Micross to Acquire AEMtec, Significantly Expanding European Footprint in Advanced Packaging and Optoelectronics
Acquisition Broadens Micross' Advanced Packaging, Photonics and Test Capabilities and Expands Its Reach into the European Market
Melville, NY – July 28, 2026 – Micross Components, Inc. ("Micross" or the "Company"), a leading provider of high-reliability microelectronic product and service solutions for aerospace, defense, space, medical and industrial applications and a portfolio company of Behrman Capital, today announced that it has entered into a definitive agreement to acquire AEMtec GmbH ("AEMtec"). AEMtec is a leading provider of complex micro- and optoelectronic modules, advanced packaging, test and assembly services for high-reliability applications, headquartered in Berlin, Germany and a portfolio company of Capiton.
The acquisition significantly enhances Micross' presence in continental Europe and further broadens Micross' portfolio of high-reliability microelectronic services and products. AEMtec specializes in delivering end-to-end solutions across the entire packaging and integration value chain—from design, prototyping and industrialization through qualification, series production and lifecycle support. AEMtec's technology portfolio spans wafer back-end services and wafer testing, chip-on-board, flip chip, 3D integration and opto packaging, all performed in cleanroom facilities in Berlin and Dresden, Germany, and Boston, Massachusetts. Its deep expertise in miniaturization and high-precision assembly enables highly reliable solutions for the most demanding customer requirements.
Serving demanding customers across the semiconductor, medical and biotechnology, industrial automation, communications, and aerospace & defense sectors, AEMtec offers customized solutions for complex, mission-critical requirements. The company's reputation for engineering excellence and reliability has made it a trusted, single-source development and manufacturing partner to blue-chip customers bringing innovative, high-performance products to market. AEMtec's management team, led by CEO Robert Giertz, will join Micross as part of the transaction.
Micross' acquisition – the eleventh under Behrman Capital's ownership and seventh since consummating a continuation fund transaction in February of 2022 – continues to build on the strategic priorities for the Company, namely broadening Micross' advanced packaging, photonics and test capabilities. The acquisition also materially expands Micross' manufacturing and engineering footprint in Europe, positions the Company closer to leading European customers, and better positions the Company for future growth opportunities. The acquisition of AEMtec enhances Micross's ability to serve existing customers with advanced optoelectronic packaging capabilities, while expanding its European manufacturing footprint to further support the European defense industrial base.
Jim Cannon, CEO of Micross, said, "We are excited to welcome AEMtec to the Micross family, as their world-class expertise in advanced packaging, photonics and optoelectronics will augment our capabilities and accelerate our ability to deliver cutting-edge solutions to our customers. AEMtec establishes our first scaled foothold in continental Europe, augmenting our existing European facilities in the United Kingdom and Denmark, and positions Micross as a leading supplier of high-reliability microelectronic products and services. Together, we look forward to pursuing new business opportunities and expanding our reach in high-growth markets across Europe and beyond."
Robert Giertz, CEO of AEMtec, said, "We are delighted to join Micross and together capitalize on the significant growth capabilities of both AEMtec and Micross. Our broad technological expertise and end-market exposure strategically align with Micross' capabilities and provide our customers and employees a promising future."
Simon Lonergan, Managing Partner of Behrman Capital, said, "Micross' acquisition of AEMtec enhances the combined company's strategic position in the high-reliability microelectronics market. This acquisition underscores the Company's commitment to a truly global offering of high-reliability products and services, allowing us to access the high potential European market. We look forward to supporting Jim and the management to drive growth at Micross."
Financial terms of the transaction were not disclosed. Completion of the transaction is expected in the second half of 2026, subject to customary regulatory approvals. Harris Williams acted as exclusive financial advisor and Goodwin Procter LLP acted as legal counsel for Micross in connection with the transaction.
