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Leverage SEMI U learning offerings to accelerate your professional development journey for 2026! Our pledge remains unwavering: providing comprehensive, technical education to equip you with the skills needed for a prosperous journey in the semiconductor sector.

Are you ready to take your semiconductor industry knowledge to the next level? We're thrilled to invite you to our upcoming webinar titled "Kick Start 2026 with SEMI U." This webinar promises to be an informative session where you'll gain insights into the latest updates and course offerings. 

During this webinar, you can expect to:  

  • Discover the latest updates and enhancements to SEMI U's on-demand course catalog.  
  • Upcoming virtual and in-person instructor-led trainings scheduled for the first half of the year.
  • Gain access to a special 10% discount on ALL on-demand courses.  

 

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Naresh Naik
Director, SEMI University
SEMI
SEMI U Workforce Development

Join us to discover our current course offerings, upcoming in-person and virtual trainings, and more. Engage in a Q&A session. Plus, by attending this free webinar, you'll receive a 10% discount code for all on-demand courses and will be entered into a raffle to win a FREE course bundle ($100 value).

8:00 am - 8:30 am Off Add to Calendar 2026-01-21 08:00:00 2026-01-21 08:30:00 Kick Start 2026 with SEMI U - Free Webinar (AM Session) Join us to discover our current course offerings, upcoming in-person and virtual trainings, and more. Engage in a Q&A session. Plus, by attending this free webinar, you'll receive a 10% discount code for all on-demand courses and will be entered into a raffle to win a FREE course bundle ($100 value). United States SEMI.org [email protected] America/Los_Angeles public Register Now
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Nijmegen, October 20, 2025 – Chip Integration Technology Center (CITC) will become part of TNO. This strategic move marks a significant step toward ensuring the long-term continuity and stability of CITC’s research and operations. The integration emphasizes TNO’s ambition to take a leading position in the innovation of chip packaging technologies and strengthen the regional semiconductor ecosystem in Nijmegen.

“In the coming years, TNO aims to play a key role in the development of advanced chip packaging in the Netherlands,” says Arnaud de Jong, director of High Tech Industry at TNO. “By integrating CITC into TNO, we can intensify and expand our research efforts. We also contribute to the further development of Lifeport in Nijmegen as a strong, future-proof semiconductor ecosystem.” With the investment in CITC, TNO connects chip technology activities between Nijmegen and other semiconductor hubs such as Eindhoven.

Advanced chip packaging
CITC was founded in 2019 by TNO and Delft University of Technology (TU Delft), among others, as an independent innovation center for advanced chip packaging technology. Within an ecosystem of companies, research institutions and educational organizations, CITC has developed into a broad R&D hub that collaborates on technological breakthroughs in advanced chip packaging.

“CITC’s integration into TNO marks a noteworthy moment for CITC. This step underscores our shared vision for the future of chip integration and packaging technology,” says Jeroen van den Brand, general manager of CITC in Nijmegen. “This provides room for growth, accelerates innovation, and strengthens CITC’s international position as a center of expertise for chip packaging.”

Strategic choice for Nijmegen
CITC’s integration into TNO will formally take effect on January 1, 2026. CITC will become part of TNO’s High Tech Industry business unit and will remain located at the Noviotech Campus in Nijmegen. Toni Versluijs, chairman of the CITC Supervisory Board: “CITC continues on its current course. For the Supervisory Board, it is essential that, with TNO’s ambition and investment, we secure continuation of the CITC activities, while building on the existing talent and technology and give CITC room to grow further.”

Lucas van Vliet, member of the CITC Supervisory Board on behalf of TU Delft: “The collaboration between TU Delft and TNO within CITC will change form as of January 1 but remains as strong as ever. TU Delft believes in the importance and growth potential of chip packaging and sees incorporating CITC into a strong organization like TNO as an opportunity to further accelerate innovation in chip technology.”

- ENDS -

About CITC
CITC is a non-profit, joint innovation center specializing in heterogeneous integration and advanced chip packaging technology. With the aim of bridging the gap between academia and industry, CITC has created an effective ecosystem where companies, research and educational institutions collaborate. CITC was founded in 2019 with strategic partners TNO and Delft University of Technology and is supported by the province of Gelderland and Nijmegen municipality. Located on Noviotech Campus Nijmegen, CITC is perfectly situated in the heart of the Dutch semiconductor industry.
www.citc.org

About TNO
TNO is the largest independent research and technology organization in the Netherlands and one of the largest in the EU. We innovate, investigate, and orchestrate, collaborating closely with governments, universities and the private sector. We inform government on policies and empower evidence-based decision-making through rigorous investigations, cutting-edge scientific insights, and reliable measurements. By building national and international consortia and ecosystems, we drive technological and methodological breakthroughs that help to realise a secure, sustainable, healthy, and digital society, and strengthen the earning power of the Dutch economy.
www.tno.nl/en/

Contact
Christian Ketelaars, Communications Manager
E [email protected]
M +31 (0)6 48 15 42 92

Breker Donates Advanced Test Suite Components to RISC-V International for Use in Future Compliance Activities

• Donation includes open-source system integrity tests for core and SoC certification
• Unique Breker tests complements existing test sets
• Breker’s RISC-V SystemVIP will be demonstrated at booth #P4 during RISC-V Summit North America 2025

SAN JOSE, CALIF. –– October 16, 2025––Breker Verification Systems today announced a donation to RISC-V International of a subset of its RISC-V advanced test suite developed through its work with more than 20 RISC-V core producers.

