At the end of 2022, there were 167 semiconductor fabs processing 300mm wafers for the fabrication of ICs, including CMOS image sensors, and non-IC products such as power discretes.

While the semiconductor market downturn persists, 13 new 300mm wafer fabs are still being brought online in 2023. These new fabs are mostly for the production of power transistors, advanced logic, and foundry services.

Based on construction schedules as of late 2022, 15 300mm fabs will be brought online in 2024, 13 of them for production of ICs. A record number of fabs are expected to open in 2025 with 17 scheduled to begin production. With cutbacks in spending during 2023, some fabs previously scheduled to open in 2024 could be delayed to 2025. By 2027, the number of 300mm fabs in operation should exceed 230. These are projections made in Knometa’s Global Wafer Capacity 2023 report.

An increasing number of 300mm fabs are being built to fabricate non-IC devices, and power transistors in particular. The manufacturing cost benefits of processing chips on the large wafers come into play for device types characterized by large die sizes and high volumes. Examples of integrated circuits with these characteristics include DRAMs, flash memory, image sensors, complex logic and microcomponent ICs, PMICs, baseband processors, audio CODECs, and display drivers. While large-size power transistors are still small compared to the die sizes of these ICs, they ship in high volumes and are big enough to keep a 300mm fab loaded at a cost-effective production level.

Of the 13 300mm wafer fabs opening in 2023, five are focused on the production of non-IC products, with three of them located in China and two in Japan.

Two-thirds of the new 300mm fabs opening this year are for foundry services, with four of them wholly dedicated to the service of fabricating semiconductors for other companies on a foundry basis.

ST formed two separate partnerships to add new 300mm fab capacity at existing sites in Crolles, France, and Agrate, Italy. In Crolles, ST is working with GlobalFoundries to add new capacity for advanced logic and foundry services. In Agrate, ST and Tower Semiconductor are adding capacity for mixed-signal, power, RF, and foundry services.

Much of the pain from the current market contraction is being felt in the memory chip arena. Not surprisingly, there are no new 300mm fabs for memory opening in 2023.

About Global Wafer Capacity 2023
Global Wafer Capacity provides a detailed examination of existing fab capacity along with a five-year forecast to 2027. The report has been published on an annual basis since 2007, initially by IC Insights. In December 2021, IC Insights transferred business associated with Global Wafer Capacity to co-founder Trevor Yancey. Mr. Yancey became an independent contractor in 2014 but continued as the principal analyst and project manager for Global Wafer Capacity. Published in January 2023, Global Wafer Capacity 2023 is sold by Mr. Yancey’s company Knometa Research. For more information, visit https://knometa.com/gwc.

About Knometa Research
Knometa Research is a semiconductor technology and market analysis firm led by former IC Insights executive, Trevor Yancey. Mr. Yancey co-founded IC Insights in 1997 with Bill McClean and Brian Matas. In 2014, Mr. Yancey established Knometa Research to serve as an independent contractor for IC Insights and TechSearch International. For more information, visit https://knometa.com.

• Read more about Despite market weakness, new 300mm fabs still opening in 2023, many for power discretes

Brewer Science Presents Printed and Flexible CO2 Sensors at Carbon 2023 Conference

Cost-efficient and robust screen-printed sensors are the future of CO2 sensing

Cancun, Mexico– July 13, 2023 –Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries, will present Printed and Flexible CO2 Sensors Prepared via Different Carbon Materials: A Comparison Study at Carbon 2023 conference in Cancun, Mexico.

Reliable, inexpensive CO2 sensors are desired by many industries

Gas sensors are crucial components of intelligent detection systems, which have garnered remarkable interest in the past few decades. Carbon dioxide (CO2) sensors are of fundamental importance in a wide variety of applications including clinical analysis, environmental monitoring, agri-food, and chemical fields. Even though the market potential of CO2 sensors is huge, fabricating a reliable and inexpensive sensor is still challenging.

