Pioneering Digital Manufacturing Technology Will Revolutionize Semiconductor Packaging, Display Manufacturing, and Consumer Electronics

Las Vegas, US, January 8, 2025 – SCRONA AG, a leader in microfabrication technologies and the proud holder of a World Record for the smallest printed color picture, has unveiled its revolutionary 128-nozzle electrohydrodynamic (EHD) printhead at CES 2025. This groundbreaking innovation achieves a three-digit nozzle count in digital EHD technology for the first time, marking a major milestone that transforms EHD printing into a mass-production-ready solution.

Launching with a newly developed print engine for seamless integration into production tools by the end of Q1 2025, the 128-nozzle printhead is poised to revolutionize high-precision manufacturing across industries. "The rapid development from 8 to 48 and now to 128 nozzles in such a short time is a testament to the scalability of our MEMS-based EHD Gen-3 platform and execution of our team," said Dr. Patrick Galliker, CTO and Co-Founder of SCRONA.

A Leap in Digital Manufacturing for Key Industries

The SCRONA 128-nozzle printhead brings unprecedented precision, material flexibility, and scalability to industries such as semiconductor advanced packaging, display manufacturing, and consumer electronics. Key benefits and applications include:

1. Semiconductor Manufacturing:
- Revolutionary die-attach applications, dispensing ultra-small adhesive volumes with unparalleled accuracy.
- High-resolution printing of conductive interconnects, vital for advanced AI chiplets and chip manufacturing innovations.

2. Display Technology:
- Unmatched precision in applying quantum dots and color filters for next-generation micro-LED and OLED displays, enabling vibrant, energy-efficient screens.
- High-accuracy printing of adhesives and sealants for display packaging, facilitating thinner and flexible substrates.

3. Versatility Across Sectors:
- Enhanced printing capabilities for consumer electronics, defense, and life sciences, with the ability to print on curved or challenging substrates.
- A versatile solution surpassing the limitations of traditional inkjet and screen printing technologies.

Accelerating Mass Production Ready for EHD Technology

The introduction of the 128-nozzle printhead represents a paradigm shift in production technology, setting a new benchmark for accuracy, speed, and material flexibility. This innovation addresses the long-standing challenges of scaling EHD technology to meet the rigorous demands of high-volume manufacturing. "We are thrilled to unveil our 128-nozzle EHD printhead at CES 2025," said Dr. Patrick Heissler, CEO, SCRONA AG. "This breakthrough paves the way for manufacturers to achieve greater performance, miniaturization, and efficiency in production processes while unlocking new opportunities for innovation in advanced technologies."

About Scrona AG
Scrona is a spin-off from ETH Zurich, one of the top 10 global research universities. Scrona has developed the industry's first multi-nozzle printing platform that can digitally print with sub-micron precision, on any material and at scale. Its patented electrostatic printing technology is transforming manufacturing processes in the field of semiconductors, displays and many other products. It is enabling new designs not feasible for implementation with today’s processes while significantly reducing material, energy and water consumption.
Learn more at www.Scrona.com

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Innexis delivers a set of products and capabilities to address demand for shift-left software development in the IC development process

With more demanding software workloads, it is critical to facilitate the development and execution of realistic workloads early in the design phase to shorten overall development time and identify hardware and software defects earlier
Siemens Digital Industries Software announced today the Innexis product suite, a complement to its industry leading Veloce™ hardware-assisted verification and validation system.

Building on the success and rapid adoption of Veloce, Siemens’ Innexis product suite delivers a set of capabilities to address customer demand for shift-left software in the early phases of IC development. These products include a hardware/software development flow from virtual to hybrid to full RTL, an architecture native virtual platform for early high-speed software development and a simulation backplane that enables the development of digital twins in Siemens’ PAVE360™ software for software-defined vehicles and other complex systems.

“The complexity of integrated circuits (IC) is increasing exponentially, designers need more efficient methodologies to meet industry demands. Veloce has seen rapid adoption by industry leaders to help solve this critical bottleneck. The Innexis product suite extends workflow improvements from Veloce to help our customers shift left their IC development and debug cycle,” said Jean-Marie Brunet, vice president and general manager, Hardware-Assisted Verification, Siemens Digital Industries Software. “This enables IC design to begin months before final RTL, all while using a common software workload across the development process.”

