Munich
Germany
Class Modules
Module 1 – EDA Standards Suite
Session 1 – Overview: Background, Motivation, Basics
This session introduces the EDA standards at a high level, explaining the historical industry context that motivated the semiconductor factory automation community to define these standards, informed the initial set of functional requirements and performance expectations, provided the engineering and administrative resources to support this multi-year effort, and drove the implementation and validation processes to successful completion of the first version.
In summary, this session describes much of the “why” the EDA standards exist.
Session 2 – Deeper Dive: Specifications, Interaction, Performance
This session shows how the standards in the EDA suite work together to meet the requirements described in Session 1, describing the overall system architecture and component technologies used. It then goes into depth for each of the major standards, which include SEMI E120 (Specification for the Common Equipment Model), SEMI E125 (Specification for Equipment Self Description), SEMI E132 (Specification for Equipment Client Authentication and Authorization), SEMI E134 (Specification for Data Collection Management), and SEMI E164 (Specification for EDA Common Metadata).
Since it is more instructive to “see” data collection in action rather than imagining it through specifications and animated PowerPoint, this session includes demonstrations of the standards using equipment simulators and reference client (host) software to bring the EDA standards to life.
In summary, this session describes most of the “what” for the EDA standards.
Module 2 – Best Practices for EDA Standards Implementation and Testing
Session 3 – Equipment Suppliers
This session describes the implementation process an equipment supplier would use to provide an EDA interface on its equipment based on the requirements specified in the SEMI standards themselves and whatever additional information may be provided by their customer(s), the semiconductor manufacturers. Most of the best practices outlined in this session apply to EDA interface design and implementation whether or not the supplier chooses to build the interface in house or purchase and configure a third-party software package.
This session also covers the validation checklist defined and published by ISMI (International Sematech Manufacturing Initiative) in its “ISMI EDA Evaluation Method” and the use of standards validation software to automate most of this process.
In summary, this session is a useful “how to” guide for equipment (and/or software) suppliers who want to implement the EDA standards.
Session 4 – Best Practices for EDA Standards Implementation and Testing
This session can be thought of as the “mirror image” of Session 3 and focuses on what the factory automation and equipment integration staff in the chip factories must do to implement the “client” (host) side of the EDA standards. Simply put, the factories are the collectors and consumers of the equipment and process data that are produced by the equipment. And as before, the topics covered in this session apply equally for in-house software development and the purchase of third-party software.
Since the EDA standards do not explicitly define many of the practical aspects of a communications interface (e.g., computing platform on which the interface runs, content of the equipment metadata model, performance requirements such as data granularity, sampling frequency, total data volume), this session also describes a process for crafting the EDA sections of an equipment purchase specification; these additional requirements form the data collection “contract” between the equipment supplier and its customer so rather than leaving this important topic to chance.
In summary, this session is a useful “how to” guide for factories that want to make the most of the EDA interfaces on their purchased equipment.
Module 3 – Example Use Cases and Customer Benefits
Session 5 – Equipment-focused Applications
This session addresses the “How do these standards benefit your company?” question that may be posed to equipment suppliers who have chosen to implement the EDA standards. In fact, there are a number of applications that equipment suppliers can implement and sell that offer added value to their customers.
Examples include equipment/process characterization utilities, throughput monitoring, component and subsystem fingerprinting, AI/ML (artificial intelligence/machine learning) model development support, remote diagnostic support, among others. This session will explain how some of these applications can leverage the capabilities of the EDA standards without negatively impacting the factory customers’ equipment integration environment.
Session 6 – Factory-focused Applications
This session answers the “Now what?” question that was actually posed to one of our standards promotion team when presenting the EDA standards at a standards technology seminar. At the time, he was focused on the detailed content and implementation process for the standards and didn’t have a satisfactory answer for why a factory would want to use these new (at the time) standards.
Such an excellent question deserved an equally excellent answer, so we spent the next 6 months meeting with the early adopters of the EDA standards to see what applications made particularly effective use of the EDA capabilities beyond what they had accomplished to date with the GEM/GEM300 standards. The applications outlines in this session are the result of those meetings and subsequent discussions.
Module 4 – Current Standardization Activities and Evolution
Session 7 – Freeze 3 Technologies and Outlook
This session covers the Freeze 3 release of the EDA standards suite, focusing especially on the recent technologies (e.g., gRPC, protocol buffers) that are being incorporated to improve data collection performance. It also compares Freeze 3 with the Freeze 2 version so people familiar with the current suite know what to expect. Finally, it will reference other standards that will impact the content of the SEMI E120/E125 equipment metadata model; examples include the GEM300 standards updates which now contain a set of “Well-Known Names” for common parameters and event, and SEMI E190/E190.1 (Equipment Data Publication) which go beyond E164 to list process-specific parameters that should appear in the EDA interface.
In summary, this session answers the question “What’s next?” for the EDA standards.
