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This SEMI CEO Series Webinar will bring you expert analysis of the outcome of the U.S. presidential election on current geopolitical tensions and the corresponding impact on the global microelectronics supply chain. SEMI President and CEO Ajit Manocha invites you to join us for an opening presentation from Eurasia Group on the post-election world and US-China trade, focusing on implications for the semiconductor and the bigger technology sector.

A panel discussion with industry CEOs from multiple regions and segments will provide their perspectives to the analysis, addressing the role industry executives can play in easing trade tensions and providing insights on navigating the current geopolitical environment.

United States

4:30 pm
Ajit formal photo Square 500px
Ajit Manocha
CEO and President
SEMI

Welcome & Opening Remarks

4:35 pm
Joe Pasetti, SEMI
Joe Pasetti
VP, Global Advocacy & Public Policy
SEMI

SEMI Global Advocacy Priorities

4:40 pm
Gerald Michael Butts
Gerald Butts
Vice Chairman
Eurasia Group

Macro Overview on the Post-Election World and US-China Trade

4:55 pm
Kevin Allison
Kevin Allison
Director, Geotechnology
Eurasia Group

Implications for Semiconductor and Overall Tech Industry

5:10 pm
James Andrew Lewis
Moderator

CEO Panel

James Andrew Lewis
Senior VP and Director, Strategic Technologies Program
Center for Strategic and International Studies (CSIS)
Biography

Mitsunobu Koshiba Photo
Panelist

Mitsunobu Koshiba
Chairman of the Board
JSR
Biography

Bertrand Loy
Panelist

Bertrand Loy
President and CEO
Entegris
Biography

Dr. Steve Schwartz
Panelist

Dr. Stephen Schwartz
President and CEO
Brooks Automation
Biography

Tien Wu 575 pixel
Panelist

Dr. Tien Wu
Director and CEO
Advanced Semiconductor Engineering, Inc. (ASE Group) and USI
Biography

5:45 pm

Q&A

5:58 pm

Closing Remarks

- 12:00 pm - 12:00 pm Off Add to Calendar Disabled America/Los_Angeles
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ESPOO, Finland, 19th October 2020 – The Chairman of the Board and founder of Picosun Group, Mr. Kustaa Poutiainen, has been awarded as Finland’s Entrepreneur of the Year 2020. Mr. Poutiainen received the National Entrepreneur Award in the annual meeting of the Federation of Finnish Enterprises in Jyväskylä on 17th October. The award is given every year to four Finnish entrepreneurs as a recognition of exceptional entrepreneurship.

Picosun provides ALD (Atomic Layer Deposition) thin film coating solutions to global microelectronics and other industries. ALD was invented in Finland in 1974 by Picosun Board Member Dr. Tuomo Suntola, who in 2018 received the Millennium Technology Prize in recognition of his invention. ALD is a mature, key enabling technology in today’s semiconductor manufacturing, realizing the development of modern microelectronics according to the Moore’s Law. ALD is expanding rapidly to other fields of industry as well, and it is expected to bring a fundamental disruption especially to healthcare technologies, where Picosun’s PicoMEDICAL™ solutions have already enabled several new innovations.

“Even if we had great premises to start manufacturing ALD equipment, not everyone believed in us in the beginning. Our personnel did and showed what they are capable of. It has taken us to a path of excellent growth,” says Poutiainen.

Picosun’s first customers, when the company entered the ALD business in 2004, were universities and research institutes. Now, the world’s leading electronics manufacturers and other companies turn to Picosun when they need the most advanced thin film coating technology to stay spearheading their own industries. Even in the middle of the global pandemic, Picosun’s turnover is expected to grow 50%, which is remarkably higher than the market’s average of 15%.

“Since day one, our vision was to be the best in the world. We have already achieved this with our R&D ALD tools, and now we are heading further. We invest a significant amount of our turnover in development of our ALD solutions and our personnel so that we can always exceed the expectations of our customers. It is an honor to receive the National Entrepreneurship Award of Finland, and it is an honor to be a part in steering Picosun towards the future, which looks very bright indeed,” continues Poutiainen.

