Heraeus Covantics: Materials specialist further expands its technology leadership
From January 1, 2025 Heraeus is combining the high-performance materials expertise of Heraeus Conamic and Heraeus Comvance into a new operating company: Heraeus Covantics. The merged business will be led by a new management team. The legal entities will remain the same.
With the new operating company, Heraeus is further expanding its technology leadership in the manufacturing and processing of high-purity quartz, fused silica, and other high-end materials such as ceramics and innovative composites.
“We are creating a global powerhouse in which we drive innovation and exploit technological synergies,” explain Christoph Fark, Michael Werth and Nikolas Pojezny, Managing Directors of Heraeus Covantics. ”The new structure more closely aligns our combined capabilities and competencies with market requirements and customer needs. This enables our customers to strengthen their competitive advantage.”
Heraeus Covantics manufactures semi-finished products, complex system components and custom-tailored solutions made of quartz glass, fused silica and ceramic materials. They are used in the data transmission and telecommunication industry, the production of specialty optical fibers for industrial and medical applications, semiconductor manufacturing and optical applications among others.
About Heraeus
Heraeus is a family-owned global technology group headquartered in Hanau, Germany. The company’s roots go back to a family pharmacy started in 1660. With its expertise and resources, Heraeus has been making meaningful contributions over generations and is committed to do so in the future. Today, the group bundles diverse activities in four Business Platforms: Metals and Recycling, Healthcare, Semiconductor and Electronics, as well as Industrials. Customers benefit from innovative technologies and solutions based on broad materials knowledge and technological leadership. In the 2023 financial year, the group generated revenues of €25.6 billion (US$27.7 billion*) with approximately 16,400 employees in 40 countries. Heraeus is one of the top 10 family-owned companies in Germany.
About Heraeus Covantics
Heraeus Covantics is a technology leader specializing in the manufacturing and processing of the industry’s highest purity quartz, fused silica and other high-end materials such as ceramics and composites. With locations in Europe, USA and Asia, Heraeus Covantics manufactures semi-finished products, complex system components and custom-tailored solutions made of quartz glass, fused silica and ceramic materials. They are used in the data transmission and telecommunication industry, the production of specialty optical fibers for industrial and medical applications, semiconductor manufacturing and optical applications among others.
Hardware is at the heart of computing systems. However, recent years have seen increased attacks exploiting hardware vulnerabilities and exploits, which even traditional software-based protections cannot prevent. Hardware fuzzing has shown promise in detecting vulnerabilities in large-scale designs like modern processors. In this talk, we will describe the hardware vulnerabilities in hardware description languages, such as Verilog and VHDL. Then, we will explain a new and radical approach called hardware fuzzing to find these vulnerabilities and detail how fuzzing techniques can be combined with existing formal verification techniques to detect vulnerabilities efficiently. Finally, we will discuss a strategy for pinpointing vulnerabilities to accelerate the mitigation process and briefly talk about improving the efficiency of hardware fuzzing using ML/AI techniques, such as multi-armed bandit (MAB) and large language models (LLM).
Meet the Speakers
Guest Speaker
Jeyavijayan (JV) Rajendran Associate Professor Department of Electrical and Computer Engineering Texas A&M University Biography
Moderator
Warren Savage Researcher at University of Maryland Applied Research Laboratory for Intelligence and Security Biography
The ESD Alliance, a SEMI Technology Community, is hosting a webinar series, "Savage on Security," moderated by Warren Savage, Researcher at University of Maryland, Applied Research Laboratory for Intelligence and Security.
10:00 am - 11:00 am
Off
Add to Calendar2025-03-27 10:00:002025-03-27 11:00:00ESD Alliance Webinar: Savage on Security 2: Mar 27, 2025The ESD Alliance, a SEMI Technology Community, is hosting a webinar series, "Savage on Security," moderated by Warren Savage, Researcher at University of Maryland, Applied Research Laboratory for Intelligence and Security. United StatesSEMI.org[email protected]America/Los_AngelespublicRegister Now to Watch the Recorded Event
NOTE: This webinar has been indefinitely postponed.