About Micross
Micross is a provider of advanced, high-reliability microelectronic products and services. With broad authorized access to die & wafer suppliers, an extensive portfolio of hi-rel power, RF, optoelectronics, memory, data bus, logic, and SMD/5962 qualified products, and comprehensive advanced packaging, assembly, modification, upscreening, and test capabilities, Micross is uniquely positioned to provide differentiated high-reliability solutions, from bare die, to fully packaged devices including hermetic ICs/MCMs, PEMs, ASICs, FPGAs, and PCBs, to complete program lifecycle sustainment. For more than 45 years, Micross has been a trusted source for the aerospace, defense, space, medical, energy, communications, and industrial markets. For more information about Micross, please visit www.micross.com and follow us on LinkedIn.
About Behrman Capital
Based in New York City, Behrman Capital was founded in 1991 by Grant G. and Darryl G. Behrman. The firm invests in management buyouts, leveraged buildups and recapitalizations of established growth businesses. The company's investments are focused in three industries: Defense & Aerospace, Healthcare, and Specialty Industrials. The firm has raised nine private equity funds with combined capital of $4.7 billion and is currently managing active partnerships capitalized at $1.6 billion cumulatively. For more information, please visit www.behrmancap.com.
About AEMtec
AEMtec GmbH is a leading European provider of engineering and electronic manufacturing services specializing in complex micro- and optoelectronic modules and systems. Founded in 2000, AEMtec offers a broad technology portfolio spanning wafer back-end services, chip-on-board, flip chip, 3D integration and opto packaging, serving blue-chip customers across the semiconductor, medical, industrial automation, communications, and aerospace and defense sectors. Headquartered at the Berlin-Adlershof science and technology hub, the company operates cleanroom facilities in Berlin and Dresden, Germany, and Boston, Massachusetts. www.aemtec.com
Contacts
For Micross
Thomas J. Dinges, CFA
Sr. VP of Finance
P: +1 (631) 542-5019
[email protected]
ROSENHEIM, Germany, 10 July 2026 — esmo group (esmo), a leading global full-service systems integrator, developer, and supplier of advanced automation solutions, is marking its 25th anniversary in 2026 from a position of continued growth, having completed three facility expansions across Germany, China and Taiwan within a six-month period. The investments strengthen the company’s engineering, manufacturing and customer support capabilities in key semiconductor markets worldwide.
Engineering Growth Through 25 Years of Customer Trust
Today, the esmo Group employs approximately 285 people and generates annual revenue of around EUR 60 million through its two business divisions: semiconductor test solutions and special-purpose machinery.
Founded in 2001, esmo has grown from a small engineering company delivering just three manipulators in its first year to a globally recognised specialist serving customers in more than 70 countries. The company today produces more than 2,000 manipulators annually and is the world’s leading supplier in the segment. Its customer base includes leading semiconductor manufacturers such as CCTec, ADVANTEST, Infineon, Bosch, STMicroelectronics and Intel, with many customer relationships spanning more than 15 years. Notably, esmo’s very first customer remains an active customer today.
“Reaching 25 years is a significant milestone, but what matters more to us is what it represents — a track record built on engineering discipline and long-term customer relationships,” expressed Mr Andreas Rothstein, CEO of esmo AG. “The expansions we are completing this year are a natural extension of that foundation, and a clear signal of where we are headed.”
Expanding Presence Across Strategic Semiconductor Markets
As part of its latest growth phase, esmo has expanded its global footprint through three facility investments.
In Rosenheim, Germany, the company has established a new building adjacent to its existing assembly hall. The facility houses administrative functions as well as engineering and software development teams from esmo semicon. Following the building’s soft opening in November 2025, the site also hosted esmo’s 25th anniversary open house in June 2026, welcoming nearly 1,000 visitors for a behind-the-scenes look at its production and engineering capabilities, including technologies supporting advanced semiconductor test applications such as AI and high-performance computing (HPC).
In Shanghai, China, esmo has opened a new production facility featuring dedicated manufacturing space and a cleanroom environment. Focused on automated test equipment (ATE) and prober solutions, the site enhances the company’s ability to deliver precision assembly, quality assurance and local support for customers in one of the world’s largest semiconductor markets.
