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Brewer Science Earns 2026 USA TODAY Top Workplaces Award
Employee-Owner Feedback Recognizes Company’s People-First Culture

Rolla, MO – April 14, 2026 – Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries, has been named a 2026 USA TODAY Top Workplace. The recognition underscores Brewer Science’s long-standing commitment to fostering a people-first culture.

The USA TODAY Top Workplaces award honors organizations with 150 or more employees that have created exceptional workplace cultures centered on trust, engagement, and employee well-being. This year, more than 42,000 organizations were invited to participate. Award recipients are recognized for building environments that prioritize employee listening and meaningful engagement. USA TODAY showcased the winners online and at the National Awards Summit in Las Vegas.

Winners are determined solely by authentic employee feedback collected through a confidential survey administered by Energage, the HR research and technology company behind the Top Workplaces program since 2006. Results are based on employee responses to Workplace Experience Themes, which research shows are strong indicators of organizational health and performance.

“Earning a USA TODAY Top Workplaces award is a testament to an organization’s credibility and commitment to a people-first culture,” said Eric Rubino, CEO of Energage. “This award, driven by real employee feedback, is more than just a recognition — it’s proof that your employees believe in the organization and its leadership. Job seekers and customers look for this trusted badge of credibility and excellence. It signals a company that values its people, and that kind of culture resonates in today’s competitive market.”

In addition to the national USA TODAY recognition, Brewer Science continues to receive strong regional and industry-specific honors. In 2025, the company was named a Top Workplace in Greater St. Louis for the ninth consecutive year and earned recognition as a 2025 National Top Workplace in the Manufacturing Industry. These sustained accolades reflect a culture intentionally designed to provide employee-owners with a fulfilling and purpose-driven work experience that fuels innovation across the microelectronics industry.

“Delivering customized solutions to customers’ complex challenges requires a strong sense of clarity and commitment across the company,” said Dan Brewer, co-CEO of Brewer Science. “That commitment is rooted in our value to create an environment where employees are empowered to think creatively, collaborate openly, and innovate boldly. Our employee-owners take pride in the products they bring to our customers, partners, and the industry as a whole.”

Learn more about Brewer Science’s culture and explore career opportunities at:
https://www.brewerscience.com/about-us/company/careers/

ABOUT BREWER SCIENCE
Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique quality monitoring systems for water and air applications. We are Certified Employee-Owned and a Certified B Corporation™, using our business as a force for good. Our headquarters are in Rolla, Missouri, with customer support throughout the world. Learn more at: www.brewerscience.com.

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Company Contact:
Nathan Ayres
Email: [email protected]

ABOUT ENERGAGE
Energage is a purpose-driven company that helps organizations turn employee feedback into useful business intelligence and credible employer recognition through Top Workplaces. Built on 20 years of culture research and the results from 30 million employees surveyed across more than 80,000 organizations, Energage delivers the most accurate competitive benchmark available. With access to a unique combination of patented analytic tools and expert guidance, Energage customers lead the competition with an engaged workforce and an opportunity to gain recognition for their people-first approach to culture. For more information or to nominate your organization, visit energage.com or topworkplaces.com.

Kuala Lumpur, Malaysia, 29 April 2026 – DAS Environmental Experts presents its latest sustainable technologies at SEMICON SEA 2026 (May 5–7, MITEC, Booth 1174). The focus is on closing resource loops in semiconductor manufacturing through integrated waste gas and water treatment.

Integrated environmental technologies for next-generation fabs

DAS Environmental Experts demonstrates how point-of-use waste gas treatment can be seamlessly combined with advanced water recycling to create an integrated solution. This approach reduces both resource consumption and emissions, actively supporting closed-loop concepts for water and materials.

By strategically linking waste gas and wastewater management, the company enables measurable efficiency and sustainability gains directly at the source. DAS Environmental Experts provides a comprehensive range of point-of-use (POU) and end-of-pipe solutions, all tailored to specific customer requirements. This holistic strategy reflects the growing industry imperative for integrated waste and water management in modern semiconductor fabs.

