MUNICH, Germany ─ August 19, 2024 ─ Themed Innovation and Collaboration: Powering Sustainable Exponential Growth, SEMICON Europa 2024 will gather industry experts November 12-15 at Messe München in Munich, Germany for insights into the latest innovations and trends in sustainability, mobility, healthcare, materials, packaging, fab management and workforce. Co-located with electronica, SEMICON Europa, Europe’s premier exhibition and conference for the microelectronics supply chain, will feature keynotes from the electronics design and manufacturing ecosystem, academia and governments. Registration is open. 

"Leaders from across the value chain at SEMICON Europa will discuss innovations and collaboration strategies that are driving semiconductor industry growth in Europe and globally," said Laith Altimime, president of SEMI Europe. "The industry remains committed to ensuring harmony between technological advancement and environmental progress. We look forward to hosting visionaries as they offer insights into achieving sustainable growth and overcoming the talent gap."

A key highlight of the event, the CxO Summit, will bring together visionary leaders from across the value chain to discuss how Europe’s microelectronics ecosystem can collaborate to uphold strategic leadership. The Summit will serve as a stage for fostering insightful partnerships on pressing and emerging challenges throughout SEMICON Europa. Executives from AMS Osram, Bosch, Comet Group, Inficon, Porsche, Schneider Electric, Siemens, STMicroelectronics, and other leading companies will share insights on the critical issues shaping the foundation for sustainable exponential growth in the European semiconductor industry.

SEMICON Europa 2024 will feature the launch of the III-V Compound Summit that will showcase the critical importance and emerging impact of III-V compound semiconductors in driving the future of electronics.

“Advancements in III-V compound semiconductor materials are crucial for the next generation of high-performance, energy-efficient devices, supporting the industry to overcome manufacturing complexities, boost efficiency and reduce costs,” said Ajit Manocha, SEMI President and CEO. “The III-V Compound Summit at SEMICON Europa will be an indispensable discussion in how these technologies will transform the electronics landscape, marking the beginning of a new era of technological progress.” 

Additional SEMICON Europa Highlights

• ITF Chip into the Future - Powered by imec: Industry leaders will examine how the EU Chips Act can advance Europe’s semiconductor industry through collaboration, innovation, and investment. Discussions will cover key drivers, best practices, and the future of chip research and manufacturing.
• Advanced Packaging Conference: Leading experts will discuss innovations in chiplets, heat dissipation, miniaturization, and other advanced packaging techniques essential for meeting the high-performance computing demands of modern AI applications.
• Fab Management Forum: Presenters will explore strategies to enhance semiconductor manufacturing efficiency and performance. Topics include global market strategies, smart manufacturing, innovations, environmental sustainability, supply chain resilience, and next-gen technologies.
• MEMS & Imaging Sensors Summit: Sessions will examine how advancements in MEMS and imaging technologies are enhancing connectivity and driving innovation across sectors such as agriculture, automotive, and healthcare, with a focus on the integration of AI/ML and data fusion in next-generation applications.
• SEMI Networking Night: Industry stakeholders will gather to connect with peers and explore new business partnerships.

Executive Forum Programs 

• Cultivating a Thriving SiC Market: This session will feature insights from industry leaders addressing the challenges and solutions in Silicon Carbide (SiC) power semiconductors, crucial for automotive and AI applications.
• Electrification and Power Semiconductors: Examining key innovations in power semiconductors driving global electrification, this session will cover focus areas including efficiency, cost-performance, manufacturing technologies, and the role of semiconductors in advancing sustainable energy and electric vehicles.
• Global Automotive Advisory Council Summit - Smart Mobility Forum: Addressing current challenges and opportunities in automotive semiconductor technology, this forum will bring together stakeholders and innovators to explore trends, such as autonomous, electric and software defined vehicle, towards a sustainable future in mobility.
• Innovation Showcase: Attendees will learn about innovations in the microelectronics and semiconductor space.
• Integrated Photonics: This session will explore how photonic integrated circuits (PICs) are transforming various industries by combining optical and electronic systems into compact, high performance, energy and cost-efficient designs.
• Meet the SEMIs: Session attendees will have opportunities to network with SEMI European Committee Members, exchange ideas, and discuss ways to advance the industry.
• Smart Manufacturing: This session will explore AI solutions for smarter semiconductor manufacturing operations, including data acquisition, digital twins, and autonomous production, with a focus on climate. 

