YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today announced that it has signed an exclusive agreement with Osiris (Osiris International GmbH) to license its smartEBR technology for edge bead removal on panels. This proprietary process, based on wet etch chemistry, will enable YES to expand its wet processing capabilities.

“We are very pleased to partner with YES in this effort to extend our smartEBR technology to more complex applications,” said Pirmin Muffler, founder and Managing Director of Osiris. “We selected YES as our partner because of their proven ability to rapidly bring innovation to high-volume manufacturing production environments.”

“YES is committed to developing a variety of solutions for panel-based applications in the PCB and advanced packaging markets” said Zia Karim, CTO of YES. “When combined with our extensive process expertise, the smartEBR technology will allow our customers to remove metal, photoresist and dielectric coatings efficiently from a variety of panel types, ensuring high yield and defect control.”

“Our mission is to be the preferred provider of surface modification and material enhancement solutions in the markets that we serve,” said Rezwan Lateef, President of YES. “The Osiris EBR technology adds an important element to our product portfolio, as we continue to support and enable the ambitious roadmaps of our key semiconductor customers.”

About YES
YES (Yield Engineering Systems, Inc.) is a preferred provider of high-tech, cost-effective equipment for transforming surfaces, materials, and interfaces. The company’s product lines include vacuum cure ovens, chemical vapor deposition (CVD) systems, and plasma etching tools used for precise surface modification and thin-film coating of semiconductor wafers, semiconductor and MEMS devices, and biodevices. With YES, customers ranging from startups to Fortune 100 companies can create and volume-produce products in a wide range of markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality and Life Sciences. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit www.yieldengineering.com.

About Osiris International GmbH
Osiris International GmbH is a manufacturer of machines specializing in photolithographic process equipment used in semiconductor, microOLED, Mask and microsystems (MEMS) technology. The company provides a wide range of optimized front- and back-end solutions used in the processing of a variety of substrates. For more information, please visit www.osiris-nano.com.

• Read more about YES Announces Strategic Partnership with Osiris for Edge Film Removal Technology

YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today announced that Guy Shechter has joined the company as its new Vice President of Global Product Management and Global Service.

“Guy’s proven ability to manage change for rapidly growing innovative companies, ranging from start-ups to market leaders, will be a valuable resource as we implement our plans to fulfill YES’s potential,” said Rezwan Lateef, President of YES. “He has an impressive track record for building winning teams and optimizing both organizational performance and customer satisfaction. We are pleased to welcome him to our executive team.”

Mr. Shechter was formerly the Vice President and General Manager of Global Services Solutions at Veeco, where he spent 13 years in Marketing and Service leadership roles of increasing responsibility. Earlier in his career, he was Director of Marketing at Oramir (now part of Applied Materials) and Vice President of Marketing at Sagitta. Mr. Shechter holds both a bachelor’s degree in Mechanical Engineering (magna cum laude) and an MBA in Technology Development from the Technion – Israel Institute of Technology. He is a Certified Six Sigma Black Belt.

About YES
YES (Yield Engineering Systems, Inc.) is a preferred provider of high-tech, cost-effective equipment for transforming surfaces, materials, and interfaces. The company’s product lines include vacuum cure ovens, chemical vapor deposition (CVD) systems, and plasma etching tools used for precise surface modification and thin-film coating of semiconductor wafers, semiconductor and MEMS devices, and biodevices. With YES, customers ranging from startups to Fortune 100 companies can create and volume-produce products in a wide range of markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality and Life Sciences. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit http://www.yieldengineering.com.

• Read more about Guy Shechter Joins YES as VP of Global Product Management and Global Service

ESPOO, Finland, 14th of October 2021 – PICOSUN® Morpher has continued to demonstrate excellent batch process results in the latest acceptance runs the company has performed for its customers in the global semiconductor industry.
Excellent uniformities (About Picosun
Picosun provides the most advanced ALD (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

• Read more about Excellent batch process results with Picosun new generation tools

YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today announced that it has purchased the semiconductor equipment business of Swedish heating technology provider Kanthal.

Under the terms of the agreement, which was signed on October 6, YES will take ownership of Kanthal’s semiconductor-related capital equipment portfolio, system-related upgrades, and service needs. The acquisition will add Kanthal’s high-temperature (>800°C) furnace technology as well as Low Pressure Chemical Vapor Deposition (LPCVD) processes to YES’s growing capabilities in the thermal processing area.