Reliable waste gas treatment: LARCH PLUS DUO

The LARCH PLUS DUO is engineered for maximum operational reliability. This burn-dry system is specifically designed to treat waste gases from MOCVD processes for LEDs, μLEDs and GaN, as well as from EUV processes, directly at the point of use.

It combines two fully independent units running in parallel. Intelligent piping and internal data exchange provide full redundancy and ensure continuous operation, even during maintenance or in the event of a malfunction on one side.

The system operates without fresh water, generates no wastewater, and minimizes environmental impact with zero CO₂ emissions and low NOx emissions.

Resource Recovery & Water Recycling

The company also highlights solutions for material recovery and water reuse. By treating wastewater from grinding and abatement processes, valuable materials like gallium, germanium, and copper are recovered. The modular design allows easy integration into existing fabs and supports retrofit applications, helping operators improve environmental performance while reducing dependency on primary raw materials.

Expert presentation

As part of the conference program, Falk Allmrodt (Key Account Manager) will present "Raising CF₄ Abatement Efficiency Standards in Semiconductor Manufacturing: Beyond Industry Benchmarks" on Thursday, May 7, at 14:55 hrs (Novel 1, Level 1A).

The team welcomes visitors at Booth 1174 to discuss innovative paths to sustainable manufacturing.

About DAS Environmental Experts
DAS Environmental Experts (DAS EE) is a leading international provider of comprehensive environmental technology solutions in the fields of waste gas and water treatment. Founded in Dresden, Germany, in 1991, the company supports industrial enterprises worldwide in safely treating emissions, using resources efficiently and reliably complying with environmental standards.

With 950+ employees and locations in nine countries, the DAS Group combines global expertise with local presence. These solutions, developed and manufactured in Germany, stand for the highest quality and technological innovation.

As one of the top three companies in waste gas treatment, DAS EE offers the semiconductor industry unique, integrated solutions combining waste gas and wastewater treatment.

The company’s portfolio encompasses plants, system solutions and services across the entire process chain—from planning and implementation through to operation. Enhanced by digital solutions, the technologies ensure maximum efficiency and reliable operations.

Its customers include companies from the semiconductor, LED, solar, chemical, pharmaceutical, cosmetics and food industries. The range of services is complemented by Innovation and Support Centers (ISC) in Dresden, Taiwan and the USA.

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Belgium France Germany Ireland Italy United States Adv_Packaging Training Featured Speakers

Course Description 

This course will stress the impace of the IC and End product requirements, i.e., smaller, better, cheaper" and their influence on the manufacturing processes. Topics include area packaging - ball grid arrays, flip chip, fanout, attaching dies and chip scale packages, and the assembly technologies - chip & wire, tape automated bonding, and flip chip, as well as emerging technologies, namely, 3-D and stacked die, and packaging reliability issues.

Who Should Attend

This course is intended for both manufacturing and R&D know-how in IC packaging professionals, including but not limited to:

  • Engineers
  • Managers
  • Process Engineers
  • R&D Engineers
  • Sales and Application Engineers who supply packaging materials and tools

Learning Objectives

  • Identify the wide variety of package types and how they align with different application uses.
  • Understand chip interconnection technologies (such as wirebond, flip chip, or thin film) and chip encapsulation
  • Identify the materials and processes used in packaging.
  • Summarize the current state of the art packages, such as chiplets and heterogeneous packaging.
  • Gain a foundational understanding of what packaging is and its importance to the microelectronics industry. 

 

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge. 

Can't find the training link on the day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in advance and an hour before with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

United States

Dr. Terry Alford
Dr. Terry Alford
PT International
- SEMI U

Strengthen your knowledge and skills by learning about IC packaging, assembly, and package/substrate and Heterogeneous Integration & Chiplets. 