TechARENA Programs 

• 20 Under 30 Recognition Program: The 2024 SEMI Europe 20 Under 30 will honor young leaders in the microelectronics supply chain for their career success, leadership, commitment, community involvement, and collaborative innovation.
• Advocacy and Geopolitics: Exploring the European Economic Security Strategy's impact on the semiconductor industry, this session will feature presenters discussing how new policies affect global supply chains and the need for international cooperation to ensure competitiveness and long-term growth.
• Breakthroughs in Medical Technology: This session will explore how advanced medical electronics and semiconductors are advancing digital healthcare for the future.
• Building the Talent Pipeline – SEMI Initiatives: Session attendees will discover how SEMI initiatives are fostering a robust talent pipeline for the semiconductor industry through university partnerships, STEM outreach, ongoing training, and diversity programs.
• End-to-End Cybersecurity: Experts will come together to explore comprehensive solutions for securing semiconductor supply chains, protecting intellectual property, and ensuring product integrity in a connected world.
• EU Digital Forum: Partners from HiCONNECTS and other R&D EU-funded projects will demonstrate how innovative heterogeneous integration (HI) core technologies address major societal and technical challenges.
• European Projects for a Diverse Talent Pipeline: Speakers will highlight European Commission funded projects under the EU Chips Act aimed at addressing the urgent talent gap in the semiconductor industry by enhancing STEM education, re-skilling and up-skilling, promoting diversity, and sharing best practices in recruitment and onboarding.
• Future Disruptions: Experts will share actionable insights and strategies on critical topics such as supply chain management, sustainability, ESG, PFAS regulations, and geopolitical impacts to navigate future disruptions in the semiconductor industry.
• Future of Computing: This session will examine how advancements in quantum computing, neuromorphic computing, and trusted electronics are addressing global challenges and transforming the future of information processing with innovative solutions.
• Future of Work: Industry leaders will discuss how inclusive leadership can address the global talent shortage, develop the next generation of industry leaders, and foster a diverse and sustainable workforce.
• Materials Innovation: This session will examine how innovations in materials are advancing Moore’s Law, supporting sustainable semiconductor manufacturing, and addressing global environmental challenges.
• SCREEN─ Innovation For a Sustainable World: Experts will present updates on new equipment platforms and solutions for Industry 4.0, 3D-Integration, and More-than-Moore devices, drawing from 25 years of collaboration with European partners.
• Tackling Investment in Semiconductors Start-Ups: This session will feature demonstrations on how European innovations are enabling future technology roadmaps and scaling up start-ups in the industry. 

For more details, please visit the SEMICON Europa 2024 website and connect with SEMI Europe on X or LinkedIn @SEMIEurope (#SEMICONEuropa).

Press and media partners can register for free by contacting Sitong He at [email protected].

SEMICON Europa Sponsors 

• Platinum: Comet Yxlon, Edwards, INFICON, Invest in Pomerania, Koh Young Europe, Lam Research, Merck KGaA, Darmstadt, Germany, Schneider Electric, Siemens, SUSS MicroTec and Tokyo Electron Europe (TEL)
• Gold: KLA and Synopsys
• Silver: Adeia, EBARA, Honeywell, Kanken and Semilab
• Event: ASE Global, Atotech an MKS Brand, Catalonia Trade & Investment, CI Semi, Comet Group, DB Schenker, Entegris, EVGroup(EVG), Flexciton, Fluor, IBM, imec, SCREEN, and Watlow 

About SEMI

SEMI ^® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON ^® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contacts

Maria Daniela Perez / SEMI Europe 
Phone: +49 160 2562977 
Email: [email protected]

Samer Bahou / SEMI Headquarters
Phone: +1 408 943 7870
Email: [email protected]

• Read more about SEMICON Europa 2024 to Spotlight Innovation and Collaboration Powering Sustainable Growth

Axiomise, a company noted for enabling formal verification adoption, today announced the formation of its Technical Advisory Board and its first two members, Dr. Vidya Chandran Darbari and Colin McKellar.

Dr. Darbari is an Axiomise co-founder and company director as well as Senior Lecturer in Structural Biology at Queen Mary University of London (QMUL). McKellar, formerly Vice President of Imagination Technologies, is currently Senior Director of Hardware at X-Silicon Inc.

“Vidya and Colin have long served as my unofficial advisers and confidants as I built Axiomise from the ground up,” remarks Dr. Ashish Darbari, founder and CEO of Axiomise. “Formalizing our relationships with Vidya and Colin will further strengthen the company and the expertise of our formal verification experts.”

“I have had the pleasure of watching Axiomise grow from early startup to a formidable verification provider and I couldn’t be prouder,” states Dr. Darbari. “I look forward to adding my voice as a member of the Technical Advisory Board.

My relationship with Ashish goes back to the early days of Imagination,” notes McKellar. “I watched with amazement and respect as he implemented a rigorous formal verification flow that caught bugs that would have forced costly respins and threats to the company’s good name and reputation.”

About Dr. Vidya Chandran Darbari
Dr Vidya Chandran Darbari, an Axiomise co-founder and company director, has a multi-disciplinary record combining medicine, life sciences, mathematics and technology. A leader and key contributor who leads from the front, Dr. Darbari helped steer Axiomise from its early stages to establishing it as a global leader in formal verification consulting and services, training and RISC-V solutions. She is a senior lecturer at the Queen Mary University of London with several impactful publications in high-end journals including Nature and Science. Dr Darbari received her Bachelor of Medicine, Bachelor of Surgery (MBBS) degree from Seth G.S. Medical College (KEM Hospital) in Mumbai, India, before completing her Master of Technology (MTech) degree from Indian Institute of Technology (IIT) Bombay. Dr. Darbari obtained her Doctorate degree from the University of Cambridge. She has been recognized for her innovative research through Biochemical Society Early Career Award, British Crystallographic Society Early Career prize and recently a Research Excellence Award by the Science and Engineering Faculty at QMUL.

