Showing 421-432 of 447
Blog
A New Collaborative Approach to Automobile Industry Reliability Challenges
SEMI spoke with Antoine Amade, Regional Senior Director EMEA at Entegris, about the challenges set by the car industry, and the concept of “zero defect” and the need for a collaborative approach...
Blog
SEMI Shares Industry Feedback on RoHS Review Roadmap with European Commission
SEMI recently shared industry feedback with the European Commission on the roadmap for reviewing RoHS (the Directive on the restriction of the use of certain hazardous substances in electrical and...
Blog
AI Public Policy Key to Semiconductor Innovation and Growth
Artificial Intelligence (AI) is driving game-changing capabilities with huge impacts on our lives: self-driving cars, algorithms diagnosing cancers, accelerated drug development, voice-activated...
Blog
Takeaway Trends from European MEMS & Sensors Summit
Data management tools need to become whip-smart, multi-sensor packages are the real deal, and a renewed emphasis on safety has thrust ADAS sensor systems into the spotlight. These were among the...
Blog
SEMI Reaffirms Support for Industry Cooperation on RoHS Review
SEMI today confirmed its support for a Joint-Industry Cooperation on an RoHS Review aimed at urging the European Commission to, at a minimum, consider dedicating more resources to a targeted outreach...
Blog
MEMS – One Product, One Process?
SEMI spoke with Udo Gómez, senior vice president at Robert Bosch GmbH, about MEMS technology requirements relative to standard IC design and manufacturing. Gómez highlighted solutions to challenges...
Blog
Automating 200mm Semiconductor Fabs to Meet Growing Demand
SEMI met with Heinz Martin Esser, managing director at Fabmatics GmbH, to discuss how existing 200mm semiconductor fabs can master the challenges of a 24x7 production under highest cost and quality...
Blog
Wafer-Level Chip Scale Packages: Reliability and Validation Testing Using Simulation Methodology
SEMI spoke with Balaji Nandhivaram Muthuraman, Package and Material Simulation engineer at Dialog Semiconductor, about the state of reliability testing for wafer-level chip scale packages ahead of...
Blog
3D Heterogeneous Integration Drives Demand for New Materials and Integration Solutions
SEMI met with Gerald Beyer, program manager at imec, to discuss the co-existence of various 3D interconnect technologies and their need for new materials and integration solutions. The two...
Blog
New Fabs Invest Over $220 Billion
Global fab equipment spending will increase 14 percent this year to US$62.8 billion and is expected to rise 7.5 percent, to US$67.5 billion, in 2019, marking the fourth consecutive year of spending...
Blog
Industry Growth – Still Positive but Varies by Region
Global Economy
Manufacturing activity continues to expand – but at a slowing pace (Chart 1). The Global PMI was 52.5 in August, down from 52.8 in July and its recent high of 54.5 in December. PMI...
Blog
Sensors - From Red Hot Chillies to Patients
SEMI's Serena Brischetto caught up with Zimmer and Peacock Director Martin Peacock to discuss sensor opportunities and challenges ahead of the European MEMS & Sensors and Imaging & Sensors...