Heidelberg Instruments Reports Major Orders for the VPG+ 1400 FPD Volume Pattern Generator from Leading Asian Photomask Manufacturers

Heidelberg, Germany – Heidelberg Instruments has secured two major orders for its VPG+ 1400 FPD Volume Pattern Generator from leading photomask manufacturers in Asia, with a total order value between EUR 9 million and EUR 10 million. Deliveries are scheduled for 2025.

“These significant order intakes mark major milestones for the company, reinforcing our market position and driving further innovation and growth in the display technology sector”, says Alexander Forozan, VP of Global Sales and Business Development.

The VPG+ 1400 is Heidelberg Instruments’ largest system, specifically designed for large-format photomask patterning in the flat panel display (FPD) industry. It supports mask sizes up to 1400 x 1400 mm², making it ideal for various flat panel display generations (G4 to G8). The VPG+ 1400 sets a new standard for high-throughput photomask production, offering the precision and scalability required for large displays. Additionally, it delivers the accuracy needed to produce large-area halftone photomasks for flat panel displays.

Equipped with advanced metrology and alignment features, including Cognex AI-based image recognition, the system ensures precise alignment for multilayered masks. Its linear and nonlinear coordinate corrections further enable precise overlay across tools.
By addressing the diverse exposure needs of customers, Heidelberg Instruments' large-area VPG+ Volume Pattern Generators have proven to be valuable assets in display photomask production lines.

Further information: https://heidelberg-instruments.com/product/vpg-1400-fpd/

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Innovative plug-and-play device helps conduct comprehensive equipment compliance tests for automatic carrier delivery in automated fabs

SEMICON Europa, Munich, Germany, November 12, 2024 – Agileo Automation, a leading provider of control and connectivity solutions for global semiconductor equipment manufacturers, today launches the E84 PIO Box at Booth #C2848. This handheld device offers a new lightweight interface for fab staff to test semiconductor equipment software for compliance with SEMI’s E84 and GEM300 standards suite for automatic carrier delivery. It improves the readability, identification, and validation of E84 signal exchanges and functional aspects in cleanrooms or workshops. Integrated with Agileo Automation’s Speech Scenario software that emulates the fab host and validates the SECS/GEM interface with predefined test scenarios, the E84 PIO Box can easily emulate automated carrier delivery systems such as overhead hoist transport or automated guided vehicles. It is able to detect non-compliance and other functional issues thanks to its close alignment with SEMI’s E84 standard. The device features a DB25 connector for easy integration with E84 passive systems such as a load port and connects directly to a PC via a single USB cable for both data and power supply.

“In highly automated fabs, even minor carrier delivery issues can lead to costly downtime. Our E84 PIO Box is designed to rigorously validate nominal and error cases, ensuring seamless operations and fast recovery, benefiting both equipment manufacturers and facilities alike,” explains Marc Engel, CEO of Agileo Automation. “Early adopters have seen significant improvements in overall equipment software quality and now approach each software update with greater confidence, backed by consistent testing results.”

About Agileo Automation
Since its inception in 2010 in Poitiers, France, Agileo Automation has empowered global semiconductor equipment manufacturers to optimize their production machines with control, communication, data acquisition, and testing solutions, enabling their deployment in large-scale fabs worldwide. At the heart of Industry 4.0, Agileo’s A²ECF-SEMI framework provides a robust foundation for developing equipment controller software, leveraging the SEMI SECS/GEM and GEM300 standard suites. As a member of SEMI and the OPC Foundation, Agileo is a key contributor to the development and integration of industry standards such as SEMI standards and OPC Unified Architecture (OPC-UA). For more information, please visit our web site or follow us on LinkedIn.

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Munich, Germany – November 4, 2024 – SEMI Europe and the SEMI European Advisory Council for Diversity and Inclusion today announced the 2024 20 Under 30 Award Recipients, honoring exceptional young professionals who are driving innovation and success in the semiconductor industry.

This prestigious award highlights the most promising leaders under 30-years-old who are making significant contributions within the microelectronics supply chain, fostering a more diverse and inclusive environment in a critical sector.

