Chie Yanagisawa Manager, Standards, SEMI Japan Email: [email protected]
Note: Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. If you are not a Member, please join the Standards Program and start making a big contribution to the industry’s progress, complete an application form today.
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Add to Calendar2020-09-04 00:00:002020-09-04 00:00:00Metrics Japan TC ChapterSEMI® International Standards Program
Metrics Japan TC Chapter meeting
Friday, September 4, 2020, 10:00-12:00 [JST]
SEMI Japan office, Tokyo, Japan
Agenda
Standards Contact Information:
Chie Yanagisawa
Manager, Standards, SEMI Japan
Email: [email protected]
Note: Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. If you are not a Member, please join the Standards Program and start making a big contribution to the industry’s progress, complete an application form today.SEMI Japan office Kudan-minami 4-7-15 Chiyoda Tokyo 1020074 JapanSEMI.org[email protected]Asia/Tokyopublic
Asia/Tokyo
Liquid Chemicals Japan TC Chapter Meeting
SEMI Japan Kudan Minai 4-7-15 Tokyo, Tokyo 1020074 Japan
Document 6575 — Line Item Revision to SEMI F61-0617, Guide to Design and Operation of a Semiconductor Ultrapure Water System
Document 6576 — Line Item Revision to SEMI F63-0918, Guide for Ultrapure Water Used in Semiconductor Processing
Document 6577 — Line Item Revision to SEMI F75-0617, Guide for Quality Monitoring of Ultrapure Water Used in Semiconductor Manufacturing
Document 6606 — Reapproval to SEMI C69-1015, Test Method for the Determination of Surface Areas of Polymer Pellets
Document 6489 — New Standard: Guide for Reporting Chemical Mechanical Planarization (CMP) Polishing Pad Hardness used in Semiconductor Manufacturing
Document 6645 — Revision to SEMI F40-0699E (Reapproved 0918), Practice for Preparing Liquid Chemical Distribution Components for Chemical Testing, with title change to: Practice for Preparing Liquid Chemical Distribution Components and Neat Polymers or Chemical Testing
Subcommittee & Task Force Reports
Liquid Filter TF
Liquid-Borne Particle Counter TF
Diaphragm Valve TF
Welding Fitting TF
Trace Metal Analysis for High Pure IPA TF
Old Business
New Business
Standards Contact Information:
Hirofumi Kanno Manager, Standards, SEMI Japan Email: [email protected]
Note: Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. If you are not a Member, please join the Standards Program and start making a big contribution to the industry’s progress, complete an application form today.
1:00 pm - 4:00 pm
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Add to Calendar2020-08-20 13:00:002020-08-20 16:00:00Liquid Chemicals Japan TC Chapter MeetingSEMI® International Standards Program
Liquid Chemical Japan TC Chapter meeting
Thursday, August 20, 2020, 13:00 –End 16:00
SEMI Japan office, Tokyo, Japan
AGENDA
Welcome / Call to Order
Introductions
Meeting Reminders (Membership Requirement, Antitrust and Intellectual Property Reminders, Effective Meeting Guidelines)
Agenda Review
Review and Approval of Previous Meeting Minutes
Committee Leadership Change
Liaison Report
Europe TC Chapter
North America TC Chapter
FM Forum
Staff Report
Ballot Review
Document 6575 — Line Item Revision to SEMI F61-0617, Guide to Design and Operation of a Semiconductor Ultrapure Water System
Document 6576 — Line Item Revision to SEMI F63-0918, Guide for Ultrapure Water Used in Semiconductor Processing
Document 6577 — Line Item Revision to SEMI F75-0617, Guide for Quality Monitoring of Ultrapure Water Used in Semiconductor Manufacturing
