• Total income for the first quarter of 2022 was EUR 3.6 million (first quarter 2021: EUR 3.8 million)
• Cash position further improved in the first quarter of 2022
• Order book value increased with 16% compared to March 31, 2021

Deventer, April 12, 2022 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, today releases its trading update for the first quarter of 2022. The total income for the quarter was EUR 3.6 million, which is 5% lower than the total income in the first quarter of 2021. In the first quarter of 2021, the total income included work in progress of EUR 0.5 million for SCM project preparations. With this adjustment, the total income for the first quarter of 2022 rose by 9% compared to the first quarter of 2021.
“The cash position at the end of the first quarter of 2022 has further improved compared to the end of 2021 thanks to the increased total income and a continued tight control of operational expenses”, says Martin Sallenhag, CEO of RoodMicrotec. “The increase of the total income in the first quarter, adjusted for work in progress movements, compared to 2021 also shows that the company is focusing on the right markets, customers and services.”
With the forecasted increase of total income in 2022 over last year, it is encouraging to see that the order book value continues to increase. The order book contains orders for both long term contracts and engagements as well as short term orders. The long term contracts and engagements are mainly in the SCM and Test Operations units and the short term orders are mainly in the Failure Analysis & Qualification unit. RoodMicrotec is maintaining a very tight control of all expenses, and only absolutely necessary costs for delivering our high-quality services to the customers are approved. Additional capital investments are also reviewed in detail to make sure they are done to either increase capacity or to add new capabilities to the service portfolio.

Outlook
RoodMicrotec expects the total income in 2022 to be in the range of EUR 15.0 million to EUR 15.6 million with a positive result before tax. The current situation in the world regarding lead-times for wafers and packaging as well as shipment delays may impact the ability to achieve the expected total income. The war in Ukraine could also have an impact on the business but in the short term we don’t see any significant impacts. RoodMicrotec is keeping a close eye on the situation and is doing everything possible to mitigate any impact.

Audit
The financial data in this press release have not been audited.
 
About RoodMicrotec
RoodMicrotec is a leading independent company for semiconductor supply and quality services. With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is well-established as a highly valued partner for many companies worldwide. The Company provides full-turnkey ASIC services for complex microchips that are customized to handle specific applications for individual customers. In cooperation with strong partners, RoodMicrotec manages the entire development and production flow of ASICs in the target volume, ranging from low quantities up to multiple millions per year. The turnkey solution includes project management, wafer test, assembly, final test, qualification, failure analysis and logistics. All services comply with the industrial and quality requirements of the high reliability, aerospace, automotive, healthcare and industrial sectors. RoodMicrotec’s headquarters are located in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany
For more information visit https://www.roodmicrotec.com

Further information
Martin Sallenhag - CEO, Arvid Ladega – CFO
Telephone: +31 570 745623 Email: [email protected] Web: www.roodmicrotec.com

This press release is published in English and German. In case of conflict between these versions the English version shall prevail.
This communication contains information that qualifies as inside information within the meaning of Article 7(1) of the EU Market Abuse Regulation. The company’s managing director and CEO Martin Sallenhag, is responsible for arranging the release of this document on behalf of RoodMicrotec.

• Read more about Trading Update: RoodMicrotec announces total income for the first quarter of 2022

Deventer, April 8, 2022 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, today announces that the trading update for the first quarter of 2022 will be published on April 12, 2022.

Financial calendar
April 12, 2022 Trading update quarter 1-2022
April 21, 2022 Publication Annual Report 2021
April 21, 2022 Conference call for press and analysts
April 28, 2022 Publication of invitation and agenda for the Annual General Meeting of Shareholders
June 9, 2022 Annual General Meeting of shareholders
July 21, 2022 Publication Interim Report 2022
July 21, 2022 Conference call for press and analysts
October 13, 2022 Trading update quarter 3-2022

About RoodMicrotec
RoodMicrotec is a leading independent company for semiconductor supply and quality services. With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is well-established as a highly valued partner for many companies worldwide. The Company provides full-turnkey ASIC services for complex microchips that are customized to handle specific applications for individual customers. In cooperation with strong partners, RoodMicrotec manages the entire development and production flow of ASICs in the target volume, ranging from low quantities up to multiple millions per year. The turnkey solution includes project management, wafer test, assembly, final test, qualification, failure analysis and logistics. All services comply with the industrial and quality requirements of the high reliability, aerospace, automotive, healthcare and industrial sectors. RoodMicrotec’s headquarters are located in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany.