"Recognizing the innovators of tomorrow is crucial for the growth and sustainability of our industry," said Laith Altimime, President of SEMI Europe. "The 20 Under 30 Award not only honors exceptional talent but also inspires a new generation to drive change and foster collaboration in the semiconductor sector. By proudly showcasing these talented individuals, SEMI Europe aims to foster a culture of recognition that empowers young professionals to pursue their ambitions and drive change."

2024 20 Under 30 Award Recipients

The 2024 award recipients represent a diverse range of roles and specializations within the European semiconductor landscape:

• Abel Andemichael, PCB Layout Designer, Comet AG
• Alicia Pang Li Si, Process Engineer, Soitec
• Anne-Mary YEBOAH, Technology Manager, Soitec
• Annika Schnell, Application Specialist, DR YIELD
• Augustin Detruit, Head of Production/Production Manager, ERS electronic GmbH
• Charis Kalantzi, Lead Application Engineer, Cadence Design Systems
• David Coenen, Senior researcher Silicon Photonics Thermal Management, imec
• Elisabeth Brierley, Sustainable Graduate, Edwards – Atlas Copco group
• Felix Holtsch, Engineer 2 – Product Specialist, Tokyo Electron Europe (TEL)
• Felix Kohler, Use Case Manager, Electronics business of Merck KGaA, Darmstadt, Germany
• Giulia Cioffi, Asic Digital Design Staff Engineer, Synopsys
• James McGrath, CVD Process Engineer, KLA (SPTS Division)
• Kamal Rudra, R&D Integration Engineer, IBM
• Lizzie Boakes, Researcher, imec
• Luca Sinkó, R&D Team Leader, SEMILAB
• Mouadh Ayache, Senior Engineer, Synopsys
• Pascal Fasel, Process Engineer / Project Manager, Comet AG
• Pheobe Kuo, Customer Engineer, Applied Materials
• Steve Kalkbrenner, Senior Software Developer, Kontron-AIS
• Thibaud Rebotier, Senior Industrial Engineer, ASM International

"As professionals in the semiconductor industry, it's our collective responsibility to nurture new talent as well as spark curiosity and passion for our dynamic field," said Stephan Haferl, CEO of Comet. "By supporting SEMI in honoring the young leaders who will shape our future, Comet proudly contributes to this mission."

Dan Collins, General Manager of KLA's SPTS Division, said, "We congratulate all the shortlisted individuals and feel it is important to recognize and celebrate these worthy winners as they continue their career journeys to shape this industry and lead it to a bright future."

"We are proud to partner with the SEMI 2024 20 Under 30 Award," said Olga Needham, Senior HR Director, Tokyo Electron Europe (TEL). "This award is dedicated to recognizing and empowering young leaders who are making significant contributions to their organization and customers. At TEL, we believe that by investing in the next generation, we are not only helping to shape the future but also creating opportunities for growth and innovation in our industry."

The 2024 20 Under 30 Award is sponsored by Comet Group, KLA and Tokyo Electron Europe (TEL), highlighting their commitment to nurturing emerging talent in the semiconductor field.

SEMI Europe will host the award ceremony during SEMICON Europa 2024, which will take place from November 12-15 at Messe München in Munich, Germany. Co-located with electronica, this premier exhibition and conference for the microelectronics supply chain will showcase keynotes from thought leaders in design, manufacturing, academia, and government. Registration is open.

For more information about the 20 Under 30 Award or to learn about future nomination opportunities, visit SEMI Europe 20 Under 30 Award. For more details, please visit the SEMICON Europa 2024 website and connect with SEMI Europe on LinkedIn or X @SEMIEurope (#SEMICONEuropa).