Meanwhile, in Zhubei, Taiwan, esmo has joined a new shared office established through an initiative led by Accuron Industrial Technologies, esmo's parent group. The facility brings together several Accuron portfolio companies, including RECIF Technologies, mechatronic systemtechnik, Trymax Semiconductor Equipment and NexGen Wafer Systems, strengthening collaboration and creating new opportunities to support customers across the semiconductor value chain in a strategically important market.
Investing in the Future of Semiconductor Test
Looking ahead, esmo is focused on advancing semiconductor handling technologies to meet the increasingly demanding requirements of AI, high-performance computing and other next-generation applications. At the same time, the company continues to expand its global service capabilities, invest in automation and digitalisation, and develop more sustainable manufacturing processes while building the next generation of engineering talent.
“The semiconductor industry is evolving faster than ever, and our customers need partners who can keep pace,” said Rothstein. “We’ve built our success on engineering excellence, reliability, and the ability to solve complex challenges. As we look to the future, we will continue to invest in our people, our technology, and our global presence to ensure that esmo remains the partner of choice for the world’s leading chipmakers.”
Course Description
By the end of this course, participants will understand the scope of SubFAB and its critical role within the semiconductor manufacturing ecosystem, tracing its evolution and recognizing new trends. They will be able to identify and describe the core SubFAB systems and interpret typical facility layouts and equipment installation specifics. Learners will assess the environmental, and sustainability impacts of modern SubFABs. They will map a standard SubFAB organizational chart, typical roles, and responsibilities, and simulate incident-response workflows to reinforce operational readiness. Participants will be exposed to preventive maintenance and safety best practices to ensure reliability and compliance with regulations.
Who Should Attend
This course is designed for engineers and technicians in semiconductor manufacturing, equipment suppliers/OEM on-site service personnel, IE and MEP designers.
Course Outline
- Introduction & Course Logistics
- Welcome, introductions, and platform quick start
- Learning objectives and course flow
- Module 1: SubFAB Fundamentals
- Definition & scope of SubFAB
- Historical evolution (from early fabs to today)
- Core equipment & support systems overview
- Typical facility layouts and installation configurations
- Module 2: Environmental & Sustainability Considerations
- Key environmental impacts (emissions, water/chemical use)
- Gas abatement and PFAS management fundamentals
- Metrics & case studies in sustainable SubFAB operation
- Module 3: Organizational & Operational Structures
- SubFAB org charts and stakeholder roles
- Operational workflows (from tool install to maintenance)
- Incident-response and escalation paths (role-play)
- Module 4: Safety, Maintenance, & Reliability
- Preventine- maintenance best practices
- Safety protocols and hazard identification
- Reliability metrics and continuous improvement loops
- Module 5: Emerging Trends & Innovations
- Automation, digital twins, and Industry 4.0 in SubFAB
- Advanced materials handling and process integration
- Open discussion: Where SubFAB will go next
- Wrap-Up & Next Steps
- Final Q&A and feedback collection
- Certification requirements and further resources
- Suggested post-course readings and SEMI standard references
Instructor
Ilya Zabelinksy
Important Information
Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge.
Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in advance and an hour before with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.
United States
SEMI U StandardsSubFAB 101: Foundations of Semiconductor Support Facilities is a 4-hour course that covers SubFAB basics and its critical role within the semiconductor manufacturing ecosystem, including its evolution and new trends.
- San Francisco: 8:00 AM - 12:00 PM
- Jerusalem: 6:00 PM - 10:00 PM
- England: 4:00 PM - 8:00 PM
- Munich: 5:00 PM - 9:00 PM
Pricing
- Members: $349
- Non-Members: $399
* For group orders with 10+ attendees, and for Students/Veterans, discounted pricing, please contact [email protected].
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Brno, Czech Republic - July 10, 2026
Tescan, a pioneer in electron microscopy, announces the successful completion of its full acquisition by Shimadzu Corporation. As of July 7th, Tescan officially becomes a member of the Shimadzu Group, marking an important milestone in the company’s continued growth and evolution.