Adoption of a shift-left approach for software development and IP verification processes is now mandatory. As chip designs become increasingly complex due to more demanding software workloads, it is critical to enable the development and execution of realistic workloads early in the design phase. A proactive shift-left software approach helps mitigate the risk of identifying issues late in the development cycle.

“The implementation of Innexis in our development process has significantly enhanced software and system validation performance, thereby improving the efficiency of our teams and projects. By enabling heterogeneous component modeling within virtual platforms, it allows us to create realistic high-speed models of System on Chips (SoCs),” said Ari Hautala, Principal System Architect, Nokia Mobile Networks. “Furthermore, the integration of these high-speed virtual platforms with RTL IP on Veloce emulators facilitates superior overall performance while still permitting precise cycle-accurate performance and power analysis on RTL model components. Additionally, Innexis offers exceptional visibility and debuggability for the SoC design, along with the capability to integrate and execute a large number of complex test cases effectively.”

Currently, the Innexis product suite consists of:

Innexis Developer Pro: Innexis Developer Pro software provides a connected development flow from virtual to hybrid to full RTL. This provides a comprehensive environment for accelerating the creation of complex SoC design supporting a wide range of use-cases including seamless hardware-software co-development, co-validation, and pre-silicon cycle accurate analysis and validation. Innexis Developer Pro supports the modelling of complex SoC’s with heterogeneous cores and custom SystemC model components. In addition, it provides the ability to run in both virtual plus RTL hybrid mode for high performance execution, and then at a time of interest switch to full RTL emulation enabling high accuracy analysis of the full SoC when required.

Innexis Architecture Native Acceleration (ANA): Innexis Architecture Native Acceleration software is a cloud- based high-speed virtual platform. By running natively on Arm based servers the software workloads run at much higher speeds than on typical instruction set simulation based virtual platforms. Cloud hosting also provides scalable compute resources and simple browser-based access and tools. Innexis Architecture Native Acceleration can also run on local Arm based servers if preferred. In both cases it enables early software development and testing, and early software defect identification.

Innexis Virtual System Interconnect: Innexis Virtual System Interconnect software facilitates the creation and simulation of comprehensive system level digital twin platforms by seamlessly connecting multi-behavioral virtual and physical subsystems, supporting a variety of communication protocols. Innexis Virtual System Interconnect behavioral models can include Innexis Developer Pro or Innexis Architecture Native Acceleration SoC models, supporting system-level shift-left software development and RTL verification.

To learn more about Siemens’ Innexis product suite and how it addresses the demand for shift-left software development in the integrated circuit development process, visit: www.siemens.com/innexis

About Siemens
Siemens Digital Industries Software helps organizations of all sizes digitally transform using software, hardware and services from the Siemens Xcelerator business platform. Siemens' software and the comprehensive digital twin enable companies to optimize their design, engineering and manufacturing processes to turn today's ideas into the sustainable products of the future. From chips to entire systems, from product to process, across all industries. Siemens Digital Industries Software – Accelerating transformation.

Note: A list of relevant Siemens trademarks can be found here. Other trademarks belong to their respective owners.

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Heidelberg Instruments Reports Major Orders for the VPG+ 1400 FPD Volume Pattern Generator from Leading Asian Photomask Manufacturers

Heidelberg, Germany – Heidelberg Instruments has secured two major orders for its VPG+ 1400 FPD Volume Pattern Generator from leading photomask manufacturers in Asia, with a total order value between EUR 9 million and EUR 10 million. Deliveries are scheduled for 2025.

“These significant order intakes mark major milestones for the company, reinforcing our market position and driving further innovation and growth in the display technology sector”, says Alexander Forozan, VP of Global Sales and Business Development.

The VPG+ 1400 is Heidelberg Instruments’ largest system, specifically designed for large-format photomask patterning in the flat panel display (FPD) industry. It supports mask sizes up to 1400 x 1400 mm², making it ideal for various flat panel display generations (G4 to G8). The VPG+ 1400 sets a new standard for high-throughput photomask production, offering the precision and scalability required for large displays. Additionally, it delivers the accuracy needed to produce large-area halftone photomasks for flat panel displays.

Equipped with advanced metrology and alignment features, including Cognex AI-based image recognition, the system ensures precise alignment for multilayered masks. Its linear and nonlinear coordinate corrections further enable precise overlay across tools.
By addressing the diverse exposure needs of customers, Heidelberg Instruments' large-area VPG+ Volume Pattern Generators have proven to be valuable assets in display photomask production lines.