About SEMI

SEMI^® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON^® expositions and events, technology communities, standards and market intelligence help advance our members' business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contacts

Maria Daniela Perez / SEMI Europe
Phone: +49 160 2562977
Email: [email protected]

Samer Bahou/SEMI Corporate
Phone: 1.408.943.7870
Email: [email protected]

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MUNICH, Germany ─ October 14, 2024 ─ Semiconductor industry experts will convene at SEMICON Europa 2024, November 12-15 at Messe München in Munich, to explore the latest trends and innovations in advanced packaging and fab management. The Advanced Packaging Conference (APC) and Fab Management Forum (FMF) at SEMICON Europa will each focus on driving sustainable solutions to meet the evolving demands of the semiconductor market. Co-located with electronica, SEMICON Europa is the region’s premier event connecting the entire electronics design and manufacturing supply chain. Registration is open for APC and FMF.

"Global collaboration across the semiconductor industry is essential for driving sustainable, exponential growth,” said Laith Altimime, president of SEMI Europe. ”SEMI Europe Advanced Packaging Conference and Fab Management Forum provide invaluable platforms for stakeholders to share insights and innovations, ensuring we leverage cutting-edge technologies and strategies that enhance performance while paving the way for a more sustainable future." 

Advanced Packaging Conference ─ 
Chiplets and Heterogenous Integration: The Next Frontier in Performance and Efficiency 

Demand for High Performance Computing (HPC) is increasing, driven by advancements in artificial intelligence and Large Language Models like ChatGPT. HPC’s expansion requires innovative solutions in chiplet design, heat dissipation, and power optimization. The upcoming APC will provide a platform to explore enhancing each of these developments, highlighting collaboration among academia, industry, and government.   

This year’s APC will focus on:

• The Role of Chiplets in Enhancing Performance and Efficiency
• Power Optimization Techniques for Next-Generation Applications
• Advances in Miniaturization and Material Integration
• Innovations in Heat Dissipation and Thermal Management
• Collaborations Across Academia, Industry, and Government   

Speakers include experts from Amkor Technology, ASE Global, Atotech an MKS Brand, Besi, Chip Integration Technology Center (CITC), Comet Yxlon, EV Group (EVG), Evatec, GlobalFoundries, Guangdong Fenghua Semiconductor Technology, Henkel, IBM, Infineon Technologies, JCET, Koh Young Europe, QuantumDiamonds, RHP-Technology, RoodMicrotec, Robovision, STATS ChipPAC, and SUSS MicroTec.

The conference is sponsored by ASE Global, Atotech an MKS Brand, Comet Yxlon, IBM, Koh Young Europe and SUSS MicroTec.

Fab Management Forum ─
Driving Innovation: Competitive, Sustainable and Collaborative Strategies 

To meet its evolving demands, the semiconductor industry must adopt competitive, sustainable, and collaborative strategies that enhance fab efficiency and performance. Industry stakeholders can develop innovative solutions for a sustainable future by integrating cutting-edge technologies and fostering partnerships.  This year’s FMF will focus on:

• Key Strategies in a Global Market Landscape
• Advancing Smart Manufacturing Solutions
• Europe's Environmental Transition: Stability to Sustainability
• Next-Gen Core Technologies for Future Fabs

Speakers include experts from Algorismic, ams OSRAM, BMW Group, Comet Yxlon, Flexciton, Infineon Technologies, INFICON, imec, Kontron AIS, minds.ai, Robert Bosch Semiconductor Manufacturing, STMicroelectronics, Synopsys, Texas Instruments, Tokyo Electron Europe, Watlow, and X-Fab.

The forum is sponsored by Comet Yxlon, Flexciton, INFICON, Lynceus, Tokyo Electron Europe (TEL), and Watlow.