This step builds on the strong business alliance established in 2024 and reflects a shared commitment to advancing scientific discoveries and industrial innovations worldwide.
Strengthening the Value Delivered to Tescan Customers
“For Tescan customers, this new chapter brings enhanced capabilities, broader expertise, and expanded access to integrated solutions, while preserving the agility, innovation, and customer focus that define the Tescan way,” said Sirine Assaf, CRO, Tescan.
By combining Tescan’s leadership in surface analysis and electron microscopy technologies, including SEM, FIB-SEM, and TEM, with Shimadzu’s strengths in compositional and materials analysis, customers will benefit from:
More comprehensive solutions across research, development, and production workflows
Deeper application support through combined expertise in materials science, life sciences, and semiconductors
Accelerated innovation driven by joint R&D and shared technologies
Access to a larger global support network and enhanced service capabilities
Expanded product portfolio and future integrated offerings
Importantly, Tescan remains committed to maintaining its customer-centric approach, strong technical support and responsiveness, ensuring continuity in partnerships and daily operations.
Expanding Global Reach While Preserving the Tescan Way
Tescan’s growth will be further supported by Shimadzu’s global presence, particularly in Asia, alongside strengthened positions in Europe and the Americas. This will allow Tescan to:
Reach new markets and customers worldwide
Scale manufacturing and service capabilities
Enhance operational efficiency while maintaining flexibility
At the same time, Tescan will continue to operate from its headquarters in Brno, preserving its identity, expertise, and innovation culture.
Proven Track Record and Future Growth
Since its founding in 1991, Tescan has delivered over 4,000 electron microscopes across more than 80 countries, supporting customers in both research and industrial environments.
This acquisition reinforces Tescan’s long-term strategy to expand its technological leadership and deliver higher-value solutions, ensuring customers remain at the center of its development.
Continued Collaboration and Product Innovation
The successful collaboration between Tescan and Shimadzu has already been demonstrated through the joint “Shimadzu by Tescan” SEM product line introduced in Japan.
Building on this strong foundation, the integration marks a natural next step in deepening cooperation across technologies and markets. As part of this evolution, Tescan will adopt a new endorsed brand identity, “Tescan, A Shimadzu Company,” across its portfolio and communications. This reflects both the strength of the combined organizations and Tescan’s continued commitment to delivering innovative, customer-focused solutions under a globally recognized framework.
Forward-Looking Statement for Customers
This acquisition is in fully synergy with Tescan and Shimadzu strategic plans and it makrs an acceleration of what Tescan already does best: delivering high-performance systems, application-driven innovation, and close collaboration with customers.
About Tescan
Tescan develops and manufactures advanced electron microscopy solutions for materials science, life sciences, semiconductor research, industrial R&D, and quality control. With a focus on imaging performance, automation, usability, and long-term collaboration, Tescan helps researchers see the invisible and accelerate discovery through reliable, future-ready microscopy workflows.
Course Description
This course provides a comprehensive introduction to semiconductor manufacturing, guiding participants through the complete journey from silicon fundamentals to chip fabrication and packaging. Designed for professionals new to the semiconductor industry, the course explains key concepts, terminology, devices, and manufacturing processes used in modern fabs.
This course is divided into four modules, enabling a progressive learning experience that builds from fundamentals to manufacturing execution. Participants will gain a clear understanding of how chips are made, the role of transistors, and the steps involved in front-end manufacturing, followed by back-end assembly and packaging processes. The course also introduces the broader semiconductor ecosystem, including supply chain players, helping learners connect technical fundamentals with real-world manufacturing practices.
Who Should Attend
This course is designed for sales and marketing professionals, as well as new employees, students, and anyone interested in gaining a knowledge about semiconductor manufacturing.
Learning Objectives
Upon completion of the course, participants should be able to:
- Explain fundamental semiconductor concepts, including silicon materials, doping, PN junctions, and basic device behavior.