“The whole Picosun team wants to congratulate our Chairman, Kustaa Poutiainen, on this prestigious award. We are very proud of his significant contributions and role in enabling the international breakthrough of Finnish originated ALD technology. I am sure that the entire global ALD community appreciates his efforts and joins our congratulations,” summarizes Mr. Jussi Rautee, CEO of Picosun Group.

More information:
Mr. Jussi Rautee
CEO, Picosun Group
Tel: +358 50 345 4457
Email: [email protected]
Web: www.picosun.com

ESPOO, Finland, 6th October 2020 – Picosun Group, the leading supplier of AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries, strengthens its position in power electronics market with several cluster ALD system sales to prominent manufacturers in Europe, USA and Asia.

“Power electronics is an important, fast growing market for Picosun. ALD has potential to solve various challenges manufacturers are facing in this field, and our solutions have enabled our customers to create significant added value in terms of device quality and throughput. At Picosun, we have developed several turn-key production ALD solutions specifically for 4-8 inch wafer markets such as power devices. Especially our cluster ALD systems, such as the PICOSUN® Morpher which we launched last year, have been extremely well received by our customers,” says Juhana Kostamo, Head of Customer Solutions/Deputy CEO of Picosun.

Power components are crucial in a wide range of applications from consumer electronics to transportation, energy production and distribution, including renewables such as wind and solar power generation. These components are typically manufactured on 4-8 inch compound semiconductor wafers such as GaN and SiC. These materials provide various benefits compared to pure silicon, for example higher electron mobility, higher threshold voltage, and ability to operate at higher temperatures. Challenges do exist, however, as GaN and SiC power devices are prone to high interface trap density (leading to parasitic currents and reduced electron mobility) and gate leakage current, and poor threshold voltage stability.

Interface trap density can be reduced by combining pre-cleaning methods with high permittivity, large bandgap insulators. High quality, defect-free high-k dielectric layers such as Al2O3, AlN or ZrO2 etc. are key in reducing power devices’ gate leakage current and to improve electron mobility and threshold voltage stability. A good example here are GaN-based HEMTs (high electron mobility transistors), which are important in various large scale practical applications, and which require efficient gate insulation and surface passivation to achieve optimal functionality.

ALD stands as a superior deposition method here compared to other thin film coating technologies such as PECVD, as ALD produces the most conformal, uniform, and defect-free films with accurate, digitally repeatable thickness control and sharp interfaces. With the right selection of ALD deposition equipment, even multilayer processing is possible i.e. various functional material layers and/or stacked films/nanolaminates can be manufactured in one process run.

PICOSUN® Morpher is a disruptive ALD production platform designed for up to 8 inch wafer industries such as power electronics, MEMS, sensors, LEDs, lasers, optics, and 5G components. Morpher’s operational agility makes the system adaptable to various and changing manufacturing needs, on all business verticals from corporate internal R&D to production and foundry manufacturing, where both the end products and/or customers’ requirements may change rapidly. Morpher can handle several substrate materials, batch and substrate sizes, and ALD materials with leading process quality. Multilayer deposition is possible, and cluster design allows integration of also other processing units such as pre-clean, RIE etc. for fully automated, high throughput continuous vacuum operation.

“In its versatility and transformability, Morpher is the epitome of our principle ‘Agile ALD’. Innovation, constant development and improvement of our ALD solutions to enable our customers’ success is our driving force at Picosun. This applies also to Morpher platform and we have some truly exciting additions to this product family coming in the near future,” summarizes Kostamo.

About Picosun
Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Taiwan, China, Korea and Japan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

More information:
Juhana Kostamo
Head of Customer Solutions/Deputy CEO, Picosun Group
Tel: +358 50 3699 565
Email: [email protected]
Web: www.picosun.com

ESPOO, Finland, 24th September 2020 – Picosun Group, the leading supplier of AGILE ALD® (Atomic Layer Deposition) thin film coating technology, reports excellent results in UVC (ultraviolet-C) LED performance, achieved with the company’s ALD solutions.