Other SEMICON Europa 2024 Highlights

• CxO Summit: Top executives will share strategies for sustainable growth in Europe's semiconductor sector, focusing on navigating the evolving landscape through sustainability, supply chain resilience, and technological advancements.
• III-V Summit – Integrated Photonics: This summit will examine the role of III-V compound semiconductors in advancing next-generation electronics, focusing on their impact on high-performance, energy-efficient devices in telecommunications, computing, and photonics.
• ITF Chip into the Future - Powered by imec: This session will cover the EU Chips Act's implementation and impact on Europe's semiconductor ecosystem, highlighting collaborative research and innovations in chip design and manufacturing.
• MEMS & Imaging Sensors Summit: This summit will explore recent advancements in MEMS and imaging sensor technologies, focusing on their impact on agriculture, automotive, and healthcare, along with the integration of AI, machine learning, and data fusion in next-generation applications.
• Executive Forum Programs: These sessions will provide updates on key technological trends, including Silicon Carbide (SiC) power semiconductors, smart mobility solutions, and AI-driven manufacturing processes. Industry experts will also address sustainable energy and challenges related to electrification, presenting the latest innovations aimed at overcoming these obstacles.
• TechARENA Programs: Focused on emerging technologies, TechARENA sessions will explore advancements in fields such as medical technology, quantum computing, and cybersecurity. The discussions will also address global challenges related to supply chain management, sustainability, and talent development, with an emphasis on the role of European research and innovation in driving the growth of the semiconductor industry.

Programs in halls C1, C2 and Entrance West are complimentary for all SEMICON Europa and electronica visitors. For more details, please visit the SEMICON Europa 2024 website and connect with SEMI Europe on LinkedIn or X @SEMIEurope (#SEMICONEuropa).

SEMICON Europa 2024 

• Platinum: 
  Comet Yxlon, Edwards, INFICON, Invest in Pomerania, Koh Young Europe, Lam Research, Merck KGaA, Darmstadt, Germany, Schneider Electric, Siemens, Soitec, SUSS MicroTec and Tokyo Electron Europe (TEL)
• Gold: 
  Exyte, KLA and Synopsys
• Silver: 
  Adeia, EBARA, HCLTech, Honeywell, Kanken and Semilab
• Event:
  ASE Global, Atotech an MKS Brand, Catalonia Trade & Investment, CI Semi, Comet Group, DB Schenker, Entegris, EV Group (EVG), Flexciton, Fluor, IBM, imec, Lynceus, SCREEN, and Watlow 

About SEMI 

SEMI ^® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON ^® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contacts 

Maria Daniela Perez / SEMI Europe
Phone: +49 160 2562977 
Email:  [email protected] 

Samer Bahou / SEMI Corporate
Phone: +1 408 943 7870
Email: [email protected]

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Chip Integration Technology Center (CITC) today announced the appointment of Toni Versluijs as the new chairman of its Supervisory Board. Versluijs will serve as the incoming chairman from September through December. Effective January 1, 2025, he will take over the responsibilities from chairman Roel Fonville who is retiring.

Versluijs has an extensive background of more than 25 years in the semiconductor industry, of which more than 15 years in general and executive management roles. Prior to this appointment, he worked for NXP, where he led the In-Vehicle Networking product line and was NXP Nijmegen site director and statutory director of NXP Netherlands. Most recently, he led the Business Group MOS at Nexperia, served as statutory director for Nexperia in the UK and was part of the company’s global executive leadership team.

He explains his choice for CITC: “I look forward to using my many years of experience in the semiconductor industry to contribute to the success of CITC in Nijmegen. Nijmegen is a location with a long heritage in semiconductor packages that have changed the world. CITC is a unique venture and has a unique position between private parties, the academic world and knowledge institutes.”

CITC is a smaller and different kind of organization than his previous employers, but Versluijs sees the potential: “CITC has attracted quite some talent in recent years, built partnerships and initiated new developments. In short: it has laid the foundation for growth, and it will flourish in the coming years. I am convinced that it has the potential to change the world of semiconductor packaging again.”

The current chairman of the CITC Supervisory Board, Roel Fonville, adds: “The Supervisory Board is very pleased to welcome Toni Versluijs to our midst. His personality and broad experience in the industry and in the Nijmegen region will help the Board to fulfill its role in securing the continued development of the organization.”

About CITC
Chip Integration Technology Center (CITC) is a non-profit, joint innovation center specializing in heterogeneous integration and advanced chip packaging technology. CITC has created an effective ecosystem in which companies, research and educational institutes work on bridging the gap between academics and industry. CITC's contribution to the ecosystem is to provide access to innovation, infrastructure, and education. CITC was founded in 2019 with strategic partners TNO and Delft University of Technology and is supported by local and regional governments.
www.citc.org

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