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Blog
Mid-Year End Market Recovery Plus Continued Autumn Semiconductor Strength
Although the semiconductor chip and capital equipment markets performed well in the first half of 2020, many of the electronic equipment end markets struggled globally. World electronic equipment...
Blog
FLEX 2021: Making the World Safer – Call for Abstracts Now Open!
Is your company working on the next big thing in flexible, hybrid and printed electronics – a breakthrough or innovation that will make the world safer, healthier or more productive for years to...
Member Company
Guangzhou Guanggang Gases & Energy Co.,Ltd
广钢气体是广州市国资委旗下广州工控集团重要子企业，一家具有50年工业气体投资和运营经验的专业气体公司。不仅为电子、液晶显示、半导体和芯片等高新产业提供高纯和超高纯大宗气体现场制气服务，同时涵盖特气和稀有气体业务。
G-gas is an important subsidiary of GIIHG under Guangzhou SASAC, a professional gas company...
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Standard for Substrate Mapping Recently Updated
Standard for Substrate Mapping Recently Updated
By Michelle Sun, SEMI
SEMI E142, Specification for Substrate Mapping, has been recently revised to include additional...
Page
Major Revision to SEMI F104
Major Revision to SEMI F104 for Allowable Particles Contribution
By Laura Nguyen, SEMI
Ability to control particles within advanced semiconductor industry is...
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MEMS DRIE Document Out for Ballot
MEMS DRIE Document Out for Ballot
By Alissa M. Fitzgerald, A.M. Fitzgerald and Laura Nguyen, SEMI
For the past few years, SEMI, working jointly with the MEMS and Sensors Industry Group (MSIG),...
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Ultrapure Micro 2020
SEMI Standards - IRDS - UPM Collaboration
SEMI will announce the release of the first Chemical Mechanical Planarization (CMP) Metrology suite of Standards for leading-edge semiconductor...
Blog
Highlights from SEMI’s Smart MedTech Webinar Series
If you bought a new car recently, you must have noticed that it warns you if one of its functions needs your attention. It even alerts the factory if repairs or major adjustments are needed. Wouldn’t...
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Japan Panel Level Packaging Standards Development Highlights
Japan Panel Level Packaging Standards Development Highlights
By Masahiro Tsuriya (iNEMI), Haruo Shimamoto (AIST)
3DP&I Japan Technical Committee (TC) Chapter has developed the advanced...
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New Japan Automation Technology Activity
New Japan Automation Technology Standards Activity
By Albert Fuchigami, PEER Group and Terry Asakawa, VistaIdeal Consulting
As posted on the SEMI Blog in June of this year, SEMI estimates...
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Major Revision to SEMI M13
Major Revision to Specification for Alphanumeric Marking of Silicon Wafers
By Kevin Nguyen, SEMI
Laser markings on silicon wafers are an important part of the semiconductor fabrication to...