Excellent reliability and lifetime improvements of UVC LEDs have been obtained at Picosun’s customer and collaboration partner site, National Chiao Tung University (NCTU), Taiwan, using passivation and barrier films deposited with PICOSUN® ALD equipment(*). ALD passivation layer could potentially replace the expensive hermetic seal package of the LEDs and thus lower the costs of the final device.

“We have used Picosun’s ALD technology already for years with great success. Our PICOSUN® ALD equipment yields superior quality films which has helped us to achieve several breakthroughs in our LED research. Picosun has local presence in Taiwan and we appreciate the prompt response of their customer support if we ever have any issues. At the phase when R&D results are to be ramped up to industrial-level production, the scalability of Picosun’s ALD technology is a huge benefit,” comments Professor Hao-Chung Kuo from NCTU.

In order to reach maximum light output and long operating lifetime, LED chips require surface passivation to eliminate parasitic currents caused by traps and defects. Also barrier coating is typically needed as LED materials are sensitive to moisture. ALD is an ideal technique to manufacture both the passivation and barrier films – and when the LED size diminishes to micrometer dimensions, the only coating method capable of producing high enough quality films on the required minuscule scale. Ultra-thin, pinhole-free ALD films do not suppress the LED light intensity and they provide reliable protection against ambient conditions, whereas their superior conformality ensures no thickness variations between the facets of the LED chip. Thickness variations, typical side effect of other coating methods, can potentially lead to uneven distribution of film stress or thermal expansion behavior and risk physical damage of the chip.

Short-wavelength UVC radiation destroys bacteria and viruses so UVC LED technology is particularly topical now during the still ongoing COVID-19 pandemic. Small, lightweight LEDs enable versatile design of portable, compact disinfecting equipment, they consume less power than other UVC sources, they are durable, and they pose no risk of hazardous material leaks such as e.g. mercury lamps.

“We are happy of the achievements of Professor Kuo’s group at NCTU, and how Picosun’s ALD technology has helped them to achieve their goals in UVC LED development. Our long-term collaboration and networking with both the academia and prominent industries in this field gives us the perfect synergy advantage to facilitate implementation of these solutions in industrial manufacturing,” says Mr. Edwin Wu, CEO of Picosun Asia Pte. Ltd.

(*) UVC LED with 50 nm ALD Al2O3 passivation and normal LED packaging (no hermetic seal) maintained 80% of its original efficiency even after 500 hours environmental test at 85% humidity and 85 oC temperature.

About Picosun
Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Taiwan, China, Korea and Japan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

More information:
Mr. Edwin Wu
CEO, Picosun Asia Pte. Ltd.
Tel: +358 40 480 3449
Email: [email protected]
Web: www.picosun.com

ESPOO, Finland, 31st August 2020 – Picosun Group’s growth strategy is based on strong expansion into industrial ALD markets. To support this strategy, special emphasis has been placed on strengthening the Group’s global service organization. The investment has paid itself back in the form of high level of customer satisfaction, despite the challenges caused by the global covid-19 pandemic especially in traveling and logistics.

“Due to the reinforced localization of our service and support units, our service engineers’ utilization level has been more than 85% in the past six months, and with the latest remote service and support tools we have gained advantage to manage our customers’ PICOSUN® ALD system commissionings online and in time. ALD tool maintenances, process development, spare parts and other critical deliveries are also provided locally with maximum safety precautions in place, to ensure customers continuous operation of their PICOSUN® ALD equipment,” states Mr. Timo Malinen, Customer Experience Director of Picosun Group.

During the last months, Picosun Group has hired and trained several new service engineers and sales and support personnel to provide local support at the Group’s US, Asian, and European locations. Remote diagnostics, control, and data logging features for remote troubleshooting and process optimization of customers’ PICOSUN® ALD tools are a routine approach in the Group’s ALD solution deliveries. Augmented and/or virtual reality solutions for even more efficient service operations and remote learning/e-training possibilities are also under development and will be introduced in all Picosun’s operations later on.

“Our principle of ‘AGILE ALD’ and our position as the technological forerunner in our field obligate us to provide the best possible services and solutions to our customers. As a globally operating company, pandemic risk scenarios are an integral part of our continuous risk planning. Against the backdrop of the current covid-19 outbreak, our service operations are continuously being adapted to mitigate potential impacts. Picosun Group follows a holistic management process that enables constant development of our customer service unit to ensure the best possible response even in an emergency situation,” continues Malinen.