For more information visit https://www.roodmicrotec.com

Further information
Martin Sallenhag - CEO, Arvid Ladega - CFO
Telephone: +31 570 745623 Email: [email protected] Web: www.roodmicrotec.com

This press release is only published in English. This communication contains information that qualifies as inside information within the meaning of Article 7(1) of the EU Market Abuse Regulation. The company’s managing director and CEO Martin Sallenhag, is responsible for arranging the release of this document on behalf of RoodMicrotec.

• Read more about Trading update for first quarter of 2022 will be published on April 12, 2022

ESPOO, Finland, 5th of April 2022 – Picosun Atomic Layer Deposition (ALD) has played a vital role in enhancing electro-optical characteristics of micro-LEDs in research done by National Yang Ming Chiao Tung University (NYCU) in Taiwan.

The usage of dielectric films as a passivation material is a popular technique to suppress dangling bonds as well as to improve output power and external quantum efficiency in LEDs. The study conducted at NYCU compared III-Nitride micro-LEDs of different sizes with and without ALD Al2O3 passivation. The results showed external quantum efficiency enhancement of 70% for 5 µm × 5 µm micro-LEDs and 60% for 10 µm ×10 µm micro-LEDs when using ALD Al2O3 passivation.

In addition, to achieve full color display, an inkjet printing to pattern quantum dots automatically has been developed at NYCU. The solution can considerably improve the precision of color pixels and satisfy the high-resolution requirements. Picosun ALD passivation technology was successfully used for preventing the quantum dots from photo-oxidation and degradation. After a 500 hours environmental reliability test, the color gamut remained at excellent level.*

“Micro-LED technology has been the disruptive technology in the next generation displays, and more application areas are emerging its benefits being long lifetime, high power efficiency and high brightness. With quantum dot-based technology micro-LEDs can be used in applications such as virtual and mixed reality as they allow the use of single-color, blue, micro-LED chips resulting in lower manufacturing costs. Our study has proved that ALD passivation plays a key role in upcoming nanometer-scale devices”, says Hao-Chung Kuo, professor at NYCU.

“Picosun’s ALD technology has been production-proven at many prominent LED manufacturers. ALD films’ superior conformality and uniformity, and their ability to ensure reliable, pinhole-free encapsulation even at extremely low film thicknesses is a key benefit. Furthermore, the ALD process can be run at moderate temperatures”, explains Juhana Kostamo, VP, Industrial Business Area of Picosun Group.

*NTSC and Rec. 2020 standards: Color gamut 99% and 90% at 50% humidity and 50℃ temperature
NTSC: Analog television format encoding system developed by National Television Standards Committee
Rec. 2020: International Telecommunication Union Recommended standard defining various aspects of ultra-high-definition television with standard dynamic range and wide color gamut.

More information:
Juhana Kostamo
Vice President, Industrial Business Area, Picosun Group
Tel: +358 50 369 9565
Email: [email protected]
www.picosun.com

About Picosun
Picosun provides the most advanced ALD (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

• Read more about Picosun ALD enhances micro-LED efficiency

Heidelberg, Germany – Heidelberg Instruments has received a significant order from a leading semiconductor wafer-level packaging production company in Asia for its MLA 300 Maskless Aligner. With this order, Heidelberg Instruments has reached another important milestone towards the company’s goal of becoming a leading supplier of maskless lithography tools to the advanced wafer-level packaging industry.

Optimized for industrial manufacturing, the MLA 300 Maskless Aligner features distinct benefits for the wafer-level technology: The flexibility of maskless lithography allows rapid design customizations, and even unique designs on each substrate. This is of particular use for chip packaging where mounted die shift and each panel is unique. Meeting these demands, the MLA 300 can be seamlessly integrated into wafer-level packaging production lines, fully automating wafer production with a resolution down to 2 µm lines and spaces. The MLA 300 reduces production costs and efforts by eliminating mask procurement, verification, and management requirements. Operating costs are reduced by utilizing a long-lifetime exposure laser and fewer consumables. Modularity enables fast maintenance, replacement, or repair. Real-time autofocus compensates substrate warp or corrugations for flawless patterning.