The donation is designed to be complementary to the existing Architectural Compliance Test (ACT) and ongoing ISA compliance activities, consisting of unique tests not available from other sources.

Breker provides test suites for the complete verification of RISC-V cores and SoCs from detailed microarchitectural analysis to advanced system integrity validation. The radonation will consist of a subset of these tests to target ISA compliance. The test donation will cover both core and SoC certification and will include, but is not limited to, coherency, hypervisor, vectors, advanced interrupt architecture, IOMMU and other scenarios. Each component is designed to complement existing tests.

“Breker is now working with over 20 commercial entities and other organizations to verify their RISC-V cores, providing us with unique experience of the myriad of unusual verification issues inherent in these processors,” says David Kelf, Breker’s CEO. “We are giving back to the RISC-V community by providing a subset of these tests, open source, that can target ISA compliance and for other purposes.”

The announcement of the donation coincides with the RISC-V Summit North America Tuesday, October 21, through Thursday, October 23, at the Santa Clara Convention Center in Santa Clara, Calif. As a Platinum Sponsor, Breker will exhibit in Booth #P4 and offer five presentations as part of the RISC-V Summit program.

“At RISC-V International, we greatly value the expertise of the Breker team and the contributions they have made to ongoing ISA compliance work,” remarks Andrea Gallo, RISC-V International’s CEO. “I am looking forward to Breker’s donation and the impact it can have in complementing and extending our existing ACT test suites.”

Breker’s donation provides alignment with RISC-V International programs. This will provide value to the company’s customers, as well as the RISC-V designer community, by aligning Breker’s full RISC-V verification test suite with RISC-V test developments.

In addition to existing test suites and generators, which are focused on random instruction generation for instruction set architecture testing, with SystemVIPs, Breker has been able to significantly extend testing to advanced system-level integrity. Using test suite synthesis technology, Breker is able to provide a high degree of coverage by driving cross functional stress verification and unpredictable corner case discovery. The donation will include tests generated using test suite synthesis.

David Kelf and Adnan Hamid, Breker’s Executive President and CTO, were elected Chairperson of the Requirements Working Group and Vice-Chairperson of the Test Plan Working Group, respectively, in the RISC-V International Certification Steering Committee.

Breker at RISC-V Summit North America 2025
Breker will demonstrate its RISC-V CoreAssurance and SoCReady SystemVIPs and Trek Test Suite Synthesis solutions at RISC-V Summit North America, Tuesday, October 21 through Thursday, October 23, at the Santa Clara Convention Center.

Presentations featuring Breker executives include:
Member Day: “Framework for RISCV Certification—Software, Hardware and Systems”
Nambi Ju, Lyle Technologies, LLP
Tuesday at 4 p.m. in Grand Ballroom H (Level 1)

Demo: “RISC-V AIA Expanding Interrupts: Applications, Implementation and Verification”
Adnan Hamid
Wednesday at 1 p.m.
Exhibit Hall A, Demo Theater

“RISC-V System Level Certification from Verification Foundations”
Adnan Hamid
Wednesday at 3:15 p.m.
Theater (Level 2)

Lightning Round: “Leveraging AI to understand the RISC-V ISA Specification”
Dave Kelf and Nambi Ju
Wednesday at 4:15 p.m.

“Unleashing ML Processing Power Through RISC-V Vectors: Applications, Implementation and Verification”
Brian Baker, Solutions Architect
Thursday at 2:35 p.m.
Grand Ballroom G (Level 1)

To arrange a demonstration or private meeting, send email to [email protected].

About Breker Verification Systems
Breker Verification Systems solves complex semiconductor challenges across the functional verification process from streamlining UVM-based testbench composition to execution for IP block verification, significantly enhancing SoC integration and firmware verification with automated solutions that provide test content portability and reuse. Breker’s solutions include a SystemVIP library of scenarios for RISC-V and Arm, core and SoC testing, coherency, security and other critical areas. Breker solutions easily layer into existing environments and operate across simulation, emulation, prototyping, and post-silicon execution platforms. Its Trek family is production-proven at leading semiconductor companies worldwide and enables design managers and verification engineers to realize measurable productivity gains, speed coverage closure and easy verification knowledge reuse. As a leader in the development of the Accellera Portable Stimulus Standard (PSS), privately held Breker has a reputation for dramatically reducing verification schedules in advanced development environments. Case studies that feature Analog Devices, Broadcom, IBM and other companies leveraging Breker’s solutions are available on the Breker website.