The FDA’s Center for Devices and Radiological Health (CDRH) launched the voluntary Total Product Life Cycle (TPLC) Advisory Program (TAP) Pilot to help spur more rapid development of high-quality, safe, effective, and innovative medical devices that are critical to public health. TAP’s primary goal is to expedite patient access to innovative medical devices by providing early, frequent, and strategic communications with the FDA and by facilitating engagement with other key parties for developers of devices of public health importance. To achieve this goal, a dedicated cadre of FDA TAP Advisors proactively provide solutions-focused engagement that is tailored to each TAP Innovator’s needs in advancing devices to market and patient access. In this seminar, FDA TAP Advisors will discuss this pilot program and provide participants input on when in their regulatory journey TAP may be an option for them.
ABOUT THE SPEAKERS:
Kimberly Knish, MS, CCRP, RAC Kimberly is a TAP Advisor within FDA’s Center for Devices and Radiological Health, Total Product Life Cycle (TPLC) Advisory Program (TAP). In this role, she establishes and cultivates a wide network of synergistic relationships across the entire medical technology innovation ecosystem and integrates ecosystem, sponsor, and lead reviewer input into strategic planning options intended to reduce stakeholder risk and maximize the opportunities of timely commercial rollout and sustainable patient access. She brings to the FDA 30 years of medical technology industry experience within clinical affairs, regulatory affairs, health economics, reimbursement and quality systems. She has been involved with all phases of medical device development (concept through obsolescence) involving device types from Class III implantables to wearables and remote monitors. Therapeutic expertise spans cardiovascular, nervous, digestive, endocrine, respiratory, and skeletal systems. Kimberly holds a B.A. degree in Biology from the College of St. Benedict, a M.S. degree in Management from Cardinal Stritch University and has professional certifications in clinical research (CCRP) and regulatory affairs (RAC).
April Marrone, PhD, MBA April is a Senior Advisor in the FDA/CDRH Total Product Lifecycle Program (TAP) since November 2023. Prior to her current role, April has served on the Obesity and Hepatobiliary Devices Team as the acting Assistant Director, Team Lead, Lead Reviewer, and chemistry consultant since 2014. In addition to supervisory, leadership, and medical device review responsibilities, April has promoted improvement in product manufacturing and quality through developing device specific FDA guidance documents, creating review tools to ensure consistency and quality in device review, and publishing external manuscripts on topics relevant to the FDA and industry on topics in the obesity and hepatobiliary device space. April has served as a Commissioner Fellowship Program (CFP) preceptor, mentor to new reviewers and advisors, and has developed and instructed Reviewer Certification Program courses.
Prior to joining CDRH in 2014, April was a Commissioner Fellow at FDA’s National Center for Toxicology Research (NCTR) and has served on the CFP Advisory Board. During her tenure at the NCTR, April did research to develop novel epigenetic approaches to safely assess the safety and carcinogenicity of FDA regulated products. Prior to joining the FDA, April was a post-doctoral scientist at the University of Pittsburgh, Children’s Hospital of Pittsburgh where she studied epigenetic regulation of congenital kidney disease in a mouse model. April also completed post-doctoral training at the Max Planck Institute for Biophysical Chemistry where she studied genetic and epigenetic regulation of neuromuscular disease. April has a PhD in Chemistry and BS in Physics from the University of Central Florida and an MBA from Florida Institute of Technology.
Plan now to join fellow semiconductor industry professionals at SEMI Headquarters in Milpitas, California at the 2025 SEMI EHS Summit.
Industry experts will present on the regulatory matters that will impact the industry in 2025 and beyond, followed by discussions on taking collective action to strengthen semiconductor manufacturing.
Topics will include:
US Regulatory Landscape under second Trump Administration and global impact
US EPA New Chemical Authorization Process
Europe: PFAS restriction, F-Gas restriction, GENESIS Consortium, REACH restriction, etc.
US EPA Technology Transition Rule
UN Plastics Treaty and related policies
US EPA TSCA New Substances of Concern
PFAS taxonomy
Overview of SEMI EHS activities, including SEMI PFAS Initiative
Attend, network and strategically prepare your company. This is an in-person event only.
