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March 23, 2021 - March 25, 2021

Technology webinar series

Technology Week Webinar Series

At the end of the webinars, participants will have the opportunity to interact with the Semiconductor Technology Committee (STC) and guest speakers.

Time

2:30 pm - 5:00 pm

Add to Calendar 2021-03-23 14:30:00 2021-03-25 17:00:00 Technology Week Webinar Series Technology Week Webinar Series At the end of the webinars, participants will have the opportunity to interact with the Semiconductor Technology Committee (STC) and guest speakers. Online, Central European Time Alemania SEMI.org contact@semi.org Europe/Berlin public
Location

Online, Central European Time
Germany

Technology webinar series

Day 1 - Power Electronics and Devices Day 

Empowering Electrification in the New Digital World 

Growing adoption of electric vehicles along with the rising trend of lightweight vehicles has been a key driver for power semiconductor devices, including diodes, silicon-controlled rectifiers (SCRs), thyristors, power MOSFETs, and many others used for control and conversion of electric power. Recent progress in the wide-band-gap semiconductor such as GaN and SiC, combined with traditional Si-based insulated gate bipolar transistors (IGBTs) and MOSFETs offers multiple choices for system designers of each specific application. 

This program will bring together experts from both academia and industry providing a comprehensive view of power devices, technologies and applications.

 

Day 2 - Materials Day 

Materials Innovation Enabling Semiconductor Technologies 

Materials of all types – gases, chemicals, substrates, masks, coatings, encapsulants, adhesives, etc. – are essential for the fabrication of semiconductor devices. European device makers rely on a strong and vibrant supplier base to enable their manufacture of a wide variety of device types, including power semiconductors, RF components, optoelectronics, embedded memories, MEMS and sensors. Fabless companies and designers in Europe rely on the materials and processes employed by foundries worldwide to realize their ideas on silicon. European innovation centers drive the new materials required to keep the semiconductor roadmap and Moore’s Law as well as more than Moore on track. This includes materials for Fan-In and Fan-Out Wafer Level Packaging to enable new 5G, AI and ADAS developments.  

This program covers materials of all types that are essential for the fabrication of semiconductor devices. 

 

Day 3 - Future Fab Day 

The World of Smart Manufacturing 

Semiconductor Integrated Circuits have become ubiquitous in our modern world, with all aspects of our lives being assisted and enhanced. These is driving an un-ending hunger for even more applications and experiences, requiring a constant innovation to realize next generation leading-edge devices and process technologies. Our industry is responsible for the high-volume manufacturing of arguably the most complex devices known to human-kind, in an environment where safety, quality and output critical success indicators may not be compromised.

During the last years, manufacturing has been dramatically changing due to technology implementation, customer demands and competition, largely driven by the influence of the digital technologies’ evolution. We are now experiencing a time in history aptly named the “4th Industrial Revolution” where a significant element of “cyber-physical systems” introduction is enabling a disruptive impact on manufacturing capabilities and efficiencies.

This session is designed to showcase some of the latest Industry 4.0 innovations and future trends, and their relevance to our world-class high-volume semiconductor manufacturing and downstream industries, especially electronics manufacturing.

 

Agenda

Day 1 | Power Electronics and Devices Day | Tuesday, March 23, 2021

2:30 pm - 2:40 pm

Opening Remarks

2:40 pm - 3:00 pm

Technological Challenges for MOS HEMT Power GaN Devices

3:00 pm - 3:20 pm
Torsten Loch
Torsten Loch
Director Technical Sales
ExaGaN

Leveraging Exagan’s 200mm GaN-on-Si Process

3:20 pm - 3:40 pm
Stefan Eisenbrandt
Stefan Eisenbrandt
Principal Engineer Process Development
X-FAB

A Robust Scalable SOI LDMOS Transistor from 40V to 125V for Smart Power Technology

3:40 pm - 4:00 pm
Walter Schwarzenbach
Walter Schwarzenbach
Technology Leader
Soitec

Smart CutTM Technology Enable Engineering SiC substrate for Power Devices

4:00 pm - 4:20 pm
Dr.-Ing. Tobias Erlbacher
Dr.-Ing. Tobias Erlbacher
Head of Department Devices
IISB Fraunhofer

SiC for Power Electronics and More – 150mm and 200mm Technologies on the Move

4:20 pm - 5:00 pm

Q&A Moderation

Day 2 | Materials Day | Wednesday, March 24, 2021

2:30 pm - 2:40 pm

Opening Remarks

2:40 pm - 3:00 pm
Rolf Aschenbrenner
Rolf Aschenbrenner
Director's Deputy
Fraunhofer IZM

Heterogeneous Integration – A Key Enabler for Electronic Systems

3:00 pm - 3:20 pm
Vincent Vandalon
Vincent Vandalon
Post-Doctoral Researcher
TU/e

Strategies for Doping 2D Transition Metal Dichalcogenides: Atomic Layer Deposition of p-type Al-doped MoS2

3:20 pm - 3:40 pm
Prof. Dr. Jonathan Finley
Prof. Dr. Jonathan Finley
Chair for Semiconductor Nanostructures and Quantum Systems
TUM

Direct Bandgap Emission from Hexagonal Ge and SiGe Alloys

3:40 pm - 4:00 pm

Thin Film Processing of Innovative Ionic Synaptic Transistors for Neuromorphic Applications

4:00 pm - 4:20 pm
Prof. Amelie Hagelauer
Prof. Amelie Hagelauer
University of Bayreuth

SAW and BAW - Current and Future Materials Technology for New Antennas

4:20 pm - 5:00 pm

Q&A Moderation

Day 3 | Future Fab Day - The World of Smart Manufacturing | Thursday, March 25, 2021

2:30 pm - 2:40 pm

Opening Remarks

2:40 pm - 3:00 pm

TBA

3:00 pm - 3:20 pm

TBA

3:20 pm - 3:40 pm
Tom Hoogenboom
Tom Hoogenboom
System Engineer
ASML

Holistic Data and Computing Platform for Advanced Semiconductor Manufacturing

3:40 pm - 4:00 pm

Big Data Processing & Machine Learning

4:00 pm - 4:20 pm
Thomas Schulz
Thomas Schulz
Channel Manager Central and Eastern Europe
GE Digital

Cyber Security for Connected Applications in Industry 4.0

4:20 pm - 5:00 pm

Q&A Moderation

REGISTRATION

Sponsors

For sponsorship opportunities, please contact:

Cassandra Melvin, Director of Operations at cmelvin@semi.org
Adi Hodorov, Manager, Sales and Key Accounts at ahodorov@semi.org 

PRESS AND MEDIA

If you are interested in partnering with us or have any questions about press and media, please contact us.

Serena Brischetto, Senior Manager, Marketing and Communications at sbrischetto@semi.org