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Germany

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Registration is free of charge, but must be done in advance 

 

 

 

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UCLA
Los Angeles, CA
United States

1:00 pm - 3:00 pm

Phase 2 Project Introductions

- Low-SWaP-C, GPS-free PNT technology
- Novel materials, fabrication & packaging techniques and approaches
- Advancements in atomic clock and quantum sensor photonics

3:00 pm - 4:30 pm

Break Out Sessions

Thrust Area 1: Novel Materials, Fabrication, and Packaging Techniques for Low-SWaP Inertial and PNT Sensors
Thrust Area 2: Advanced Active and Passive Integrated Photonics for Low-SWaP Atomic Clocks, Quantum Systems, & PNT Sensors
Thrust Area 3: Advancements Towards Low-SWaP, GPS-Free PNT Technologies

4:30 pm - 5:00 pm

Group Reports & Wrap Up

MSIG
SEMI MSIG has another $5M in R&D funding for sensor positioning, navigation, and timing (PNT) technology development! Register now to attend our half-day Gap Analysis workshop, taking place April 30, the afternoon before our premier sensor technology-event, the MEMS & Sensors Technical Congress (MSTC). Meet US Gov’t subject matter experts (SME’s) to discuss PNT pain points and get insights into this year’s request for proposals (RFP).
 
The workshop will feature presentations from the new 2024 PNT projects and identify areas for this year’s RFP.
 
Have your voice heard, as SEMI MSIG and the Army Research Lab work to fund PNT R&D technology improvements in a 5-year (2022-2027) $25M program. This gap analysis workshop is a critical component of the program’s 2nd year activities.
1:00 pm - 5:00 pm Off Add to Calendar Disabled America/Los_Angeles

Hotel

Cambridge hotels are expensive in late May, so we have made a deal for you, click here!

We have a room block reserved at DoubleTree Suites by Hilton Hotel Boston, Cambridge for May 21, 2023 through May 25, 2023. Booking your room is simple, just select "Book a Room" to receive your group's preferred rate. Must book rooms before May 12th to obtain discounted rate.

Please book your hotel reservations online for MSTC 2023 Conference or guests can call our 24-7 reservations desk to book your room or please ask for the Front Desk and then provide the Group Code: MSTC 

Book a Room Here

*must book rooms before May 12th to obtain discount rate. 

WILMINGTON, Del., Jan. 22, 2024 — DuPont (NYSE: DD) today announced that Drew Chambers has been named global business director, Lithography Technologies business in DuPont Electronics & Industrial, effective Jan. 1. Chambers succeeds George Barclay, Ph.D., who has elected to retire after more than 25 years of service.

“George Barclay’s significant contributions to our lithography business and portfolio have been tremendous and we are grateful for the lasting legacy he leaves with our organization,” said Sang Ho Kang, VP & General Manager, Semiconductor Technologies, DuPont Electronics & Industrial. “A true technical expert, George is a prolific innovator and visionary leader.”

“Drew Chambers has demonstrated outstanding leadership across multiple technology segments in electronics and is a strong proponent of delivering results to meet the needs of our customers,” said Kang. “In his new role as the leader of our lithography materials portfolio, Drew will play a pivotal role in furthering our offerings for extreme ultraviolet lithography and other advanced patterning solutions.”

Chambers brings a diversity of experiences both at DuPont and elsewhere in the electronics industry. He joined DuPont in 2019 as global marketing director for chemical mechanical planarization (CMP) pads in CMP Technologies and most recently served as acting business director. Prior to DuPont, he led the Electronics & Surface Technologies segment for Ferro Corporation, led regional sales and marketing for ESL ElectroScience (now part of Ferro Corporation), and worked in new business development for Lutron Electronics. Earlier in his career, Chambers held several roles in engineering, product management and account management in the semiconductor materials segment with Rohm and Haas Electronic Materials (now part of DuPont). Chambers holds an MBA from Duke University’s Fuqua School of Business and a BS in chemical engineering from Lafayette College.

DuPont Lithography Technologies is a global leader in materials for microlithography, with offerings enabling advanced patterning at the most advanced technology nodes; and bringing quality, yield and defectivity improvements to existing lithography processes. DuPont’s portfolio includes ArF photoresists, KrF photoresists, i/g line photoresists, extreme ultraviolet (EUV) photoresists, advanced overcoats, EUV underlayers and anti-reflective coating materials. Lithography Technologies is part of Semiconductor Technologies in DuPont Electronics & Industrial.