“We aim to be the semiconductor industry’s provider of choice for surface modification, material enhancement, and high-quality deposition,” said Rezwan Lateef, President of YES. “With this acquisition of equipment and technical expertise from a leader in industrial heating, we look forward to supporting our global customer base with new high-temperature annealing and bonding systems that leverage Kanthal heating equipment. In addition, we feel that the Kanthal LPCVD technology has potential to open exciting deposition opportunities for YES beyond our current monolayer coating systems, particularly in the areas of optical, power and microLED.”

About YES
YES (Yield Engineering Systems, Inc.) is a preferred provider of high-tech, cost-effective equipment for transforming surfaces, materials and interfaces. The company’s product lines include vacuum cure ovens, chemical vapor deposition (CVD) systems, and plasma etching tools used for precise surface modification and thin-film coating of semiconductor wafers, semiconductor and MEMS devices, and biodevices. With YES, customers ranging from startups to Fortune 100 companies can create and volume-produce products in a wide range of markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality and Life Sciences. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit www.yieldengineering.com.

• Read more about YES Acquires Kanthal’s Semiconductor Capital Equipment Business

SANTA ROSA, Calif. – September 28, 2021 – PNI Sensor, the world’s foremost expert in precision location, motion tracking, and fusion of sensor systems into real-world applications, today announced that its proprietary magneto-inductive sensor technology is now integrated into MagCanica’s torque sensor systems for high-performance FORMULA 1 race cars. PNI’s sensor technology is used in MagCanica’s innovative driveshaft, clutch shaft, and MGUK shaft torque sensor systems to accurately measure both steady-state and transient torque levels, helping race teams optimize powertrain performance and driveability.

MagCanica designs, develops, and manufactures wireless torque sensor systems and rate-of-change-of-torque (ROC) sensor systems for high performance applications such as automotive racing powertrains, turboshaft engines and associated rotorcraft transmissions, and high speed couplings for gas compression trains and power generation trains for the energy sector.

“The team at PNI worked closely with our engineers to customize their high-performance magnetic sensors to our exacting specifications,” said Sami Bitar, President and co-founder of MagCanica. “This close collaboration supports our mission to deliver the most lightweight, compact and accurate systems for our FORMULA 1 race team customers.”

“Our team of highly experienced engineers takes a holistic approach and supports our customers’ system accuracy and long-term reliability requirements,” said Robin Stoecker, director of marketing at PNI Sensor. “We’re proud that MagCanica is using our expertise and field-tested sensor hardware and applying it to a highly specialized and demanding application like automotive racing systems.”

About PNI Sensor
With over 30 years of experience, PNI is the world’s foremost expert in precision location, motion tracking, and fusion of sensor systems into real-world applications. PNI’s sensors and algorithms serve as the cornerstone of successful IoT projects and mission-critical applications where pinpoint location, accuracy, and low power consumption are essential. Building on decades of patented sensor and algorithm development, PNI offers the industry’s highest-performance geomagnetic sensor in its class, location and motion coprocessors, high-performance modules, sensor fusion algorithms, and complete sensor systems. To learn more, please visit www.pnicorp.com.

The F1 logo, F1 FORMULA 1 logo, FORMULA 1, F1, FIA FORMULA ONE WORLD CHAMPIONSHIP, GRAND PRIX, PADDOCK CLUB and related marks are trademarks of Formula One Licensing BV, a Formula 1 company. All rights reserved. Use of the Formula 1 trademark does not imply any affiliation with, or endorsement by, FORMULA 1.

• Read more about MagCanica Chooses PNI Sensor for Torque Sensor Systems in FORMULA 1™ Race Cars

YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today announced that Kimihiko Matsubara has joined its senior management team and will lead its sales efforts in the Japan market, supporting the rapidly evolving semiconductor and advanced organic substrate market segments in the region.

“We welcome Matsubara-san warmly to the YES senior team. His proven management and relationship-building skills, strong record of sales growth, and deep knowledge of the country’s precision machinery and semiconductor industries will be highly valuable to YES as we build our local presence in Japan,” said Rezwan Lateef, President of YES.