Engage with Breker at:
Website: www.brekersystems.com
Twitter: @BrekerSystems
LinkedIn: https://www.linkedin.com/company/breker-verification-systems/
Facebook: https://www.facebook.com/BrekerSystems/

TrekSoC, TrekSoC-Si, RISC-V CoreAssurance SystemVIP and RISC-V SoCReady SystemVIP are registered trademarks of Breker Verification Systems. Breker Verification Systems acknowledges trademarks or registered trademarks of other organizations for their respective products.

FOR IMMEDIATE RELEASE

Media contact: M. Guilbert, [email protected]

RECIF Technologies Adopts Agileo Automation’s Combined Speech Scenario and E84 PIO Box Solution to Test E84 and SECS/GEM SEMI Standard Compliance of Wafer Handling and Tracking Equipment

Global French manufacturer of automated handling equipment, wafer sorters, and equipment front-end modules (EFEMs) saves significant fab equipment integration time and enhances customer satisfaction

PHOENIX, October 7, 2025 – Agileo Automation, a leading provider of control and connectivity solutions for global semiconductor manufacturing equipment, today announced at Booth #877 at SEMICON West 2025 that RECIF Technologies has adopted its combined Speech Scenario and E84 PIO Box solution to test its wafer handling and tracking equipment for E84 and SECS/GEM compliance. The global company headquartered in Toulouse Blagnac, France, which specializes in the design, manufacturing, and installation of automated equipment for semiconductor wafer handling, needed a fast and effective solution to validate the compliance of its products with SEMI’s E84 and SECS/GEM standards before they are shipped and implemented at customers’ semiconductor manufacturing sites all over the world.

Speech Scenario is a software that emulates the fab host to validate SECS/GEM tool scenarios before shipping brand-new production equipment to fabs. The E84 PIO Box is a compact and lightweight device that serves as an interface between Speech Scenario and E84 passive equipment. Used together, these products allow RECIF Technologies to generate complete test reports that can be communicated to its customers, ensure fast detection of non-compliance and errors to avoid downtime, as well as quick and reliable SEMI E84 and SECS/GEM compliance testing, especially in the management of complex cases. The company has now better control over host-sorter interactions, with customizable scenarios related to automatic carrier delivery defined in the E84 standards. With Speech Scenario, RECIF teams can more effectively replicate customer use cases when resolving anomalies.

“We were using less flexible software where automation messages were not easily modifiable and old emulation technology for validation of only the PIO part of the E84 standard, which meant that more complex cases and host-sorter interactions had to be tested and adapted in the field during machine integration at customer sites,” explains Thomas Brillouet, research and development director for RECIF Technologies SAS. “We selected Agileo’s all-in-one Speech Scenario and E84 PIO Box solution because we believe that it is the most efficient and competitive product currently on the market. The flexibility and time savings we have garnered since using Agileo’s solution has translated into enhanced overall customer satisfaction for our company.”

“Over the past 40 years, RECIF Technologies has built a solid reputation as an innovative industry leader in advanced semiconductor equipment manufacturing and as an early adopter of SEMI standards,” adds Marc Engel, CEO of Agileo Automation. “Agileo Automation, whose origins are closely tied to RECIF Technologies, benefits from a strong cultural and technical proximity with the company. We are proud to contribute to RECIF Technologies’ success, both as a technology partner and by supporting them in demonstrating quality and reliability to their customers.”

- ends -

About Agileo Automation
Since its inception in 2010 in Poitiers, France, Agileo Automation has empowered global semiconductor equipment manufacturers to optimize their production machines with control, communication, data acquisition, and testing solutions, enabling their deployment in large-scale fabs worldwide. At the heart of Industry 4.0, Agileo’s A²ECF-SEMI framework provides a robust foundation for developing equipment controller software, leveraging the SEMI SECS/GEM and GEM300 standard suites. As a member of SEMI and the OPC Foundation, Agileo Automation is a key contributor to the development and integration of industry standards such as SEMI and OPC UA. For more information, please visit our web site or follow us on LinkedIn.

About RECIF Technologies
RECIF Technologies, headquartered in Toulouse-Blagnac, France, has been providing advanced robotic solutions for semiconductor wafer handling since 1985. The company designs and manufactures reliable sorters, EFEMs, and compact handling tools that help leading semiconductor manufacturers worldwide improve productivity, ensure reliability, and reduce total cost of ownership. As a member of SEMI and the Aeneas association, RECIF Technologies actively contributes to the industry standards and collaborative projects shaping the future of the semiconductor industry. For more information, please visit our web site or follow us on LinkedIn.

