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SEMI Press Release
Virtual MSEC 2020 to Spotlight MEMS and Sensors Innovations for Medical, Smart Cities, Other Growth Markets
MILPITAS, Calif. – August 31, 2020 – Staged for the first time in virtual format, MEMS and Sensors Executive Conference (MSEC 2020) will gather industry visionaries and experts October 6-15 for the...
Member Press Release
High customer satisfaction with Picosun’s new service and support model
ESPOO, Finland, 31st August 2020 – Picosun Group’s growth strategy is based on strong expansion into industrial ALD markets. To support this strategy, special emphasis has been placed on...
Member Company
Hunan Dezhi Material Co.,Ltd
湖南德智新材料有限公司专注于半导体芯片制备中SiC涂层石墨工件等耗材。SiC涂层石墨工件是半导体芯片制备中必不可少的一项易耗零件，包括晶圆外延环节、衬底长晶环节及衬底氧化/退火环节，其中晶圆外延环节典型代表有LED芯片中MOCVD外延，Si外延，SiC外延，GaN外延，单晶衬底长晶部分典型代表有大尺寸硅单晶衬底，SiC单晶衬底及GaN外延。
Hunan Dezhi New Materials...
Member Company
Beijing TSD Semiconductor Co.,Ltd.
北京特思迪半导体设备有限公司专注于半导体领域高质量表面加工设备的研发、生产和销售。公司以更平、更薄。更快的技术导向，重点针对半导体衬底材料、半导体器件、先进封装、MEMS等领域，提供减薄、抛光、CMP的系统解决方案和工艺设备。
Beijing TSD Semiconductor Equipment Co.,Ltd focuses on R&D, production and sales...
Member Company
SEMI-TECH Co., Ltd.
赛美特集团向半导体客户提供智能制造软件系统开发和实施服务，产品包含：MES/EAP/SPC/APS/WMS/ERP等。
SEMI-TECH providesProvides Intelligent Manufacturing Software System Development and Implementation Services to Semiconductor...
Member Company
SEMI Integration (M) Sdn Bhd
Member Company
UTAC Headquarters Pte Ltd
UTAC Holdings Ltd and its subsidiaries (“UTAC”) is a leading independent provider of assembly and test services for a broad range of semiconductor chips with diversified end uses, including:...
Blog
Smart Mobility: An Impactful and High-Growth Market
About 70% of the U.S. Gross Domestic Product (GDP) is driven by consumer demand. What consumers are looking for is influenced by, for example, fashion trends, product innovations, environmental...
Event
[SMART MedTech Virtual Workshop 4] Automation, Augmentation, and AI
SMART MedTech Virtual Workshop #4
Automation, Augmentation, and AI
WORKSHOP SERIES OVERVIEW
Event
3D Packaging & Integration Taiwan TC Chapter Meeting
3D Packaging & Integration Taiwan TC Chapter Meeting
Wednesday,Aug. 26,2020
Huiyou Yuanjian Commercial Office Building, Zhubei City, Hsinchu County,...
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Smart Backend Assembly Factory for Industry 4.0 – Key Technologies, Challenges and Applications
Chan Pin CHONG, Executive Vice President and General Manager of Products and Solutions at Kulicke & Soffa, recently offered insights in how smart...
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IoT at Infineon Backend Manufacturing Singapore Plant – Connecting to Drive New Efficiencies
Infineon designs, develops, manufactures and markets a broad range of semiconductors and system solutions. The focus of its activities is on automotive electronics, industrial electronics, RF...