About DuPont Electronics & Industrial
DuPont Electronics & Industrial is a global supplier of new technologies and performance materials serving the semiconductor, circuit board, display, digital and flexographic printing, healthcare, aerospace, industrial, and transportation industries. From advanced technology centers worldwide, teams of talented research scientists and application experts work closely with customers, providing solutions, products and technical service to enable next-generation technologies. http://electronics.dupont.com

About DuPont
DuPont (NYSE: DD) is a global innovation leader with technology-based materials and solutions that help transform industries and everyday life. Our employees apply diverse science and expertise to help customers advance their best ideas and deliver essential innovations in key markets including electronics, transportation, construction, water, healthcare and worker safety. More information about the company, its businesses and solutions can be found at www.dupont.com. Investors can access information included on the Investor Relations section of the website at investors.dupont.com.

Lansdale, PA – Greene Tweed, a leading global manufacturer of high-performance sealing solutions and engineered components, announces the introduction of Fusion® F07, a performance-enhanced fluoroelastomer. Developed by Greene Tweed material scientists and application engineers, Fusion® F07 is specifically crafted to withstand common Etch and CVD oxygen/fluorine based gases in semiconductor processing subfab lines, at temperatures up to 355°F (180°C).

With an expected lifetime of at least 6 months, Fusion® F07 lasts longer than standard FKM in subfab vacuum system lines. As a result, the new performance enhanced FKM extends the time between planned maintenance activities. Notably, it provides a better total cost of ownership where applications do not require an FFKM compound.

“At Greene Tweed, we enable customers to operate efficiently and safely in the world’s most demanding environments. We understand that the semiconductor industry needs reliability and longevity. Fusion® F07 is a result of meticulous research and development, aimed at not only extending the life of their system but also improve operational efficiency,” says Magen Buterbaugh, President and CEO, Greene Tweed.

Fusion® F07 can be purchased as a seal assembly or as an individual O-Ring. Customers can effortlessly upgrade to Fusion® F07 and experience the benefits of extended lifetime and the resultant reduced operating costs as the seals are form-fit replaceable with other industry standard (KF/ISO flange fittings) seals. A blue outer ring allows for easier identification upon installation and replacement. Fusion® F07 seals are available in most typical sizes, including KF16, KF25, KF40, KF50, ISO63, ISO80, ISO100, ISO160, and ISO200.

About Greene Tweed
As a leading global provider of sealing solutions to the semiconductor industry for over four decades, Greene Tweed engineers advanced elastomer seals and thermoplastic components that are found in a broad range of mission-critical equipment in key process areas of the world’s semiconductor fabs, including etch, deposition, aqueous, and electro-chemical (electroplating). The company is now investing in Korea with its upcoming state-of-the-art manufacturing facility expected to commence production this year. “Greene Tweed has a history of investing to meet the demands of our global customers and the Korea expansion offers the organization an opportunity to support the continued growth of the semiconductor industry in the region. The multi-million-dollar investment represents a significant increase in the company’s global manufacturing capacity while enabling supply chain resiliency,” said Magen Buterbaugh.

Reaffirms Full Year 2023 Revenue Expectations Above $1.1 billion

BEVERLY, Mass., Jan. 16, 2024 -- Axcelis Technologies, Inc. (Nasdaq: ACLS), a leading supplier of enabling ion implantation solutions for the semiconductor industry, today increased financial guidance for the fourth quarter of 2023 and reaffirmed its expectations for the full year. Based on preliminary fourth quarter financial results, the Company expects revenue for the fourth quarter of 2023 to be greater than $300 million, above the approximately $295 million prior guidance, and reaffirmed its expectation for full year 2023 revenue above $1.1 billion. Earnings per diluted share for the fourth quarter of 2023 are now forecasted to be greater than $2.05, above prior guidance of approximately $2.00.

President and CEO Russell Low commented, “Our excellent financial performance in the fourth quarter and for the full year 2023 resulted from strong execution by Axcelis employees, combined with our leadership position in the growing power device market.” Low continued, “Based on our strong yearend backlog and fourth quarter bookings, especially in power devices, we expect the power device market to remain healthy in 2024. We also believe that the mature process technology and memory segments, two markets in which Axcelis is well-positioned, will recover in the second half of the year, enabling strong growth in 2025.”