Pricing

             Early Bird Pricing $100 off

  • Members: $845   $745
  • Non-Members: $945  $845

* * Group pricing for 20+ attendees: $9900
Any questions, please contact [email protected]

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Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $149

Students:  Free

Contact Basak Ulutas Ozturkler ([email protected]) with a picture of your student ID to receive your discount code.

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Belgium Germany Singapore Taiwan United States FEMC31 Business Executive Technical
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This comprehensive course will cover the underlying fundamentals, the interrelationship between materials and processes, and the hardware used in printed electronics.  The masterclass will also explore how printed electronics can be applied currently in example applications including practical aspects of the technology, its highlights and challenges and scalability.  We will also explore emerging new technologies at the cutting edge of FHE, semiconductor packaging, photonics and quantum materials.  Throughout the course there will be opportunities for Q/A and discussions and case studies based on participant's interest.

ABOUT THE SPEAKER

J. Devin MacKenzie, PhD
Dr. Devin MacKenzie is the Washington Research Foundation Professor and an Assoc. Prof. of Materials Science and Engineering and Mechanical Engineering at UW. He is also the Technical Director of the Washington Clean Energy Testbeds, a lab that provides open-access to world-class advanced manufacturing and characterization tools for printed optoelectronics, sensors and energy device research and scale-up. Devin also has 25 years of entrepreneurial experience in sustainable materials and manufacturing of semiconductors, optoelectronics and energy devices. Prior to UW he was CEO and co-founder of printed battery company, Imprint Energy (acquired CCL/Avery), Previously, as the CTO of Add-Vision, Inc. (acquired Sumitomo Chemical), Dr. MacKenzie led R&D for roll-to-roll printed flexible OLEDs at Add-Vision with licensing in Europe and Asia. Prior to Add-Vision, he led printed silicon RF device and product engineering at Kovio, Inc. a Si Valley MIT spin-out (acquired Thin Film Electronics). Dr. MacKenzie also co-founded, Plastic Logic, from Cambridge University as a postdoc and subsequently a visiting scientist in Physics at the Cavendish Laboratory. Prior to that he worked at Bell Labs and NASA. Dr. MacKenzie has authored over 240 publications and patents that have been licensed globally and has been cited over 12,900 times in fields ranging from rare earth-doped nitrides to quantum materials. He holds Ph.D, MS, and undergraduate degrees in Materials Science and Engineering from the University of Florida and the Massachusetts Institute of Technology.

United States

J. Devin MacKenzie
J. Devin MacKenzie, PhD
Washington Research Foundation Professor of Clean Energy, Associate Professor
University of Washington
Gity Samadi
Moderator
Gity Samadi, PhD
Sr. Director, R&D Programs
SEMI
NBMC Smart MedTech FlexTech

Join us for a comprehensive Master Class with Dr. Devin MacKenzie, as he dives into the fundamentals and real-world applications of printed and flexible hybrid electronics (FHE). This session will explore the critical interrelationship between materials, processes, and hardware used in printed electronics, providing a strong foundation for understanding how these systems are designed and manufactured.

Participants will gain insight into current applications of printed electronics, along with practical considerations such as performance, scalability, and manufacturing challenges. The course will also highlight emerging technologies at the forefront of innovation, including advances in FHE, semiconductor packaging, photonics, and quantum materials

10:00 am - 12:00 pm Off Add to Calendar 2026-09-30 10:00:00 2026-09-30 12:00:00 FEMC#31 Advancing Printed Electronics Technology: From Macroelectronics to Quantum Devices Join us for a comprehensive Master Class with Dr. Devin MacKenzie, as he dives into the fundamentals and real-world applications of printed and flexible hybrid electronics (FHE). This session will explore the critical interrelationship between materials, processes, and hardware used in printed electronics, providing a strong foundation for understanding how these systems are designed and manufactured.Participants will gain insight into current applications of printed electronics, along with practical considerations such as performance, scalability, and manufacturing challenges. The course will also highlight emerging technologies at the forefront of innovation, including advances in FHE, semiconductor packaging, photonics, and quantum materials United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles REGISTER NOW
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Belgium France Germany Ireland Italy United States Wafer Training

Course Description 

This course provides a comprehensive introduction to semiconductor manufacturing, guiding participants through the complete journey from silicon fundamentals to chip fabrication and packaging. Designed for professionals new to the semiconductor industry, the course explains key concepts, terminology, devices, and manufacturing processes used in modern fabs. 