Germany https://www.semiconeuropa.org/ SEMICON Europa Tile Expositions
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Intel and Flexciton announce partnership to provide semiconductor manufacturers with a comprehensive Factory Automation and Optimisation Software Solution.

LONDON – September 25th, 2025 – Flexciton, a leader in autonomous planning and scheduling for semiconductor manufacturing, today announced a partnership with Intel. This collaboration will provide semiconductor manufacturers with a comprehensive, end-to-end set of software solutions to increase the level of automation and accelerate their transition to autonomous factory operations.

The partnership combines the power of  Intel® Automated Factory Solutions (Intel® AFS) software suite, including Intel® Operations Recon, and Intel® Factory Pathfinder, with Flexciton’s autonomous technology suite of Advanced Production Planning and Scheduling. The two companies will offer a synergic, holistic approach that provides complete visibility and control over complex semiconductor production workflows, enabling smart, autonomous decision-making and significant gains in key performance indicators.

"I am incredibly excited about this partnership. Intel® AFS solutions have been developed and tested within the most advanced fabs, and we see a great synergy with our cutting-edge planning and scheduling technologies," said Jamie, CEO & Cofounder, Flexciton. "With Intel® Factory Pathfinder and  Intel® Operation Recon combined with our Flex Planner and Scheduler suite, we will be able to provide an end-to-end optimisation solution that empowers our customers to unlock new levels of automation and significantly increase factory efficiency."

The partnership is designed to meet the growing demand for greater operational efficiency in the semiconductor industry. By leveraging high-speed simulations, AI, and advanced optimisation, the combined approach will enhance factory automation and deliver tangible benefits, including complete visibility of shopfloor operations, optimised planning and scheduling, and a significant uplift in factory key metrics such as throughput and cycle times.

Paul Schneider, Intel Principal Engineer, Director, said: "By combining our deep factory automation expertise with Flexciton's innovative scheduling solutions, we are providing manufacturers with the critical tools they need to enhance their operational efficiency and maintain a competitive edge.

—------------

About Flexciton: Flexciton partners with semiconductor manufacturers to power their transition towards autonomous factories. Our suite of intelligent planning and scheduling applications combines advanced optimisation techniques with the power of AI to orchestrate complex fab workflows and achieve critical revenue-to-shop-floor alignment. Flexciton’s Autonomous Technology transforms fab operations by eliminating manual and reactive decision-making processes. This dramatically improves factory throughput and cycle times, enhances labour efficiency, and optimises overall costs and resource utilisation. Trusted by industry leaders including Seagate Technology, Renesas, and Microchip, Flexciton drives the next phase of digitalisation and transformation to an autonomous factory. Headquartered in London, UK, Flexciton operates globally with dedicated teams located in Europe and the US.
www.flexciton.com 

About Intel Automated Factory Solutions: Intel® Automated Factory Solutions (Intel® AFS) is a comprehensive software suite that optimises industrial processes.  It utilises advanced technologies such as Digital Twins, predictive analytics, high-speed simulation, and AI to improve efficiency and reduce downtime in factory operations and other complex operational processes with many interdependencies.

Intel® Factory Pathfinder: A high-speed discrete event simulator and digital twin designed for factory prediction and optimisation. It can function independently or integrate with production systems to streamline product assignments and reduce order fulfilment times.

Intel® Operations Recon: Provides a graphical digital twin of factory production equipment and automated systems, boosting operational visibility and enabling real-time troubleshooting and material movement simulations.
www.intel.com/content/www/us/en/software/automated-factory-solutions.html

 

Via Automation Debuts Agentic AI-Based Platforms for Smart Manufacturing at SEMICON West

• Set to revolutionize semiconductor manufacturing operations, paving the way for self-healing factories and resilient supply chains
• Demos of Via Connect and Via Co-Pilot available during SEMICON West October 7 to October 9 in Booth #7438
• Via Automation “Developing Explainable Digital Twins and Connecting to Via CoPilot Agents for Autonomous Tool Operations” at Smart Manufacturing Theater

FREMONT, CALIF.––September 23, 2025––Via Automation today unveiled Via Connect and Via Co-Pilot, Agentic AI-based platforms that combine edge data integration with AI-driven human collaboration to revolutionize enterprise manufacturing operations and pave the way for self-healing factories and resilient supply chains.

Demonstrations of Via Connect and Via Co-Pilot will be available during SEMICON West October 7 to October 9 at the Phoenix Convention Center in Phoenix, Ariz.

“Predictive maintenance isn’t just about preventing breakdowns, it’s about enhancing yield and enabling smarter, safer and more efficient industrial operations,” remarks Nitin Parekh, CEO at Via Automation. “With Via Connect and Via Co-Pilot, enterprises can move beyond pilot projects into scalable, trusted and ROI-positive predictive maintenance programs.”

