ALD enables lead-free MCP production with precise thin-film deposition, enhancing manufacturing yields, device performance, and lifetime value. Exosens chose Beneq’s P400A batch and TFS 500 ALD systems for their scalability, precision, and ability to support development from R&D to production.

Espoo, Finland, 06-Mar 2025 – Beneq and Photonis Scientific, part of the Exosens Group, have announced a significant advancement in Microchannel Plate (MCP) technology. This collaboration focuses on replacing traditional lead-based materials with ALD-enabled solutions, driving sustainable MCP manufacturing and unlocking new commercial opportunities for this versatile detection technology.

Unlocking New Potential in MCP Technology
Microchannel Plates (MCPs) are essential components in a variety of high-performance detection systems, from medical imaging and mass spectrometry to neutron imaging and scientific instrumentation. Historically manufactured using lead-silicate glass, MCPs are now transitioning to lead-free alternatives to comply with environmental regulations and improve long-term sustainability.

ALD technology plays a central role in this shift by enabling precise, conformal deposition of thin films. This approach decouples the properties of the glass substrate from those of the conductive and electron emissive coatings, allowing each to be independently optimized. The result is better performance, higher manufacturing yields, and greater flexibility to tailor MCPs to the demands of growing commercial markets.

Sustainability and Performance Gains with ALD
ALD enables MCP manufacturers to eliminate hazardous materials while achieving higher performance benchmarks. Lead-free MCPs produced using ALD deliver key benefits, such as enhanced stability, reduced noise, lower operational voltages, and minimized power consumption. ALD also supports advanced MCP designs that maintain performance under harsh conditions and extend device lifespan by up to 10 times compared to conventional methods.

“The introduction of ALD into MCP production marks a significant step forward for the industry,” said Ulrich Laupper, President and Executive General Manager of the Exosens Ultimate Detection Business Unit. “By leveraging ALD technology, we can align sustainability with high-performance detection solutions, addressing today’s market needs while preparing for future applications.”

Enabling Growth in MCP Markets with Beneq’s ALD Solutions
Photonis Scientific partnered with Beneq for its customizable TFS 500 ALD system, which supports MCP development at all stages—from R&D and pilot production to full-scale manufacturing. Beneq’s modular tool designs enable precise control over deposition parameters, meeting the rigorous requirements of MCP coatings while ensuring scalability and cost-efficiency.

“Beneq’s ALD tools provide the flexibility and precision we need to refine MCP coatings and scale our production,” said Till Cremer, R&D Scientist at Photonis Scientific. “Their tailored solutions have allowed us to unlock new potential in MCP technology and enhance its value for commercial applications.”

By fostering collaborations like this, Beneq is working to establish a growing market for ALD-enabled MCP technologies. The ability to tailor performance parameters such as operational stability, noise reduction, and power efficiency is positioning MCPs as a key detection technology across a wide range of industrial, medical, and scientific fields.

About Photonis
Photonis is a leading product brand of Exosens, a high-tech company with more than 85 years of experience in the innovation, development, manufacture and sale of high-end electro-optical technologies. Photonis offers its customers photo-detection and low light conditions imaging solutions for extremely demanding environments such as Defense & Security, Nuclear Safety, Life Science and Industrial & Non-Destructive testing. Photonis is internationally recognized as a leading brand and a major innovator in its fields with production and R&D sites in Europe and North America. For more information: exosens.com

About Beneq
Beneq is the home of Atomic Layer Deposition (ALD). Founded in 1984, Beneq introduced the first industrial ALD production and continues to lead the market with solutions for R&D, semiconductor fabrication, and advanced manufacturing. Beneq’s product portfolio includes tools for lab-scale research (TFS 200, TFS 500), high-volume production (Transform®, Prodigy™), ultra-fast spatial ALD (C2R), and roll-to-roll ALD (Genesis).

Beneq’s Development Service accelerates the adoption of new ALD processes, while its Coating Service offers streamlined, state-of-the-art ALD production capabilities. Beneq’s mission is to enable groundbreaking applications with ALD technology, providing unparalleled precision and scalability for researchers and manufacturers worldwide.

• Read more about Beneq and Exosens Collaborate on Lead-Free MCPs with ALD

PDF Solutions, Inc. (Nasdaq: PDFS) today announced it has entered into a definitive agreement to acquire secureWISE, LLC, the most widely used secure, remote connectivity solution in the semiconductor manufacturing equipment industry, from Telit IOT Solutions Inc.

The secureWISE global network enables equipment manufacturers to bring up new equipment faster, provide operational support, and maximize the value derived from the equipment customers’ investments. It is currently used by over 100 equipment vendors to connect and control their tools located in over 190 semiconductor fabs and to manage the exchange of multiple petabytes of data annually.

PDF Solutions empowers semiconductor companies to maximize their manufacturing effectiveness. The PDF Solutions platform breaks down data silos to enable engineers to uncover critical relationships across manufacturing and design, resulting in better process control, product screening, and equipment operations.

As the semiconductor industry becomes more globally distributed, and as advanced devices rely on the integration of multiple chiplets into a single package, more collaboration and integration are required across the semiconductor industry. This collaboration needs to be executed securely with each participant controlling access to its intellectual property.

Today, secureWISE customers have built applications on top of the secureWISE network to deliver equipment analytics. PDF Solutions expects the acquisition to accelerate equipment makers’ ability to derive value from equipment data by enabling them to leverage PDF Solutions’ Exensio analytics software.

Beyond enabling equipment vendors to build equipment analytics at foundries, the acquisition of secureWISE is expected to dramatically expand the capability of PDF Solutions’ secure DEX OSAT network by allowing equipment makers, fab operators, and fabless companies to collaborate to optimize chip manufacturing and test.

“This acquisition extends PDF Solutions analytics for equipment makers and fabless to the factory manufacturing level, which allows them to generate value from AI,” said Dr. John Kibarian, President, CEO and co-founder of PDF Solutions. He continued, “We provide the leading analytics platform for semiconductor manufacturing, and with secureWISE, the PDF Solutions platform will also be able to help members of the semiconductor ecosystem collaborate through a secure, direct connection and control the manufacturing process down to the production equipment.”

Mike Dempsey, Vice President of secureWISE LLC, said, “We believe PDF Solutions is the ideal partner to accelerate secureWISE’s evolution, ensuring we remain at the forefront of industry trends and ahead of our customers’ needs. This acquisition will strengthen our ability to anticipate, pioneer, and integrate a far richer suite of security, collaboration, and analytics capabilities into our platform. As data exchange and collaboration become increasingly relevant to the semiconductor industry, this acquisition will better position secureWISE to deliver maximum long-term benefit to its customers who have invested in our platform.”

Under the terms of the definitive agreement, PDF Solutions will pay a cash amount of $130.0 million, subject to customary purchase price adjustments. The purchase price will be funded by a combination of cash on hand and $70M of new bank debt. The acquisition is subject to certain closing conditions and is expected to close in the first calendar quarter of 2025.

TD Securities (USA) LLC acted as financial advisor and Latham & Watkins LLP acted as legal advisor to PDF Solutions.

Updated Financial Outlook
John Kibarian, CEO and President of PDF Solutions, said, “Assuming the transaction closes in the first quarter of 2025, and with purchase accounting adjustments, we would expect to achieve a full year 2025 revenue growth rate between 21% to 23% on year-over-year basis. Given that, we also expect to achieve 2025 gross margin in line with our corporate gross margin, our target model 20% operating margin, and for EPS to be slightly accretive.”

Conference Call
PDF Solutions will discuss this announcement on a live conference call beginning at 3:00 p.m. Pacific Time / 6:00 p.m. Eastern Time today. To participate in the live call, analysts and investors should pre-register at: https://register.vevent.com/register/BI9abfc7eadb2245c5ba00c59922fe6c87.

Registrants will receive dial-in information and a unique passcode to access the call. We encourage participants to dial into the call ten minutes ahead of the scheduled time. The teleconference will also be webcast simultaneously on the Company’s website at https://ir.pdf.com/webcasts. A replay of the conference call webcast will be available after the call on the Company’s investor relations website. A copy of this press release will also be available on PDF Solutions’ website at News & PR Archives - PDF Solutions following the date of this release.