This course is divided into four modules, enabling a progressive learning experience that builds from fundamentals to manufacturing execution. Participants will gain a clear understanding of how chips are made, the role of transistors, and the steps involved in front-end manufacturing, followed by back-end assembly and packaging processes. The course also introduces the broader semiconductor ecosystem, including supply chain players, helping learners connect technical fundamentals with real-world manufacturing practices. 

Who Should Attend

This course is designed for sales and marketing professionals, as well as new employees, students, and anyone interested in gaining a knowledge about semiconductor manufacturing.   

Learning Objectives

Upon completion of the course, participants should be able to:

  • Explain fundamental semiconductor concepts, including silicon materials, doping, PN junctions, and basic device behavior. 
  • Identify and correctly use common semiconductor manufacturing terminology.
  • Outline the key steps involved in front-end wafer fabrication, from bare silicon to patterned wafers.
  • Summarize back-end manufacturing processes, including assembly, packaging, and testing.

Topics Included

  • Module 1: Semiconductor Fundamentals

    Introduces semiconductor basics, silicon materials, doping PN junctions, and core device concepts, building a foundation for understanding how electronic devices function.

  • Module 2: Semiconductor Terminologies and Manufacturing Context

    Covers essential semiconductor terminology, cleanroom concepts, supply chain players, process nodes, and packaging to help learners navigate manufacturing discussions with confidence.

  • Module 3: Front-end and Back-end Semiconductor Manufacturing

    Provides an overview of the key steps involved in front-end wafer fabrication and back-end assembly, packaging, and testing processes.

  • Module 4: Transistors and Their Operation

    Explains different types of transistors and their working principles, showing how transistors function as switches and amplifiers inside integrated circuits. 

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge. 

Can't find the training link on the day of the training? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders 24 hours in advance and 1 hour before, with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

 

Mayura Padmanabhan
Program Manager
SEMI
Instructor Bio

 

United States

SEMI U

Strengthen your knowledge and skills by learning about the journey from silicon fundamentals to chip fabrication and packaging. 

Pricing                     
  • Members:  $149
  • Non-Members:  $179

* * Group pricing for 10+ attendees: $1,299 and 20+ attendees: $2,399
Any questions, please contact [email protected]

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Thank you to our sponsors:  

 

 

         Sundt Construction Company & General Contractor | Sundt                                   SCREEN logo

 

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United States

9:00 am - 9:10 am

Welcome and Overview of the Water Management Working Group

9:10 am - 9:25 am
Pascal Osten
Leader, Water Solution Providers Cohort
Pascal Osten
DAS Environmental Expert GmbH

Procedures Guide

9:25 am - 9:35 am
Catherine Marsan-Loyer
Co-Lead, Fab, OSATs Cohort
Catherine Marsan-Loyer
C2MI

Water Savings Guide and Baseline-setting

9:35 am - 9:45 am
Jared Burdik
Co-Lead, Fab, OSAT Cohort
Jared Burdick
Sundt Corp.

Solutions Maturity Scale

9:45 am - 9:55 am

Q&A & WrapUp

EHS SMG Sustainability EMG FOA Standards

Join the SEMI Water Management team and document authors for a webinar discussing their research and findings for the Water Management Strategy Reports.  The reports are guides for water managers for understanding their water balance, baseline, potential savings and a general maturity scale for several solutions to be considered to move up the maturity scale to Zero Liquid Discharge (ZLD). The webinar will provide an overview on how the documents should be used to work with water solutions providers and provide strategies for both new and legacy facilities with end-of-pipe solutions as well as treatments for individual process stage water discharge. 

