downloadGroupGroupnoun_press release_995423_000000 copyGroupnoun_Feed_96767_000000Group 19noun_pictures_1817522_000000Group 19Group 19noun_Photo_2085192_000000 Copynoun_presentation_2096081_000000Group 19Group Copy 7noun_webinar_692730_000000Path
Skip to main content

LOCATION: Grenoble Ecole de Management


Thursday, September 26th

Session 2: Technology & Manufacturing | Chaired by Jean-Luc Jaffard, Consultant & Advisor, Redbelt Conseil

08:40 - 09:05

  From Image Capture to 3D Environment Sensing
Laurent Malier, Head of Technology Design Platform Development, STMicroelectronics                                                                     
09:05 - 09:30  
  Discovering New Dimensions: Our Vision to Sense the World
Christian Herzum, Senior Director 3D-Sensing & Discretes, Infineon Technologies
09:30 - 09:55  
  Infrared Imaging Detectors New Challenges
David Billon-Lanfrey, Chief Strategy Officer, Lynred
09:55 - 10:20  
  Depth Sensing and ToF Image Sensors: an Overview of the Latest Growth Opportunities in the Sensor Market
Manuel Tagliavini, Principal Analyst | MEMS & Sensors, IHS Markit
10:20 - 11:10       Coffee Break                                                                                                                                                                                                           
Session 3: Imaging and Sensors Technology Showcase | Chaired by Peter Simkens, Innovation Expert
11:10 - 11:20  
John Hubert
  Impedance / Dielectric Spectrum Imaging System for Non Invasive Continuous Glucose Monitor (NICGM) for Diabetics
John Hubert, VP of Engineering of Alertgy
11:20 - 11:30  

7.2µm Pixel Event-Based Vision Sensor with Frame Readout
Raphael Berner, Head of chip design, Insightness AG

11:30 - 11:40  
Bastjan Prenaj

Eyeware - 3D Eye Tracking Software for Depth Sensing Cameras
Bastjan Prenaj, Co-founder & Growth, Eyeware Tech

11:40 - 11:50  
  Line Scan Camera Technology: Advantages of this Technology and Necessary Premises for Proper Image Acquisition
Marek Grzelak, Senior Vision Engineer at Emsys / VisionGeek
11:50 - 12:00  
  Photodetectors and Dedicated Analog Front-end for Novel LiDAR Architectures
Farzad Parsaie, CEO, SAND Microsystems GmbH
12:00 - 13:45       Lunch
Session 4: Technology & Manufacturing | Chaired by Eric Mazaleyrat, Technology Strategy and Partnership Director, STMicroelectronics
13:30 - 13:55  
  A Subretinal Bionic Vision System for Central Vision Restoration in Advanced Dry Age-related Macular Degeneration
Martin Deterre, Engineering Manager, Pixium Vision
13:55 - 14:20  
Guy Lauvergeon
  Revisiting the Rich Sensor Value Chain for the Advent of AIoT
Guy Lauvergeon,Chairman of Greenwaves Technologies and Founders of Morphosense
14:20 - 14:45  
Patrice Roulet

Intelligent Vision, How Latest Generation Super-wide-angle Cameras, MEMS and Image Processing Algorithms Enable Advanced Vision Applications
Patrice Roulet, Vice President, Technology & Co-Founder, Immervision

14:45 - 15:10  

Glass Core Technology: Integration Leads to Innovation
Tim Rümping, Applications Engineer, Samtec Germany

15:10 - 15:35  
David Henry
  PIXCURVE: a Global Approach for Curved Optical Components
David Henry, Head of Packaging and Assembly Laboratory, Optics and Photonics Division,CEA-Leti
15:35 - 16:25       Coffee Break                                                                                                                                                                                                           
Session 5: Image Sensors | Chaired by Francois Simoens, Strategic Program Manager - Lidar in CPS, CEA-Leti
16:25 - 16:50  
Thalis Anaxagoras
  Wafer Scale Image Sensors: New Developments and Technology Challenges for the X-ray Market
Thalis Anaxagoras, Founder, ISDI
16:50 - 17:15  

Industrial Atomic Layer Deposition for Imaging Sensors
Mikko Söderlund, Director, Technical Sales Europe, Beneq

17:15 - 17:40  
Reinhard Voelkel
  Excellence in Microlens Imprint Lithography and Wafer-Stacking
Reinhard Voelkel, CEO, SUSS MicroOptics SA
17:40 - 18:05  
Bram Senave
  AI Close to the Sensor: an Approach for Energy Efficient and Real Time AI
Bram Senave, Business Development Manager, Easics
18:05 - 18:30  
Benjamin Bouthinon
  Organic Image Sensors for Fingerprint Acquisition in Smartphone Display and NIR Development for Hybrid CMOS Imager
Benjamin Bouthinon, Optics Manager, ISORG
18:30 - 18:45       Bus Shuttle
19:00       Gala Dinner

Friday, September 27th

08:00 - 08:30       Welcome Coffee
Session 6: Applications | Chaired by Philippe Monnoyer, Customer Account Lead, VTT
08:20 - 08:45  

3D Depth Sensing: Time-of-Flight Technology and Application
Morin Dehan,Technology Engineer, Sony Depthsensing Solutions                                                                                       

08:45 - 09:10  
  Multi-sensor Imaging to Sort Recyclables
Antoine Bourely, Chief Technology Officer, PELLENC Selective Technologies S.A.S.
09:10 - 09:35  
  Electrowetting Based Liquid Lenses – a Novel Technology that Improves Imaging Device Performance
Frederic Laune, Corning
09:35 - 10:00  
Jan Makowski
  Hyperspectral Imaging for Wafer Inspection
Jan Makowski, CEO / CTO, LuxFlux
10:00 - 10:25  
Jochem Herrmann
  Machine Vision Standards – Meeting challenges for the next decade(s)
Jochem Herrmann, President, EMVA
10:25 - 11:00       Coffee Break