James Coogan, executive vice president and chief financial officer said, “We look forward to discussing our results for 2023 and expectations for 2024 on our upcoming fourth quarter and full year earnings call. We believe we are still on track to achieve our $1.3 billion revenue model in 2025. This expectation is based on continued demand for the Purion product family, continued bookings strength, and a backlog stretching into 2025.” Coogan continued, “Additionally, we continue to manage spending to improve our earnings power and to invest in R&D to strengthen our market position.”

Fourth Quarter and Full Year 2023 Conference Call
The Company will release financial results for the fourth quarter and full year 2023 on Wednesday, February 7, 2024, at 4:00 p.m. Eastern Time (ET). The Company will host a call to discuss the results for the fourth quarter and full year 2023 on Thursday, February 8, 2024, at 8:30 a.m. ET. The call will be available to interested listeners via an audio webcast that can be accessed through the Investors page of Axcelis' website at www.axcelis.com, or by registering as a Participant here https://edge.media-server.com/mmc/p/su3u4oev. Webcast replays will be available for 30 days following the call.

Safe Harbor Statement
This press release contains forward-looking statements under the SEC safe harbor provisions. These statements, which include our guidance for future financial performance, are based on management’s current expectations and should be viewed with caution. They are subject to various risks and uncertainties, many of which are outside the control of the Company, including the timing of orders and shipments, the conversion of orders to revenue in any particular quarter, or at all, the continuing demand for semiconductor equipment, relative market growth, continuity of business relationships with and purchases by major customers, competitive pressure on sales and pricing, increases in material and other production costs that cannot be recouped in product pricing and global economic, political and financial conditions. These risks and other risk factors relating to Axcelis are described more fully in the most recent Form 10-K filed by Axcelis and in other documents filed from time to time with the Securities and Exchange Commission.

About Axcelis
Axcelis (Nasdaq: ACLS), headquartered in Beverly, Mass., has been providing innovative, high-productivity solutions for the semiconductor industry for over 40 years. Axcelis is dedicated to developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation systems, one of the most critical and enabling steps in the IC manufacturing process. Learn more about Axcelis at www.axcelis.com.

Kitchener, ON, January 11, 2024 – PEER Group®, the largest supplier of innovative factory automation software products for the semiconductor industry, is highlighting its lineup of SEMI Standards compliance test products at booth A434 during SEMICON Korea 2024.
“We are excited to return SEMICON Korea and look forward to connecting with our partners and customers at the show,” says Bob Kane, PEER Group’s Director of Factory Sales, Asia. “SEMI Standards compliance testing is critical for passing the factory acceptance test. OEMs that validate their tools using PEER Group’s test applications before shipping increase their chances of a successful factory integration and securing repeat business from factories.”
PEER Group’s test products include SECSIM Pro®+, which has been trusted by equipment manufacturers for more than 20 years to test and validate SECS/GEM communications. Also highlighted during the show are PFAT™, a workflow-based scenario test designer used by factories and OEMs to ensure equipment meets factory requirements, and CCS Envoy™, a factory automation standards compliance tester.
Visitors to booth A434 will have the opportunity to meet with representatives from PEER Group’s global sales team, as well as members from Toward Future, PEER Group’s exclusive sales partner serving South Korea. SEMICON Korea, which is happening January 31 - February 2, is the country’s leading semiconductor industry event.
To learn more, and to schedule a meeting during SEMICON Korea, visit PEER Group’s event page.

About PEER Group
PEER Group® is the largest supplier of innovative factory automation software products for the semiconductor industry. Since 1992, our solutions have helped the world’s most advanced OEMs and factories reduce time to market and lower costs by solving their equipment automation, data management, and process control problems. An award-winning company, PEER Group’s commitment to quality has been recognized by Intel’s EPIC Supplier Program, naming PEER Group a Distinguished Supplier in 2023 and an Outstanding Supplier in 2022. Follow PEER Group on LinkedIn.

REGISTRATION

Registration is free.