The webinar will include a discussion of next steps for the continued development of the reports, including how they interact with SEMI Standards and the industry roadmaps.

Reports can be downloaded HERE.

9:00 am - 10:00 am Off Add to Calendar 2026-05-21 09:00:00 2026-05-21 10:00:00 Water Management Strategies Webinar Join the SEMI Water Management team and document authors for a webinar discussing their research and findings for the Water Management Strategy Reports.  The reports are guides for water managers for understanding their water balance, baseline, potential savings and a general maturity scale for several solutions to be considered to move up the maturity scale to Zero Liquid Discharge (ZLD). The webinar will provide an overview on how the documents should be used to work with water solutions providers and provide strategies for both new and legacy facilities with end-of-pipe solutions as well as treatments for individual process stage water discharge. The webinar will include a discussion of next steps for the continued development of the reports, including how they interact with SEMI Standards and the industry roadmaps.Reports can be downloaded HERE. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Register Here
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Belgium France Germany Ireland Italy United States Security Training

Course Description

This course introduces key cybersecurity principles, practices, and strategies tailored for semiconductor manufacturing environments. Participants will explore foundational concepts in cybersecurity, risk management, and best practices to secure semiconductor manufacturing systems and data.

Who Should Attend

This course is designed for:

  • Engineers and technicians in semiconductor manufacturing
  • IT professionals managing manufacturing systems
  • System administrators are responsible for securing semiconductor equipment and networks
  • Individuals tasked with implementing cybersecurity strategies in industrial settings

Prerequisites

  • Basic understanding of semiconductor manufacturing processes
  • Familiarity with IT infrastructure (networks, computers, and systems)

Learning Objectives

By the end of the course, participants will: 

  • Understand the basic principles of cybersecurity and their importance in a manufacturing environment.
  • Be able to assess and manage cybersecurity risks within the semiconductor manufacturing systems.
  • Learn practical strategies for implementing cybersecurity measures to protect critical infrastructure, devices, and data.
  • Gain insights into responding to and recovering from cybersecurity incidents.

  • Be prepared to develop and promote a strong security culture within their organization. 

     

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge. 

Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the trainings on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

United States

SEMI U Standards

Unlock the secrets to safeguarding semiconductor manufacturing systems with this comprehensive cybersecurity course. Learn essential principles, risk management strategies, and best practices to protect critical infrastructure and data from cyber threats. Equip yourself with the knowledge to implement robust security measures and respond effectively to incidents in industrial environments.

Pricing
  • Members: $99
  • Non-Members: $129

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]. 

8:00 am - 12:00 pm Off Add to Calendar 2026-07-13 08:00:00 2026-07-13 12:00:00 Implementing Basic Cybersecurity Principles in Semiconductor Manufacturing (Virtual Training (Americas & EU) Unlock the secrets to safeguarding semiconductor manufacturing systems with this comprehensive cybersecurity course. Learn essential principles, risk management strategies, and best practices to protect critical infrastructure and data from cyber threats. Equip yourself with the knowledge to implement robust security measures and respond effectively to incidents in industrial environments.PricingMembers: $99Non-Members: $129* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected].  United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Register Now
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High-performance connectivity software delivers structured, high-volume equipment data required by tier-one fabs and advanced packaging facilities ahead of the expected mid-2026 SEMI standards update

POITIERS, March 25, 2026 – Agileo Automation, a leading provider of control and connectivity solutions for global semiconductor manufacturing, today unveils Agil'EDA, a new software solution implementing Equipment Data Acquisition (EDA), a set of SEMI standards also known as Interface A, to enable semiconductor equipment manufacturers to meet the evolving high-performance connectivity requirements of tier-one fabs and advanced packaging facilities.

