PENANG, MALAYSIA - OCTOBER 2023 Curious about how Integrated Circuit (IC) manufacturers keep pace with fast-changing technology? Discover how automated systems are revolutionising the semiconductor industry, enhancing production efficiency and cost-effectiveness.

ViTrox, which aims to be the world’s most trusted technology company, is thrilled to introduce a game-changing addition to our advanced machine vision inspection solutions: the 4-sided Auxiliary (AUX 4S+) Inspection Module. This exciting optional add-on feature is designed with our customers' needs in mind and is set to elevate the capabilities of Tray-to-Tray Vision Inspection Handler – TH3000i and Tray-to-Tape & Reel Vision Inspection Handler – TR3000i.

Our Tray-Based Vision Handlers, the TH3000i and the TR3000i are high-quality machine vision inspection solutions that support emerging industries like 5G, IoT, Automotive, and Industry 4.0, with the main difference being their handling mechanism. Both tray-based handlers are designed to support inspection capabilities that accommodate IC package sizes up to 120 mm x 120 mm, including BGA, QFP, QFN, CSP, TSSOP, MSOP, and SOP. In addition, both solutions offer an array of benefits, such as high-speed IC inspection, easy operation, quick conversion time, and low maintenance cost.

The auxiliary module inspection function enables more precise defect detection that occurs at the sides of the semiconductor device. This is achieved via dedicated optics, lighting and software algorithms. The optional advance inspection function is particularly beneficial for customers who demand stringent product quality, especially for automotive, computing, and telecommunications end-applications.

The AUX 4S+ elevates electronics manufacturing to the next level by providing a comprehensive 4-sided inspection solution. It's all about ensuring the highest quality and reliability of customers’ electronic components. Explore the awe-inspiring capabilities of the AUX 4S+ showcased below.:

Enhanced Inspection Capabilities
The AUX 4S+, built upon an innovative design concept, goes beyond conventional inspection capabilities. In addition to the bottom and side vision station, it features an additional vision module dedicated to performing direct side view inspections on specialised devices like Power Devices, Land Grid Array (LGA), and Ball Grid Array (BGA) with Metal Lid components. This advanced hardware concept incorporates high-performance cameras, precision lighting, and motorised focusing mechanisms, ensuring adaptability across a wide range of package sizes. Furthermore, its cutting-edge software concept employs advanced algorithms tailored for intricate inspections. As a result, the AUX 4S+ significantly enhances inspection capabilities, meticulously inspecting products from all angles, reducing the risk of unnoticed defects, and ultimately upholding the highest standards of quality and reliability.

Seamless Integration
Designed for seamless integration with your TH3000i and TR3000i models, the AUX 4S+ offers vision-enabled flexibility and ease of use in inspection processes. This integration streamlines workflow by harnessing the power of advanced vision technology. It reduces downtime and minimises manual intervention, resulting in faster and more efficient inspections. This vision-enabled workflow optimisation allows users to meet production schedules, reduce operational costs, and deliver products to customers with uncompromised quality.

Comprehensive Inspection Coverage
The existing TH3000i and TR3000i solutions offer 3D vision inspection, Leaded Packages Inspection, Ball Packages Inspection, Leadless Packages Inspection, Top 3D POP Inspection, 2D Barcode Inspection, Mark Inspection, Package Vision Inspection, Passive Component Inspection, and 6-sided (6S) Colour Inspection. By adding the AUX 4S+ vision inspection module, users can now comprehensively cover a wide range of inspection items, including side package defects, Lid Gap inspection, Package Height inspection, and more. With the advanced vision capabilities to ensure meticulous inspection of every detail, users can save initial costs of investments as they can now rely on one solution for various inspections.

Versatile Package Size and Thickness Support
Another significant advantage of the AUX 4S+ vision inspection module is its versatility when it comes to accommodating component sizes. From compact 2x2 mm to spacious 120x120 mm packages, the system seamlessly adapts with minimal need for conversion kits. Additionally, it offers automated conversion, effortlessly transitioning between these diverse package sizes. This not only simplifies users’ inspection operations but also minimises the need for costly specialised equipment. As a result, it improves production efficiency and keeps the operational cost to a minimum.

At ViTrox, we are dedicated to empowering users with cutting-edge solutions to enhance product quality and manufacturing efficiency. The AUX 4S+ is the latest testament to our commitment to innovation and excellence; it's a game-changer for electronics manufacturing processes.

Are you interested in learning how to further enhance your IC package inspection for better results? Get in touch with us at [email protected] to learn more about our impressive AUX 4S+ feature and master the art of automation!