Forward-Looking Statements
The statements in this press release regarding the expected future financial results, benefits and synergies of the secureWISE acquisition on PDF Solution’s product offerings, and the expected closing of the secureWISE acquisition are forward looking and are subject to future events and circumstances. Actual results could differ materially from those expressed in these forward-looking statements. Risks and uncertainties that could cause results to differ materially include risks associated with: uncertainties with respect to the timing of the closing of the proposed transaction, including when and whether all conditions to closing will be satisfied; the failure of expected benefits from the proposed transaction to be realized or to be realized within the expected time period; uncertainties with respect to the future performance of secureWISE following an acquisition by PDF Solutions; PDF Solution’s ability to integrate secureWISE and its product and service offerings, the cost and schedule of new product development; continued adoption of the PDF Solution’s and secureWISE’s solutions by new and existing customers; the fact that operating costs and business disruption may be greater than expected following the public announcement or consummation of the proposed transaction; potential adverse reactions or changes to business or employee relationships, including those resulting from the public announcement or consummation of the proposed transaction; the incurrence of significant transaction costs related to the proposed transaction; unknown or understated liabilities of secureWISE; and other risks set forth in PDF Solutions’ periodic public filings with the Securities and Exchange Commission, including, without limitation, its Annual Reports on Form 10-K, most recently filed for the year ended December 31, 2023, Quarterly Reports on Form 10-Q, and Current Reports on Form 8-K and amendments to such reports. The forward-looking statements made herein are made as of the date hereof, and PDF Solutions does not assume any obligation to update such statements nor the reasons why actual results could differ materially from those projected in such statements.

About PDF Solutions
PDF Solutions (Nasdaq: PDFS) provides comprehensive data solutions designed to empower organizations across the semiconductor and electronics industry ecosystem to improve the yield and quality of their products and operational efficiency for increased profitability. The Company’s products and services are used by Fortune 500 companies across the semiconductor and electronics ecosystem to achieve smart manufacturing goals by connecting and controlling equipment, collecting data generated during manufacturing and test operations, and performing advanced analytics and machine learning to enable profitable, high-volume manufacturing.

Founded in 1991, PDF Solutions is headquartered in Santa Clara, California, with operations across North America, Europe, and Asia. The Company (directly or through one or more subsidiaries) is an active member of SEMI, INEMI, TPCA, IPC, the OPC Foundation, and DMDII. For the latest news and information about PDF Solutions or to find office locations, visit: https://www.pdf.com.

Headquartered in Santa Clara, Calif., PDF Solutions also operates worldwide in Canada, China, France, Germany, Italy, Japan, Korea, Sweden, and Taiwan. For the Company’s latest news and information, visit https://www.pdf.com.

About secureWISE
The secureWISE platform enables secure and controlled remote connectivity, collaboration and service enablement in the semiconductor industry. The secureWISE suite of products and services is designed to give OEM suppliers role-based, real-time and on-demand access to their equipment that is installed at the production facilities of their customers, to deliver valuable operational insights, mission-critical performance, substantial time and cost savings, and new service revenue opportunities. As the only remote access tool built around the ISMI guidelines, secureWISE is installed in over 90% of the world’s 300mm semiconductor fabs and also numerous solar and chemical plants across the globe. https://www.telit.com/iot-platforms-overview/telit-securewise/

PDF Solutions and the PDF Solutions logo are trademarks or registered trademarks of PDF Solutions, Inc. and/or its subsidiaries in the United States and other countries. Other trademarks used herein are the property of their owners.

• Read more about PDF Solutions to Acquire secureWISE to Expand the Reach of its Semiconductor Manufacturing Data Platform

–– Breker Verification Systems today confirmed its RISC-V SystemVIP library components and test suite synthesis product portfolio is deployed in more than 15 commercial RISC-V semiconductor design projects, while its RISC-V products are used in several large-scale academic projects.

Large, complex application processor projects that range from data center, automotive and AI accelerator to consumer device applications rely on Breker’s RISC-V CoreAssurance™, SoCReady™ and Cache Coherency SystemVIPs across the RISC-V core and SoC verification stack. Breker executives are heading working groups in the evolving RISC-V International certification program.

“Breker Verification Systems’ products provide significant advantages on top of standard verification solutions, especially for the most challenging verification problems,” affirms Ty Garibay, President of Condor Computing. “Applying these approaches to RISC-V processor design was a natural extension, and leveraging this technology in the development of our high-performance CPU IP is already paying dividends.”

Breker’s test suite synthesis solution and SystemVIP library allow for enhanced verification coverage while significantly reducing test development time for complex scenarios. The verification of processor cores that leverage the RISC-V Open Instruction Set Architecture (ISA) requires testing specialized, unique scenarios. Breker’s RISC-V synthesized SystemVIPs make use of AI Planning Algorithms, cross-test multiplication and concurrent, multi-threaded scheduling provide rigorous testing from randomized instructions to unique coherency, paging and other complex system integration validation.