Introducing AI-Powered Industrial Automation
Unplanned equipment downtime cost manufacturers more than $1.5 trillion globally per year, a problem that grows more expensive annually. The cost of a single hour of downtime has surged by 50% in just two years.

Via Automation’s Via Connect and Via Co-Pilot powers real-time, AI-driven decisions across the factory floor, enhancing efficiency, optimizing operations, reducing unplanned downtime, elevating performance across all areas.

Via Connect
Traditional solutions rely on dashboards and complex visualizations that don't solve the root problem. Via Connect seamlessly offers data integration at the edge by acting as the digital fabric between assets, IoT sensors and enterprise systems. Via Connect can be connected into digital twin models to provide holistic monitoring capabilities as a software development kit (SDK) for equipment vendors to integrate with their equipment.

With its edge-ready processing capabilities, Via Connect can detect low-latency anomalies directly at the factory floor and integrates with manufacturing execution systems (MES), enterprise resource planning (ERP) systems and cloud platforms including AWS, Azure and Databricks using out-of-the box connectors.

For predictive maintenance, it ensures unified data collection of real-time vibration, temperature and process signals streamed from machines and IoT endpoints. Using Via Connect, predictive models can access clean, contextualized data without integration bottlenecks, one of the biggest hurdles in scaling predictive maintenance initiatives.

Via Co-Pilot
Where Connect enables data orchestration, Via Co-Pilot elevates operational intelligence, acting as a decision assistant to unite humans with AI tools for smarter decision making.

Via Co-Pilot turns predictive maintenance from a “black-box algorithm” into a trusted co-worker—accelerating adoption and building operator confidence by providing AI-Driven insights for warnings of equipment degradation using machine learning models trained on sensor data. Its diagnostics are easily explainable, interpretable and highlight root causes, such as bearing wear or lubrication breakdown. It enables collaborative workflows for engineers, operators and managers to interact with AI that delivers recommendations, validate insights and trigger automated work orders

It also offers continuous learning opportunities with its feedback loops that improve model accuracy over time and adapt to new operating conditions.

Via Automation can AI enable any equipment or fab with Via Connect and Via Co-pilot. An intuitive interface gives manufacturing teams the ability to build and deploy custom workflows without deep AI expertise and focus on keeping their equipment running smoothly and efficiently.

Early results show that Via Connect and Via Co-Pilot together reduce unplanned downtime by between 30-40% and maintenance costs by between 15-20%. They extend asset life by about 25% and improve operator safety and compliance reporting.

Via Automation at SEMICON West October 7-9 in Phoenix, Ariz.
Via Automation will exhibit and demonstrate its Connect and Co-Pilot at SEMICON West in Booth #7438 Tuesday, October 7, through Thursday, October 9, at the Phoenix Convention Center in Phoenix, Ariz.

Kiran Karunakaran, Via’s CTO, will present “Developing Explainable Digital Twins and Connecting to Co-Pilot Agents for Autonomous Tool Operations” Wednesday in the Smart Manufacturing Pavilion Theater.

To arrange a demonstration or private meeting, send email to [email protected].

About Via Automation
Via Automation is a pioneering technology company that specializes in creating advanced automation solutions designed to optimize and transform fab operations for advanced semiconductors. Leveraging cutting-edge AI and machine learning technologies, it develops intuitive, scalable and robust tools aimed at enhancing productivity, efficiency and data-driven decision-making. Via Automation’s commitment to innovation and customer-centric solutions make it a leader in the fab and equipment automation space, driving progress and operational excellence for improving operations and maintenance with AI.
Engage with Via Automation at:
Website: Getvia.ai/
Email: [email protected]
LinkedIn: https://www.linkedin.com/company/getvia/

For more information, contact:
Nanette Collins
Public Relations for Via Automation
[email protected]

Germany EDA_Tile Training
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Class Modules

Module 1 – EDA Standards Suite

  • Session 1 – Overview: Background, Motivation, Basics

    This session introduces the EDA standards at a high level, explaining the historical industry context that motivated the semiconductor factory automation community to define these standards, informed the initial set of functional requirements and performance expectations, provided the engineering and administrative resources to support this multi-year effort, and drove the implementation and validation processes to successful completion of the first version. 

    In summary, this session describes much of the “why” the EDA standards exist.

  • Session 2 – Deeper Dive: Specifications, Interaction, Performance

    This session shows how the standards in the EDA suite work together to meet the requirements described in Session 1, describing the overall system architecture and component technologies used. It then goes into depth for each of the major standards, which include SEMI E120 (Specification for the Common Equipment Model), SEMI E125 (Specification for Equipment Self Description), SEMI E132 (Specification for Equipment Client Authentication and Authorization), SEMI E134 (Specification for Data Collection Management), and SEMI E164 (Specification for EDA Common Metadata). 