About ViTrox Technologies
ViTrox is committed to being the World’s Most Trusted Technology Company and the leading solutions provider through the most innovative, advanced, and cost-effective machine vision solution of excellent quality to its customers by integrating ViTrox’s technologies, people, and strategic alliances.

ViTrox offers a full spectrum of solutions, ranging from Middle & Back-end Semiconductor Inspection Solutions, SMT PCB Assembly Vision Inspection Solutions, Integrated Industrial Embedded Solutions, and Industry 4.0 Manufacturing Intelligence Solutions. ViTrox is headquartered in Penang, Malaysia, with offices in Asia, Germany, and the United States and sales and support sites worldwide.

For more information about ViTrox’s products and services, please visit www.vitrox.com.

• Read more about Elevate Your Tray-Based Inspections with our Latest Configuration – the AUX 4S+ Inspection Module!

Deventer, September 28, 2023 – RoodMicrotec N.V., a leading independent company for semiconductor supply and quality services, and Angst+Pfister Sensors and Power AG, an independently operating company of the Angst+Pfister Group, today announce their cooperation for testing semiconductor-based temperature sensors. These highly accurate sensors are able to measure extremely fine temperature differences down to +/-0.1 °C in wide temperature ranges from -45 °C to 130 °C.

Such sensitive and particularly accurate sensors will subsequently be used in industrial applications, in medical technology, and in the automotive sector and thus have to be tested with the greatest precision. In addition, these sensors have a very small drift, a repetition accuracy of 0.01 °C and a extremely fast reaction speed. Another advantage is that the sensor can be customized. The housing, the sensor technology, or the cables can be specially adapted to customer requirements.

"For this project, it was important for us to have a reliable partner who works with the utmost care. As our high-quality components are often used in very sensitive areas, they need to be tested at the highest level," says Robin Ellinger, Product Manager Temperature Sensors of Angst+Pfister Sensors and Power.

For RoodMicrotec, this collaboration means a great appreciation of its capabilities, as the company specializes in the precise testing of highly sensitive components.

"We are really pleased that the quality of our work and our capabilities are so highly appreciated in the semiconductor business. For us, the most fundamental basis of a strong cooperation is mutual trust," says Martin Sallenhag, CEO of RoodMicrotec.
About Angst+Pfister Sensors and Power AG

About Angst+Pfister
Angst+Pfister Sensors and Power AG belongs to the Angst+Pfister Group. The Group´s headquarter is located in Switzerland. It has been a leading developer and manufacturer of technical components and engineering solutions for more than 100 years. With local sales and technical support units as well as logistics centers all over the world, the company serves more than 20,000 customers of numerous industries in over 50 countries. Angst+Pfister operates state-of-the-art research and development centers in Switzerland, Turkey, and Italy. Furthermore, the company runs its own production facilities for elastomer and rubber-metal parts and compounds in Switzerland, Turkey, Italy, Denmark, China, and Vietnam. To complement the capabilities, Angst+Pfister has production partners in over 15 countries, thus enabling the Group to always be at the cutting edge of technology.

Angst+Pfister attaches the utmost importance to reliability and flexibility as well as the respectful and fair treatment of all people who are somehow correlated with them. In proactively implementing the principles of the "United Nations Global Compact", Angst+Pfister pursues the goal of sustainability in all its activities in order to have a positive impact on our planet and society through pragmatic, meaningful, and measurable initiatives.

For more information please visit www.sensorsandpower.angst-pfister.com

About RoodMicrotec
With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is a leading independent company for semiconductor supply and quality services. RoodMicrotec is a highly valued partner for many companies worldwide and offers specifically tailored turnkey solutions for each single customer's requirements. The turnkey services include project management, wafer test, assembly, final test, qualification, failure analysis, and logistics. All services provided by RoodMicrotec meet the high quality standards of the automotive, industrial, healthcare, and high reliability aerospace sectors. RoodMicrotec is headquartered in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany.
For more information, please visit https://www.roodmicrotec.com

This press release is available in English and German. In case of conflict between these versions, the English version shall prevail.

• Read more about Test of Semiconductor-based Temperature Sensors for Angst+Pfister

Industry survey finds 83% of respondents would be more inclined to buy used equipment with money-back guarantee.

Moov, the largest and fastest growing global marketplace for used semiconductor equipment, today announced changes to its industry-first “Money Back Guarantee” (‘MBG’) program that will expand access to buyers by eliminating the premium previously associated with this warranty. Moov will now offer its no-questions-asked, money-back guarantee free of charge for end users (semiconductor manufacturers) who purchase semiconductor equipment and parts through Moov’s global marketplace, valid on over 90% of inventory. This announcement comes as Moov’s marketplace surpasses another milestone, exceeding $4bn FMV in active listings for pre-owned semiconductor manufacturing equipment.