EHS Summit 2025
Regulations, Rules, Allocations & Proposals
8:30 am - 3:30 pm
Off
Add to Calendar2025-02-11 08:30:002025-02-11 15:30:002025 EHS SummitPlan now to join fellow semiconductor industry professionals at SEMI Headquarters in Milpitas, California at the 2025 SEMI EHS Summit.Industry experts will present on the regulatory matters that will impact the industry in 2025 and beyond, followed by discussions on taking collective action to strengthen semiconductor manufacturing. Topics will include:US Regulatory Landscape under second Trump Administration and global impactUS EPA New Chemical Authorization ProcessEurope: PFAS restriction, F-Gas restriction, GENESIS Consortium, REACH restriction, etc.US EPA Technology Transition RuleUN Plastics Treaty and related policiesUS EPA TSCA New Substances of ConcernPFAS taxonomyOverview of SEMI EHS activities, including SEMI PFAS Initiative Attend, network and strategically prepare your company. This is an in-person event only.SEMI 673 South Milpitas Avenue Milpitas, CA 95035 United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
Siemens extends Veloce hardware-assisted verification and validation with new Innexis shift-left software
Innexis delivers a set of products and capabilities to address demand for shift-left software development in the IC development process
With more demanding software workloads, it is critical to facilitate the development and execution of realistic workloads early in the design phase to shorten overall development time and identify hardware and software defects earlier
Siemens Digital Industries Software announced today the Innexis product suite, a complement to its industry leading Veloce™ hardware-assisted verification and validation system.
Building on the success and rapid adoption of Veloce, Siemens’ Innexis product suite delivers a set of capabilities to address customer demand for shift-left software in the early phases of IC development. These products include a hardware/software development flow from virtual to hybrid to full RTL, an architecture native virtual platform for early high-speed software development and a simulation backplane that enables the development of digital twins in Siemens’ PAVE360™ software for software-defined vehicles and other complex systems.
“The complexity of integrated circuits (IC) is increasing exponentially, designers need more efficient methodologies to meet industry demands. Veloce has seen rapid adoption by industry leaders to help solve this critical bottleneck. The Innexis product suite extends workflow improvements from Veloce to help our customers shift left their IC development and debug cycle,” said Jean-Marie Brunet, vice president and general manager, Hardware-Assisted Verification, Siemens Digital Industries Software. “This enables IC design to begin months before final RTL, all while using a common software workload across the development process.”
Adoption of a shift-left approach for software development and IP verification processes is now mandatory. As chip designs become increasingly complex due to more demanding software workloads, it is critical to enable the development and execution of realistic workloads early in the design phase. A proactive shift-left software approach helps mitigate the risk of identifying issues late in the development cycle.
“The implementation of Innexis in our development process has significantly enhanced software and system validation performance, thereby improving the efficiency of our teams and projects. By enabling heterogeneous component modeling within virtual platforms, it allows us to create realistic high-speed models of System on Chips (SoCs),” said Ari Hautala, Principal System Architect, Nokia Mobile Networks. “Furthermore, the integration of these high-speed virtual platforms with RTL IP on Veloce emulators facilitates superior overall performance while still permitting precise cycle-accurate performance and power analysis on RTL model components. Additionally, Innexis offers exceptional visibility and debuggability for the SoC design, along with the capability to integrate and execute a large number of complex test cases effectively.”
Currently, the Innexis product suite consists of:
Innexis Developer Pro: Innexis Developer Pro software provides a connected development flow from virtual to hybrid to full RTL. This provides a comprehensive environment for accelerating the creation of complex SoC design supporting a wide range of use-cases including seamless hardware-software co-development, co-validation, and pre-silicon cycle accurate analysis and validation. Innexis Developer Pro supports the modelling of complex SoC’s with heterogeneous cores and custom SystemC model components. In addition, it provides the ability to run in both virtual plus RTL hybrid mode for high performance execution, and then at a time of interest switch to full RTL emulation enabling high accuracy analysis of the full SoC when required.
Innexis Architecture Native Acceleration (ANA): Innexis Architecture Native Acceleration software is a cloud- based high-speed virtual platform. By running natively on Arm based servers the software workloads run at much higher speeds than on typical instruction set simulation based virtual platforms. Cloud hosting also provides scalable compute resources and simple browser-based access and tools. Innexis Architecture Native Acceleration can also run on local Arm based servers if preferred. In both cases it enables early software development and testing, and early software defect identification.
Innexis Virtual System Interconnect: Innexis Virtual System Interconnect software facilitates the creation and simulation of comprehensive system level digital twin platforms by seamlessly connecting multi-behavioral virtual and physical subsystems, supporting a variety of communication protocols. Innexis Virtual System Interconnect behavioral models can include Innexis Developer Pro or Innexis Architecture Native Acceleration SoC models, supporting system-level shift-left software development and RTL verification.