Screen-printed CO2 sensors using carbon materials offer cost-efficient robust solution

“Following up on our previous work, we proposed a comprehensive study comparing the manufacturing process and sensing performance of screen-printed CO2 sensors using different carbon materials.” states Dr. Jiadeng Zhu, Principal Investigator and Team Lead of Sensor Materials at Brewer Science.

Polyethyleneimine (PEI)/functionalized carbon nanotubes (f-CNTs) (PEI/f-CNTs) and PEI/carbon black (PEI/CB) composites were utilized as the sensing agents for screen-printed CO2 sensors. The manufacturing process and sensing performance of the resultant sensors have now been thoroughly explored and compared with a goal of achieving cost-effective and robust sensors.

Dr. Zhu will present the keynote Printed and Flexible CO2 Sensors Prepared via Different Carbon Materials: A Comparison Study at Carbon 2023 conference in Cancun, Mexico on July 17th at 10:30am EST.

If you cannot attend the conference but wish to learn more about Brewer Science’s innovative gas sensor technology or printed electronic capabilities, please submit a request at the bottom of our website.

About Brewer Science
Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique quality monitoring systems for water and air applications. We are Certified Employee-Owned and a Certified B Corporation™, using our business as a force for good. Our headquarters are in Rolla, Missouri, with customer support throughout the world. Learn more at www.brewerscience.com.

• Read more about Brewer Science Presents Printed and Flexible CO2 Sensors at Carbon 2023 Conference

Sold to Littelfuse, a U.S.-headquartered industrial technology company, for 93 million Euro

SEATTLE, June 28, 2023 – ATREG, Inc., the premier global firm in the semiconductor industry for initiating, brokering, and executing the exchange of advanced technology cleanroom manufacturing assets, announced today that it has successfully advised Elmos Semiconductor SE on the sale of its 200mm wafer fab located in Dortmund, Germany to Littelfuse, Inc., a diversified, industrial technology manufacturing company headquartered in Chicago, Illinois. Elmos has entered into a definitive agreement with Littelfuse for a total purchase price of approximately 93 million Euro for the Dortmund wafer fab. In addition, Elmos and Littelfuse have agreed to enter into a defined multi-year capacity sharing arrangement with an initial term lasting through 2029, with Elmos buying defined volumes of wafers produced at the fab.

"The ATREG team has been instrumental in bringing the right caliber of global buyers to the table and demonstrated the persistence needed in achieving a transaction that met all of our business objectives," explains Elmos CEO Dr. Arne Schneider. “The sale of this wafer fab is an important structural alignment to our strategy, and over time, also brings new products and technologies to the Dortmund wafer fab and its workforce. We greatly appreciate ATREG’s long-term partnership and strong industry relationships that have enabled us to get to this successful outcome with Littelfuse.”

“This transaction is positive for both Elmos and Littelfuse, and at a time when global demand for 200mm wafer fab equipment and capacity is at an all-time high,” adds Stephen Rothrock, founder, president and CEO of ATREG. “We are very pleased to have played a pivotal role in this transaction by providing strategic guidance and comprehensive advisory services.”

About ATREG, Inc.
ATREG is the only firm in the world dedicated to the holistic exchange of advanced technology manufacturing infrastructure. A linchpin of the semiconductor industry for nearly 25 years, ATREG has served as an objective intermediary in the transfer of over $30 billion in assets, acting as an indispensable conduit for the growth of its partners and the industry as a whole while remaining uniquely focused on aggregate asset deployment and human capital retention. For more information, please visit our web site, read our blog, or follow us on LinkedIn and Twitter.

• Read more about ATREG Successfully Assists Elmos Semiconductor SE with the Sale of its 200mm Wafer Fab in Dortmund, Germany

Effective July 1st, Photodigm is reducing the retail price of its Distributed Bragg Reflector (DBR) semiconductor laser diodes by 25% and showcasing a new product strategy to deliver savings and simplicity to its global customer base.

