Showing 7297 - 7308 of 11384
Page
Korea Explosion-Proof Webinar Series
Korea Explosion-Proof Webinar Series
By Natalie Shim, SEMI Korea
SEMI Korea recently hosted an explosion-proof webinar series from June 25 to July 22, 2020. It was the first event related...
SEMI Press Release
SEMICON Taiwan 2020 Hybrid to Lead the Way in AI and 5G Era
HSINCHU, Taiwan – September 10, 2020 – Advanced, smart and green manufacturing will take center stage on-site and online September 23-25 as SEMICON Taiwan 2020 gathers industry visionaries and...
Event
PI&C Japan TC Chapter Meeting
SEMI® International Standards Program
PI&C Japan TC Chapter meeting
Thursday, September 10, 2020, 10:00-15:00 [JST]
SEMI Japan office, Tokyo, Japan
Agenda (TBD)
Standards...
Page
World’s First Global Flexible Hybrid Electronics Standards Committee
World’s First Global Flexible Hybrid Electronics Standards Committee
By James Amano, SEMI
Since its creation in the early 1970s, the SEMI International...
Page
A Baseline of Security for Fab Equipment Standards
A Baseline of Security for Fab Equipment Standards
By Mei-Tso Lin and Ming-Hui Chung, ITRI
With the rise of industry 4.0 and smart factories, new intelligent solutions like full automation,...
Member Press Release
ClassOne’s Solstice LT Plating System Selected by Jenoptik for Producing High-Power Diode Lasers
Kalispell, MT – Semiconductor equipment manufacturer ClassOne Technology announced the sale of its Solstice® LT electroplating system to Jenoptik for manufacturing semiconductor material for...
SEMI Press Release
Second Quarter 2020 Global Semiconductor Equipment Billings Up 26% Year-Over-Year, SEMI Reports
MILPITAS, Calif. – September 8, 2020 – Second quarter 2020 global billings for semiconductor manufacturing equipment jumped 26% year-over-year and 8%, to US$16.8 billion, from the first quarter of...
SEMI Press Release
COVID-19 Drives Rise in Global Fab Equipment Spending, SEMI Reports
MILPITAS, Calif. – September 8, 2020 – Soaring pandemic-fueled demand for chips that power everything from communications and IT infrastructures to personal computing, gaming and healthcare...
Member Press Release
MRSI launches submicron die bonding solution for silicon photonics, co-packaging, and wafer-level packaging
MRSI launches submicron die bonding solution for silicon photonics, co-packaging, and wafer-level packaging
At CIOE 2020 MRSI Systems will introduce a new product, MRSI-S-HVM high-speed, flexible 0.5...