Belgium France Germany Ireland Italy Japan South Korea United States REGISTER NOW EPA Thumbnail Image_NEW Business Executive

The webinar will feature senior leaders and other experts from EPA and provide SEMI members with an overview of EPA’s efforts under the PFAS Strategic Roadmap; the recently finalized reporting rules under the Toxic Substances Control Act (TSCA) and the Toxics Release Inventory (TRI) program; the review and management of new PFAS chemicals under the TSCA New Chemicals program; and an update on research and development activities, including analytical test methods development.  In addition to hearing directly from EPA officials on these important topics, participants will have an opportunity to ask questions at the end.  

United States

Welcome Remarks

1:00 pm
Joe Stockunas, SEMI Americas
Joe Stockunas
President
SEMI Americas

Speakers

Michal Freedhoff, PhD, U.S. Environmental Protection Agency
Dr. Michal Freedhoff
Assistant Administrator, Office of Chemical Safety and Pollution Prevention
U.S. Environmental Protection Agency
Matt Klasen, U.S. Environmental Protection Agency
Matt Klasen
PFAS Council Manager
U.S. Environmental Protection Agency
Susan Burden, PhD, U.S. Environmental Protection Agency
Dr. Susan Burden
PFAS Executive Lead, Office of Research and Development
U.S. Environmental Protection Agency
Stephanie Griffin, U.S. Environmental Protection Agency
Stephanie Griffin
Team Lead, Data Collection Branch, Office of Pollution Prevention and Toxics
U.S. Environmental Protection Agency
Shari Barash, U.S. Environmental Protection Agency
Shari Barash
Acting Director, New Chemicals Division, Office of Pollution Prevention and Toxics
U.S. Environmental Protection Agency
Tyler Lloyd, U.S. Environmental Protection Agency.jpg
Tyler Lloyd
Team Leader, Risk Management Branch 1, New Chemicals Division, Office of Pollution Prevention and Toxics
U.S. Environmental Protection Agency
2:00 pm

Adjourn

Join us to learn more about several of the U.S. Environmental Protection Agency’s recent actions related to PFAS and their relevance to the semiconductor manufacturing industry.

1:00 pm - 2:00 pm Off Add to Calendar Disabled America/New_York
Event format

Deventer, December 12, 2023 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, and HE System Electronic GmbH, an established development and manufacturing partner for sensors and power electronics, today announce their cooperation to perform certified validation of power modules in the field of electromobility. All qualification and reliability tests will be carried out in compliance with the AQG 324 standard, among others, and the final product will be used in high power solutions such as car batteries. The partnership was initiated in 2021 and is now even stronger with this new project.

The majority of projects at HE System Electronic are located in the automotive sector. In this area, it is important to be certified or accredited according to quality management standards such as VDA 6.2 and DIN EN ISO / IEC 17025:2018.

“RoodMicrotec is one of the few independent service providers in the European region that can carry out a complete validation according to AQG 324. This makes the cooperation with RoodMicrotec so valuable,” says Axel Weber, CEO of HE System Electronic GmbH.

For RoodMicrotec, this partnership fits well into their general range of services and the company is looking forward to realizing further projects in this area, thus planning to expand its capacities.

“The final product from HE System Electronic is highly interesting. Because of this, we have added power cycling to our qualification capabilities. An additional tester with extended high power capabilities has already been ordered, so we can expand our capabilities and provide additional support to our customers,” says Martin Sallenhag, CEO of RoodMicrotec.

About HE System Electronic GmbH
HE System Electronic is a medium-sized electronics and microsystems technology company based in Veitsbronn in the location for business of the metropolitan region Nuremberg. Founded as a provider for electronic manufacturing services in the field of hybrid technology, HE System Electronic is well established as a competent partner for development and manufacturing and has been successful on the market for its customers in the product areas of sensor technology and power electronics for many years. The parent company, TKH Technologie Deutschland AG, based in Bielefeld, is supporting the growth and thus, HE System Electronic offers its customers the best of two worlds: the financially stable background of a healthy and profitable holding company as well as the innovative strength and short distances of a medium-sized company.
For more information please visit he-system.com/en.
Further information
Axel Weber – CEO, Klaus Aßmann – Distribution
Phone +49 911 97 58 10, E-mail: [email protected].