For Picosun, the health of employees and customers is the highest priority. In order to closely monitor and manage the covid-19 situation, Picosun follows all the safety regulations provided by WHO, CDC, ECDC, and Finnish Institute for Health and Welfare, and provides the necessary information timely to all employees, customers, and other stakeholders.

Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Taiwan, China, Korea and Japan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

More information:
Mr. Timo Malinen
Customer Experience Director, Picosun Group
Tel. +358 40 5011 860
Email: [email protected]
Web: www.picosun.com

REGISTRATION

smart manufacturing webinar

This webinar is free of charge. 

smart manufacturing webinar
Belgium France Germany Ireland Italy Russia United States REGISTER About Smart Manufacturing Business Technical

For sponsorship opportunities, please contact:

Cassandra Melvin, Director of Operations at [email protected]
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PRESS AND MEDIA

If you are interested in partnering with us or have any questions about press and media, please contact us.

Serena Brischetto, Senior Manager, Marketing and Communications at [email protected]

The SEMI SMART Manufacturing Initiative is a global effort to promote awareness and interest about smart manufacturing and industry 4.0. Through their collaborative efforts, the members of the SEMI SMART Manufacturing Regional Chapters meet regularly, both virtually and in person, to facilitate discussions for solving challenges and issues that impact manufacturing.  

The webinar will provide an update on pressing critical topics derived from key players across the supply chain and is recommended to semiconductor professionals interested in the European smart manufacturing trends and market.

Topics include:

  • a summary of stakeholder-identified activities aligned to Industry 4.0
  • key initiatives and emerging roadmaps
  • standards
  • best practices for improved process quality
  • market updates
  • overview of current Smart Manufacturing activities

Online, Central European Time
Germany

4:00 pm - 4:10 pm
Tom Salmon
Tom Salmon
Vice President, Collaborative Technology Platforms Executive Director, Fab Owners Alliance (FOA), SEMI

Welcome Remarks and Moderation

4:10 pm - 4:30 pm
Claude Morant
Claude Morant
Group Vice President Quality & Manufacturing Excellence / Manufacturing Data & Analytics Lead
STMicroelectronics

Manufacturing Data & Analytics

4:30 pm - 4:45 pm
Ilan Englard
Ilan Englard
European Cooperative Projects Manager
Applied Materials Israel (AMIL)

MADEin4 - Metrology Advances for Digitized ECS (Semiconductor and Automotive) Industry 4.0

4:45 pm - 5:00 pm
Michael Arnold
Michael Arnold
Managing Director
PEER Group GmbH

SEMI Smart Manufacturing Technology Community – Europe Chapter

5:00 pm - 5:15 pm
MICHAEL ALEXANDER
Michael Alexander
Partner Electronics, Co-Lead Advanced Technology Center, CC Industrial Products & Services
Roland Berger GmbH

Sizing the Digital Gap - Visualizing the Gap and Discussing Levers to Close it

5:15 pm - 5:30 pm

Q&A

FOA

Free Webinar

European Collaborations Driving Smart Manufacturing Excellence
 

SMART Manufacturing

 

4:00 pm - 5:30 pm Off Add to Calendar 2020-12-09 16:00:00 2020-12-09 17:30:00 Webinar - European Collaborations Driving Smart Manufacturing Excellence Free Webinar European Collaborations Driving Smart Manufacturing Excellence     Online, Central European Time Germany SEMI.org [email protected] Europe/Berlin public Europe/Berlin
Belgium China France Germany Ireland Italy Japan Malaysia Russia Singapore South Korea Taiwan United States Vietnam Learn More FOA 2020 Business Executive Technical

The close-knit FOA Device-Maker-to-Device-Maker information sharing has always been one of the key benefits of the organization. While in-person meetings continue to be a challenge amid the pandemic, the FOA is still looking to facilitate best practice & information sharing virtually. Similar to the first open forum, the second one will be based on a purpose-driven survey and will focus on return-to-work/business continuity during the pandemic.