To learn more about Siemens’ Innexis product suite and how it addresses the demand for shift-left software development in the integrated circuit development process, visit: www.siemens.com/innexis
About Siemens
Siemens Digital Industries Software helps organizations of all sizes digitally transform using software, hardware and services from the Siemens Xcelerator business platform. Siemens' software and the comprehensive digital twin enable companies to optimize their design, engineering and manufacturing processes to turn today's ideas into the sustainable products of the future. From chips to entire systems, from product to process, across all industries. Siemens Digital Industries Software – Accelerating transformation.
Note: A list of relevant Siemens trademarks can be found here. Other trademarks belong to their respective owners.
Heidelberg Instruments Reports Major Orders for the VPG+ 1400 FPD Volume Pattern Generator from Leading Asian Photomask Manufacturers
Heidelberg Instruments Reports Major Orders for the VPG+ 1400 FPD Volume Pattern Generator from Leading Asian Photomask Manufacturers
Heidelberg, Germany – Heidelberg Instruments has secured two major orders for its VPG+ 1400 FPD Volume Pattern Generator from leading photomask manufacturers in Asia, with a total order value between EUR 9 million and EUR 10 million. Deliveries are scheduled for 2025.
“These significant order intakes mark major milestones for the company, reinforcing our market position and driving further innovation and growth in the display technology sector”, says Alexander Forozan, VP of Global Sales and Business Development.
The VPG+ 1400 is Heidelberg Instruments’ largest system, specifically designed for large-format photomask patterning in the flat panel display (FPD) industry. It supports mask sizes up to 1400 x 1400 mm², making it ideal for various flat panel display generations (G4 to G8). The VPG+ 1400 sets a new standard for high-throughput photomask production, offering the precision and scalability required for large displays. Additionally, it delivers the accuracy needed to produce large-area halftone photomasks for flat panel displays.
Equipped with advanced metrology and alignment features, including Cognex AI-based image recognition, the system ensures precise alignment for multilayered masks. Its linear and nonlinear coordinate corrections further enable precise overlay across tools.
By addressing the diverse exposure needs of customers, Heidelberg Instruments' large-area VPG+ Volume Pattern Generators have proven to be valuable assets in display photomask production lines.
2025 Technology Workshops Shaping the Future of Electronics
Registration
Early Bird Pricing (until March 25, 2025) $375 members $525 non-members
Regular Pricing (After March 25, 2025) $525 members $699 non-members
MDM2 members please contact Michelle Fabiano, [email protected], for discount information.
Complimentary student registration is available but has limited capacity. Students can Register here to be contacted about complimentary attendance after March 15th.
Cancellation Policy
Cancellations received on or before March 25, 2025, are fully refunded with a $50 processing fee. Refunds will not be issued for cancellations (including no-shows) made after March 25, 2025, and only substitutions are accepted with a written note from the registered attendee. Please email your cancellations or substitutions on company letterhead to Michelle Fabiano at [email protected].
Industry Tours Take advantage of an exclusive industry tour at Medtronic on April 21, just before our workshop begins! Please note that space is limited and transportation will not be provided. Don't miss this unique opportunity!
Shaping the Future of Flexible Hybrid Electronics: FHE Technical Gap Analysis workshop Join us on April 22 for a focused technical gap analysis workshop on Flexible Hybrid Electronics (FHE) to shape FlexTech’s 2025 Request for Proposals (RFP). With a history of over five dozen R&D projects, FlexTech has driven advancements in flexible batteries, energy harvesting, and system integration. Hear from principal investigators on the latest developments and join breakout sessions to explore challenges, gaps, and priorities for future innovation with industry, government, and academic leaders.
Why Attend: Contribute to FlexTech’s 2025 priorities, learn about cutting-edge developments, and Join breakout sessions and network with key experts.
The day will conclude with a Mayo Clinic Lab for function tour followed by a Student Poster Networking Reception.
Advancing Human Performance Technologies: NBMC Technical Gap Analysis Workshop Join us on April 23 for the Nano-Bio Materials Consortium (NBMC) Technical Gap Analysis Workshop, a focused forum on wearables and bio-signal sensing technologies for real-time cognitive and physical state monitoring, augmentation, and intervention. Participants will address critical technical gaps in preparation for the next NBMC Request for Proposal.
NBMC brings together industry, government, and academia to advance early-stage nano and bio technologies, driving innovations in low-cost wearable sensors and communication systems through over three dozen R&D projects.