Historically, reliability has been a significant barrier for semiconductor manufacturers looking to incorporate secondhand equipment in their procurement strategies. In fact, this problem has been so pervasive that 81% of industry respondents surveyed by Moov “strongly agree” or “agree” that reliability is a top barrier to purchasing secondhand semiconductor manufacturing equipment.

“Reliability is arguably the biggest barrier to the growth of the global secondary equipment market, and the growth of used equipment as a percentage of fabs’ overall equipment spend,” said Steven Zhou, CEO and cofounder of Moov Technologies. “In growing Moov to become the world’s largest marketplace for used equipment, solving the reliability challenge is at the core of just about everything we’ve built – from verified listings to digital inspections, white-glove logistics, and most importantly our no-questions-asked money-back guarantee.”

A money-back guarantee fundamentally shifts risk away from buyers and significantly impacts manufacturers’ willingness to purchase used equipment. Indeed, 83% of industry respondents agreed that they would be more inclined to purchase secondhand equipment if offered a 100% no-questions asked money-back guarantee.

Moov’s decision to offer its MBG free to all buyers reflects its commitment to quality.

“We eliminated the small premium on this program because Moov stands by the quality of our service and inventory on our marketplace,” said Raymond Mahon, Head of Customer Success at Moov. “All eligible purchases on Moov will now include our no-questions-asked, money-back guarantee so that buyers can fully leverage the secondary market as an integral part of their procurement strategy – without the risk historically associated with purchasing secondhand equipment.”

To learn more about Moov’s Money Back Guarantee program visit www.moov.co/services.

About Moov Technologies Inc.
Headquartered in Tempe, Arizona, and Austin, Texas, Moov is a technology-driven marketplace and asset management platform that matches buyers and sellers of pre-owned semiconductor manufacturing equipment. Built by a team with more than 50 years of experience in the manufacturing equipment brokerage industry, Moov's platform ensures accurate listings and faster transactions. CEO Steven Zhou and Managing Director Maxam Yeung co-founded the company in 2017. To learn more, please visit Moov.co.

• Read more about Moov Offers Money-Back Guarantee Free to First Time Buyers, Expanding Global Access to Secondhand Semiconductor Equipment

SANTA BARBARA, CA – September 1, 2023 – Sikama International Inc., in collaboration with AirProducts Inc.™, is proud to announce the full commercial launch of its acid-free Electron Attachment (EA) Fluxless Reflow Soldering System, a revolutionary step for the Advanced Packaging Semiconductor sector.

The innovative technology behind this system is based on the Electron Attachment (EA) principle for activating hydrogen, a method that AirProducts has been refining for the past 15 years to efficiently reduce surface oxides. The EA technology is engineered to break down H₂ molecules into hydrogen anions, which are then targeted towards the soldering surfaces to effectively clean and reduce oxides before the reflow process. Additionally, this technology operates at ambient pressure and temperatures well within the window of traditional reflow processes.

The key advantages of this technology include:
• Truly Residue-Free: Enhanced reflow quality without flux-induced solder voids and wafer contamination. No post-reflow cleaning equipment is required and significantly less oven cleaning.
• In-line Process: Easily integrated into existing manufacturing lines without batch processing. The EA process occurs immediately before the reflow process.
• Environmental Impact: The EA flux-free process is entirely residue-free and environmentally benign with no organic vapors, hazardous residues, or CO2 emission.
• Ambient Pressure and sub-reflow temperatures: No vacuum requirements and safely processes substrates.

Sikama, as the exclusive global integrator of this technology and partner with AirProducts, views the technology and equipment commercialization as “a game-changer for this industry, as the need for advanced solutions to packaging evolutions in the semiconductor industry continue to evolve”, according to Herb Weigel, President and CEO of Sikama International.

The Sikama EA1200 Solder reflow oven is certified to EN 600204-1, SEMI S2/S8/S22/S23/F47/E6, is CE certified, and is verified to be compliant with NFPA79 in installed applications. Nearly 50 Worldwide Patents have been issued on this technology. The technology is well suited to provide significant benefits to small geometries in wafer bumping, copper pillar, and flip chip applications.

Established in 1982, Sikama International, Inc. designs and produces its products in Santa Barbara, California. Their reflow system offerings provide exceptional performance, with the fluxless systems set to redefine industry standards.