“MIPS RISC-V cores represent the state-of-the-art in advanced application processor solutions,” notes Steve Mullinnix, Senior Director, Design Verification, MIPS. “Working with Breker, we are able to verify complex, compounded scenarios unique to these devices quickly and efficiently.”

Breker is cooperating with academic institutions including Harvey Mudd College in Claremont, Calif., and Oklahoma University, developers of the Wally open-source processor core, and ETH Zurich in Zurich, Switzerland, that produced the Ariane processor core. Breker has provided application-level tests for these institutions while collaborating on next-generation verification environments.

“Breker is at the forefront of RISC-V verification,” comments David Harris, the Harvey S. Mudd Professor of Engineering Design. “It’s first-rate SystemVIP synthesis platform is a breakthrough verification tool and an effective problem-solver for our RISC-V programs.”

Additionally, executives from Breker are leading two working groups within RISC-V International’s Certification Steering Committee to develop a program to provide a quality stamp based on extensive, independent architectural testing.

“The rate of adoption of our tools is remarkable and supports our belief that test suite synthesis is a must-have tool for every RISC-V design project,” says David Kelf, Breker’s Chief Executive Officer. “Our efforts to build more features will continue as will our willingness to partner with leading project groups and industry organizations helping to cement the RISC-V ISA place across the semiconductor industry.”

Breker’s RISC-V CoreAssurance, SoCReady and SystemVIP
Breker unveiled RISC-V CoreAssurance, SoCReady and SystemVIP in June 2024, along with a complete range of tests for the entire RISC-V core verification stack. Starting with randomized instruction generation and microarchitectural scenarios, SystemVIP includes unique tests that check all integrity levels ensuring the smooth application of the core into an SoC, regardless of architecture, and the evaluation of possible performance and power bottlenecks and functional issues.

The SystemVIP can be extended for custom RISC-V instructions to be fully incorporated into the complete test suite crossed with other tests. It is self-checking and incorporates debug and coverage analysis solutions and can be ported across simulation, emulation, prototyping, post-silicon and virtual platform environments.

Breker’s SystemVIP is used for a variety of complex RISC-V core designs, including system coherency in a multicore SoC integrity test sets, high-coverage core test, power domain switching, hardware security access rules, and automated packet generation.

Breker at DVCon U.S. February 24-27 in San Jose
Breker will exhibit and demonstrate its RISC-V CoreAssurance and SoCReady SystemVIP and Trek Test Suite Synthesis solutions at DVCon U.S. February 24-26 at the DoubleTree Hotel in San Jose, Calif.

It will present a workshop titled “Complex Verification Example: RISC-V MMU Verification of Virtualization and Hypervisor Operation for CPU and SOC platforms” Monday, February 24, from 3:30 p.m. until 5 p.m. in the Oak Room.

To arrange a demonstration or private meeting, send email to [email protected].

About Breker Verification Systems
Breker Verification Systems solves complex semiconductor challenges across the functional verification process from streamlining UVM-based testbench composition to execution for IP block verification, significantly enhancing SoC integration and firmware verification with automated solutions that provide test content portability and reuse. Breker solutions easily layer into existing environments and operate across simulation, emulation and prototyping, and post-silicon execution platforms. Its Trek family is production-proven at leading semiconductor companies worldwide and enables design managers and verification engineers to realize measurable productivity gains, speed coverage closure and easy verification knowledge reuse. As a leader in the development of the Accellera Portable Stimulus Standard (PSS), privately held Breker has a reputation for dramatically reducing verification schedules in advanced development environments. Case studies that feature Altera (now Intel), Analog Devices, Broadcom, IBM and other companies leveraging Breker’s solutions are available on the Breker website.

Engage with Breker at:
Website: www.brekersystems.com
Twitter: @BrekerSystems
LinkedIn: https://www.linkedin.com/company/breker-verification-systems/
Facebook: https://www.facebook.com/BrekerSystems/

• Read more about Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification

SOPOT, Poland — February 17, 2025 — The SEMI Industry Strategy Symposium Europe (ISS Europe) 2025, March 12-14 in Sopot, Poland, is themed AI: Catalyst to Propel Europe’s Competitiveness. The event will explore how AI is reshaping economic, technological, and market dynamics within the semiconductor industry. Experts will examine AI-driven innovation, efficiency improvements, and the balance between collaboration and competition (co-opetition) in fostering Europe’s leadership in the global semiconductor market. Registration is open.