Kimihiko Matsubara started his career with process equipment manufacturer Hakuto, spending three decades there in positions of increasing managerial responsibility. He subsequently held business development and senior sales management roles at TASMIT (a subsidiary of Toray, specializing in semiconductor inspection and metrology) and Faro Japan, a maker of 3D metrology and visualization systems. He earned his bachelor’s degree in Mathematics from Meijo University in Nagoya, Japan.

About YES
YES (Yield Engineering Systems, Inc.) is a preferred provider of high-tech, cost-effective equipment for transforming surfaces, materials and interfaces. The company’s product lines include vacuum cure ovens, chemical vapor deposition (CVD) systems, and plasma etching tools used for precise surface modification and thin-film coating of semiconductor wafers, semiconductor and MEMS devices, and biodevices. With YES, customers ranging from startups to Fortune 100 companies can create and volume-produce products in a wide range of markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality and Life Sciences. YES is headquartered in Fremont, California, with a growing global presence.

For more information, please visit www.yieldengineering.com.

• Read more about Kimihiko Matsubara Selected as General Manager of YES Japan

ESPOO, Finland, 7th of September 2021 – Picosun Group has taken into use new facilities at its production laboratory in Kirkkonummi, Finland. The Picosun Innovation Lab will be used for the company’s own research and development projects, for demo purposes and most importantly for serving the company’s global semiconductor customers operating in the 300 mm market.

The Innovation Lab hosts Picosun’s new generation tools PICOSUN® Morpher and PICOSUN® Sprinter. Morpher was launched in 2019 and it started a completely new era in Picosun products. Its adaptive and versatile nature makes it an ideal ALD solution for to the changing needs of different business verticals in the up to 200 mm wafer industries. Sprinter was launched late 2020 for the 300 mm wafer markets to meet the ever-increasing demands of semiconductor, display and IoT component manufacturing lines. It has brought single wafer film quality and uniformity for fast batch processing and met the challenges in high volume ALD manufacturing.

The Innovation Lab increases the laboratory capacity Picosun currently has on its premises significantly. The new facilities will have the ability to host tens of ALD tool modules. The facilities also support a variety of process gases including for example N2, O2, O3, Ar, H2, NH3 and NF3. Furthermore, special attention has also been paid for the best-in-class building management and safety systems.

“The opening of the new Innovation Lab reflects our role in being the pioneer in ALD and continuing the daily work in setting the standards for future innovations in the ALD sphere. The Innovation Lab has been a big investment for the company, but we see this as an essential investment to our and our customers’ future”, says Jussi Rautee, CEO of Picosun Group.

Watch the video on Picosun Innovation Lab: https://press.picosun.com/picosun-invests-in-future-with-its-innovation…

More information:
Jussi Rautee
CEO, Picosun Group
Tel: +358 50 345 4457
Email: [email protected]
www.picosun.com

About Picosun
Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

• Read more about Picosun invests in future with its Innovation Lab

ESPOO, Finland, 31st of August 2021 – Picosun Group strengthens its position in the 300 mm semiconductor market with its new generation ALD tool PICOSUN® Sprinter.

PICOSUN® Sprinter was first launched in December 2020 as a stand-alone module. Now also customer deliveries and installations of PICOSUN® Sprinter clusters have started.

“A Sprinter cluster consist of two Sprinter modules and a central vacuum wafer-handling robot utilizing 5 wafers handling. The set-up enables a throughput of more than 100 wafers an hour with 10nm aluminium oxide target film thickness”, explains Juhana Kostamo, VP, Industrial Business Area of Picosun Group.

“The throughput capability combined with the unique design of the tool’s reaction chamber, the record-breaking batch film quality and the fact that the tool can be fully integrated with the customers’ production line, makes PICOSUN® Sprinter the tool of choice for semiconductor, display and IoT component industries who need a future-proof tool with single wafer film quality and uniformity in fast batch processing”, Kostamo concludes.

Read more about PICOSUN® Sprinter and watch the video:
https://www.picosun.com/products/300mm-wafers/picosun-sprinter/

More information:
Juhana Kostamo
Vice President, Industrial Business Area, Picosun Group
Tel: +358 50 369 9565
Email: [email protected]
www.picosun.com

About Picosun
Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

• Read more about Picosun strengthens its position in the semiconductor market