Document 6606 — Reapproval to SEMI C69-1015, Test Method for the Determination of Surface Areas of Polymer Pellets
Document 6489 — New Standard: Guide for Reporting Chemical Mechanical Planarization (CMP) Polishing Pad Hardness used in Semiconductor Manufacturing
Document 6645 — Revision to SEMI F40-0699E (Reapproved 0918), Practice for Preparing Liquid Chemical Distribution Components for Chemical Testing, with title change to: Practice for Preparing Liquid Chemical Distribution Components and Neat Polymers or Chemical Testing
Subcommittee & Task Force Reports
Liquid Filter TF
Liquid-Borne Particle Counter TF
Diaphragm Valve TF
Welding Fitting TF
Trace Metal Analysis for High Pure IPA TF
Old Business
New Business
Standards Contact Information:
Hirofumi Kanno
Manager, Standards, SEMI Japan
Email: [email protected]
Note: Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. If you are not a Member, please join the Standards Program and start making a big contribution to the industry’s progress, complete an application form today.SEMI Japan Kudan Minai 4-7-15 Tokyo, Tokyo 1020074 JapanSEMI.org[email protected]Asia/Tokyopublic
Asia/Tokyo
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Add to Calendar2020-07-17 00:00:002020-07-17 00:00:00I&C Korea TC Chapter MeetingI&C Korea TC Chapter meeting
Friday, July 17, 2020
15:00-18:00
SEMI Korea office, Seoul, Korea
AGENDA
1.0 Welcome / Call to Order
Introductions
Meeting Reminders (Membership Requirement, Antitrust and Intellectual Property Reminders, Effective Meeting Guidelines)
Agenda Review
2.0 Review and Approval of Previous Meeting Minutes
3.0 Committee Leadership Change
4.0 Liaison Report
Europe TC Chapter
Japan TC Chapter
North America TC Chapter
Taiwan TC Chapter
Staff Report
5.0 Ballot Review
5832B - New Standard: Specification for Equipment Generic Counter Model (EGCM)
6.0 Subcommittee & Task Force Reports
Advanced Back-end Factory Integration (ABFI) TF
Diagnostic Data Acquisition (DDA) TF
GEM300 TF
7.0 Old Business
Project period Review
5-year Review
8.0 New Business
Ballot Submission for E87 Revision GEM300 TF
9.0 Action Item Review
Open Action Items
New Action Items
10.0 Next Meeting & Adjournment
Standards Contact Information
Natalie Shim
Manager, SEMI Korea
Email: [email protected]
Phone: 82.2.531.7808Gangnam-gu Seoul South KoreaSEMI.org[email protected]Asia/Seoulpublic
Asia/Seoul
#6625 - Line Item Revision to SEMI A1.1-1019 Specification For TCP/IP Interface For Production Equipment Smart Connection Interface (PESCI)
#6629 - Line Item Revision to SEMI A1-1019 Specification for Production Equipment Smart Connection Interface (PESCI)
#6630 - Line Item Revision to SEMI A2-1019 Specification for Surface Mount Assembler Smart Hookup (SMASH)
Subcommittee & Task Force Reports
A1 TF
Surface Mount Technology (SMT) TF
Flow shop Generic Equipment Model (F-GEM) TF
Old Business
Project period Review
5-year Review
New Business
New SNARF for Line Item Revision to SEMI A2 SMASH - SMT TF
Ballot Submission of Line Item Revision to SEMI A2 SMASH - SMT TF
Abolishment of SNARF #6627 SMT-GEM - F-GEM TF
New SNARF for New Specification SMASH-FOX - F-GEM TF
Ballot Submission of New Specification SMASH-FOX - F-GEM TF
Action Item Review
Open Action Items
New Action Items
Next Meeting and Adjournment
Standards Contact Information:
Hirofumi Kanno Manager, Standards, SEMI Japan Email: [email protected]
Note: Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. If you are not a Member, please join the Standards Program and start making a big contribution to the industry’s progress, complete an application form today.