Reliable. Repeatable. Responsible. Reflow.

About Sikama
For over 40 years, Sikama International has offered highly reliable equipment and is the trusted option of manufacturers worldwide.

• Read more about Sikama International Announces Full Commercialization of Acid-Free “Electron Attachment” Fluxless Solder Reflow System

Brewer Science unveils innovative advanced packaging solutions at SEMICON Taiwan and Advanced Packaging Summit 2023
Innovative bonding materials presented at leading Asia technology conferences

Tapei, Taiwan – August 28, 2023 – Brewer Science, Inc., will present new developments in temporary and permanent bonding material technologies for advanced packaging this week at Asia’s two premier technology conferences, Advanced Packaging Summit on September 5th and SEMICON Taiwan from September 6th – 8th.

Dr. Dongshun Bai, Brewer Science's Senior Technologist & Business Development Director, spearheads a decade-spanning journey in semiconductor advancements. His expertise will be on display at the Advanced Packaging Summit, hosted by SEMI, where he will delve into his presentation titled "Novel Materials for Advanced Packaging". Dr. Bai will discuss new material improvements for advanced packaging, focusing on excellent bonding uniformity, optimizing adhesion for high-density substrates, ensuring high-temperature stability, and groundbreaking innovations in surface modification.

Brewer Science continues at SEMICON Taiwan, hosted at the TaiNEX 1&2 in Taipei from September 6th to 8th. Ms. Rama Puligadda, Chief Technical Officer at Brewer Science, takes the stage at the Heterogeneous Integration Global Summit. Scheduled for September 7th at 11:50am (Taipei Time), her presentation, "Recent Advances in Materials for Advanced Packaging", will illuminate advancements powering hybrid bonding, fan-out packaging, 3D/2.5D technology, and embedded solutions for heterogeneous semiconductor integration.

Ms. Puligadda's presentation will underscore the pivotal role of materials innovation in enabling cutting-edge packaging technologies. Addressing challenges in 3D/2.5D packaging, flexible solutions, and fan-out packaging, her insights will unveil how Brewer Science's advanced materials enable innovative packaging design, miniaturization, functionality, and cost-effectiveness.

In conjunction with the events, Brewer Science announces the launch of BrewerBOND® 703 laser release material, which reduces the risk of UV damage during laser debonding. The new material combines high UV absorption capabilities with ultra-low UV transmittance properties to provide a safeguard against UV laser energy interference on delicate device wafers. Learn more about this material by visiting Brewer Science's booth at SEMICON Taiwan or submitting an inquiry through the company's official website.

Throughout the events, Brewer Science's experts will be stationed at booth K2470 in the SEMICON Taiwan Exhibit Hall, available for engaging discussions and insightful demonstrations. Join them on:
• Wednesday, September 6: 10:00am–5:00pm
• Thursday, September 7: 10:00am–5:00pm
• Friday, September 8: 10:00am–4:00pm

For those unable to attend the conferences, Brewer Science extends an open invitation to explore their Temporary Bonding and Debonding Services and Permanent Bonding Materials webpages. You can also request datasheets or schedule expert-led consultations through the company's website.

About Brewer Science
Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique quality monitoring systems for water and air applications. We are Certified Employee-Owned and a Certified B Corporation™, using our business as a force for good. Our headquarters are in Rolla, Missouri, with customer support throughout the world. Learn more at www.brewerscience.com.

• Read more about Brewer Science unveils innovative advanced packaging solutions at SEMICON Taiwan and Advanced Packaging Summit 2023

Sikama International, a trusted provider of state-of-the-art reflow systems is proud to announce their new partnership with CMT, a global leader specializing in back-end semiconductor solutions.

CMT was formed in August 2010 by Mr. CW Kwak, who has over 30 years experience in the semiconductor industry. CMT offers both material and equipment solutions in the back-end semiconductor assembly market.

CMT is a unique global marketing and sales company. CMT focuses on a micro-level marketing working directly with clients and customers through offering specific projects, right beta sites, and global project management. CMT focuses on short-term projects to deliver sales on client’s current products, then offers mid-term projects for next 2-3 years, and long-term programs 5-10 years out to deliver continuous long-term growth and sustainability.

Sikama’s new partnership with CMT will enable both companies to expand their reach to provide customers with an expansive range of solutions on a global platform.

About Sikama
For over 40 years, Sikama International has offered highly reliable equipment and is the trusted option of manufacturers worldwide.

• Read more about Sikama International Strengthens Worldwide Distributor Network by Partnering with CMT Global to Support Korean and International Markets