For information on the open forum, please contact the FOA staff: [email protected]

United States

11:00 am - 11:05 am
Tom Salmon
Tom Salmon
SEMI
Executive Director, FOA & VP, CTP

Welcome Remarks

11:05 am - 11:15 am
Tom Salmon
SEMI
Executive Director, FOA & VP, CTP

Survey Results

11:15 am - 11:30 am
TBD

Contact Tracing, HIPAA & Privacy

11:30 am - 11:40 am
TBD

Q&A

11:40 am - 12:30 pm

Open Forum

FOA

Fab Owner's Alliance (FOA), a SEMI technology community, is hosting an open forum to discuss how members are handling the return to work for non–essential employees.

This event is by invitation only.

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11:00 am - 12:30 pm Off Add to Calendar Disabled America/Los_Angeles
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Webinar - The Future of Work: Leading Remote Teams

Open to All.

Not able to attend? Register anyway. We'll send you a link to the webinar archive so you can view it at your own convenience.

Webinar - The Future of Work: Leading Remote Teams
Belgium China France Germany Ireland Italy Japan Malaysia Russia Singapore South Korea Taiwan United States Vietnam save your seat Smart Mobility: Next Generation Transportation Enabled by Sensorization V2 Business Technical

Sensorization will enable next generation of transportation: Autonomous, Connected, Electric, and Shared (ACES) vehicles.  Join McKinsey & Company and SEMI Smart Mobility for this webinar detailing the opportunities for sensors in vehicles and smart infrastructure.

McKinsey & Company have identified several major disruptions that will impact the mobility sector.  For example, the automotive sensor market for light vehicles is expected to grow from around $30 billion to $60+ billion by 2030 (Mapping the Automotive Software and Electronics Landscape through 2030, McKinsey.com, July 2019). While current cars with L1 automation (and internal combustion engine) have around $300 worth of sensors, a purpose-built robo-taxi (BEV) in 2030 will have around $2,000 worth of sensors. An increase in the adoption of cameras, radars, and LiDARs contributes to large per vehicle sensor value and enables the data collection necessary for advanced features. Additionally, the sensor market related to smart roads/infrastructure is also growing rapidly and creating opportunities for sensor manufacturers and related players.

The MSIG community is a critical partner in contributing to SEMI's Smart Mobility initiative to connect and synchronize the automotive/mobility and semiconductor/sensor supply chains around issues that matter to both. By creating collaborative platforms and bringing communities together, Smart Mobility will streamline the transition to highly-sensorized ACES vehicles and provide business opportunities to MSIG members. One such community is the SEMI’s Global Automotive Advisory Council (GAAC) where auto manufacturers and suppliers meet to address common challenges, share information and align priorities.

This webinar will provide details on market projections, GAAC activities, Smart Mobility initiates, and provide examples of how MSIG members should participate.  Together, MSIG and Smart Mobility can help the Transportation Evolution.

United States

8:00 am - 8:05 am
Tim Brosnihan SEMI
Moderator: Tim Brosnihan
Executive Director, MSIG
SEMI

Welcome Remarks

8:05 am - 8:10 am
Bettina Weiss
Bettina Weiss
Chief of Staff and Global Smart Mobility Lead
SEMI

Introduction: Smart Mobility Initiative

8:10 am - 8:25 am
Andreas Breiter
Andreas Breiter
Partner
McKinsey & Company

Biography

Andreas leads McKinsey’s capital-investment work for advanced industries in North America as well as our Center for Future Mobility on the West Coast. In his advisory work, Andreas serves a broad range of companies in the automotive sector, including car and truck manufacturers and their suppliers, as well as companies in the utilities and renewables space. He helps executives make strategic choices around product development while reducing material costs and optimizing the purchasing function. Andreas helps companies stay ahead of emerging trends, such as autonomous driving, connectivity, electric vehicles, and shared mobility.

Andreas holds a PhD in Operations Management and studied in Germany, France, the USA and Canada.

8:25 am - 8:40 am
Armen Mkrtchyan
Armen Mkrtchyan
Associate Partner
McKinsey & Company

Biography

Armen Mkrtchyan is an Associate Partner in McKinsey’s Los Angeles Office and is a co-leader of McKinsey’s Center for Future Mobility on the West Coast.