Since its market introduction at the end of 2019, the MLA 300 has received a terrific reception and has become a popular tool for the microfabrication industry. The MLA 300 comprises a customizable wafer handling system, customizable vacuum chucks, and a large autofocus compensation help account for challenges like warped substrates, and software designed for production environments.

“This latest order, by a leading advanced wafer packaging production group, is a big step forward for us and maskless lithography. With the MLA 300, Heidelberg Instruments has introduced the most innovative maskless lithography system for mid-volume wafer production and high-volume prototyping. So far, several fabrication groups globally have purchased and installed the MLA 300 tool, replacing their traditional lithography production platforms, such as mask aligners and steppers,” says Alexander Forozan, Head of Global Sales and Business Development, Heidelberg Instruments group of companies.

MLA300 is a versatile tool for application areas such as advanced semiconductor packaging, IR sensors, MEMS, electronic probes, and high precision electronic components.

Contact:
Veronika Loose
Marketing and Communications
[email protected]
+49 931 90879288

Further information:
https://heidelberg-instruments.com/

About Heidelberg Instruments Mikrotechnik GmbH
With over 35 years of experience and more than 1,200 installed systems, Heidelberg Instruments is one of the leading international players in developing and producing high-precision photolithography systems and nanofabrication tools. Heidelberg Instruments systems are installed in industrial and scientific facilities around the world. They are used for efficient direct writing and photomask fabrication for various industries, including semiconductors, quantum computing, photonics, 2D materials, IoT, and many related fields.

• Read more about Heidelberg Instruments receives an order from an advanced wafer-level packaging provider in Asia

Rochester, NY—Linton Crystal Technologies (LCT) has been awarded a U.S. Letters Patent for its Seed Lifting and Rotating System for Use in Crystal Growth. Patent 11,255,024 is the first of four applications Linton has made to the USPTO for innovations related to the seed lifting and rotating mechanism, and the company’s first approved patent.

“This patent is the first of four applications that address the increasingly critical need to counteract centrifugal forces created by the rotating mass of the seed lift as the cable spool translates along its axis of travel. As growers become larger, the need for this technology becomes even more essential” explains John Reese, mechanical engineering manager with Linton Crystal Technologies.

Typically, silicon crystal growing furnaces use a cable winch system to lift and rotate a growing crystal. Most traditional seed lift mechanisms have a grooved spool that wraps and gathers the seed cable, lifting the crystal. The spool must translate side to side to keep the gathering cable centered to a pulley, which in turn is centered on the growth chambers. Most often, the spool moves this way via an attached thread that engages to a nut. As the bolt turns into the nut in its fixed position, the head of the bolt becomes closer to the nut. In the case of a seed lift spool, the length of the screw depends on the length of translation that is necessary to wind and/or unwind the cable enough to grow the crystal to a desired length. Thus, the length of the screw increases the overall length of the cable winch system. This adds size and weight to the overall system.

As the spools shifts/translates from one end of its travel to the other, the shifting mass of the spool dramatically and negatively influences the dynamic balance of the rotating seed lift assembly, thus creating centrifugal forces that have a negative impact on the stability of the overall growth process.

Linton’s patented new “guided spool” design utilizes a floating roller that engages with the grooved spool, therefore eliminating the need for the extra threaded feature and fixed position nut. This reduces the overall weight of the mechanism, making for a more stable rotating mass. Current units that don’t have this feature require additional fixed and active weight to balance them.

About Linton
Linton is the world leader in the design, development and manufacture of equipment for producing monocrystalline ingots for the solar and semiconductor industries. The company specializes in silicon and produces equipment for materials such as germanium and gallium arsenide. They also provide technical support, process engineering support and replacement parts to help clients get businesses off the ground, improve productivity and continue to innovate. Linton has been the exclusive owner of Kayex technology for eight years.

For more information, visit www.lintoncrystal.com.

# # #

• Read more about Linton Crystal Technologies Awarded Seed Lift and Rotating System Patent

ESPOO, Finland, 22nd of March 2022 – Picosun Atomic Layer Deposition (ALD) has been demonstrated to be a suitable solution for protection of surfaces exposed to atomic oxygen degradation in Low Earth Orbit. High material survivability is a requirement for objects sent to space as they are faced with a number of degrading circumstances, such as exposure to atomic oxygen.