1:30 pm - 3:30 pm
Off
Add to Calendar2020-07-31 13:30:002020-07-31 15:30:00Automation Technology Japan TC Chapter meetingSEMI® International Standards Program
Automation Technology Japan TC Chapter meeting
Friday, July 31, 2020, 13:00 –End 15:00
SEMI Japan office, Tokyo, Japan
AGENDA
Welcome / Call to Order
Introductions
Meeting Reminders (Membership Requirement, Antitrust and Intellectual Property Reminders, Effective Meeting Guidelines)
Agenda Review
Review and Approval of Previous Meeting Minutes
Committee Leadership Change
Appointment of New TF Leader A1 TF
Appointment of New TF Leader SMT TF
Liaison Report
Europe TC Chapter
Taiwan TC Chapter
FM Forum
Staff Report
Ballot Review
#6625 - Line Item Revision to SEMI A1.1-1019 Specification For TCP/IP Interface For Production Equipment Smart Connection Interface (PESCI)
#6629 - Line Item Revision to SEMI A1-1019 Specification for Production Equipment Smart Connection Interface (PESCI)
#6630 - Line Item Revision to SEMI A2-1019 Specification for Surface Mount Assembler Smart Hookup (SMASH)
Subcommittee & Task Force Reports
A1 TF
Surface Mount Technology (SMT) TF
Flow shop Generic Equipment Model (F-GEM) TF
Old Business
Project period Review
5-year Review
New Business
New SNARF for Line Item Revision to SEMI A2 SMASH - SMT TF
Ballot Submission of Line Item Revision to SEMI A2 SMASH - SMT TF
Abolishment of SNARF #6627 SMT-GEM - F-GEM TF
New SNARF for New Specification SMASH-FOX - F-GEM TF
Ballot Submission of New Specification SMASH-FOX - F-GEM TF
Action Item Review
Open Action Items
New Action Items
Next Meeting and Adjournment
Standards Contact Information:
Hirofumi Kanno
Manager, Standards, SEMI Japan
Email: [email protected]
Note: Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. If you are not a Member, please join the Standards Program and start making a big contribution to the industry’s progress, complete an application form today.SEMIジャパン 市ヶ谷 1-17 千代田区, Tokyo 102-0074 JapanSEMI.org[email protected]Asia/Tokyopublic
Asia/Tokyo
Standards
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Add to Calendar2020-08-21 00:00:002020-08-21 00:00:00FPD Materials & Components Japan TC ChapterSEMI Japan office Tokyo JapanSEMI.org[email protected]Asia/Tokyopublic
Asia/Tokyo
3D Packaging & Integration Japan TC Chapter Meeting
Standards
2:30 pm - 5:00 pm
Off
Add to Calendar2020-07-10 14:30:002020-07-10 17:00:003D Packaging & Integration Japan TC Chapter MeetingSEMI Japan office Tokyo JapanSEMI.org[email protected]Asia/Tokyopublic
Asia/Tokyo
Off
Add to Calendar2020-06-12 00:00:002020-06-12 00:00:00FPD Metrology Korea TC Chapter MeetingFPD Metrology TC Chapter meeting
Friday, June 12, 2020
17:00-18:00
SEMI Korea office, Seoul, Korea
Agenda_FPDM_June12_2020.pdf
(74.19 KB)
Standards Contact Information
Natalie Shim
Manager, SEMI Korea
Email: [email protected]
Phone: 82.2.551.7808
ADD TO CALENDARSeoul South KoreaSEMI.org[email protected]Asia/Seoulpublic
Asia/Seoul
The worldwide expansion of MEMS and photonic devices in Consumer, Automotive, and IoT applications is driving new requirements to the supply chain. Advanced substrates are needed to meet these requirements. Applying standardization to advanced substrates will aid efficient use of material, reduce cycle time and provide product cost reduction. SEMI’s MEMS & Sensors Industry Group (MSIG) aims to enable such standards.
Recently, MSIG’s multi-company, industry-collaborative Manufacturing Working Group published the SEMI MS12 standard- Specification for Silicon Substrates Used in Fabrication of MEMS Devices. The SEMI MS12 document provides information on 150 mm and 200 mm diameter customized silicon substrates to be used for MEMS device fabrication, including physical dimensions, surface conditions, and basic electrical properties. Utilizing this guidance will allow the stocking of standard material, lowering the time to purchase, simplifying front-end operations, reducing time to market and lowering unit costs significantly.
This webinar will showcase three case studies demonstrating how the cost of ownership can be enhanced through various MEMS substrate platforms. Substrate manufacturers can apply the MEMS standardization and bring added value to their customers.
1. Cost savings with better integration and elimination of front-end process steps at customer site
2. Cost-savings through better flatness capabilities enabling significant die shrink and new capabilities for the customer.
3. Advantages of patterned SOI – i.e.) Silicon interposer on C-SOI® platform
United States
8:00 am
Michelle Bourke
Senior Director of Strategic Marketing, Lam Research
Mr. Santala received his B.Sc. in Process Engineering at the Espoo University of Applied Sciences Finland. Mr. Santala has over 20 years of experience in Silicon based material engineering. He has worked for Okmetic since 1999 and held various positions related to R&D, process engineering, quality and applications support. Currently he is working as Customer Support Manager being responsible for Okmetic’s Technical Customer Support for the North America.
8:00 am - 9:00 am
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Add to Calendar2020-06-18 08:00:002020-06-18 09:00:00MSIG Webinar - MEMS Substrate Evolution: Standards to drive efficiency & cost reductionA SEMI MEMS & Sensors Industry Group (MSIG) Hosted WebinarUnited StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles