Munich, Germany – July 15, 2024 – Industry experts will gather November 14-15 at the SEMI MEMS & Imaging Sensors Summit to explore the latest MEMS and sensors technological developments and their role in driving the next generation of connectivity across various industries. Themed Sensor Revolution for a Connected Future, the event will be held at the International Congress Center Munich (ICM) in Munich, Germany. Registration is open.

Hosted by SEMI Europe and the MEMS & Sensors Industry Group, a SEMI Technology Community, the summit will feature a comprehensive program designed to provide valuable insights into market dynamics, technological innovations, and sustainable practices. Attendees will be able to engage with thought leaders and gain knowledge on critical semiconductor industry topics.

“We look forward to bringing together international industry experts to share with us their vision and to collaborate on the latest MEMS and imaging technologies innovations driving the future of connectivity,” said Laith Altimime, President of SEMI Europe. 

MEMS & Imaging Sensors Summit Sessions

Session 1: Market Dynamics: Landscape and Growth Strategies

Industry leaders will discuss market dynamics and growth strategies, along with the latest technological innovations and future trends driving the market for MEMS and imaging sensors. Attendees will gain valuable insights into the opportunities and challenges faced by the MEMS and imaging sensor industry, and learn how to leverage these trends to fuel growth and innovation within their companies.

Session 2: MEMS: Exploring Future Trends for Technologies and Device Manufacturing 

Speakers will explore the latest developments and trends in MEMS technology, including roadmaps and market forecasts. Presenters will spotlight advancements for new MEMS devices in key applications.

Session 3: Imaging – Exploring Future Trends for Technologies and Device Manufacturing 

Experts will deep dive into the latest developments and trends in imaging technology, including roadmaps and market forecasts. Special attention will be given to advancements for new imaging devices in key applications.

Session 4: Sustainable Supply Chain Capabilities 

Experts will highlight how the industry can contribute to sustainability through production methods and by enhancing performance in various applications. Attendees will gain a comprehensive understanding of the technological innovations driving improved efficiency and sustainability within the industry.

Session 5: Innovations for Next-Gen Applications: Agriculture 

Speakers will discuss the practical applications of innovations in MEMS and imaging sensor products for agriculture, addressing the unique challenges faced by the industry in this sector. The session will focus on short-wave infrared applications and the integration of AI, highlighting how advanced technologies are transforming agricultural practices.

Session 6: MEMS and Imaging Young Talent 

Entrepreneurs, start-up companies, graduates, and industry newcomers will show their research and early-stage products to the summit audience. The main goal of this session is to spotlight new talent interested in the semiconductor industry and provide them with insights for a successful career launch.

Session 7: Innovations for Next-Gen Applications: Smart Mobility 

Experts will explore the practical applications of innovations for MEMS and imaging sensor products for Smart Mobility, addressing the unique challenges faced by the industry. The session will focus on short-wave infrared applications and the integration of AI, highlighting how advanced sensing technologies are driving innovation and meeting industry needs.

Session 8: Innovations for Next-Gen Applications: Health

Speakers will showcase how innovations in MEMS and imaging sensor products are being applied in the healthcare sector, tackling industry-specific challenges and addressing unique operational requirements. The presentations will explore short-wave infrared applications and the seamless integration of AI, illustrating the transformative impact of cutting-edge sensing technologies on innovation and industry adaptation.

Exhibition and Business Networking 

The exclusive exhibition will showcase leading companies driving the future of MEMS, imaging and sensors design and manufacturing including: AGP, Eurofins | MASER, FormFactor, Philips MEMS & Micro Devices, Pyxalis, QP Technologies, and many more. 

To reserve an exhibition space, contact [email protected].

The MEMS & Imaging Sensors Summit will provide numerous networking opportunities, including a networking reception and dinner. The event's location has allowed SEMI Europe to schedule more sessions and reach a broader and more diverse audience across the semiconductor supply chain.

MEMS & Imaging Sensors Summit Premium Sponsors: Comet Yxlon, KLA, Infineon.

For more information, please visit the MEMS & Sensors Imaging Summit website.

Stay connected with SEMI Europe on X or LinkedIn @SEMIEurope: #SensorsSummit #MEMS #Imaging #SEMIEurope

About SEMI 

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more. 

Association Contacts 

Sitong He / SEMI Europe 
Phone: +49 151 5546 2638
Email: [email protected]  

Samer Bahou/SEMI US
Phone: 1.408.943.7870
Email: [email protected] 

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scia Systems’ high-precision ion beam process solutions are enabling the automotive, cloud computing, AR/MR, and mobile communications industries

Chemnitz, Germany, July 1, 2024 – scia Systems GmbH, an industry leader in advanced ion beam and plasma process equipment for microelectronics, MEMS, and precision optics industries, today announced that it will highlight key advances in ion beam processing for semiconductor, sensor and photonic integrated circuit (PIC) manufacturing at SEMICON West 2024. The premier microelectronics event will be held July 9-11, 2024, at the Moscone Center in San Francisco, Calif. scia Systems’ high-precision solutions are playing an essential role in enabling many of today’s high-growth consumer and industrial applications.

According to Dr. Michael Zeuner, CEO of scia Systems, “As semiconductors, sensors, and optical devices increase in complexity due to smaller features, new exotic materials, and more layers and complex structures, the processes used to manufacture them require higher levels of precision. Our advances in ultra-precision ion beam process technologies are enabling manufacturers’ success in producing these devices, which are driving cloud computing, augmented/mixed reality (AR/MR), automotive, telecommunications, and many other industries. A case in point, every modern cell phone has components that have been manufactured using a scia Systems product. We look forward to highlighting these solutions, as well as the many high-growth applications that they enable, at SEMICON West – the premier event for the semiconductor ecosystem.”

Ion beam etching solutions enable significant growth in photonic integrated circuits
Demand for PICs is growing rapidly in telecommunications and data centers due to their wide bandwidth, low transmission loss, and numerous other advantages over traditional electronic integrated circuits. Integrating new materials, material stacks, and designs requires new etching solutions. scia Systems’ advanced ion beam etching and trimming processes enable manufacturing of three-dimensional optoelectronic microstructures for PICs, such as waveguides and other optical components. Reducing microroughness by ion beam trimming is another promising application area that enhances the production of high-performance PICs. Further applications include nano-structured surface relief gratings for AR/MR systems, and surface form error correction for telescope mirrors, X-ray optics, lenses, and conventional optics.

Ion beam etching technology produces GMR/TMR sensors for mega markets
High-precision sensors that use magnetic storage, most notably giant magnetoresistance (GMR) and tunnel magnetoresistance (TMR) sensors, are used to detect any type of motion including proximity, rotations or vibrations. These have been rapidly adopted across a wide variety of industries and applications, including automotive electronics, industrial equipment, and cloud storage. However, the complex, multi-layer composition of these sensors creates significant challenges for traditional chemical and dry etching processes, which have difficulty processing magnetic materials. scia Systems overcomes these limitations with its high-precision ion beam etching technology, enabling the manufacture of high-performance GMR sensors for flexible and wearable electronics, including AR/MR headsets, and TMR sensors for Internet of Things (IoT), automotive, smart home, eMobility, and many other applications.

Ion beam etching solutions for precision reverse engineering of ICs
Reverse engineering is an essential step in semiconductor manufacturing. By conducting verification, failure analysis, and research of internal device structures, engineers can isolate and troubleshoot problems to improve manufacturing yields. Reverse engineering involves exposing internal components, delayering to analyze each layer of the device, imaging, and post-processing. Conventional delayering processes such as wet chemical etching, CMP or plasma etching are often expensive, error-prone, and limited in application. scia Systems’ ion beam etching technology enables precise processing within the micro- and nanometer-size range and atomic-level-thickness range for different materials at once.

See scia Systems at SEMICON West
SEMICON West attendees interested in learning more about scia Systems and its advanced ion beam and other thin-film process solutions are invited to visit the Moscone Center North Hall, Booth #553 on July 9-11 in San Francisco.

About scia Systems GmbH
Founded in 2013, scia Systems is a technology leader in thin-film process equipment based on advanced ion beam and plasma technologies. The systems are used for coating, etching, and cleaning processes with nanometer resolution and have been successfully implemented in various high-tech industries worldwide, including microelectronics, MEMS, and precision optics industries. For more information, visit the company’s website at www.scia-systems.com.

• Read more about SCIA SYSTEMS HIGHLIGHTS ADVANCES IN ION BEAM PROCESSING FUELING SEMICONDUCTOR MEGA MARKET TRENDS AT SEMICON WEST 2024

Verific Design Automation today affirmed its position as the leading provider of front-end platforms powering an emerging electronic design automation (EDA) space by collaborating with a group of well-funded artificial intelligence (AI) EDA startups.

These new AI EDA companies use Verific’s unsurpassed language support for fast, accurate large language model (LLM) development, speeding time to market for products that range from functional verification, chip design to code development.

AI EDA providers PrimisAI and Silimate, founded by former chip designers, will be in the Verific booth (#1414) AI showcase at the 61st Design Automation Conference (DAC) June 24-26 at Moscone West in San Francisco.

“This new and exciting market segment is about to change the entire makeup of the EDA industry,” says Rick Carlson, vice president of Verific. “We are about to see a variety of tools, technologies and methodologies destined to change the way chip design and verification is done.”

Introducing the EDA Startups Ushering in the Era of AI EDA
PrimisAI and Silimate will be showcased in the Verific DAC booth and present their unique use of AI technology to eliminate error-prone repetitive tasks for efficient and more productive chip design.

PrimisAI offers a generative AI solution for chip design with advanced language-to-code and language-to-verification capabilities through its interactive AI assistant to address complex hardware challenges across the entire design stack from concept to bitstream/GDSII. RapidGPT, unveiled earlier this year, lets engineers interact with their design and the entire EDA ecosystem with a natural language interface, boosting productivity and accelerating time-to-market. Founded by serial entrepreneur Naveed Sherwani who serves as chairman and CEO, PrimisAI is backed by two early-stage investors.

“Verific’s front-end platform lived up to its well-earned status of industry standard as we implemented it in RapidGPT,” remarks Pierre-Emmanuel Gaillardon, CSO of PrimisAI. “The robustness and quality of the Verific front-end platform ensured we would deliver a tool that would give engineers a seamless and efficient workflow.”

Silimate, backed by Y Combinator, is building the co-pilot for chip designers to help build better chips faster. Silimate finds functional bugs, predicts power, performance and area (PPA) issues, and recommends real and accurate fixes in real time, and is already being used by chip teams building complex IP and SoCs. Co-founders Ann Wu and Akash Levy previously built chips and EDA tools at Apple, Stanford, NVIDIA, and Synopsys.

“Verific consistently produces quality products and offers exceptional quality support,” comments Wu. “Their parsers are fantastic and result in very quick tool bring-up times for our customers.”

Metalware co-founded by Ryan Chow and Andrew Nedea is another Verific front-end platform user. It was started with initial funding from Y Combinator with the mission to accelerate embedded development using AI technology after personally experiencing repeated bottlenecks in embedded software at SpaceX. The Metalware AI EDA tools help designers rapidly write HDL and embedded C/C++ by combining insights from manuals, datasheets and code, offering 10x faster development by automating low-level programming.

“Verific embodies our stated goals to reduce the time it takes to design chips and systems,” affirms Chow. “Verific and its team of experienced EDA engineers have shown repeatedly that its front-end platforms enable a project that would normally take days to be completed in hours.”

Another AI EDA startup in stealth mode is also a new Verific user. Details will be announced shortly.

DAC AI Showcase
Verific will demonstrate its SystemVerilog, Verilog, VHDL and UPF front-end platforms, while PrimisAI and Silimate will be in the Verific DAC Booth #1414 at various times of the day to give 10-minute presentations.

DAC will be held from Monday, June 24, through Wednesday, June 26, from 10 a.m. until 6 p.m. at Moscone West in San Francisco.

To arrange a demonstration or private meeting, send email to [email protected]

DAC registration is open.

About Verific Design Automation
Verific Design Automation is the leading provider of SystemVerilog, Verilog, VHDL and UPF Parser Platforms that enable project groups to develop advanced electronic design automation (EDA) products quickly and cost effective worldwide. With offices in Alameda, Calif., and Kolkata, India, Verific has shipped more than 60,000 copies of its software used worldwide by the EDA and semiconductor industry since it was founded in 1999.

Engage with Verific at:
Email: [email protected]
Website: www.verific.com
LinkedIn: https://www.linkedin.com/company/verific-design-automation-inc/
Facebook: https://www.facebook.com/Verific-Design-Automation-100448363329771/

• Read more about Verific’s Front-End Platforms Now Powering AI EDA Startups, Serving as Foundational Technology for a New and Emerging Market

Kitchener, Ontario, June 13, 2024 – PEER Group®, the largest supplier of innovative factory automation software products for the semiconductor industry, will launch the latest versions of its best-in-class automation and connectivity products at SEMICON West 2024.

The new versions of PEER® Tool Orchestrator (PTO®) and EIB® OEM feature multiplatform support for Windows and Linux, the latest technologies including Microsoft .NET and gRPC, and the ability to be deployed as a container.

“We’re excited to launch the latest versions of our flagship products, PTO and EIB OEM at booth 339 during SEMICON West,” says Mike Barrett, PEER Group’s Vice President, Global Sales. “By continuously reinvesting in our products, we make sure our customers get access to the latest technologies and advancements in tool automation and connectivity. Now, with PTO and EIB OEM, our customers benefit from more deployment flexibility, higher performance, reduced costs, and faster time to market.”

Cybersecurity forum
Building on the momentum of last year’s SEMICON West Global Cybersecurity Forum and subsequent establishment of the SEMI Semiconductor Manufacturing Cybersecurity Consortium (SMCC), SEMI is presenting an all-new forum for 2024, Assuring Cybersecurity Resilience Through Industry Partnership.

Hosted by Doug Suerich, PEER Group’s Director of Marketing and Governing Council member of the (SMCC), the forum will feature presentations from cybersecurity thought leaders who will share best practices examples from other industries and how they can be adopted by semiconductor manufacturing. Attendees will also learn about the progress made by the SMCC and the different ways industry members can get involved in helping guide the best path forward to securing and protecting our supply chain.

Smart Manufacturing Pavilion
Suerich will also perform moderating duties at the Smart Manufacturing Pavilion Stage, which will feature presentations on the latest advancements in smart manufacturing, including digital twins, AI, automation, and more.

To learn more about PEER Group’s presence at SEMICON West 2024, or to book a meeting during the show, visit: .

About PEER Group
PEER Group® is the largest supplier of innovative factory automation software products for the semiconductor industry. Since 1992, our solutions have helped the world’s most advanced OEMs and factories reduce time to market and lower costs by solving their equipment automation, data management, and process control problems. An award-winning company, PEER Group’s commitment to quality has been recognized by Intel’s EPIC Supplier Program, naming PEER Group a Distinguished Supplier in 2024. Follow PEER Group on LinkedIn.

• Read more about PEER Group launching latest products at SEMICON West

Axiomise, a company noted for enabling formal verification adoption, today announced the formation of its Technical Advisory Board and its first two members, Dr. Vidya Chandran Darbari and Colin McKellar.

Dr. Darbari is an Axiomise co-founder and company director as well as Senior Lecturer in Structural Biology at Queen Mary University of London (QMUL). McKellar, formerly Vice President of Imagination Technologies, is currently Senior Director of Hardware at X-Silicon Inc.

“Vidya and Colin have long served as my unofficial advisers and confidants as I built Axiomise from the ground up,” remarks Dr. Ashish Darbari, founder and CEO of Axiomise. “Formalizing our relationships with Vidya and Colin will further strengthen the company and the expertise of our formal verification experts.”

“I have had the pleasure of watching Axiomise grow from early startup to a formidable verification provider and I couldn’t be prouder,” states Dr. Darbari. “I look forward to adding my voice as a member of the Technical Advisory Board.

My relationship with Ashish goes back to the early days of Imagination,” notes McKellar. “I watched with amazement and respect as he implemented a rigorous formal verification flow that caught bugs that would have forced costly respins and threats to the company’s good name and reputation.”

About Dr. Vidya Chandran Darbari
Dr Vidya Chandran Darbari, an Axiomise co-founder and company director, has a multi-disciplinary record combining medicine, life sciences, mathematics and technology. A leader and key contributor who leads from the front, Dr. Darbari helped steer Axiomise from its early stages to establishing it as a global leader in formal verification consulting and services, training and RISC-V solutions. She is a senior lecturer at the Queen Mary University of London with several impactful publications in high-end journals including Nature and Science. Dr Darbari received her Bachelor of Medicine, Bachelor of Surgery (MBBS) degree from Seth G.S. Medical College (KEM Hospital) in Mumbai, India, before completing her Master of Technology (MTech) degree from Indian Institute of Technology (IIT) Bombay. Dr. Darbari obtained her Doctorate degree from the University of Cambridge. She has been recognized for her innovative research through Biochemical Society Early Career Award, British Crystallographic Society Early Career prize and recently a Research Excellence Award by the Science and Engineering Faculty at QMUL.

About Colin McKellar
Colin McKellar brings the customer experience to the Axiomise team having been a key player in driving customer engagements in his previous roles with Apple, Intel, TI, SiFive and SEGA among others. He started his career in electronics 30 years ago in Sony Broadcast and Professional working on HD video encode and decode. Most of his career was spent working at Imagination Technologies as a key contributor to the graphics IP roadmap and was instrumental in bringing in and maturing a world-class verification infrastructure including simulation, formal verification and large FPGA, emulation and silicon farms. McKellar joined X-Silicon in 2023 with the responsibility to drive product and execution for bringing graphics and AI acceleration to the RISC-V ecosystem. He has a wealth of design and verification experience across GPU, CPU, AI and SoC chips successfully managing large multinational teams of more than 200 engineers.