Researchers at the European Space Agency (ESA) have tested and analysed various material samples provided by Picosun to verify the protective coatings’ suitability for protection against atomic oxygen. This testing was performed in the ESTEC TEC-QEE Laboratory LEOX facility as part of an “open lab” test campaign. These campaigns are intended to provide access to ESA’s unique space environmental test facilities and allow collaboration with ESA’s research fellows, especially for SMEs and institutes new to the space business.

The test simulates the corroding effect of atomic oxygen, for which satellites, including the International Space Station (ISS), are exposed to. The results of the tests, performed on Kapton® HN polyimide film, silicon pieces and PCBs (Printed Circuitry Boards) protected with Picosun ALD coating clearly demonstrated the erosion protection provided by the ALD coating. The demonstrated low temperature (125 °C) film was relatively thin (20 nm) enabling coating of different relevant materials. Decreased thickness of ALD coating is known to withstand more deformation required for flexible materials than thick layers. Also, ALD coating can be applied to a 3D surface with extreme aspect ratios. The analysis performed by ESTEC consisted of mass measurement, Scanning Electron Microscope (SEM) inspection and thermo-optical properties measurement, partially, before and after the test.

“Atomic oxygen erosion has a major impact on the choice of external materials available for spacecrafts and satellites operating in Low Earth Orbit. Picosun ALD showed atomic oxygen resistance in the tests and forms a suitable protective coating for extreme environmental conditions, applicable also for flexible materials”, explains Adrian Tighe, Senior Materials Engineer in the Materials’ Physics and Chemistry Section at ESA.

“ALD is an advanced thin film coating method for ultra-thin, highly uniform and conformal material layers. It has proved to be the coating solution of choice already in production in solutions and innovations operating in extreme environments. Today, they can be found everywhere from deep seabed to Mars”, says Juhana Kostamo, VP, Industrial Business Area of Picosun Group.

More information:
Juhana Kostamo
Vice President, Industrial Business Area, Picosun Group
Tel: +358 50 369 9565
Email: [email protected]
www.picosun.com

About Picosun
Picosun provides the most advanced ALD (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

• Read more about Picosun ALD demonstrates effective surface protection for materials in space conditions in ESA's tests.

BENEQ, PRESS RELEASE, March 10, 2022, 14.00 EEST

Beneq, the home of Atomic Layer Deposition (ALD), has introduced BeneqCare, a new modular solution to offer support and maintenance services to organizations that own and operate Beneq ALD equipment.

Beneq leads the market with ALD products for R&D, semiconductor device fabrication, 3D and batch production, ultra-fast spatial ALD (C2R), and roll-to-roll ALD. Today, the company has launched BeneqCare to help customers in the EU, Asia and the USA maximize the value of their ALD tools throughout their equipment’s life cycles.

“We have been investing heavily in widening our service capabilities worldwide. Now, we offer service coverage in all regions. We have also established spare part hubs in every region at Beneq offices,” says Hans Fabritius, Vice President, Life Cycle Services at Beneq.

“BeneqCare simplifies ALD equipment ownership by helping our customers maximize uptime and gain access to the right support at every stage of their tool’s life cycle. We are ready to assist our customers in meeting their productivity requirements –from training personnel in using the equipment to meeting any unscheduled maintenance or spare parts needs,” asserts Fabritius.

BeneqCare provides Beneq customers who operate in the industrial and research sectors with a wide range of service modules to suit their operations, from extended warranty and training services to remote or onsite support.

“Our customers have high expectations for the performance of their Beneq ALD tools. BeneqCare brings them versatile support and service plans that grow with their businesses,” says Fabritius.

Companies and research facilities that have commissioned Beneq ALD equipment can avail of a variety of BeneqCare service modules to suit their unique requirements. Among the BeneqCare modules are technical support services, including remote support via Augmented Reality (AR); spare part services; extended warranties; preventive as well as unscheduled maintenance services; and training.

Learn more about BeneqCare: www.beneq.com/beneqcare/

Further information
Lie Luo, Head of Marketing, [email protected]

About Beneq
Beneq is the home of atomic layer deposition. In 1984, we established the world’s first industrial production using ALD. Today, we lead the market with products for R&D (TFS 200, TFS 500, R2), semiconductor device fabrication (Transform®), 3D and batch production (P400A, P800, P1500), ultra-fast spatial ALD (C2R), and roll-to-roll ALD (Genesis).

