Also, the credit expires at the end of 2026, leaving insufficient planning and implementation time for the billions in upfront investment required to support semiconductor infrastructure in the United States. To support the success, growth, and innovation of the U.S. semiconductor ecosystem, SEMI and its members urge Congress to include in the reconciliation package:Expansion of the Sec. 48D tax credit for the entire supply chain—as included in the SEMI Investment Act (S. 1642)Extension of the credit to allow enough time for businesses to plan and execute needed investments as included in the BASIC Act (H.R. 3204)Recognition of R D and design expenditures as eligible Sec. 48D projects as included in the STAR Act (H.R. 802)These inclusions are crucial to maintain U.S. competitiveness in attracting global semiconductor industry investments.The letter was signed by CEOs or presidents of the following leading companies: SEMI; ASML; ASM; Advantest America, Inc.; Axcelis Technologies Inc.; Brewer Science; Chemours; Dupont’s Electronics business, and Qnity™; Entegris; Evatec NA, Inc.; EFC Gases Advanced Materials; GlobalWafers Co., Ltd.; Lam Research Corporation; Micron Technology; Tokyo Electron America, Inc. TEL Manufacturing and Engineering of America, Inc.; SACHEM, Inc.; SkyWater Technology.Visit SEMI Global Advocacy to learn more about public policy efforts and developments as well as how your company or organization can get involved.Christina Banoub, Senior Manager, Federal Affairs at SEMI.