Munich, Germany – September 11, 2024 –The SEMI MEMS & Imaging Sensors Summit, themed Sensor Revolution for a Connected Future, is set to bring together some of the world’s leading minds in sensor technology on November 14 at the International Conference Center Munich (ICM), Germany. Registration is open.
Hosted by SEMI Europe and the MEMS & Sensors Industry Group, a SEMI Technology Community, the summit will showcase leading-edge innovations in wearable health monitoring, 300mm MEMS manufacturing for increased scalability, and energy-efficient AI for visual applications. Presentations will also explore advancements in hyperspectral imaging, light detection and ranging (LiDAR) for autonomous vehicles, and sustainable sensor technologies driving progress in healthcare, smart mobility, and sustainability.
"As the MEMS and imaging sensors landscape continues to evolve, we’re witnessing rapid advancements in technologies like AI and machine learning, opening doors to innovative applications that are transforming industries,” said Laith Altimime, president of SEMI Europe. “We are excited to bring together industry leaders at this year’s summit to explore how these cutting-edge technologies are coming together to enable sustainable growth and shape a connected future.”
Featured Speakers
The Summit will present a distinguished lineup of thought leaders, providing insights into emerging trends and the latest technological developments:
- Stefan Finkbeiner, CEO, Bosch Sensortec
- Jean-Christophe Eloy, CEO and President, Yole Group
- Simone Ferri, AMS Group Vice President, MEMS sub-group General Manager, STMicroelectronics
- Charbel Rizk, Founder CEO, Oculi
- Jessica Gomez, CEO, Rogue Valley Microdevices
- Eric Aguilar, CEO, Omnitron Sensors, Inc.
- Avi Bakal, CEO & Co-founder, TriEye
- Alissa Fitzgerald, CEO, A.M. Fitzgerald & Associates, LLC
- Markus Arzberger, Senior Director, ams OSRAM
- Thomas Uhrmann, Director of Business Development, EV Group
- Jussi Soukkamaki, Lead, Hyperspectral & Imaging Technologies, VTT Technical Research Centre of Finland Ltd
- David Springer, Product Manager, MVD and Release Etch Products, KLA Corporation
Industry-Leading Exhibitors at MEMS & Imaging Sensors Summit
- AGP Co., Ltd
- CEA-Leti
- COMET Yxlon
- EDA Solutions Limited
- Eurofins | MASER
- FormFactor
- LAM Research
- Philips MEMS & Micro Devices
- Polyteknik AS
- Pyxalis
- QP Technologies (formerly Quik-Pak)
- Schott AG
- scia Systems GmbH
- Shenzhen Angstrom Excellence Technology
- Spraying Systems Deutschland GmbH
- Ushio Inc.
Premier Sponsors
- Platinum Sponsors: Comet Yxlon, Infineon, and KLA
- Event sponsors: STMicroelectronics, Teledyne MEMS
Contact Salil Gupte at [email protected] to explore sponsorship opportunities for the MEMS & Imaging Sensors Summit 2024.
For more information, please visit the MEMS & Sensors Imaging Summit website .
Stay connected with SEMI Europe on X or LinkedIn @SEMIEurope: #SensorsSummit #MEMS #Imaging #SEMIEurope
About SEMI
SEMI®is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON®expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.
Association Contacts
Sitong He / SEMI Europe
Phone: +49 151 5546 2638
Email: [email protected]
Samer Bahou / SEMI Headquarters
Phone: 1.408.943.7870
Email: [email protected]