Beneq’s unique Development Service simplifies customer adoption and proof-of-concept for new ALD processes, while our Coating Service cuts down time to market by outsourcing state of the art ALD production. Our team of engineers and experts is dedicated to making ALD tools accessible for researchers.

• Read more about Beneq fulfills customer demand for tailored ALD equipment services and support with BeneqCare (TM)

ESPOO, Finland, 17th of February 2022 – Fraunhofer Institute for Silicon Technology (ISIT) has taken PICOSUN® P-300B ALD system into use as their powder MEMS technology platform.

Fraunhofer ISIT PowderMEMS is a new innovative technology for creating three-dimensional microstructures from a multitude of materials on wafer level. The technology is based on bonding together µm-sized powder particles in a cavity with Atomic Layer Deposition (ALD). It has many advantages compared to other manufacturing techniques as it allows using much lower process temperatures compared to a traditional sintering process. The bonded porous structures are thermally and chemically resistant thus enabling their extensive post-processing in a clean room.

"The technology can be used for various applications, such as microelectronics, MEMS sensors, MEMS actuators and microfluidics. For example, it enables the integration of porous and magnetic 3D microstructures on wafer level", explains Dr. Björn Gojdka, Group Leader at Fraunhofer ISIT.

“We were looking for a solution for conformal high surface area coating of powder located in trenches. Picosun solution is a perfect fit for this need as we are also looking into scaling up the technology. We are especially happy about the tool’s hot wall reactor, versatile precursor sources and its easy maintenance”, states Dr. Thomas Lisec, Chief Scientist at Fraunhofer ISIT.

“We are excited over this new technology coming to life and all the opportunities it will bring. I am especially impressed by the potential applications for the Fraunhofer ISIT PowderMEMS as they are exceptionally diverse. I’m looking forward to continuing working closely with Fraunhofer ISIT on bringing the technology up to industrial production”, says Dr. Christoph Hossbach, General Manager of Picosun Europe GmbH.

More information:
Dr. Christoph Hossbach, General Manager, Picosun Europe GmbH
Tel. +49 1522 449 49 11
Email: [email protected]
Web: www.picosun.com

About Picosun
Picosun provides the most advanced ALD (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

About Fraunhofer ISIT
Fraunhofer ISIT in Itzehoe is one of Europe's most modern research facilities for microelectronics and microsystems technology. At the heart of the institute are the clean room facilities, large enough not only to conduct research but also to manufacture the developed microchips on an industrial scale. In close cooperation with partners from industry, 160 scientists at ISIT develop power electronics components and microsystems with fine moving structures for sensor technology and actuator technology, including the necessary packaging technology. www.isit.fraunhofer.de

• Read more about Picosun delivers powder MEMS technology platform to Fraunhofer ISIT

BENEQ, PRESS RELEASE, December 6, 2021

Beneq revolutionized ALD cluster tools for More-than-Moore device makers with the highly successful Beneq Transform® family of products. Today, Beneq broadens its product portfolio further with two new distinct solutions: the Transform® 300 and ProdigyTM.

The Beneq Transform 300 and Prodigy were each created in response to specific technology requirements in the semiconductor manufacturing sector.

“The Transform 300 is designed to meet the growing demand of emerging semiconductor applications at 300 mm for devices such as CMOS image sensors, Power Devices, Micro-OLED/LED, and Advanced Packaging, which call for a high degree of versatility,” explains Patrick Rabinzohn, Vice President, Semiconductor ALD at Beneq.

“We created Prodigy to address those market segments that need a simple solution supported by high-end technology. It inherits the ALD design and processing knowhow we at Beneq have developed over the last 15 years, packing advanced features in a simpler, targeted industrial form factor,” continues Rabinzohn.

Beneq Transform® 300
Beneq Transform 300 is the only 300 mm ALD cluster tool that combines thermal ALD (batch) and plasma ALD (single wafer) technologies to provide a highly versatile platform for IDMs and foundries. It is dedicated to advanced thin-film applications in CIS, Power, Micro-OLED/LED, Advanced Packaging and other MtM applications.