JUNE 26, 2023 (RICHARDSON, TX) –– Photodigm is thrilled to announce that as of July 1st, its entire product portfolio of Distributed Bragg Reflector (DBR) laser diodes will receive a historic 25% price reduction and new strategic approach to deliver savings and simplicity to its global customer base.

The semiconductor manufacturer announced a progressive tiered pricing strategy earlier this year to provide discounts on higher-volume orders of 100 units or more. As customer demand continued to increase, Photodigm intentionally invested in R&D projects partnering with the Office of Naval Research (ONR) to raise yields and overall volume of their fab, evolving from the company’s early years of on-demand production where it operated much like a university research lab.

“As we continue our journey to ever-improving laser lifetimes with better quality, higher yields, and gains in our overall production process, we are intentionally leveraging every opportunity to drive value to our customers,” said Bill Stuart, President and CEO of Photodigm.

Photodigm’s product portfolio now boasts thirty-two wavelengths of DBR laser diodes including Spectroscopy Certified devices tuned to unique elements like Rubidium which is often used in biomedical sensing applications or atomic clocks in GPS-denied environments for military applications.

To empower its customers, Photodigm restructured its product line around four simple decisions –– application (wavelength), functionality (chip architecture), added customization, and device packaging all with transparent pricing to provide a clear understanding of the added value in each selection.

“We’re putting our customers in the driver's seat by providing them with greater insight into our product capabilities and pricing than ever before,” says Mandy Eaton, VP of Sales & Marketing at Photodigm. “One of our core tenets at Photodigm is to foster innovation through collaboration and our new strategic approach to our product [portfolio] invites customers to shop, but also prompts them to ask themselves what they really need our technology to provide, which helps us evolve together.”

Photodigm, Inc. is the only 100% U.S.-based commercial manufacturer of semiconductor DBR laser diodes 730–1090nm with a global clientele of corporations, government entities, space programs, research labs, and universities. View the new catalog offering and updated pricing at www.photodigm.com/DBR.

About Photodigm, Inc.
For over 20 years Photodigm, Inc. has been the only 100% U.S.-based semiconductor manufacturer of single spatial and longitudinal mode Distributed Bragg Reflector (DBR) laser diodes. DBR lasers are essential to quantum sensing and atomic clock manufacturers, optical metrology and sensing, and laser spectroscopy. Headquartered in Richardson, Texas, they design and produce fixed wavelength diode lasers best known for their accuracy and reliability. Learn more at Photodigm.com.

• Read more about PHOTODIGM UNVEILS A STRATEGIC PRODUCT RESTRUCTURING PAIRED WITH A 25% PRICE REDUCTION AS CUSTOMER DEMAND CONTINUES TO DRIVE INCREASED PRODUCTION

Brewer Science Earns Intel’s 2023 EPIC Distinguished Supplier Award

Brewer Science is one of only 22 Distinguished Award recipients across Intel’s global supply chain

Rolla, MO, June 21, 2023 – Brewer Science is proud to announce that it has earned Intel’s EPIC Distinguished Supplier Award. Through its dedication to Excellence, Partnership, Inclusion, and Continuous (EPIC) quality improvement, Brewer Science has achieved a level of performance that consistently exceeds Intel’s expectations.

“As one of only 22 Distinguished Supplier Award recipients across the Intel global supply chain, Brewer Science stands out among suppliers in the semiconductor industry,” said Keyvan Esfarjani, chief global operations officer at Intel. “Their customer orientation and commitment to excellence is a testament to their dedication and serves as a global benchmark for others to follow.”

The Intel EPIC Distinguished Supplier Award recognizes a consistent level of strong performance across all performance criteria. Of the thousands of Intel suppliers around the world, only a few hundred qualify to participate in the EPIC Supplier Program. The EPIC Distinguished Award is the second-highest honor a supplier can achieve. In 2023, only 22 suppliers in the Intel supply chain network earned this award.

To qualify for an Intel EPIC Distinguished Supplier Award, suppliers must exceed expectations, meet aggressive performance goals, and score 80 percent or higher in performance assessments throughout the year. Suppliers must also meet 80 percent or more of their improvement plan deliverables and demonstrate formidable quality and business systems.