As semiconductor manufacturing moves towards higher levels of automation and data-driven optimization, fab owners increasingly require EDA alongside traditional SECS/GEM connectivity from semiconductor OEMs for their production tools. Agil'EDA addresses this by separating the control flow from the data flow, ensuring that structured, high-frequency data collection does not interfere with critical equipment operations.
Designed for long-term deployment, Agil'EDA fully supports the widely used EDA Freeze 2 (SOAP/XML) and is architected for the transition to Freeze 3 (gRPC/protocol buffers). This next-generation standard offers significantly higher data throughput and reduced latency. Agileo has already successfully tested and validated its EDA Freeze 3 implementation at SEMI’s North America Standards Fall Meetings in November 2024 in Milpitas, California. SEMI’s EDA Freeze 3 standards suite is expected to be released mid-2026.

Complementing the SECS/GEM standards used to control equipment behavior, Agil’EDA incorporates robust cybersecurity features such as authentication and encrypted communications. The product is available as a stand-alone solution for any existing equipment software using a platform-independent gRPC application programming interface (API) to communicate with it or as a pre-integrated component within Agileo’s A²ECF-SEMI framework. When used with Agil'GEM and Agil'GEM300, it provides a comprehensive connectivity solution that significantly reduces time to market for OEMs.

"With the growing demand for data to improve yield in tier-one fabs, as well as in Advanced Packaging and 3D integration, EDA is no longer optional. It is becoming a mandatory requirement for equipment entering the world's most advanced fabs," explains Marc Engel, chief executive officer of Agileo Automation. "The key value we deliver for OEMs is a fast and easy adoption path for a seamless EDA architecture that delivers compliant production machines to global fab customers. By providing a future-proof architecture ready for Freeze 3, which will significantly increase performance, we address OEMs’ current needs while preparing them for the evolving requirements of semiconductor manufacturing, including AI-driven process control."

- ends -

About Agileo Automation
Agileo Automation is a trusted partner for equipment manufacturers, helping them build smarter, automated, and more connected machines that integrate seamlessly into advanced semiconductor fabs. Founded in 2010 in Poitiers, France, Agileo helps OEMs with control, communication, data acquisition, and testing across their tools through proven software and expert support. Its flagship A²ECF-SEMI framework provides a solid foundation for developing equipment controllers fully aligned with SEMI SECS/GEM, GEM300, and EDA standards. As an active member of SEMI and the OPC Foundation, Agileo Automation contributes directly to shaping the standards that drive manufacturing. For more information, please visit our website or follow us on LinkedIn.

Dresden, Germany, March 24, 2026 – As semiconductor manufacturing continues to expand in China, reliable and efficient environmental technologies are becoming increasingly important for stable and sustainable fab operation. DAS Environmental Experts presents its SALIX wet scrubber product family, a series of high-efficiency point-of-use systems designed for the treatment of waste gases from wet chemical processes in semiconductor manufacturing.

SALIX systems are engineered to ensure high removal efficiency and stable operation in demanding semiconductor production environments. SALIX reliably removes substances such as IPA, ammonia and hydrofluoric acid (HF) from waste gas streams of modern single wafer clean systems – a key contribution to safe and sustainable semiconductor manufacturing. In addition, the technology removes particles, salts and droplets from the processed gas stream. The robust system design supports high uptime and long maintenance intervals, contributing to reliable fab operation.

A key advantage of the SALIX product family is its flexible portfolio. SALIX products are among the smallest and most compact systems on the market and are suitable for both new fabs and retrofit applications in existing fabs. DAS Environmental Experts offers the technology in four different products, providing semiconductor manufacturers with a wide range of configuration options:

• NEW: SALIX – the latest release with improved performance and optimized system operation
• SALIX MINI – a compact two-stage system for space-constrained installations
• NEW: SALIX MICRO [SR1.1]– a highly compact configuration with pre-scrubber section for flexible integration

This structured product portfolio enables customers to select the most suitable system according to process requirements, fab layout and integration needs. The availability of multiple system variants within one technology platform provides semiconductor manufacturers with excellent flexibility in system selection and plant design.