About Axiomise
Axiomise is accelerating formal verification adoption through its unique combination of training, consulting, services and specialized verification solutions for RISC-V. Axiomise was founded by Dr. Ashish Darbari, FBCS, FIETE, DPhil (Oxford), who has been a formal verification practitioner for more than two decades with 60 patents in formal verification and over 70 publications.

Engage with Axiomise at:
Website: www.axiomise.com
Twitter: @axiomise
LinkedIn: https://www.linkedin.com/company/axiomise/
Facebook: https://www.facebook.com/axiomise

• Read more about Axiomise Names Two Executives to Newly Formed Technical Advisory Board

Sunnyvale, USA - Meylan, FRANCE – May 29, 2024 Numem - a leader in high-performance Memory IP Cores and Memory Chip/Chiplet based on its patented NuRAM (MRAM) and SmartMem technologies, and IC’ALPS - a leader in ASIC/SoC design and supply chain management, have pooled their expertise to meet the challenge of developing an ambitious integrated circuit with RISC-V processors, 2MBytes of NuRAM and a DSP/AI Custom Datapath Accelerator. The Custom SoC was developed in an advanced technology node.

This SoC has been designed and implemented to highlight the Numem high-performance, low power Memory subsystem with a RISC V Processor and AI Accelerator for ultra-low power applications. It has been developed through a close collaboration between Numem and IC’ALPS.

The physical implementation of this integrated circuit was made in a secure space (isolated location, network, and servers, encrypted exchanges, etc.) to meet with the stringent protection of sensitive data required by this program.

“We were very pleased with the collaboration and quality of service provided by IC’ALPS which made this on-time tape out possible and first time functional silicon,” said Jack Guedj, CEO of Numem. NuRAM with SmartMem is a high-performance memory subsystem which is 2-3x smaller and boast significant power reduction over SRAM,” he added.
 
Lucille Engels, COO of IC’ALPS indicated: “The challenges were numerous including: architecture, power domains, protection of the sensitive data, run times pushing improvement of EDA flow and the pressure of the tape out deadline.”

Numem and IC’Alps intend to extend their partnership to serve new customers SoC projects – feel free to contact us.

NUMEM/IC'ALPS with ultra-low-power SoC for Sensor and AI

About NUMEM
Numem, headquartered in Sunnyvale, California, is the leading provider of Memory Subsystem Chip/Chiplet and IP based on proven foundry MRAM process. Numem’s patented NuRAM technology enables best in class power/performance and reliability with 2.5x smaller area and 85x lower leakage power than traditional SRAM. Numem’s SmartMem subsystem technology significantly improves performance and endurance as well as ease-of-use and reliability for high-volume deployment and enables to reach ultra-high bandwidth.
Visit our website at https://www.numem.com or contact us at [email protected].

About IC’Alps
IC’Alps is your one-stop-shop ASIC partner. Based in France (HQ in Grenoble, two design centers in Grenoble and Toulouse), the company provides customers with a complete offering for Application Specific Integrated Circuits (ASIC) and Systems on Chip (SoC) development from circuit specification, mastering design in-house, up to the management of the entire production supply chain. Its areas of expertise include analogic, digital and mixed-signal circuits (sensor/MEMS interfaces, ultra-low power consumption, power management, high-resolution converters, high voltage, signal processing, ARM and RISC-V based multiprocessors architectures, hardware accelerators) on technologies from 0.18 µm down to 5 nm, and from multiple foundries (TSMC, Global Foundries, Tower Semiconductor, X-FAB, STMicroelectronics, etc.). The company is active worldwide in medical, industrial, automotive, IoT, IA, mil-aero and digital identity & security sectors. IC’Alps is ISO 9001:2015, ISO 13485:2016, EN 9100:2018 certified, Common Criteria on-demand, IATF16949-ready, member of TSMC Design Center Alliance (DCA), ARM Approved Design Partner and X-FAB’s partner network. More information on www.icalps.com and follow us on https://www.linkedin.com/company/ic-alps

• Read more about NUMEM & IC'ALPS Collaborate to Develop an ultra-low-power SOC for Sensor and AI applications