- Identify and correctly use common semiconductor manufacturing terminology.
- Outline the key steps involved in front-end wafer fabrication, from bare silicon to patterned wafers.
- Summarize back-end manufacturing processes, including assembly, packaging, and testing.
Topics Included
Module 1: Semiconductor Fundamentals
Introduces semiconductor basics, silicon materials, doping PN junctions, and core device concepts, building a foundation for understanding how electronic devices function.
Module 2: Semiconductor Terminologies and Manufacturing Context
Covers essential semiconductor terminology, cleanroom concepts, supply chain players, process nodes, and packaging to help learners navigate manufacturing discussions with confidence.
Module 3: Front-end and Back-end Semiconductor Manufacturing
Provides an overview of the key steps involved in front-end wafer fabrication and back-end assembly, packaging, and testing processes.
Module 4: Transistors and Their Operation
Explains different types of transistors and their working principles, showing how transistors function as switches and amplifiers inside integrated circuits.
Important Information
Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge.
Can't find the training link on the day of the training? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders 24 hours in advance and 1 hour before, with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.
Mayura Padmanabhan
Program Manager
SEMI
United States
SEMI UStrengthen your knowledge and skills by learning about the journey from silicon fundamentals to chip fabrication and packaging.
- London: 4:00 pm - 8:00 pm
- Munich: 5:00 pm - 9:00 pm
Pricing:
- Members: $199
- Non-Members: $249
Any questions, please contact [email protected]
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Brooks Instrument Launches Ultra-Compact, High-Performance Mass Flow Controller
HATFIELD, Pa. (USA), June 18, 2026 — Brooks Instrument, a world leader in precision fluid measurement and control technology, announced the global launch of its new ultra-compact AMF Series™ Advanced Mass Flow Controller. About the size of a standard Post-it® Note pad, it has the smallest footprint of any mass flow controller (MFC) in its performance class.
Combining precise gas flow control, fast response, industry-leading 1000:1 turndown capability and advanced diagnostics, the AMF Series offers equipment manufacturers and end users more operating flexibility and improved reliability and process control without the limitations of traditional compact MFCs.
“Equipment designers historically have had to choose between compact dimensions and advanced capabilities,” said Steve Kannengieszer, Global Marketing Director. “With the AMF Series, we’re changing that trade-off. Customers can now integrate high-performance flow control and predictive diagnostics into the most space-constrained systems without sacrificing accuracy, reliability or process insight.”
Advanced Features in a Compact Footprint
As equipment size across industries continues to shrink while growing in complexity and throughput, maintaining stable and precise gas flow becomes increasingly critical. The AMF Series was developed specifically to address these challenges.
With a 1-inch x 3-inch x 3-inch footprint, the MFC fits easily inside compact gas cabinets. Despite its small size, the highly accurate AMF Series features advanced capabilities, including integrated EtherNet/IP™ digital communications and onboard diagnostics for predictive maintenance.
By providing actionable diagnostic data alongside accurate flow measurement and control, the AMF Series helps users identify potential issues before they impact production, reducing unplanned downtime and improving overall equipment effectiveness.
Easier Operation and More Uptime
In addition, the AMF Series was designed to maximize uptime and simplify operation with a universal USB-C service port and embedded web-based interface that streamlines in-situ commissioning and troubleshooting. Industry-leading long-term sensor stability helps reduce maintenance requirements and eliminate periodic recipe adjustments and recalibrations.
The AMF Series also supports multi-gas configurability and simplified ordering bundles, helping OEMs reduce system complexity while streamlining product selection and integration.