Get more information about the Intel EPIC Supplier Awards

Find the latest at the Intel Newsroom

Visit the Intel EPIC Supplier Awards page

About Brewer Science
Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique quality monitoring systems for water and air applications. We are Certified Employee-Owned and a Certified B Corporation™, using our business as a force for good. Our headquarters are in Rolla, Missouri, with customer support throughout the world. Learn more at www.brewerscience.com.

• Read more about Brewer Science Earns Intel’s 2023 EPIC Distinguished Supplier Award

Dresden, 21 June 2023. On 19 June, Masao Hodai, Chief Operating Officer of EBARA Precision Machinery Company Tokyo, visited EBARA’s German site in Dresden-Weixdorf. After a welcome by Dr Reinhart Richter, Managing Director of EBARA Precision Machinery Europe, an informative tour followed, during which Masao Hodai inspected the Overhaul Centre for vacuum pumps, built in 2021, the warehouse, the training facilities currently being built, and representatives from the most important product divisions. A joint lunch with members of Dresden’s staff rounded off his visit.

Strong signal for the Dresden location
“The visit of COO Masao Hodai reinforces our location within the Silicon Saxony region and shows the significant status of the semiconductor industry in Dresden for EBARA’s headquarters in Japan. Our progress in terms of safety, quality, CO2 reduction and market acquisition has made a deep impression. All EBARA employees in Dresden feel very honoured by this visit from Japan”, said Dr Reinhart Richter, happily. In the afternoon, in-depth client meetings were on the agenda at the Dresden site before Masao Hodai returned home to Tokyo.

About EBARA
EBARA Precision Machinery Europe (EPME) GmbH, headquartered in Sauerlach near Munich, is the European sales and service company of EBARA Corporation Tokyo. EBARA is a leading global manufacturer of vacuum and semiconductor systems used to produce wafers, liquid crystals, solar cells and other high-tech products. EBARA Corporation was founded in 1912 by Issey Hatakeyama and employs over 19,000 people worldwide. With an annual turnover of 4.7 billion euros, EBARA is one of the largest companies in the industry. EBARA supplies 16 of the top 20 manufacturers in the chip industry.

About EBARA Precision Machinery Europe
The EPME portfolio includes dry and turbomolecular vacuum pumps as well as modern gas abatement systems for the chemical industry, for example. In addition, EPME distributes state-of-the-art CMP tools, wafer bevel polishing and substrate coating systems for chip manufacturing. In 2021 EBARA opened its second modern overhaul centre for vacuum pumps in Dresden. EPME has been operating a vacuum pump overhaul centre in Livingston (UK) since 1993. EPME employs over 250 people in Europe and Israel.
Photo: EBARA / Tommy Halfter

• Read more about Important visitor from Japan – from parent company EBARA Corporation Tokyo

Brewer Science’s High-Temperature-Stable, Gapfilling Planarizing Material Revolutionizes Advanced ArF and EUV Processes

OptiStack® SOC450 material provides zero shrinkage up to 550°C when baking in N2

June 15, 2023 – Rolla, MO – Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials for the microelectronics and optoelectronics industries, is thrilled to announce the latest breakthrough in high-temperature gapfilling materials – OptiStack® SOC450 material, enabling advanced node processes by providing unparalleled performance at extreme temperatures.

A basic overview of a spin-on carbon and the need for a high-temperature stable material.
Overcoming the Industry Compromise: Thermal Stability for Planarization and Gapfilling

One of the greatest challenges in the advanced ArF and EUV industries has been finding a material that can withstand high temperatures without sacrificing its planarization and gapfilling capabilities.

Shrinkage in spin-on glass (SOG) coatings, or annealing processes, can result in incomplete coverage, pattern distortion, delamination, or cracking. Insufficient thermal stability properties can affect subsequent process steps, compromising the overall performance and reliability of the device. To prevent significant yield loss caused by unstable materials during high-temperature annealing, such as those necessary in self-aligned double patterning (SADP) applications, it’s important to ensure gapfilling materials are stable over 400°C.