SALIX systems are designed for compatibility with all common process tools and can be adapted to a wide range of wet chemical applications. Their compact design and flexible configuration support efficient integration into modern fabs, helping manufacturers optimize both environmental performance and operational efficiency.

The SALIX product family will be presented during SEMICON China 2026 (March 25–27, Shanghai New International Expo Centre). Interested visitors can learn more about the technology and its applications at the DAS Environmental Experts booth (Booth N2 | 2619).

With more than three decades of experience in environmental technology for the semiconductor industry, DAS Environmental Experts continues to support chip manufacturers worldwide with solutions that combine high process reliability, efficient emission treatment and long-term operational stability.

About the Company
DAS Environmental Experts Group (DAS Group), headquartered in Dresden, Germany, was founded in 1991 and is now a global organization with subsidiaries on three continents and more than 950 employees worldwide. Over the past three decades, DAS Group has become one of the leading technology and equipment providers for waste gas abatement solutions with a focus on semiconductor industry.
In addition, DAS Group develops advanced process and system solutions for industrial water treatment, with extensive expertise in the recycling and reuse of wastewater from the semiconductor industry.
DAS solutions are engineered to meet the stringent purity requirements of semiconductor manufacturing, helping clients comply with global environmental standards.

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Belgium France Germany Ireland Italy United States Seimconductor Device Assembly Training

Course Description 

This three-day virtual workshop (4 hours a day) provides a complete overview of the semiconductor manufacturing process. The class focuses on key process steps needed to form a functioning device. Some important science and engineering ideas needed to understand device manufacturing will be discussed. The workshop is designed for non-technical personnel needing an understanding of the fab process steps.  Some technical background from attendees will improve the workshop learning. 

The first day will overview the fab process steps with a brief summary of how a transistor functions. We will discuss how multiple transistors are connected to form a logic or memory device. We will also cover how a transistor works with respect to the physical layout of Bipolar and MOSFET transistors. 

The second day will cover key fab process steps. Ion implantation, photolithography including DUV and EUV processes, plasma processes including deposition and etch, rapid thermal processing, and wet etch processing. Specific emphasis will be given to the different wet etch processes. 

The third day of the workshop will focus on the new transistor designs, including FinFET and CFET designs. We will also cover reasons for changing the transistor design and newer materials, including tantalum, hafnium, silicon germanium, and low-k dielectrics.  We will also review roadmaps of leading companies, including TSMC, Intel, and Samsung. 

After completing the workshop, the student will be able to describe all the fabrication and assembly process steps and have an understanding of how the process steps work together to form the completed integrated circuit, in addition to an understanding of future structures.

 

Who Should Attend

This course is intended for both manufacturing and R&D know-how in IC packaging professionals, including but not limited to:

  • Process Technicians
  • Material Engineers
  • Process Engineers
  • Equipment Manufactures
  • Technical Marketing Engineers

Topics Included

  • Silicon wafer manufacturing
  • Basic operating principles of transistors and semiconductor devices
  • Planar, FinFET, and GAA transistor formation and design differences

  • Fab processes needed to form a semiconductor, including the following:

    • Lithography, with a focus on DUV and EUV methods
    • Etching, including wet and plasma processes
    • Deposition, thermal, plasma, electroplating deposition
    • CMP and modern CMP processes

     

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge. 

Can't find the training link on the day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in advance and an hour before with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

 

Tom Dory
ITM Consulting, Inc
Instructor Bio

United States

- SEMI U

Strengthen your knowledge and skills by learning about IC packaging, assembly, and package/substrate and Heterogeneous Integration & Chiplets. 

Pricing         

              Early Bird Pricing: $100 off

  • Members:  $699   $599
  • Non-Members:  $749   $649

* * Group pricing for 20+ attendees: $11,500
Any questions, please contact [email protected]

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