About RoodMicrotec
With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is a leading independent company for semiconductor supply and quality services. RoodMicrotec is a highly valued partner for many companies worldwide and offers specifically tailored turnkey solutions for each single customer's requirements. The turnkey services include project management, wafer test, assembly, final test, qualification, failure analysis, and logistics. All services provided by RoodMicrotec meet the high quality standards of the automotive, industrial, healthcare, and high reliability aerospace sectors. RoodMicrotec is headquartered in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany.
For more information, please visit https://www.roodmicrotec.com.
Further information
Martin Sallenhag, CEO or Arvid Ladega, CFO
Phone +31 570 745623, E-mail [email protected].

This press release is available in English and German. In case of conflict between these versions, the English version shall prevail.

Registration Details

Registration is required for this event as it is likely to reach maximum room capacity, at which point interested attendees will be waitlisted.

SEMI Members:  $100

Non-Members of SEMI:  $150

Refunds possible before January 10, 2024.  Substitutions allowed up to January 24.

Questions? Contact James Amano at [email protected].

Belgium France Germany Ireland Italy United States Register Now 2024 EHS Summit Business Executive Technical

The Summit includes strategic business and technical information for many levels and sectors of the ecosystem, including:

  • Government relations/advocacy staff
  • EHS regulatory professionals
  • Senior executives
  • Business development
  • Device manufacturers
  • Equipment suppliers
  • Materials suppliers
  • Component suppliers
  • Fab and facility systems construction companies

SEMI
673 South Milpitas Avenue
Milpitas, CA 95035
United States

8:30 am - 9:00 am

Registration & Networking

9:00 am - 9:05 am
James Amano, SEMI
James Amano
Senior Director, EHS
SEMI

Welcome

9:05 am - 9:20 am
James Amano, SEMI
James Amano
Sr. Director, EHS
SEMI

Europe PFAS Restriction Proposal

9:20 am - 9:45 am
Russ LaMotte
Russ LaMotte
Principal
Beveridge & Diamond PC

US EPA PFAS Reporting rule

9:45 am - 10:10 am
Andrew Petraszak
Andrew Petraszak
Tokyo Electron
Ben Kallen, SEMI
Ben Kallen
SEMI

PFAS US States Proposals & Positions

10:10 am - 10:30 am

Break

10:30 am - 11:00 am
Lauren Crane
Lauren Crane
Lam Research

European Regulations

Including: EU Machinery Regulation, Battery Regulation, Cybersecurity Resiliency Act (CRA), AI regulation, the Ecodesign “passport” concept. UK Conformity Assessed (UKCA) mark. California fan efficiency regulation. SEMI EHS Standards update.

11:00 am - 11:25 am
Allen Karpman
Allen Karpman
Arkema

AIM Act: HFC Allocations

11:25 am - 11:50 am
Kristine Baranski, PE, Intel
Kristine Baranski, PE
Global Air Program Manager
Intel

AIM Act: challenges with new refrigerants

11:50 am - 12:10 pm
Katelyn Walck
Katelyn Walck
Chemours
Jim Snow SCREEN
James Snow
SCREEN

SIA PFAS Consortium

12:10 pm - 1:15 pm

Lunch & Networking

1:15 pm - 1:35 pm
James Amano, SEMI
James Amano
SEMI

SEMI PFAS Initiative

1:35 pm - 2:00 pm
Russ LaMotte
Russ LaMotte
Principal
Beveridge & Diamond

TSCA PBT: PIP, DecaBDE, What's Next?

2:00 pm - 2:35 pm
Ben Gross, Applied Materials
Ben Gross
Applied Materials
Supika Mashiro
Supika Mashiro
TEL
Katelyn Walck
Katelyn Walck
Chemours
Lauren Crane
Lauren Crane
Lam Research

Supply Chain Inquiry Panel - sharing best practices

2:35 pm - 2:55 pm

Q&A

2:55 pm - 3:00 pm

Wrap-Up

3:00 pm - 3:30 pm

Networking

Standards

Plan now to join fellow semiconductor industry professionals at SEMI Headquarters in Milpitas, California for presentations and discussions around critical EHS regulatory issues impacting the industry.

Industry experts will address regulations in Europe and the United States that could significantly threaten our capability to continue manufacturing. Topics will include:

  • US EPA PFAS Reporting Rule 
  • US AIM Act HFC phasedown: challenges with new refrigerants 
  • US AIM Act HFC Allocation 
  • EU: PFAS Restriction Proposal, F-gas, Revised Machinery Regulation, Revised Battery Regulation, Pending Cybersecurity resiliency regulation, Pending AI regulation, the ecodesign “passport” concept.
  • Updates from SEMI PFAS Initiative and other collaborative industry efforts.
  • US EPA TSCA: PIP 3:1, DecaBDE…what's next?
  • Panel discussion on supply chain communication.