The day will conclude at the Phoenix Bioscience Core, located in the heart of the innovator's district in downtown Phoenix, Attendees will enjoy guided tours, a reception and a keynote presentation on "Bridging Clinical Needs and Emerging Technology: Emerging Device-Based Health Intervention Platforms: Wearables, Robotics, and BioHybrids." Networking opportunities will be available throughout these activities.
Clinician Insights Shaping the Future of Electronics: MDM2 and Smart MedTech Forum Join us on April 24, for an inspiring and dynamic session spotlighting the collaboration between MDM2 (Medical Device Manufacturing Multiplier ) and the Smart MedTech Initiative. This forum highlights the critical role of clinician and patient perspectives in driving innovation for next-generation medical devices.
Together, MDM2—a consortium dedicated to positioning Greater Phoenix as a leading hub for digital medical device manufacturing—and SEMI Smart MedTech Initiative are working to bridge the gap between emerging technologies and real-world needs. Discussions will explore how clinician insights can spark innovation in medical devices, accelerate technology adoption and commercialization and leverage AI and machine learning to advance manufacturing processes.
An evening event will be hosted by Venture Cafe at the end of the workshop to engage with the local innovation community.
Including with registration are breakfasts, breaks, lunches and receptions.
ASU Health Futures Center 6161 E Mayo Blvd Phoenix, AZ85054 United States
Monday, April 21 (Medtronic Tour)
2:00 pm
Medtronic Tour
(Tour sold out. Sign up for the waitlist.)
Join us for an exclusive one-hour tour of Medtronic’s facility, to explore its advanced operations in designing and manufacturing microelectronics for implantable medical devices.
Attendees will break into groups for smaller discussions to identify challenges, prioritize those challenges and identify opportunities on critical issues discussed throughout the morning session.
3:05 pm
-
3:20 pm
Break
3:20 pm
-
4:10 pm
Breakout Sessions Readout
4:30 pm
-
6:00 pm
Student Poster Networking Reception & Mayo Clinic Lab for Function Tour
Mayo Clinic
IERB Building
5951 E. Mayo Blvd
Phoenix, AZ 85054
Mayo Lab Tour: If you're interested, please sign up at the registration desk. Space is limited to 20 participants and will be available on a first-come, first-served basis.
Note: Transportation to this reception will not be provided. (2 minute drive.)
Attendees will break into groups for smaller discussions to identify challenges, prioritize those challenges and identify opportunities on critical issues discussed throughout the morning session.
3:05 pm
-
3:20 pm
Break
3:20 pm
-
4:10 pm
Breakout Sessions Readout
5:00 pm
-
7:00 pm
Networking Reception and Tours of Wexford Connect
Enjoy Networking, concurrent tours, and presentation content
850 Phoenix Bioscience Core
850 N 5th Street
Phoenix, AZ 85004 https://850pbc.com
5:00 pm - 5:30 pm: Tours of Wexford Connect (Limited to 30 people)
6:15 pm - 7:00 pm: Panel Discussion:
Bridging Clinical Needs and Emerging Technology: Research, Implementation, and Scale. Moderator: Chris Yoo, General Partner, Xcellerant Ventures Panelists: Suman Bose, Assistant Professor of Biomedical Engineering, Mayo Clinic Hakan Ceylan, Assistant Professor and Principal Investigator, Mayo Clinic Ross Bundy, CEO, CRISPRQC Elsa Abruzzo, CEO, Anuncia Medical Allen Waziri, CEO and Co-Founder, iCE Neurosystems
Note: Transportation will not be provided. (30+ minute drive.)
Panel Discussion: The Arizona MDM2 Consortium - Investing in the Medical Technology Manufacturing Renaissance
Moderator: Chris Yoo, Founder and CEO and Regional Innovation Officer, MDM2 Consortium Panelists: Kiran Avancha, Chief Innovation Officer, HonorHealth Rochelle Rivas, District Director for Healthcare Innovation, Maricopa Community Colleges Alex Tessmer, Associate Director, BD Peripheral Intervention, Ideation
9:45 am
-
10:10 am
Jonathon Parker
Neurosurgeon, Director of Device-Based Neuroelectronics Lab
Mayo Clinic, Arizona
Aman Verma
Hospitalist
Mayo Clinic, Arizona
FIRESIDE CHAT: How can wearables and implantables improve care of the acutely ill patient?
Moderator: Jonathon Parker , Neurosurgeon, Director of Device-Based Neuroelectronics Lab, Mayo Clinic - Arizona Participants: Aman Verma, Hospitalist, Mayo Clinic, Arizona
10:10 am
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10:25 am
Break
10:25 am
-
11:10 am
Moderator
Kiran Avancha
Chief Innovation Officer
Honor Health Innovations
Craig Norquist
Chief Innovation Officer
Honor Health
Matthew Anderson
Chief Medical Information Officer - Ambulatory
Honor Health
PANEL DISCUSSION: Health Data 2035: How do we Capture, Integrate, and Secure Health Data Streams From Wearables and Implantables to Improve Patient Care?
Moderator: Kiran Avancha, Chief Innovation Officer, Honor Health Innovations Panelists: Craig Norquist, Chief Innovation Officer, Honor Health Matthew Anderson, Chief Medical Information Officer - Ambulatory, Honor Health
11:10 am
-
11:45 am
Jonathon Parker
Neurosurgeon, Director of Device-Based Neuroelectronics Lab
Mayo Clinic, Arizona
Bart M. Demaerschalk
Vascular Neurologist
Mayo Clinic, Arizona
Chandan Krishna
Neuro-endovascular Neurosurgeon
Mayo Clinic - Arizona
FIRESIDE CHAT: Stroke Care 2035- How Can Digital Health Data Transform Stroke Care?
Moderator: Jonathon Parker , Neurosurgeon, Director of Device-Based Neuroelectronics Lab, Mayo Clinic - Arizona Participants: Bart M. Demaerschalk, Vascular Neurologist, Mayo Clinic, Arizona Chandan Krishna, Neuro-endovascular Neurosurgeon, Mayo Clinic, Arizona
11:45 am
-
12:15 pm
Jonathon Parker
Neurosurgeon, Director of Device-Based Neuroelectronics Lab
Mayo Clinic, Arizona
Nandita Khera
Oncologist, Associate Chair of Digital Health
Mayo Clinic
FIRESIDE CHAT: Real-Time Oncology - How Can Wearables and Implantables Reshape Oncology Care in 2035?
Moderator: Jonathon Parker , Neurosurgeon, Director of Device-Based Neuroelectronics Lab, Mayo Clinic - Arizona Participants: Nandita Khera, Oncologist, Associate Chair of Digital Health, Mayo Clinic
12:15 pm
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1:00 pm
Moderator
Randal Schulhauser
Founder and CEO
Schulhauser Associates LLC
Jonathon Parker
Neurosurgeon, Director of Device-Based Neuroelectronics Lab
Mayo Clinic
Allen Waziri
Neurosurgeon, Co-Founder iCE Neurosystems
iCE Neurosystems
Paul Gerrish
VP, Technology and Medtronic Fellow
Medtronic
Panel Discussion: The New Frontier of Long-Term Brain Monitoring: Brain Computer Interface Re-Imagined
Moderator: Randal Schulhauser, Founder and CEO, Schulhauser Associates LLC Panelists: Jonathon Parker, Neurosurgeon, Director of Device-Based Neuroelectronics Lab, Mayo Clinic Allen Waziri, Neurosurgeon, Co-Founder iCE Neurosystems, iCE Neurosystems Paul Gerrish, VP, Technology and Medtronic Fellow, Medtronic
Division Director, Integrative Health and Performance Sciences
BlueHalo
Deon Chen
Sr. Manager, HEOR Strategic Planning
BD
Panel Discussion: Digital Health Revolution: Insights and Innovations
Moderator: Douglas Kiehl, BioCrossroads/Purdue Panelists: Bharath Rajagopalan , Director – Strategic Marketing, Health & Wellness, STMicroelectronics Anirban Bandyopadhyay, Senior Director, Global Foundries Stephaney Shanks, Division Director, Integrative Health and Performance Sciences, BlueHalo Deon Chen, Sr. Manager, HEOR Strategic Planning, BD
4:30 pm
-
7:00 pm
Evening Program Hosted by Venture Café
850 Phoenix Bioscience Core
850 N 5th Street
Phoenix, AZ 85004 https://venturecafephoenix.org/
Venture Café Phoenix is a dynamic weekly gathering where entrepreneurs, innovators, and business leaders connect to exchange ideas and build meaningful relationships.