Beneq Transform 300 is a highly configurable platform that caters to multiple advanced thin-film applications ranging from gate dielectric including in high aspect ratio trenches, to anti-reflection coating, final passivation or encapsulation, Chip-Scale-Packaging and beyond.

Beneq Prodigy
Beneq Prodigy is the deal manufacturing solution for compound semiconductor including RF IC’s (GaAs/GaN/InP), LED, VCSEL, Light Detectors and for MEMS manufacturers and foundries looking to enhance device performance and reliability through an affordable stand-alone ALD batch tool. Beneq Prodigy provides best-of-breed passivation and encapsulation films across multiple wafer types and sizes.

To learn more, visit:

Beneq Transform 300:  https://beneq.com/en/products/semiconductors/transform300/

Beneq Prodigy: https://beneq.com/en/products/semiconductors/prodigy/

Further information:
Lie Luo, Head of Marketing, [email protected]

About Beneq
Beneq is the home of atomic layer deposition. In 1984, we established the world’s first industrial production using ALD. Today, we lead the market with products for R&D (TFS 200, TFS 500, R2), semiconductor device fabrication (Transform®), 3D and batch production (P400A, P800, P1500), ultra-fast spatial ALD (C2R), and roll-to-roll ALD (Genesis).  Beneq’s unique Development Service simplifies customer adoption and proof-of-concept for new ALD processes, while our Coating Service cuts down time to market by outsourcing state of the art ALD production. Our team of engineers and experts is dedicated to making ALD tools accessible for researchers. 

• Read more about Beneq unveils two new ALD products for 300mm and compound semiconductor device fabrication respectively

FREMONT, Calif. - YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today announced that it has set up Engineering Centers of Excellence at two locations in India: Coimbatore and Bangalore. A sales office will also be located in the Bangalore area.

“It is no secret that high-caliber engineering expertise is in high demand in Silicon Valley,” said Ramakanth Alapati, Chairman and CEO of YES. “Our company’s rapid growth has inspired us to widen our technical recruitment efforts to include global engineering talent powerhouses like India. In addition, we feel there is a strong market for reliable, cost-effective YES systems within India’s domestic semiconductor industry.”

Leading YES’s efforts in India will be Dr. Ankineedu Velaga, a high-tech engineering executive with more than 35 years of experience spanning engineering and fab operations, customer interaction and retention, and business development support in the US and Asia.

“Ankineedu’s experience in driving teams to improve processes will be a great resource for YES as we scale to meet the challenges of worldwide growth. We will be looking to him to draw upon his impressive track record of building organizations to develop complex semiconductor capital equipment as well as leading organizations to achieve better process development, yields, process control, cycle time, cost, and product quality,” said Rezwan Lateef, President of YES.

Dr. Velaga has held leadership roles with BRIDG, imec, SilTerra, Applied Materials, Avago, and Lucent (among others), and his global management experience extends from the US and the European Union to Malaysia and Singapore. His educational background includes a Ph.D. in Chemical Engineering from the University of Arkansas, an M.S. in Chemical Engineering from the Indian Institute of Technology in Madras, and a B.S in Chemical Engineering from the Regional Engineering College in Warangal, India.

“I am pleased and honored to be embarking on this exciting endeavor with YES,” commented Velaga. “We expect to build our India team quickly, and I look forward to talking with high-potential candidates. To see our current job postings for YES India, please visit Careers at yieldengineering.com and scroll down to the ‘YES India’ heading. If you don’t see a job there at the moment that aligns with your skills and interests, but you are a qualified candidate with a technical background and semiconductor experience, I encourage you to submit your resumé to [email protected] and include ‘YES India’ in the subject line.”

About YES
YES (Yield Engineering Systems, Inc.) is a preferred provider of high-tech, cost-effective equipment for transforming surfaces, materials, and interfaces. The company’s product lines include thermal processing systems, chemical vapor deposition (CVD) systems, plasma etching tools, and wet process equipment used for the precise surface modification of semiconductor substrates, semiconductor and MEMS devices, and biodevices. With YES, customers ranging from startups to Fortune 100 companies can create and volume-produce products in a wide range of markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality and Life Sciences. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit www.yieldengineering.com.

• Read more about YES Establishes Engineering, Design and Sales Presence in India; Ankineedu Velaga to Lead YES India as Country Head and Managing Director