At the Firm, Armen’s clients primarily include Automotive passenger and truck manufacturers and their suppliers. He also serves electronics and semiconductor players across the value chain both on operational and strategic topics.

Previously, Armen was the Founding Director of the Entrepreneurship and Product Innovation Center (EPIC) at the American University of Armenia and served as an Assistant Professor in the College of Engineering.

Armen has a PhD in Aeronautics and Astronautics from MIT and has worked on the development of various autonomous air and ground vehicles. He received his Bachelor’s degree in Electrical Engineering from the University of North Dakota and has multiple publications in the area of control systems, test and simulation, product development optimization.

8:40 am - 9:00 am

Q&A

MSIG
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8:00 am - 9:00 am Off Add to Calendar 2020-08-19 08:00:00 2020-08-19 09:00:00 Smart Mobility: Next Generation Transportation Enabled by Sensorization United States SEMI.org [email protected] America/Los_Angeles public
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Belgium China France Germany Ireland Italy Japan Malaysia Russia Singapore South Korea Taiwan United States Vietnam Watch the Video The impact of future mobility disruptions on the semiconductor design ecosystem V2 Business Technical

Future mobility disruptions include the development of autonomous and connected vehicles, electric powertrains, and shared mobility solutions. These trends will shape and impact the semiconductor design value chain:

  • The development of autonomous vehicles will impact chip design, verification, and IP through demand for high-performance computing, connectivity, functional safety, security, and reliability.
  • Software-rich automotive solution-specific EDA products will serve the needs of automotive OEMs and Tier 1 suppliers to accelerate R&D, verification, and testing.
  • Partnerships in the semiconductor value chain will play an important role to make these mobility disruptions reality. Suppliers in the design ecosystem could partner on system architecture, design, development, and verification

Join McKinsey & Company and SEMI's Electronic System Design Alliance at this webinar to learn about emerging new opportunities in Design and IP being driven by the rapid growth and disruptions in the global automotive markets and supply chains.

United States

10:00 am - 10:05 am
Bob Smith
Moderator: Bob Smith
Executive Director, ESDA
SEMI

Welcome Remarks

10:05 am - 10:10 am
Bettina Weiss
Bettina Weiss
Chief of Staff and Global Smart Mobility Lead
SEMI

Introduction: Smart Mobility Initiative

10:10 am - 10:25 am
Andreas Breiter
Andreas Breiter
Partner
McKinsey & Company

Biography

Andreas leads McKinsey’s capital-investment work for advanced industries in North America as well as our Center for Future Mobility on the West Coast. In his advisory work, Andreas serves a broad range of companies in the automotive sector, including car and truck manufacturers and their suppliers, as well as companies in the utilities and renewables space. He helps executives make strategic choices around product development while reducing material costs and optimizing the purchasing function. Andreas helps companies stay ahead of emerging trends, such as autonomous driving, connectivity, electric vehicles, and shared mobility.

Andreas holds a PhD in Operations Management and studied in Germany, France, the USA and Canada.

10:25 am - 10:40 am
Armen Mkrtchyan
Armen Mkrtchyan
Associate Partner
McKinsey & Company

Biography

Armen Mkrtchyan is an Associate Partner in McKinsey’s Los Angeles Office and is a co-leader of McKinsey’s Center for Future Mobility on the West Coast.

At the Firm, Armen’s clients primarily include Automotive passenger and truck manufacturers and their suppliers. He also serves electronics and semiconductor players across the value chain both on operational and strategic topics.

Previously, Armen was the Founding Director of the Entrepreneurship and Product Innovation Center (EPIC) at the American University of Armenia and served as an Assistant Professor in the College of Engineering.

Armen has a PhD in Aeronautics and Astronautics from MIT and has worked on the development of various autonomous air and ground vehicles. He received his Bachelor’s degree in Electrical Engineering from the University of North Dakota and has multiple publications in the area of control systems, test and simulation, product development optimization.

10:40 am - 11:00 am

Q&A

ESD Alliance
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