Session 8 – Support for AI/ML-based Initiatives
This session describes some of the unique and challenging characteristics of AI/ML-based systems that the EDA standards were (in hindsight) designed to support. This not only includes collecting massive amounts of detailed equipment and process data to feed these algorithms but also managing the available context information necessary for correct training and tuning machine learning models and selecting the appropriate model for a given production situation. Finally, this session will highlight a number of promising AI/ML use cases that have already been implemented.
In summary, this session answers the question “How can I leverage the EDA standards to support the wave of AI/ML implementations currently and/or soon to be underway?”
Instructor

Alan Weber

Mihai Bodea

Sreeraj
SEMICON Europa
Munich
Germany
The EDA Standards course is an all-day workshop aiming to provide a comprehensive understanding of the standards used in semiconductor factory automation. Beginning with an overview of EDA, the course will focus on best practices for implementing and testing EDA interfaces from both an equipment supplier and factory perspective. You will learn how EDA interfaces can benefit your company’s existing processes through multiple real-world use cases.
Pricing
- Members: $695
- Non-members: $795
- Students: $595
* Coffee, refreshments, and lunch will be provided for all attendees.
* During this course, we will be covering the basics of SEMI E120 (Specification for the Common Equipment Model), SEMI E125 (Specification for Equipment Self Description), SEMI E132 (Specification for Equipment Client Authentication and Authorization), SEMI E134 (Specification for Data Collection Management), and SEMI E164 (Specification for EDA Common Metadata). These Standards are recommended, but not required for this course.
Who Should Attend
Automation staff at semiconductor manufacturing equipment suppliers and semiconductor factories
Manufacturing application software suppliers
Automation consultants
Manufacturing data scientists
Prerequisites
- Familiarity with basic factory automation terminology
- Familiarity with basic communication protocol terminology
- Familiarity with common semiconductor manufacturing artifacts
United States
StandardsJoin us for the SEMI Standards
3D Packaging & Integration (3DP&I)
North America Technical Committee Chapter Fall Meeting
Date: Tuesday, October 14, 2025
Time: 13:00-14:30 Pacific Time
Online via Web Conference
To receive the calendar invite, please reach out to the contact below.
AGENDA
(Subject to change)
Last updated: September 14, 2025
1:00 pm - 2:30 pm Off Add to Calendar 2025-10-14 13:00:00 2025-10-14 14:30:00 3D Packaging & Integration North America TC Chapter Fall Meeting 2025 Join us for the SEMI Standards3D Packaging & Integration (3DP&I)North America Technical Committee Chapter Fall MeetingDate: Tuesday, October 14, 2025Time: 13:00-14:30 Pacific TimeOnline via Web ConferenceTo receive the calendar invite, please reach out to the contact below. AGENDA(Subject to change)Last updated: September 14, 2025 United States SEMI.org [email protected] America/Los_Angeles public
Virtual + Voting Instructions
SEMI uses RingCentral to host virtual meetings.
To receive the calendar invite, please reach out to the contact below.
To Vote During TC Chapter Meetings
- Open a separate Web browser and go to: https://svm.semi.org/
- Click “Login”
- Enter your Standards Membership username and password (same login you use for voting on ballots)
- Find the meeting room you wish to attend under “Room Name”
- Click “Go” to enter the meeting room.
NOTE: You must be a registered SEMI Standards Program Member to gain access. Reach out to your staff contact if you are unable to log on, or if your "voting interest" is incorrect or shows "NONE".
Contact
Laura Nguyen
Sr. Coordinator, International Standards
SEMI Japan
26F, xLINK Marunouchi Eiraku Bldg.
1-4-1 Marunouchi,
Chiyoda-ku, Tokyo
1010005
Japan
Information & Control Japan TC Chapter Meeting
Date: Tuesday, October 21, 2025
Time: 9:30 am - 12:00 pm JST
Venue: SEMI Japan Office Room 1 + OVTCCM (Hybrid)
AGENDA
Standards Contact Information:
Takeaki Hirabara
Standards & EHS, SEMI Japan
Email: [email protected]
NOTE:
Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.
If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!
Questions? Contact your local staff coordinator: Click here
KOMORI CORPORATION, Tsukuba Plant
203-1 Nakayama
Tsukuba-shi, Ibaraki
300-1268
Japan
Flexible Hybrid Electronics (FHE) Japan TC Chapter Meeting
Date: Friday, October 17, 2025
Time: 3:30 PM - 5:30 PM JST
via OVTCCM/ KOMORI CORPORATION, Tsukuba Plant, Ibaraki, Japan (Hybrid)
AGENDA
Standards Contact Information:
Nahoko Koga
Coordinator, SEMI Japan
Email: [email protected]
NOTE:
Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.
If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!
Questions? Contact your local staff coordinator: Click here
SEMI Japan
26F, xLINK Marunouchi Eiraku Bldg.
1-4-1 Marunouchi
Chiyoda-ku, Tokyo
1000005
Japan
FPD Materials & Components and FPD Metrology Japan Joint TC Chapter Meeting
Date: Wednesday, October 15, 2025
Time: 3:00 PM - 5:00 PM JST
via OVTCCM/ SEMI Japan Office (Hybrid)
AGENDA
Standards Contact Information:
Nahoko Koga
Coordinator, SEMI Japan
Email: [email protected]
NOTE:
Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.