Wide Range of Use
The AMF Series is especially suitable for pilot-scale applications where precise low-flow gas control and equipment miniaturization are critical, including:
• Bioprocessing and laboratory-scale bioreactors
• Thin film coating and vacuum deposition systems
• Carbon capture, utilization, and storage (CCUS)
• Hydrogen and energy transition technologies
• Analytical instrumentation
• University and research laboratories
• Industrial gas processing
Demand for Smaller Instrumentation
“Across biotechnology, we’re seeing a shift toward smaller-scale development platforms that demand greater flexibility and precision from process instrumentation,” said Joe Sipka, Business Development Director, Biotechnology. “The AMF Series was developed for micro-dosing and pilot-scale systems and delivers a wealth of digital insights—including health indicators, reliability metrics and pedigree—that enable greater automation and support a path to prescriptive maintenance. Many of these same trends are emerging in adjacent applications, such as industrial coatings, where engineers are being asked to do more with increasingly compact systems. Developed directly from conversations with our customers, the AMF Series delivers the precise low-flow control, wide operating range and reliability needed to accelerate innovation while maximizing valuable equipment space.”
For more information about the AMF Series Advanced Mass Flow Controller, visit www.BrooksInstrument.com/product/AMF.
About Brooks Instrument:
Since 1946, Brooks Instrument has been a leader in precision fluid measurement and control technology. Providing instrumentation for flow, pressure and vapor delivery, the company serves customers in semiconductor and high-tech manufacturing, laboratories and other processes and industries. With manufacturing, sales and service locations in the Americas, Europe and Asia, Brooks Instrument has the world’s largest installed base of mass flow controllers.
For more information, please visit www.BrooksInstrument.com. The company is also on LinkedIn (www.linkedin.com/company/Brooks-Instrument) and YouTube (www.youtube.com/user/Brooks407).
RENA Technologies GmbH, a long-standing and experienced manufacturer of wet processing solutions for the semiconductor, advanced packaging, and solar industries, has been awarded a multi-million Euro order by a leading European semiconductor manufacturer for a specialized cleaning application designed for advanced substrates.
The solution is based on a high-performance batch wet processing platform and has been specifically engineered to deliver ultra-clean and highly efficient processing of demanding substrates. By combining advanced process control with a scalable batch architecture, the system ensures outstanding process stability, repeatability, and optimized throughput.
The customer’s decision underscores the technological strength and competitiveness of RENA’s wet processing solutions. Particularly when handling complex substrate materials, the application provides significant advantages in quality assurance, process control, and overall production efficiency. The mature cleanroom capabilities, excellent process control, and high- volume automation solutions of RENA add up to the perfect fit for the customer’s needs.
With this order, RENA further strengthens its position in the European semiconductor market and reinforces its commitment to delivering innovative, locally supported solutions to key industry players.
“Our success in securing this project highlights the growing demand for advanced wet processing technologies in Europe,” said Peter Schneidewind, CEO of RENA Technologies GmbH. “With more than 80 glass treatment tools in production worldwide - including cutting etch TGV/advanced packaging applications - RENA´s sophisticated technological solutions prove again in this new application for specialized semiconductor substrates.”
Course Description
This course provides a comprehensive introduction to semiconductor manufacturing, guiding participants through the complete journey from silicon fundamentals to chip fabrication and packaging. Designed for professionals new to the semiconductor industry, the course explains key concepts, terminology, devices, and manufacturing processes used in modern fabs.
Who Should Attend
Anyone interested in understanding semiconductor manufacturing, including new employees, professionals in related industries, and those seeking to broaden their knowledge of the field.
Learning Objectives
Upon completion of the course, participants should be able to:
- Explain fundamental semiconductor concepts, including silicon materials, doping, PN junctions, and basic device behavior.
- Identify and correctly use common semiconductor manufacturing terminology.
- Outline the key steps involved in front-end wafer fabrication, from bare silicon to patterned wafers.
- Summarize back-end manufacturing processes, including assembly, packaging, and testing.
Topics Included
- Basic Electronics and Microelectronics
- Process Nodes
- Device Physics and Transistor Operation
- Crystal Growth and Wafer Preparation
- Advanced Transistor Technologies
- Circuit Design and Layout
- Wafer Processing
Important Information
Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge.
Can't find the training link on the day of the training? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders 24 hours in advance and 1 hour before, with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.
