March 23, 2021 - March 25, 2021
Technology Week Webinar Series
At the end of the webinars, participants will have the opportunity to interact with the Semiconductor Technology Committee (STC) and guest speakers.
2:30 pm - 5:00 pm
Online, Central European Time
Day 1 - Power Electronics and Devices Day
Empowering Electrification in the New Digital World
Growing adoption of electric vehicles along with the rising trend of lightweight vehicles has been a key driver for power semiconductor devices, including diodes, silicon-controlled rectifiers (SCRs), thyristors, power MOSFETs, and many others used for control and conversion of electric power. Recent progress in the wide-band-gap semiconductor such as GaN and SiC, combined with traditional Si-based insulated gate bipolar transistors (IGBTs) and MOSFETs offers multiple choices for system designers of each specific application.
This program will bring together experts from both academia and industry providing a comprehensive view of power devices, technologies and applications.
Day 2 - Materials Day
Materials Innovation Enabling Semiconductor Technologies
Materials of all types – gases, chemicals, substrates, masks, coatings, encapsulants, adhesives, etc. – are essential for the fabrication of semiconductor devices. European device makers rely on a strong and vibrant supplier base to enable their manufacture of a wide variety of device types, including power semiconductors, RF components, optoelectronics, embedded memories, MEMS and sensors. Fabless companies and designers in Europe rely on the materials and processes employed by foundries worldwide to realize their ideas on silicon. European innovation centers drive the new materials required to keep the semiconductor roadmap and Moore’s Law as well as more than Moore on track. This includes materials for Fan-In and Fan-Out Wafer Level Packaging to enable new 5G, AI and ADAS developments.
This program covers materials of all types that are essential for the fabrication of semiconductor devices.
Day 3 - Future Fab Day
The World of Smart Manufacturing
Semiconductor Integrated Circuits have become ubiquitous in our modern world, with all aspects of our lives being assisted and enhanced. These is driving an un-ending hunger for even more applications and experiences, requiring a constant innovation to realize next generation leading-edge devices and process technologies. Our industry is responsible for the high-volume manufacturing of arguably the most complex devices known to human-kind, in an environment where safety, quality and output critical success indicators may not be compromised.
During the last years, manufacturing has been dramatically changing due to technology implementation, customer demands and competition, largely driven by the influence of the digital technologies’ evolution. We are now experiencing a time in history aptly named the “4th Industrial Revolution” where a significant element of “cyber-physical systems” introduction is enabling a disruptive impact on manufacturing capabilities and efficiencies.
This session is designed to showcase some of the latest Industry 4.0 innovations and future trends, and their relevance to our world-class high-volume semiconductor manufacturing and downstream industries, especially electronics manufacturing.
Day 1 | Power Electronics and Devices Day | Tuesday, March 23, 2021
Technological Challenges for MOS HEMT Power GaN Devices
Leveraging Exagan’s 200mm GaN-on-Si Process
A Robust Scalable SOI LDMOS Transistor from 40V to 125V for Smart Power Technology
Smart CutTM Technology Enable Engineering SiC substrate for Power Devices
SiC for Power Electronics and More – 150mm and 200mm Technologies on the Move
Day 2 | Materials Day | Wednesday, March 24, 2021
Heterogeneous Integration – A Key Enabler for Electronic Systems
Strategies for Doping 2D Transition Metal Dichalcogenides: Atomic Layer Deposition of p-type Al-doped MoS2
Direct Bandgap Emission from Hexagonal Ge and SiGe Alloys
Thin Film Processing of Innovative Ionic Synaptic Transistors for Neuromorphic Applications
SAW and BAW - Current and Future Materials Technology for New Antennas
Day 3 | Future Fab Day - The World of Smart Manufacturing | Thursday, March 25, 2021
Holistic Data and Computing Platform for Advanced Semiconductor Manufacturing
Big Data Processing & Machine Learning
Cyber Security for Connected Applications in Industry 4.0
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