A typical low-temperature SOC has 50% weight loss when baked to 400°C which makes planarization suffer due to the film shrink.

OptiStack® SOC450 Material Enables SADP Processing with High Thermal Stability

With OptiStack® SOC450 material EUV processes will no longer have to sacrifice temperature stability for superior gapfilling and planarization.

OptiStack® SOC450 material is a carbon-based high-aspect-ratio spin-on-carbon material designed to withstand high temperatures and provide low shrinkage, offering significant benefits to ArF, EUV, SADP, SAQP, 3D NAND, and advanced memory processes.

The following simplified example illustrates one potential application of OptiStack® SOC450 material to improve a SADP process by utilizing high-temperature CVD deposition of the spacer.

The following simplified example illustrates one potential application of OptiStack® SOC450 material to improve a SADP process by utilizing high-temperature CVD deposition of the spacer.

Key Features and Benefits of OptiStack® SOC450 Material

Zero Shrinkage: Unlike traditional SOC materials, OptiStack® SOC450 material boasts a remarkable 0% shrinkage when subjected to high-temperature baking, up to 550°C when baking in N2 after a 170°C soft bake step. This means precise planarization and gapfilling are possible without worrying about dimensional changes, maintaining the integrity of valuable components.

High Thermal Stability: OptiStack® SOC450 material can withstand high-temperature vacuum-deposited SiXn films over 200 nm. The high thermal stability enables integration schemes utilizing chemical vapor deposition (CVD) and/or atomic layer deposition (ALD) processes.

OptiStack® SOC450 material offers narrow trench and high-aspect ratio gapfilling, including a complete fill, without void or delamination.

CMP Compatibility: When a strict global-level planarization is needed, OptiStack® SOC450 material can be further planarized by chemical mechanical planarization (CMP) for use in high topography, and/or highly variable pattern density devices. With many spin-on carbons facing challenges with long-range planarization, the ability to OptiStack® SOC450 material enables superior planarization by controlling the rate of removal, based on the slurry and pad type.

CVD Processing: Chemical vapor deposition (CVD) can pose many problems if the spin-on carbon material vaporizes or sublimates, including contamination that leads to defects. Ineffective CVD can cause film thickness variation or that challenge the integrity of the device. Off-gassing, delamination, and cracking are also seen with traditional SOC thermal decompositions. OptiStack® SOC450 material does not sublimate or vaporize in conditions up to 400°C, and demonstrates superior stability in conditions up to 550°C.

Increase Efficiency: High carbon content of OptiStack® SOC450 material enables CF4 plasma etch rates better than SiOx. Ultralow metal ions less than 1,000 part-per-trillion ensure decreased post-etch defects. Additionally, the solubility in fab-friendly solvents and compatibility with other spin-on materials eliminates potential drain clogging issues.

OptiStack® SOC450 material will redefine what you expect from high-temperature-stable, gapfilling planarizing materials. Its unique combination of thermal stability, zero shrinkage, and exceptional performance will enable new possibilities for your products, helping you achieve unprecedented levels of quality and reliability. Don’t settle for compromises between thermal stability and superior gapfilling when you can have it all with OptiStack® SOC450 material. Connect with a product expert or learn more by visiting our website.

About Brewer Science
Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique monitoring systems for industrial, environmental, and air applications. Our relationship-focused approach provides outcomes that facilitate and deliver critical information. Our headquarters are in Rolla, Missouri, with customer support throughout the world. We invite you to learn more about Brewer Science at www.brewerscience.com.

• Read more about Brewer Science’s High-Temperature-Stable, Gapfilling Planarizing Material Revolutionizes Advanced ArF and EUV Processes

Axiomise, the leading provider of cutting-edge formal verification solutions that include training, consulting, services and custom apps, today launched its next-generation formalISA® app with open-source, formally verified RISC-V processors such as cv32e40p and WARP-V.