ISS Europe 2025 will feature featured speakers addressing key unprecedented challenges and opportunities in the semiconductor industry. Topics will focus on the role of artificial intelligence (AI) in shaping the industry, strategies to strengthen Europe’s semiconductor supply chain resilience, sustainability, and innovative approaches to workforce development. Industry executives, market analysts, economists, and policymakers will convene to discuss the latest industry trends and advancements. 

“As AI, automation, and sustainability reshape our industry, it is crucial that we foster collaboration and innovation to secure Europe’s competitive edge,” said Laith Altimime, President of SEMI Europe. “At ISS Europe 2025, industry leaders will share their strategies for supply chain resilience, workforce development, and the transition from systems on chips to systems of chips. By working together, we can drive technological advancement and build a more sustainable and robust semiconductor ecosystem for the future.”

ISS Europe 2025 Featured Speakers  

• Andreas Schleicher, Director for Education and Skills, Organisation for Economic Co-operation and Development (OECD)
• Benedikt Ernst, SVP, Head of Strategy & Transformation, Electronics, Merck KGaA, Darmstadt, Germany
• Bill Lussier, Managing Director, Tokyo Electron Europe Ltd (TEL)
• Charles Vaillant, Chief Technology Officer and Chief Digital Officer, MANN+HUMMEL
• Christophe Frey, VP of EU Engagements and General Manager, Arm France
• Dariusz Standerski, Secretary of State, Ministry of Digital Affairs, Poland
• George Dritsantos, VP of Secure Power Central and Eastern Europe, Schneider Electric
• Hendrik Bourgeois, VP, European Government Affairs, Intel
• Jean-Christophe Eloy, CEO, Yole Group
• John Behnke, General Manager FPS Product Line, INFICON
• Meike Boekelmann, Chief Human Resources Officer, Comet Group
• Rainer Kiefer, EVP Global Head of Sales, Schenker AG
• Thomas Kralinski, State Secretary, Saxon State Secretary of Economic Affairs, Labour, Energy and Climate
• Volker Herbig, VP, BU MEMS, X-FAB

 ISS Europe 2025 Highlights

Session 1: Europe’s Strategy in a Shifting Geopolitical Landscape
Industry leaders will analyze how Europe is addressing global market trends and navigating geopolitical challenges to maintain a leadership position and drive innovation.

Session 2: Technology Roadmap to Net Zero: Breakthroughs and Energy Strategies
Experts will discuss breakthrough technologies, energy strategies, and AI-driven innovations shaping the semiconductor industry’s journey toward Net Zero goals.

Session 3: Shaping Europe’s Future Workforce: Strategies for Growth
Thought leaders will share actionable strategies to cultivate the workforce of tomorrow, emphasizing collaboration between industries, academia, and governments to drive innovation and sustainable growth.

Session 4: AI for Smarter Sustainable Manufacturing
Speakers will explore how AI can transform semiconductor manufacturing with smarter, sustainable processes while addressing workforce readiness and revitalizing European manufacturing capabilities.

Session 5: Driving Innovation to the Next Generation from Materials to System Level
Experts will highlight next-generation advancements in materials, design, and AI that are driving semiconductor innovation and enabling future technological breakthroughs.

Sponsors

• Headline:
  Invest in Pomerania
• Platinum: 
  Comet, Edwards, INFICON, MANN+HUMMEL, Polish Investment & Trade Agency, Schneider Electric, Synopsys and Tokyo Electron Limited (TEL)
• Gold:
  EBARA and Merck KGaA, Darmstadt, Germany
• Event: 
  DB Schenker, EV Group (EVG), HCLTech, imec, JSR Micro, Ovivo and VAT

For more details, please visit the Industry Strategy Symposium Europe (ISS Europe) 2025 website and connect with SEMI Europe on LinkedIn or X @SEMIEurope (#ISSEurope).

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.  

Contact Information:

Maria Daniela Perez / SEMI Europe 
Phone: +49 160 2562977 
Email: [email protected]  

Sherrie Gutierrez / SEMI Corporate
Phone: +1 831 889 3800 
Email: [email protected]

• Read more about SEMI ISS Europe 2025 Speakers to Address AI, Sustainability, Supply Chain Resilience, and Workforce Development