Further information: https://heidelberg-instruments.com/product/vpg-1400-fpd/

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Innovative plug-and-play device helps conduct comprehensive equipment compliance tests for automatic carrier delivery in automated fabs

SEMICON Europa, Munich, Germany, November 12, 2024 – Agileo Automation, a leading provider of control and connectivity solutions for global semiconductor equipment manufacturers, today launches the E84 PIO Box at Booth #C2848. This handheld device offers a new lightweight interface for fab staff to test semiconductor equipment software for compliance with SEMI’s E84 and GEM300 standards suite for automatic carrier delivery. It improves the readability, identification, and validation of E84 signal exchanges and functional aspects in cleanrooms or workshops. Integrated with Agileo Automation’s Speech Scenario software that emulates the fab host and validates the SECS/GEM interface with predefined test scenarios, the E84 PIO Box can easily emulate automated carrier delivery systems such as overhead hoist transport or automated guided vehicles. It is able to detect non-compliance and other functional issues thanks to its close alignment with SEMI’s E84 standard. The device features a DB25 connector for easy integration with E84 passive systems such as a load port and connects directly to a PC via a single USB cable for both data and power supply.

“In highly automated fabs, even minor carrier delivery issues can lead to costly downtime. Our E84 PIO Box is designed to rigorously validate nominal and error cases, ensuring seamless operations and fast recovery, benefiting both equipment manufacturers and facilities alike,” explains Marc Engel, CEO of Agileo Automation. “Early adopters have seen significant improvements in overall equipment software quality and now approach each software update with greater confidence, backed by consistent testing results.”

About Agileo Automation
Since its inception in 2010 in Poitiers, France, Agileo Automation has empowered global semiconductor equipment manufacturers to optimize their production machines with control, communication, data acquisition, and testing solutions, enabling their deployment in large-scale fabs worldwide. At the heart of Industry 4.0, Agileo’s A²ECF-SEMI framework provides a robust foundation for developing equipment controller software, leveraging the SEMI SECS/GEM and GEM300 standard suites. As a member of SEMI and the OPC Foundation, Agileo is a key contributor to the development and integration of industry standards such as SEMI standards and OPC Unified Architecture (OPC-UA). For more information, please visit our web site or follow us on LinkedIn.

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Munich, Germany – November 4, 2024 – SEMI Europe and the SEMI European Advisory Council for Diversity and Inclusion today announced the 2024 20 Under 30 Award Recipients, honoring exceptional young professionals who are driving innovation and success in the semiconductor industry.

This prestigious award highlights the most promising leaders under 30-years-old who are making significant contributions within the microelectronics supply chain, fostering a more diverse and inclusive environment in a critical sector.

"Recognizing the innovators of tomorrow is crucial for the growth and sustainability of our industry," said Laith Altimime, President of SEMI Europe. "The 20 Under 30 Award not only honors exceptional talent but also inspires a new generation to drive change and foster collaboration in the semiconductor sector. By proudly showcasing these talented individuals, SEMI Europe aims to foster a culture of recognition that empowers young professionals to pursue their ambitions and drive change."

2024 20 Under 30 Award Recipients

The 2024 award recipients represent a diverse range of roles and specializations within the European semiconductor landscape:

• Abel Andemichael, PCB Layout Designer, Comet AG
• Alicia Pang Li Si, Process Engineer, Soitec
• Anne-Mary YEBOAH, Technology Manager, Soitec
• Annika Schnell, Application Specialist, DR YIELD
• Augustin Detruit, Head of Production/Production Manager, ERS electronic GmbH
• Charis Kalantzi, Lead Application Engineer, Cadence Design Systems
• David Coenen, Senior researcher Silicon Photonics Thermal Management, imec
• Elisabeth Brierley, Sustainable Graduate, Edwards – Atlas Copco group
• Felix Holtsch, Engineer 2 – Product Specialist, Tokyo Electron Europe (TEL)
• Felix Kohler, Use Case Manager, Electronics business of Merck KGaA, Darmstadt, Germany
• Giulia Cioffi, Asic Digital Design Staff Engineer, Synopsys
• James McGrath, CVD Process Engineer, KLA (SPTS Division)
• Kamal Rudra, R&D Integration Engineer, IBM
• Lizzie Boakes, Researcher, imec
• Luca Sinkó, R&D Team Leader, SEMILAB
• Mouadh Ayache, Senior Engineer, Synopsys
• Pascal Fasel, Process Engineer / Project Manager, Comet AG
• Pheobe Kuo, Customer Engineer, Applied Materials
• Steve Kalkbrenner, Senior Software Developer, Kontron-AIS
• Thibaud Rebotier, Senior Industrial Engineer, ASM International

"As professionals in the semiconductor industry, it's our collective responsibility to nurture new talent as well as spark curiosity and passion for our dynamic field," said Stephan Haferl, CEO of Comet. "By supporting SEMI in honoring the young leaders who will shape our future, Comet proudly contributes to this mission."

Dan Collins, General Manager of KLA's SPTS Division, said, "We congratulate all the shortlisted individuals and feel it is important to recognize and celebrate these worthy winners as they continue their career journeys to shape this industry and lead it to a bright future."

"We are proud to partner with the SEMI 2024 20 Under 30 Award," said Olga Needham, Senior HR Director, Tokyo Electron Europe (TEL). "This award is dedicated to recognizing and empowering young leaders who are making significant contributions to their organization and customers. At TEL, we believe that by investing in the next generation, we are not only helping to shape the future but also creating opportunities for growth and innovation in our industry."

The 2024 20 Under 30 Award is sponsored by Comet Group, KLA and Tokyo Electron Europe (TEL), highlighting their commitment to nurturing emerging talent in the semiconductor field.

SEMI Europe will host the award ceremony during SEMICON Europa 2024, which will take place from November 12-15 at Messe München in Munich, Germany. Co-located with electronica, this premier exhibition and conference for the microelectronics supply chain will showcase keynotes from thought leaders in design, manufacturing, academia, and government. Registration is open.

For more information about the 20 Under 30 Award or to learn about future nomination opportunities, visit SEMI Europe 20 Under 30 Award. For more details, please visit the SEMICON Europa 2024 website and connect with SEMI Europe on LinkedIn or X @SEMIEurope (#SEMICONEuropa).

About SEMI

SEMI^® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON^® expositions and events, technology communities, standards and market intelligence help advance our members' business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contacts

Maria Daniela Perez / SEMI Europe
Phone: +49 160 2562977
Email: [email protected]

Samer Bahou/SEMI Corporate
Phone: 1.408.943.7870
Email: [email protected]

• Read more about SEMI Europe Announces 2024 20 Under 30 Awards Celebrating Innovation and Leadership

MUNICH, Germany ─ October 14, 2024 ─ Semiconductor industry experts will convene at SEMICON Europa 2024, November 12-15 at Messe München in Munich, to explore the latest trends and innovations in advanced packaging and fab management. The Advanced Packaging Conference (APC) and Fab Management Forum (FMF) at SEMICON Europa will each focus on driving sustainable solutions to meet the evolving demands of the semiconductor market. Co-located with electronica, SEMICON Europa is the region’s premier event connecting the entire electronics design and manufacturing supply chain. Registration is open for APC and FMF.

"Global collaboration across the semiconductor industry is essential for driving sustainable, exponential growth,” said Laith Altimime, president of SEMI Europe. ”SEMI Europe Advanced Packaging Conference and Fab Management Forum provide invaluable platforms for stakeholders to share insights and innovations, ensuring we leverage cutting-edge technologies and strategies that enhance performance while paving the way for a more sustainable future." 

Advanced Packaging Conference ─ 
Chiplets and Heterogenous Integration: The Next Frontier in Performance and Efficiency 

Demand for High Performance Computing (HPC) is increasing, driven by advancements in artificial intelligence and Large Language Models like ChatGPT. HPC’s expansion requires innovative solutions in chiplet design, heat dissipation, and power optimization. The upcoming APC will provide a platform to explore enhancing each of these developments, highlighting collaboration among academia, industry, and government.   

This year’s APC will focus on:

• The Role of Chiplets in Enhancing Performance and Efficiency
• Power Optimization Techniques for Next-Generation Applications
• Advances in Miniaturization and Material Integration
• Innovations in Heat Dissipation and Thermal Management
• Collaborations Across Academia, Industry, and Government   

Speakers include experts from Amkor Technology, ASE Global, Atotech an MKS Brand, Besi, Chip Integration Technology Center (CITC), Comet Yxlon, EV Group (EVG), Evatec, GlobalFoundries, Guangdong Fenghua Semiconductor Technology, Henkel, IBM, Infineon Technologies, JCET, Koh Young Europe, QuantumDiamonds, RHP-Technology, RoodMicrotec, Robovision, STATS ChipPAC, and SUSS MicroTec.