Also announced today is a new RISC-V Studio Portal with real-world formalISA applications and product demonstrations to help the RISC-V ecosystem understand the necessity of exhaustive formal and the kind of bugs that can be caught with formal methods.

“We are excited to share the app launch in conjunction with a new studio portal with real-world applications of formalISA and product demos,” remarks Dr. Darbari. “The app will enable the wider ecosystem of RISC-V to see why exhaustive formal verification is a necessity and what kind of bugs can be caught with formal methods. formalISA app is a powerful offering in realizing our vision of making formal normal. Axiomise has the tools and the skills to become the ‘go to’ RISC-V Verification expert.”

Dr. Darbari and his team will be at the RISC-V Summit Europe to demonstrate formalISA in Bay 7 from Tuesday, June 6, to Thursday, June 8, at Hotel Barcelo Sants in Barcelona, Spain.

About formalISA
Axiomise’s formalISA is a push-button formal verification solution used for architectural and micro-architectural verification of RISC-V processor cores. Initially launched four years ago, it has been used to formally verify numerous open-source and commercial RISC-V processors by identifying deep corner-case bugs and mathematically proving the absence of bugs on complex out-of-order and in-order cores.

A state-of-the-art proof status dashboard captures reporting and coverage information and provides full automation, saving time and cost. formalISA is powered by i-RADAR®, and a reporting and coverage solution called SURF.

formalISA is available now. Pricing is available upon request.

About Axiomise
Axiomise is accelerating formal verification adoption through its unique combination of training, consulting, services and specialized verification solutions for RISC-V. Axiomise was founded by Dr. Ashish Darbari, FBCS, FIETE, DPhil (Oxford), who has been a formal verification practitioner for more than two decades with 60 patents in formal verification and over 70 publications.

Engage with Axiomise at:
Website: www.axiomise.com
Twitter: @axiomise
LinkedIn: https://www.linkedin.com/company/axiomise/
Facebook: https://www.facebook.com/axiomise
Axiomise, formalISA and the Axiomise logo are trademarks of Axiomise Limited, UK.
Making formal normal is a registered trademark of Axiomise Limited, UK.

• Read more about Axiomise Launches Next-Generation formalISA App for RISC-V Processors

Virginia Beach, Virginia - Busch Vacuum Solutions, a leading provider of reliable solutions for SubFab Management, is proud to exhibit at this year's SEMICON West show and conference. As a reliable partner for vacuum pumps, gas abatement systems, leak detection and more, Busch provides the semiconductor industry with the highest quality solutions and services.

At SEMICON West, Busch is showcasing their comprehensive subfab management services. Critical SubFab systems are monitored and predictively maintained by Busch. Their SubFab management minimizes production downtime and enables energy-efficient operation and cost savings. Continuous monitoring extends maintenance intervals and the entire product life cycle. All Busch on-site service teams are certified to ISO9001:2016, ISO14001:2016 and ISO45001:2018 standards.

"We are proud of our comprehensive solutions for the semiconductor industry," said Mark Magill, Vice President of Medium High Vacuum at Busch Vacuum Solutions. "SubFab service capabilities and innovative products provide customers with reliable performance and maximum process safety to achieve optimal yields."

Magill also said they are featuring a new patented redundancy vacuum system at the show, “It uses an optimized combination of two pumps plus one booster to minimize changes in chamber pressure in case of pump failure.” This vacuum system eliminates wafer scrap and process excursion.

Visit Busch Vacuum Solutions at SEMICON WEST from July 11-15 in San Francisco, CA. Meet their experienced vacuum experts, exchange ideas and get valuable advice at booth #541.

About Busch
For more than 50 years, Busch has been an integral part of the global semiconductor industry by providing reliable solutions that enable manufacturers to produce advanced microchips. Their commitment to quality is in every product they offer and service provided. Continuous advancements ensure that Busch solutions are always state-of-the-art and used by hundreds of subfabs worldwide. www.buschusa.com | [email protected]

• Read more about Busch Vacuum Solutions Exhibiting at SEMICON West 2023