About Colin McKellar
Colin McKellar brings the customer experience to the Axiomise team having been a key player in driving customer engagements in his previous roles with Apple, Intel, TI, SiFive and SEGA among others. He started his career in electronics 30 years ago in Sony Broadcast and Professional working on HD video encode and decode. Most of his career was spent working at Imagination Technologies as a key contributor to the graphics IP roadmap and was instrumental in bringing in and maturing a world-class verification infrastructure including simulation, formal verification and large FPGA, emulation and silicon farms. McKellar joined X-Silicon in 2023 with the responsibility to drive product and execution for bringing graphics and AI acceleration to the RISC-V ecosystem. He has a wealth of design and verification experience across GPU, CPU, AI and SoC chips successfully managing large multinational teams of more than 200 engineers.

About Axiomise
Axiomise is accelerating formal verification adoption through its unique combination of training, consulting, services and specialized verification solutions for RISC-V. Axiomise was founded by Dr. Ashish Darbari, FBCS, FIETE, DPhil (Oxford), who has been a formal verification practitioner for more than two decades with 60 patents in formal verification and over 70 publications.

Engage with Axiomise at:
Website: www.axiomise.com
Twitter: @axiomise
LinkedIn: https://www.linkedin.com/company/axiomise/
Facebook: https://www.facebook.com/axiomise

• Read more about Axiomise Names Two Executives to Newly Formed Technical Advisory Board

Sunnyvale, USA - Meylan, FRANCE – May 29, 2024 Numem - a leader in high-performance Memory IP Cores and Memory Chip/Chiplet based on its patented NuRAM (MRAM) and SmartMem technologies, and IC’ALPS - a leader in ASIC/SoC design and supply chain management, have pooled their expertise to meet the challenge of developing an ambitious integrated circuit with RISC-V processors, 2MBytes of NuRAM and a DSP/AI Custom Datapath Accelerator. The Custom SoC was developed in an advanced technology node.

This SoC has been designed and implemented to highlight the Numem high-performance, low power Memory subsystem with a RISC V Processor and AI Accelerator for ultra-low power applications. It has been developed through a close collaboration between Numem and IC’ALPS.

The physical implementation of this integrated circuit was made in a secure space (isolated location, network, and servers, encrypted exchanges, etc.) to meet with the stringent protection of sensitive data required by this program.

“We were very pleased with the collaboration and quality of service provided by IC’ALPS which made this on-time tape out possible and first time functional silicon,” said Jack Guedj, CEO of Numem. NuRAM with SmartMem is a high-performance memory subsystem which is 2-3x smaller and boast significant power reduction over SRAM,” he added.
 
Lucille Engels, COO of IC’ALPS indicated: “The challenges were numerous including: architecture, power domains, protection of the sensitive data, run times pushing improvement of EDA flow and the pressure of the tape out deadline.”

Numem and IC’Alps intend to extend their partnership to serve new customers SoC projects – feel free to contact us.

NUMEM/IC'ALPS with ultra-low-power SoC for Sensor and AI

About NUMEM
Numem, headquartered in Sunnyvale, California, is the leading provider of Memory Subsystem Chip/Chiplet and IP based on proven foundry MRAM process. Numem’s patented NuRAM technology enables best in class power/performance and reliability with 2.5x smaller area and 85x lower leakage power than traditional SRAM. Numem’s SmartMem subsystem technology significantly improves performance and endurance as well as ease-of-use and reliability for high-volume deployment and enables to reach ultra-high bandwidth.
Visit our website at https://www.numem.com or contact us at [email protected].

About IC’Alps
IC’Alps is your one-stop-shop ASIC partner. Based in France (HQ in Grenoble, two design centers in Grenoble and Toulouse), the company provides customers with a complete offering for Application Specific Integrated Circuits (ASIC) and Systems on Chip (SoC) development from circuit specification, mastering design in-house, up to the management of the entire production supply chain. Its areas of expertise include analogic, digital and mixed-signal circuits (sensor/MEMS interfaces, ultra-low power consumption, power management, high-resolution converters, high voltage, signal processing, ARM and RISC-V based multiprocessors architectures, hardware accelerators) on technologies from 0.18 µm down to 5 nm, and from multiple foundries (TSMC, Global Foundries, Tower Semiconductor, X-FAB, STMicroelectronics, etc.). The company is active worldwide in medical, industrial, automotive, IoT, IA, mil-aero and digital identity & security sectors. IC’Alps is ISO 9001:2015, ISO 13485:2016, EN 9100:2018 certified, Common Criteria on-demand, IATF16949-ready, member of TSMC Design Center Alliance (DCA), ARM Approved Design Partner and X-FAB’s partner network. More information on www.icalps.com and follow us on https://www.linkedin.com/company/ic-alps

• Read more about NUMEM & IC'ALPS Collaborate to Develop an ultra-low-power SOC for Sensor and AI applications