    Since it is more instructive to “see” data collection in action rather than imagining it through specifications and animated PowerPoint, this session includes demonstrations of the standards using equipment simulators and reference client (host) software to bring the EDA standards to life. 

    In summary, this session describes most of the “what” for the EDA standards.

Module 2 – Best Practices for EDA Standards Implementation and Testing

  • Session 3 – Equipment Suppliers

    This session describes the implementation process an equipment supplier would use to provide an EDA interface on its equipment based on the requirements specified in the SEMI standards themselves and whatever additional information may be provided by their customer(s), the semiconductor manufacturers. Most of the best practices outlined in this session apply to EDA interface design and implementation whether or not the supplier chooses to build the interface in house or purchase and configure a third-party software package. 

    This session also covers the validation checklist defined and published by ISMI (International Sematech Manufacturing Initiative) in its “ISMI EDA Evaluation Method” and the use of standards validation software to automate most of this process.

    In summary, this session is a useful “how to” guide for equipment (and/or software) suppliers who want to implement the EDA standards.

  • Session 4 – Best Practices for EDA Standards Implementation and Testing

    This session can be thought of as the “mirror image” of Session 3 and focuses on what the factory automation and equipment integration staff in the chip factories must do to implement the “client” (host) side of the EDA standards. Simply put, the factories are the collectors and consumers of the equipment and process data that are produced by the equipment. And as before, the topics covered in this session apply equally for in-house software development and the purchase of third-party software.

    Since the EDA standards do not explicitly define many of the practical aspects of a communications interface (e.g., computing platform on which the interface runs, content of the equipment metadata model, performance requirements such as data granularity, sampling frequency, total data volume), this session also describes a process for crafting the EDA sections of an equipment purchase specification; these additional requirements form the data collection “contract” between the equipment supplier and its customer so rather than leaving this important topic to chance.

    In summary, this session is a useful “how  to” guide for factories that want to make the most of the EDA interfaces on their purchased equipment.

Module 3 – Example Use Cases and Customer Benefits

  • Session 5 – Equipment-focused Applications

    This session addresses the “How do these standards benefit your company?” question that may be posed to equipment suppliers who have chosen to implement the EDA standards. In fact, there are a number of applications that equipment suppliers can implement and sell that offer added value to their customers. 

    Examples include equipment/process characterization utilities, throughput monitoring, component and subsystem fingerprinting, AI/ML (artificial intelligence/machine learning) model development support, remote diagnostic support, among others. This session will explain how some of these applications can leverage the capabilities of the EDA standards without negatively impacting the factory customers’ equipment integration environment. 

  • Session 6 – Factory-focused Applications

    This session answers the “Now what?” question that was actually posed to one of our standards promotion team when presenting the EDA standards at a standards technology seminar. At the time, he was focused on the detailed content and implementation process for the standards and didn’t have a satisfactory answer for why a factory would want to use these new (at the time) standards. 

    Such an excellent question deserved an equally excellent answer, so we spent the next 6 months meeting with the early adopters of the EDA standards to see what applications made particularly effective use of the EDA capabilities beyond what they had accomplished to date with the GEM/GEM300 standards. The applications outlines in this session are the result of those meetings and subsequent discussions.

Module 4 – Current Standardization Activities and Evolution

  • Session 7 – Freeze 3 Technologies and Outlook

    This session covers the Freeze 3 release of the EDA standards suite, focusing especially on the recent technologies (e.g., gRPC, protocol buffers) that are being incorporated to improve data collection performance. It also compares Freeze 3 with the Freeze 2 version so people familiar with the current suite know what to expect. Finally, it will reference other standards that will impact the content of the SEMI E120/E125 equipment metadata model; examples include the GEM300 standards updates which now contain a set of “Well-Known Names” for common parameters and event, and SEMI E190/E190.1 (Equipment Data Publication) which go beyond E164 to list process-specific parameters that should appear in the EDA interface. 

    In summary, this session answers the question “What’s next?” for the EDA standards.

  • Session 8 – Support for AI/ML-based Initiatives

    This session describes some of the unique and challenging characteristics of AI/ML-based systems that the EDA standards were (in hindsight) designed to support. This not only includes collecting massive amounts of detailed equipment and process data to feed these algorithms but also managing the available context information necessary for correct training and tuning machine learning models and selecting the appropriate model for a given production situation. Finally, this session will highlight a number of promising AI/ML use cases that have already been implemented.

    In summary, this session answers the question “How can I leverage the EDA standards to support the wave of AI/ML implementations currently and/or soon to be underway?”