Plan now to attend, network and strategically prepare your company.  This event is offered as an in-person briefing only.

8:30 am - 3:30 pm Off Add to Calendar 2024-01-25 08:30:00 2024-01-25 15:30:00 2024 EHS Summit Plan now to join fellow semiconductor industry professionals at SEMI Headquarters in Milpitas, California for presentations and discussions around critical EHS regulatory issues impacting the industry. Industry experts will address regulations in Europe and the United States that could significantly threaten our capability to continue manufacturing. Topics will include: US EPA PFAS Reporting Rule  US AIM Act HFC phasedown: challenges with new refrigerants  US AIM Act HFC Allocation  EU: PFAS Restriction Proposal, F-gas, Revised Machinery Regulation, Revised Battery Regulation, Pending Cybersecurity resiliency regulation, Pending AI regulation, the ecodesign “passport” concept. Updates from SEMI PFAS Initiative and other collaborative industry efforts. US EPA TSCA: PIP 3:1, DecaBDE…what's next? Panel discussion on supply chain communication. Plan now to attend, network and strategically prepare your company.  This event is offered as an in-person briefing only. SEMI 673 South Milpitas Avenue Milpitas, CA 95035 United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
Germany standards

Online, CEST
Germany

Standards

Compound Semiconductor Materials Europe TC Chapter Meeting

Date: April 9, 2024

Time:
4:30-6:30 PM CEST
7:30 - 9:30 AM PACIFIC

via Web Conference

 

AGENDA (LINK)

(subject to change)

Last updated: Dec 7, 2023

 

NOTE:

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!

4:29 pm - 6:30 pm Off Add to Calendar 2024-04-09 16:29:00 2024-04-09 18:30:00 Compound Semiconductor Materials Europe TC Chapter Meeting 2024 Compound Semiconductor Materials Europe TC Chapter MeetingDate: April 9, 2024Time:4:30-6:30 PM CEST7:30 - 9:30 AM PACIFICvia Web Conference AGENDA (LINK)(subject to change)Last updated: Dec 7, 2023 NOTE:Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! Online, CEST Germany SEMI.org [email protected] America/Los_Angeles public

Contact

Kevin Nguyen
Manager, International Standards Operations

Registration is free

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Highlighted content

United States

Moderator

9:00 am
Raj Gautam Dutta, CEO, Silicon Assurance
Moderator
Raj Gautam Dutta
CEO
Silicon Assurance

Panelists

Serge Leef
Serge Leef
Head of Secure Microelectronics
Microsoft
Swarup Bhunia, Semmoto Endowed Professor and Director of Warren B. Nelms Institute
Swarup Bhunia
Semmoto Endowed Professor and Director
Warren B. Nelms Institute
Salman Nasir
Salman Nasir
Sr. Technical Program Manager
Battelle
John Hallman
John Hallman
Digital Verification Technology Solutions Manager
Siemens EDA
Steve Carlson
Steve Carlson
Director/Solutions Architect, Aerospace and Defense Solutions
Cadence Design Systems
Ming Zhang
MIng Zhang
VP of R&D Acceleration
PDF Solutions
EMG

Many semiconductor-based systems are moving toward 2.5D and 3D designs consisting of different pre-manufactured chips (chiplets) that perform specific functions. These are often provided by multiple vendors and are typically interconnected using an interposer. However, unlike monolithic multi-function chips, chiplets can be developed anywhere and at any process node. As such, chiplets from untrusted vendors can be unreliable or malicious. Third parties can reverse engineer, overproduce, or steal the IP of chiplets. Consequently, they raise new security challenges for an industry still figuring out ways to effectively mitigate hardware security threats to monolithic chips.

The webinar will focus on the potential threats that occur at the different stages of bringing chiplets to life, including design, assembly, and testing. The panelists will assess current safeguards to mitigate these risks and discuss open challenges for industry and academia.

9:00 am - 10:00 am Off Add to Calendar Disabled America/Los_Angeles Register Now
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