Note: Transportation to this program will not be provided (30+minute drive)
5:40 pm
-
6:30 pm
Nandini Tandon
Co-Founder of Silicon Valley based VC in HealthTech
IndUS Setu Global Foundation
Jami Mei
VP of Business Development
Arizona Commerce Authority
Douglas E. Kiehl
Sr. Vice President
BioCrossroads
Mark Dydyk
Director of Engineering & Operations
Medtronic
Fireside Chat: Harnessing Semiconductor For transformational Advancements in HealthTech
Abstract Moderator: Nandini Tandon Panelists: Jami Mei, VP of Business Development, Arizona Commerce Authority Douglas E. Kiehl, Sr. Vice President, BioCrossroads Mark Dydyk, Director of Engineering & Operations, Medtronic
Join us for a three-day workshop uniting FlexTech, NBMC, Smart MedTech, and the Medical Device Manufacturing Multiplier (MDM2) — a consortium of companies, institutions, and statewide organizations working to establish Greater Phoenix as a premier hub for medical device manufacturing. This collaborative event will drive innovation in electronics and medical technologies by bringing together industry leaders, innovators, and stakeholders.
The workshop will delve into advancements, challenges, and gaps in critical technologies such as flexible hybrid electronics, hybrid electronics, and bio-signal sensing for real-time cognitive and physical state monitoring and augmentation and will highlight the collaboration between the Smart MedTech Initiative and MDM2, focusing on the voice of the customer—clinicians and patients.
2025 Technology Workshop Shaping the Future of Advancing Electronics and Medical Technologies
- FHE Gap Analysis and NBMC Gap Analysis
- MDM2 and Smart Medtech Workshop
8:00 am - 6:00 pm
Off
Add to Calendar2025-04-22 08:00:002025-04-24 18:00:002025 Technology Workshops Shaping the Future of ElectronicsPresented By
Join us for a three-day workshop uniting FlexTech, NBMC, Smart MedTech, and the Medical Device Manufacturing Multiplier (MDM2) — a consortium of companies, institutions, and statewide organizations working to establish Greater Phoenix as a premier hub for medical device manufacturing. This collaborative event will drive innovation in electronics and medical technologies by bringing together industry leaders, innovators, and stakeholders.The workshop will delve into advancements, challenges, and gaps in critical technologies such as flexible hybrid electronics, hybrid electronics, and bio-signal sensing for real-time cognitive and physical state monitoring and augmentation and will highlight the collaboration between the Smart MedTech Initiative and MDM2, focusing on the voice of the customer—clinicians and patients. ASU Health Futures Center 6161 E Mayo Blvd Phoenix, AZ 85054 United StatesSEMI.org[email protected]America/Phoenixpublic
America/Phoenix
Register Now
Agileo Automation Launches The E84 PIO Box For The Enhanced Compliance Testing Of Semiconductor Equipment With SEMI Standards
Innovative plug-and-play device helps conduct comprehensive equipment compliance tests for automatic carrier delivery in automated fabs
SEMICON Europa, Munich, Germany, November 12, 2024 – Agileo Automation, a leading provider of control and connectivity solutions for global semiconductor equipment manufacturers, today launches the E84 PIO Box at Booth #C2848. This handheld device offers a new lightweight interface for fab staff to test semiconductor equipment software for compliance with SEMI’s E84 and GEM300 standards suite for automatic carrier delivery. It improves the readability, identification, and validation of E84 signal exchanges and functional aspects in cleanrooms or workshops. Integrated with Agileo Automation’s Speech Scenario software that emulates the fab host and validates the SECS/GEM interface with predefined test scenarios, the E84 PIO Box can easily emulate automated carrier delivery systems such as overhead hoist transport or automated guided vehicles. It is able to detect non-compliance and other functional issues thanks to its close alignment with SEMI’s E84 standard. The device features a DB25 connector for easy integration with E84 passive systems such as a load port and connects directly to a PC via a single USB cable for both data and power supply.
“In highly automated fabs, even minor carrier delivery issues can lead to costly downtime. Our E84 PIO Box is designed to rigorously validate nominal and error cases, ensuring seamless operations and fast recovery, benefiting both equipment manufacturers and facilities alike,” explains Marc Engel, CEO of Agileo Automation. “Early adopters have seen significant improvements in overall equipment software quality and now approach each software update with greater confidence, backed by consistent testing results.”