The conference is sponsored by ASE Global, Atotech an MKS Brand, Comet Yxlon, IBM, Koh Young Europe and SUSS MicroTec.

Fab Management Forum ─
Driving Innovation: Competitive, Sustainable and Collaborative Strategies 

To meet its evolving demands, the semiconductor industry must adopt competitive, sustainable, and collaborative strategies that enhance fab efficiency and performance. Industry stakeholders can develop innovative solutions for a sustainable future by integrating cutting-edge technologies and fostering partnerships.  This year’s FMF will focus on:

• Key Strategies in a Global Market Landscape
• Advancing Smart Manufacturing Solutions
• Europe's Environmental Transition: Stability to Sustainability
• Next-Gen Core Technologies for Future Fabs

Speakers include experts from Algorismic, ams OSRAM, BMW Group, Comet Yxlon, Flexciton, Infineon Technologies, INFICON, imec, Kontron AIS, minds.ai, Robert Bosch Semiconductor Manufacturing, STMicroelectronics, Synopsys, Texas Instruments, Tokyo Electron Europe, Watlow, and X-Fab.

The forum is sponsored by Comet Yxlon, Flexciton, INFICON, Lynceus, Tokyo Electron Europe (TEL), and Watlow.

Other SEMICON Europa 2024 Highlights

• CxO Summit: Top executives will share strategies for sustainable growth in Europe's semiconductor sector, focusing on navigating the evolving landscape through sustainability, supply chain resilience, and technological advancements.
• III-V Summit – Integrated Photonics: This summit will examine the role of III-V compound semiconductors in advancing next-generation electronics, focusing on their impact on high-performance, energy-efficient devices in telecommunications, computing, and photonics.
• ITF Chip into the Future - Powered by imec: This session will cover the EU Chips Act's implementation and impact on Europe's semiconductor ecosystem, highlighting collaborative research and innovations in chip design and manufacturing.
• MEMS & Imaging Sensors Summit: This summit will explore recent advancements in MEMS and imaging sensor technologies, focusing on their impact on agriculture, automotive, and healthcare, along with the integration of AI, machine learning, and data fusion in next-generation applications.
• Executive Forum Programs: These sessions will provide updates on key technological trends, including Silicon Carbide (SiC) power semiconductors, smart mobility solutions, and AI-driven manufacturing processes. Industry experts will also address sustainable energy and challenges related to electrification, presenting the latest innovations aimed at overcoming these obstacles.
• TechARENA Programs: Focused on emerging technologies, TechARENA sessions will explore advancements in fields such as medical technology, quantum computing, and cybersecurity. The discussions will also address global challenges related to supply chain management, sustainability, and talent development, with an emphasis on the role of European research and innovation in driving the growth of the semiconductor industry.

Programs in halls C1, C2 and Entrance West are complimentary for all SEMICON Europa and electronica visitors. For more details, please visit the SEMICON Europa 2024 website and connect with SEMI Europe on LinkedIn or X @SEMIEurope (#SEMICONEuropa).

SEMICON Europa 2024 

• Platinum: 
  Comet Yxlon, Edwards, INFICON, Invest in Pomerania, Koh Young Europe, Lam Research, Merck KGaA, Darmstadt, Germany, Schneider Electric, Siemens, Soitec, SUSS MicroTec and Tokyo Electron Europe (TEL)
• Gold: 
  Exyte, KLA and Synopsys
• Silver: 
  Adeia, EBARA, HCLTech, Honeywell, Kanken and Semilab
• Event:
  ASE Global, Atotech an MKS Brand, Catalonia Trade & Investment, CI Semi, Comet Group, DB Schenker, Entegris, EV Group (EVG), Flexciton, Fluor, IBM, imec, Lynceus, SCREEN, and Watlow 

About SEMI 

SEMI ^® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON ^® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contacts 

Maria Daniela Perez / SEMI Europe
Phone: +49 160 2562977 
Email:  [email protected] 

Samer Bahou / SEMI Corporate
Phone: +1 408 943 7870
Email: [email protected]

• Read more about SEMICON Europa 2024 to Explore Innovations in Advanced Packaging and Fab Management for a Sustainable Future