 

Instructor

Alan Weber

Instructor Bio

 

Mihai Bodea

Instructor Bio

 

Sreeraj

Instructor Bio

SEMICON Europa
Munich
Germany

Standards

The EDA Standards course is an all-day workshop aiming to provide a comprehensive understanding of the standards used in semiconductor factory automation. Beginning with an overview of EDA, the course will focus on best practices for implementing and testing EDA interfaces from both an equipment supplier and factory perspective. You will learn how EDA interfaces can benefit your company’s existing processes through multiple real-world use cases.

Pricing

  • Members: $695
  • Non-members: $795
  • Students: $595

* Coffee, refreshments, and lunch will be provided for all attendees.

* During this course, we will be covering the basics of SEMI E120 (Specification for the Common Equipment Model), SEMI E125 (Specification for Equipment Self Description), SEMI E132 (Specification for Equipment Client Authentication and Authorization), SEMI E134 (Specification for Data Collection Management), and SEMI E164 (Specification for EDA Common Metadata). These Standards are recommended, but not required for this course.

Who Should Attend

  • Automation staff at semiconductor manufacturing equipment suppliers and semiconductor factories

  • Manufacturing application software suppliers

  • Automation consultants 

  • Manufacturing data scientists

Prerequisites

  • Familiarity with basic factory automation terminology
  • Familiarity with basic communication protocol terminology
  • Familiarity with common semiconductor manufacturing artifacts
9:00 am - 6:00 pm Off Add to Calendar 2025-11-20 09:00:00 2025-11-20 18:00:00 Everything You Need to Know about the SEMI Equipment Data Acquisition (EDA) Standards Suite The EDA Standards course is an all-day workshop aiming to provide a comprehensive understanding of the standards used in semiconductor factory automation. Beginning with an overview of EDA, the course will focus on best practices for implementing and testing EDA interfaces from both an equipment supplier and factory perspective. You will learn how EDA interfaces can benefit your company’s existing processes through multiple real-world use cases.PricingMembers: $695Non-members: $795Students: $595* Coffee, refreshments, and lunch will be provided for all attendees.* During this course, we will be covering the basics of SEMI E120 (Specification for the Common Equipment Model), SEMI E125 (Specification for Equipment Self Description), SEMI E132 (Specification for Equipment Client Authentication and Authorization), SEMI E134 (Specification for Data Collection Management), and SEMI E164 (Specification for EDA Common Metadata). These Standards are recommended, but not required for this course.Who Should AttendAutomation staff at semiconductor manufacturing equipment suppliers and semiconductor factoriesManufacturing application software suppliersAutomation consultants Manufacturing data scientistsPrerequisitesFamiliarity with basic factory automation terminologyFamiliarity with basic communication protocol terminologyFamiliarity with common semiconductor manufacturing artifacts SEMICON Europa Munich Germany SEMI.org [email protected] Europe/Berlin public Europe/Berlin Register Now
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San Diego, CA[Date] ElevATE Semiconductor, a leading provider of advanced pin electronics (PE) and device power supply (DPS/PMU/VI) IC solutions for the semiconductor test market, proudly announces the appointment of Heather Kirkby as Chairwoman of its Board of Directors.  

Heather Kirkby, who has served on ElevATE’s board since 2024, brings more than 25 years of leadership experience across technology, life sciences, and semiconductor industries. Most recently, she was the Chief People Officer at Recursion Pharmaceuticals, where she helped scale the company through IPO and global growth. Prior to Recursion, Ms. Kirkby spent over 15 years at Intuit, where she held senior leadership roles in product management, marketing, and talent development, driving innovation and organizational transformation. She has also held leadership positions at Siebel (acquired by Oracle) and Schlumberger in her early career. 

Ms. Kirkby’s leadership has earned industry recognition, including Intuit’s CEO Leadership Award in 2017 and being named a finalist for the Women Tech Council Leadership Award in 2020. She also earned her MBA from Harvard Business School.   

“I am honored to step into the role of Chairwoman at ElevATE,” said Heather Kirkby. “Having served on the Board over the past year, I’ve seen firsthand the company’s commitment to innovation and excellence in the semiconductor test market. I look forward to working with the leadership team to continue building on this momentum and driving ElevATE’s long-term growth.” 

Ms. Kirkby succeeds Chris Puscasiu, Managing Partner of Presidio Investors, who helped guide ElevATE through a period of rapid growth and innovation.  

“It has been a privilege to serve as Chairman of ElevATE since 2018," said Chris Puscasiu. "After guiding the company’s growth for the past six years, I am ready to give the reins to Heather. She has already made a meaningful impact on the Board, and I am confident her leadership will further strengthen ElevATE’s position in the semiconductor test market.” 

Since its founding in 2012, ElevATE Semiconductor has established itself as a leader in innovation in the Test and ATE markets. The appointment of Heather Kirkby as the new Chairwoman marks a crucial step in the company’s evolution, reflecting its dedication to scaling its impact and shaping the future of semiconductor testing. 

