MEMBER DIRECTORY

AGRU is a leading manufacturer and supplier of high-purity thermoplastic piping systems. These systems are used for the transport of ultra-pure media as well as waste water process and chemical drain in Semiconductor Fabs. PURAD systems are manufactured from PVDF-UHP, PP-Pure (PPR-Gray), Polypure (PPR-Natural) and ECTFE. They are available in a wide range of pipe sizes up to DN/OD 400 mm. The product range includes pipes, fittings, valves, flow control components and semi-finished products. The piping systems are joined using fully automated infrared (IR) and electrofusion AGRUWELDING machines. This ensures high reliability and consistent joint quality. For more information about AGRU’s products and worldwide sales offices, please contact [email protected]

Plan Optik AG, a high tech glass processor, existing since 1962 and based in Germany, has focused more and more on MEMS related products from glass or similar materials (mainly borosilicate glass wafers used for wafer level packaging of MEMS). Within the last years, Plan Optik - Wafers set the standard for glass wafers of this still young market.This success is driven by the development of own manufacturing methods e.g. for the polishing of glass wafers. So called MDF (micro damaging free) polished wafers show an impressive surface quality (no sub surface damaging) and are suitable for safety relevant devices such as tyre pressure sensors. No sub-surface-damaging means a dramatically increased yield during etching processes. Additionally the surface roughness is much below 5 Angstrom (0.5 nm) - this makes them suitable for direct bonding.The chips manufactured with Plan Optiks wafers are already implemented in more than 100 million sensors and micro fluidic systems per year.Our structured wafers are used in active components of micro fluidic and lab-on-chip devices. This includes Nano-Dispensing-Systems and Nano-Vaporizers for medicament administration.In the near future the technologies developed and used by Plan Optik will set new standards in consumer electronics - especially (more...)

Analysis/Measurement: Film Thickness, Microscopes, Probing Equipment/Accessories, Surface Inspection/Flatness - Surface and defect inspection, SEM CD Overlay. Assembly/Hybrid Equipment: Automation & Robotics, Burn-In, Cleaning Equipment, Inspection. FLAT PANEL DISPLAY (FPD) - Materials: Developer/Stripping & Cleaning/Etchants/Other. FLAT PANEL DISPLAY (FPD) - Processing Equipment: CVD, Wet Etching/Stripping. FLAT PANEL DISPLAY (FPD) - Test/Measurement/Repair Equipment: Optical Test, Surface Inspection/Flatness, Thickness Measurement. Photomask Equipment/Materials: Mask Making Equipment. Process Equipment: Handling/Transfer/Linear Motion Systems, Inspection Equipment, Laser Beam Equipment, Flat Panel Display, Manufacturing Equipment. Services: Training.

Microcontrol Electronic (MCE) part of EMME CI GI group, was founded in 1976 with the mission of supplying equipment and service in the Italian semiconductor market. Since 1985 Microcontrol Electronic started designing, manufacturing and distributing worldwide its own range of equipment. The group is 100% privately owned. The MCE headquarter is located in Milan, with 60 employees and a 5000 square meter warehouse. MCE facilities are ISO 9001 and 14001 Certified. Today Microcontrol Electronic installed base counts more than 500 systems installed worldwide and is very well known for the reliability and flexibility of all its equipment.Our products are installed in the following process areas:PhotolithographyLift OffBackgrindingMultiprocess systemTesting

Grintimate specializes in the development and manufacturing of high-precision grinding and thinning equipment, offering reliable solutions for processing hard and brittle materials. We are the first company in Taiwan to develop an MIT (Made-in-Taiwan) grinding machine capable of thinning 12-inch silicon carbide (SiC) wafers with a total thickness variation (TTV) of less than 2 µm. Whether you are processing silicon, SiC, quartz, glass, sapphire, ceramics, PCBs, wafers, or ingots — for substrate thinning or backside grinding — Grintimate provides versatile equipment configurations tailored to your specific process requirements.

BCG provides various management consulting services to semiconductor and related industry clients.

1990, Mr. Yuan-Jan Chang founded Topco Scientific with the philosophy of “diligence, professionalism, and sharing the success” to enter the advanced technology field. Under the leadership of Dr. J.W. Kuo, the current Chairperson, Topco has been actively introducing the latest manufacturing processes and technologies to provide customers with the highest standard of integrated services through achieving excellent strategic planning and efficient execution with the global logistics management capability. In the field of advanced technology, Topco pursues reliable quality, punctual delivery, and responsive service to meet customer needs. In addition to providing precision materials, manufacturing equipment, and components for the semiconductor, LCD, and LED industries, Topco also offers system planning and integration services. Not stopped by its stock IPO in 2003, Topco has continued to explore more business, expand the scope of operations, and march into the global market; and Topco has

FT TESTINGWAFER TESTINGIC TESTINGBURN INRE TESTINGConductive Rubber

Found in 1998, Atecom Technology Co., Ltd is the leading manufacturer and supplier of semiconductor materials in Taipei, Taiwan. The company has a long and well established history in the manufacture of Silicon semiconductor materials such as silicon ingots, silicon raw wafers, diffusion wafers to epitaxy-ready substrates. Atecom Technology also offer the widest product range like III-V compound semiconductor materials and SOI wafer in the business. We provide widespread choice of material type and forms enables it to support worldwide customer application.

ASE, Inc. is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative advanced packaging and system-in-package solutions to meet growth momentum across a broad range of end markets, including 5G, Automotive, High Performance Computing and more. To learn about our advances in SiP, Fanout, MEMS & Sensor, Flip Chip, and, 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: aseglobal.com or follow us on Twitter: @asegroup_global.