Kalya Shubhakar
Senior Lecturer
Singapore
- SEMI UStrengthen your knowledge and skills by learning about the journey from silicon fundamentals to chip fabrication and packaging.
Singapore: 3:00pm - 7:00pm
India: 12:30pm - 4:30pm
London: 8:00am - 12:00pm
Pricing
- Members: $399
- Non-Members: $449
* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]
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ESG progress, industry-first sustainability leadership and long-term governance goals
Rolla, Mo. — June 2, 2026 — Brewer Science, a global leader in developing and manufacturing next-generation materials and technologies for the semiconductor industry, today released its 2026 Impact Report, detailing continued progress across environmental stewardship, people-first initiatives, community engagement, and collaborative innovation. Additionally, the company announced it has earned GreenCircle Certified Zero Waste to Landfill certification for the eleventh consecutive year, remaining the first and only company in the semiconductor and microelectronics industry to achieve this designation.
Explore Brewer Science’s 2026 Impact Report
“The consistency matters,” said Matthew Beard, Executive Director of Strategic Planning, Management Systems, and Sustainability at Brewer Science. “Eleven consecutive years of Zero Waste to Landfill certification demonstrates our commitment to improving our processes, finding more innovative ways to reduce, reuse, and recycle our waste, thus leading to more sustainable business operations and having a positive impact on our supply chain.”
Environmental leadership rooted in verification and results
The 2026 Impact Report highlights continued momentum toward Brewer Science’s climate and waste-reduction goals, including:
• More than 631 tons of material diverted from landfills over the past decade
• 56% of generated waste reused or recycled during the most recent reporting period
• Over 75% of hazardous waste volume diverted annually to reuse applications
• 100% renewable energy consumption achieved annually
• 5% reduction in Scope 3 greenhouse gas emissions year over year
• Continued progress toward reducing Scope 1 and Scope 2 emissions by 80% by 2030 (from a 2018 baseline) and achieving net-zero carbon emissions by 2050
Brewer Science’s Zero Waste to Landfill certification verifies that 100% of waste leaving company facilities is diverted through approved methods such as reuse, recycling, composting, or source reduction. GreenCircle Certified’s program is widely regarded as one of the most rigorous third-party validations of waste diversion claims.
People, community, and industry impact
Beyond environmental performance, the Impact Report details how Brewer Science’s sustainability commitments extend to its workforce, communities, and industry partnerships:
• Named a Top Workplace in the Manufacturing Industry for the fifth consecutive year
• Employee-owners volunteered more than 3,200 hours to 129 organizations
• Supported STEM education, early childhood education, and workforce development initiatives across local and national communities
• Continued leadership as a founding member of the Semiconductor Climate Consortium, collaborating with peers to reduce emissions across the global semiconductor supply chain
• Ongoing innovation in PFAS free materials development, aligning product performance with environmental responsibility
A platform for collaboration and accountability
The 2026 Impact Report also highlights Brewer Science’s Sustainability Outreach Program, which provides tools and education for employees, customers, suppliers, and community partners to drive meaningful, scalable environmental action.
“Zero waste is not a finish line, it’s a responsibility we share,” Beard added. “We encourage our partners across the supply chain to align around verified sustainability standards and measurable impact.”
The full 2026 Impact Report is available on Brewer Science’s Going Green page at:
www.brewerscience.com/going-green
About Brewer Science
Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that enable cutting-edge technology. Since 1981, the company has expanded its technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to support microdevices and industrial monitoring solutions. Brewer Science’s relationship-focused approach ensures critical outcomes for its partners worldwide. Headquartered in Rolla, Missouri, Brewer Science operates globally. Learn more at www.brewerscience.com.
About GreenCircle Certified, LLC
GreenCircle Certified, LLC provides independent, third-party certification of environmental claims to ensure transparency and credibility in the marketplace. Since 2009, GreenCircle Certified has helped organizations validate sustainability performance through rigorous evaluation. Its certifications, including Zero Waste to Landfill, are accredited by the ANSI National Accreditation Board (ANAB). Learn more at www.greencirclecertified.com.
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