SEMI Members:  $75

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $149

Students:  Free

Contact Basak Ulutas Ozturkler ([email protected]) with a picture of your student ID to receive your discount code.

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A digital twin is a computer representation of the structure, context, and behavior of physical systems, which are critical components in the optimization of computational systems, accurately representing physical systems and processes. A Digital Twin can be used to reduce or eliminate iterative physical experiments needed for optimization, thereby enhancing yield, saving time, and resources. Semiconductor manufacturing involves numerous complex steps, where accurate control of each step is crucial to achieving the overall manufacturing yield and minimizing variations in device characteristics. The complexity of the manufacturing processes' flows limits flexibility for testing novel approaches. Unit processes can be based on first-principal models (physics-based), data-based models, or hybrid models combining both approaches when possible. Fabrication processes in the cleanroom and on printed electronics tools are often a function of time-varying parameters, including those of the equipment, environment, and materials. The parameters often have co-dependencies across different process steps and tool sets. 

This course will cover the necessary material to create DNN-based Digital twins for nanofabrication processes in cleanrooms. The course will include experimental details for data preparation, data processing, training models, and use case demonstrations. Nanofabrication process equipment can inherently have millions of internal variables and can learn from datasets, providing a robust and complementary approach to traditional feedback control and process stabilization methods. The included Digital Twin modes are developed using images (CD-SEMs, optical images), time history data (Optical Emission Spectroscopy), and textual process information (recipes and materials). The course will include: (1) Approaches to preprocess image data and create learning-based models, (2) using DNN-based domain translation for learning to predict the DUV nanolithography and ICP Plasma Etch, (3) virtual metrology methods for quantification of learning outcomes, and (4) developing a new class of process-aware DNN-based digital twins. 

ABOUT THE SPEAKERS

Benyamin Davaji, PhD
Benyamin Davaji is an Assistant Professor in the Electrical and Computer Engineering Department at Northeastern University. His research focuses on integrated microsystems with an emphasis on sensing and computation using mechanical waves, acoustic/ultrasound transducers, bio-interfaces, and microcalorimetry. He also applies data-guided methods to nanofabrication process development and semiconductor manufacturing. Dr. Davaji earned his PhD in Electrical and Computer Engineering from Marquette University in 2016 and later served as a post-doctoral associate at Cornell University’s School of Electrical and Computer Engineering.

Peter Doerschuk, PhD

Peter Doerschuk, Professor at Cornell University since 2006, previously served on the Purdue faculty in Electrical and Computer Engineering and Biomedical Engineering. He earned B.S., M.S., and Ph.D. degrees in Electrical Engineering from MIT, an M.D. from Harvard Medical School, and completed training at Brigham and Women’s Hospital and a postdoc at MIT. His research applies computational nonlinear stochastic systems to biology and medicine, spanning viral 3-D structure determination using electron microscopy and x-ray scattering, to nonlinear models of ethanol pharmacokinetics that enable sensor processing, pattern recognition, and individualized physiological analysis.

United States

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Ben Davaji, PhD
Assistant Professor
Northeastern University
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Peter Doerschuk, PhD
Professor
Cornell Engineering
Gity Samadi
Moderator
Gity Samadi, PhD
Sr. Director, R&D Programs
SEMI
NBMC Smart MedTech FlexTech

Join us for this engaging Master Class with Benyamin Davaji, PhD, Assistant Professor of Electrical and Computer Engineering at Northeastern University and Peter Doerschuk, Professor of Electrical and Computer Engineering and Biomedical Engineering at Cornell University, as they explore the role of digital twin models in advancing semiconductor manufacturing. The masterclass will highlight how data-guided methods and computational modeling are transforming unit process development, driving efficiency and innovation across the semiconductor industry. With expertise spanning microsystems, acoustic transducers, and nanofabrication, the speakers will provide insights into how digital twins can bridge research and production to accelerate breakthroughs in semiconductor technology.

10:00 am - 12:00 pm Off Add to Calendar 2025-11-05 10:00:00 2025-11-05 12:00:00 FEMC#27 Digital Twin Models for Semiconductor Manufacturing Unit Process Join us for this engaging Master Class with Benyamin Davaji, PhD, Assistant Professor of Electrical and Computer Engineering at Northeastern University and Peter Doerschuk, Professor of Electrical and Computer Engineering and Biomedical Engineering at Cornell University, as they explore the role of digital twin models in advancing semiconductor manufacturing. The masterclass will highlight how data-guided methods and computational modeling are transforming unit process development, driving efficiency and innovation across the semiconductor industry. With expertise spanning microsystems, acoustic transducers, and nanofabrication, the speakers will provide insights into how digital twins can bridge research and production to accelerate breakthroughs in semiconductor technology. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Watch On-Demand
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