About Agileo Automation
Since its inception in 2010 in Poitiers, France, Agileo Automation has empowered global semiconductor equipment manufacturers to optimize their production machines with control, communication, data acquisition, and testing solutions, enabling their deployment in large-scale fabs worldwide. At the heart of Industry 4.0, Agileo’s A²ECF-SEMI framework provides a robust foundation for developing equipment controller software, leveraging the SEMI SECS/GEM and GEM300 standard suites. As a member of SEMI and the OPC Foundation, Agileo is a key contributor to the development and integration of industry standards such as SEMI standards and OPC Unified Architecture (OPC-UA). For more information, please visit our web site or follow us on LinkedIn.
Companies across the semiconductor value chain must respond to a dynamic horizon as the ISSB Standards are adopted by securities regulators, standard-setters and stock exchanges around the world. At the same time, investors are asking companies to voluntarily transition from the TCFD recommendations to the ISSB Standards to meet their information needs.
To clarify what the ISSB Standards mean for the semiconductor value chain, SEMI is pleased to collaborate with the IFRS Foundation, which is the organizational seat of the ISSB. Our webinar, ISSB Standards Adoption and Reporting for the Semiconductor Value Chain, outlines the stakes for companies, demonstrates the business value of the Standards (IFRS S1 and IFRS S2), answers audience questions, and provides a venue for information exchange. There will be a deep dive into implications for climate reporting under IFRS S2 after a high-level look at the background and workplan of the ISSB.
Our distinguished speakers from IFRS Foundation are Neil Stewart, Director of Corporate Outreach, and Jing Zhang, Head of Climate Research.
This event is part of the SEMI webinar series, “Global State of Play: Sustainability Regulations, Reporting, & Incentives.” This series offers semiconductor industry professionals the chance to interact with top-tier experts on the most pressing challenges in compliance, disclosure, and strategy for sustainable business.
Speakers
Neil Stewart, Director of Corporate Outreach, IFRS Foundation
Neil Stewart is the International Sustainability Standards Board’s New York-based Director of Corporate Outreach, working with preparers, industry associations, the accounting profession and consultants to build awareness and understanding of the ISSB Standards and SASB Standards. Neil joined SASB in 2020 from Citigroup.
Jing Zhang, Head of Climate Research, IFRS Foundation
Jing Zhang is Head of Climate Research on the International Sustainability Standards Board’s technical staff. Previously he was the Global Head of Quantitative Research at Moody’s Analytics. Jing has numerous published books and research papers on financial risk, including the Risk Publications book “Climate Change: Managing the Financial Risk and Funding the Transition.” Jing has a PhD from the Wharton School of the University of Pennsylvania.
Worldwide, companies in the semiconductor value chain are undergoing paradigm shifts in how they report sustainability-related risks and opportunities to stakeholders in government and capital markets.
Semiconductor manufacturing and design firms, together with their business partners, face heightened pressure to report on their performance related to climate transition, human capital management, supply chain management, and a host of other environmental, social, and governance issues.
On one hand, companies face a patchwork of reporting rules conditioned on where they do business. On the other hand, a global baseline of sustainability-related disclosures ushered in by the IFRS Foundation’s International Sustainability Standards Board (ISSB) is gathering momentum.
Times
Multiple sessions available!
EMEA: Thursday, January 23, 2025 6:00-7:00 pm Central European Time (AM Session - 9:00-10:00 am Pacific)
America: Thursday, January 23, 2025, 9:00-10:00 am or 4:00-5:00 pm Pacific Time
Asia Pacific: Friday, January 24, 2025 9-10 am Japan Standard Time (PM Session) 4-5 pm Pacific)
New horizons for semiconductors have been revealed by innovations in heterogeneous integration, especially due to the availability of an abundance of inter-chiplet wires. All this has implications on security leading to new challenges as well as opportunities. This talk presents an overview on how prior work on 2D SoCs may or may not be helpful in addressing this challenge.
Meet the Speakers
Guest Speaker
Ankur Srivastava Director of the Institute for Systems Research University of Maryland Biography
Moderator
Warren Savage Researcher at University of Maryland Applied Research Laboratory for Intelligence and Security Biography
The ESD Alliance, a SEMI Technology Community, is hosting a webinar series, "Savage on Security," moderated by Warren Savage, Researcher at University of Maryland, Applied Research Laboratory for Intelligence and Security.
ESD Alliance Webinar: Security Constructs for Heterogenous Integration
Savage on Security Webinar Series #1
Recording
Recorded January 23, 2025