If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!
Questions? Contact your local staff coordinator: Click here
SEMI Japan Office
26F, xLINK Marunouchi Eiraku Bldg.
1-4-1 Marunouchi,
Chiyoda-ku, Tokyo
1000005
Japan
Physical Interfaces & Carriers Japan TC Chapter Meeting
Date: Friday, September 26, 2025
Time: 10:00 am - 1:00 pm JST
Venue: SEMI Japan Office + OVTCCM (Hybrid)
AGENDA
Standards Contact Information:
Takeaki Hirabara
Standards & EHS, SEMI Japan
Email: [email protected]
NOTE:
Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.
If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!
Questions? Contact your local staff coordinator: Click here
Munich
Germany
This event is over. Contact Laura Nguyen for additional information.
To access the recording, when available it will be posted here: https://www.semi.org/en/products-services/standards/step
Overview
The IRDS Roadmap has identified near-term challenges related to measurements of particles, trace metals and organics in liquid chemicals at levels required to meet the needs of the industry. The identified challenges are measurement of 10 nm and smaller particles, sub ppt measurement of metallic impurities, measurement of particle precursors and trace organics and online speciation of trace organics. The focus of the workshop will be on recent advances in analytical methodology and instrumentation that will enable the industry to meet these challenges.
In-Person—Mountain Time
Phoenix Convention Center
North Building, 200 Level, Room 229B
Phoenix, AZ
United States
Chemical Quality and Consistency Requirements for the Semiconductor Industry
Analysis of Challenging Semiconductor Chemicals by ICP-MS
Addressing IRDS Yield Enhancement Challenges in Liquid Chemical Metrology
Metrology for Detection of Particle Precursor and Sub-10 nm Particles In Liquids and On-Wafer
Identification of Organic Particle Precursors using FTIR-ATR, SERS and AFM-IR
Closing Remarks
SEMI Analytical Workshop
9:00 am - 11:30 am Off Add to Calendar 2025-10-08 09:00:00 2025-10-08 11:30:00 SEMI Liquid Chemicals Analytical Workshop SEMI Analytical Workshop In-Person—Mountain Time Phoenix Convention Center North Building, 200 Level, Room 229B Phoenix, AZ United States SEMI.org [email protected] America/Los_Angeles publicThis event is over. Contact Laura Nguyen for additional information.
To access the recording, when available it will be posted here: https://www.semi.org/en/products-services/standards/step
Overview
Since 2018, the SEMI Voltage Sag Task Force—comprising Fabs, Utilities, OEMs, Tool Suppliers, and EPRI—has collaborated to address a persistent challenge: why do tools remain vulnerable to voltage sags despite the implementation of SEMI F47?
Over seven years, the task force has investigated the power quality environment, tool susceptibility, testing methodologies, and mitigation strategies. This deep dive has led to actionable recommendations for strengthening the SEMI F47 standard and improving tool resilience in future builds.
What to Expect
Join us for a comprehensive workshop that will:
- Review the task force’s findings and collaborative efforts
- Share insights from key stakeholders
- Present proposed revisions to the SEMI F47 standard
- Discuss how these updates can enhance tool performance and reliability
In-Person—Mountain Time
Phoenix Convention Center
North Building, 200 Level, Room 229B
Phoenix, AZ
United States
SEMI F47 Background & Voltage Sag Immunity Task Force Review
Biography
Mark will present the background of the 7-year effort, the findings from the work , proposed updates and pathways towards improvements and will close out with a summary and next steps.
Baselining PQ Data from Semiconductor Fabs
Insights from Global Foundries
Biography
Zack will present on Global Foundries experiences with semiconductor tool shutdowns, efforts toward improvement and the types of voltage sags that are still causing tool downtime.
Experiences from National Grid
Biography
Clay will discuss the power quality environment, relay concepts such as area of vulnerability, and the need for including some level of three-phase voltage sag testing.
Key Findings from Research and Testing
Proposed Updates to the SEMI F47 Standard from Task Force Work
Facilities Korea TC Chapter Input
Voltage Sag Generator Readiness
Summary and Next Steps
Enhancing Voltage Sag Immunity: SEMI F47 Standard Updates & Insights Workshop
This is a must-attend session for professionals involved in semiconductor manufacturing, power quality engineering, and equipment design.
2:30 pm - 4:30 pm Off Add to Calendar 2025-10-08 14:30:00 2025-10-08 16:30:00 Enhancing Voltage Sag Immunity: SEMI F47 Standard Updates & Insights Workshop Enhancing Voltage Sag Immunity: SEMI F47 Standard Updates & Insights WorkshopThis is a must-attend session for professionals involved in semiconductor manufacturing, power quality engineering, and equipment design. In-Person—Mountain Time Phoenix Convention Center North Building, 200 Level, Room 229B Phoenix, AZ United States SEMI.org [email protected] America/Los_Angeles public