November 8, 2022 Comet Yxlon: The Future of Advanced Packaging is X-Ray By Cassandra Melvin SEMI spoke with Christian Driller, Vice President of Research and Development at Comet Yxlon, about opportunities to accelerate time-to-market and increase yield for advanced packaging manufacturers through x-ray inspection. Read More
November 8, 2022 imec ITF Beyond 5G: Exploring Next-Gen Mobile Connectivity By Serena Brischetto Electronics industry experts will offer insights into key aspects of the radio frequency (RF) challenge – from materials and devices to ICs and modules – at ITF Beyond 5G at SEMICON Europa 2022, Nov. 15-18 in Munich, Germany. Read More
June 8, 2022 Atomic Layer Deposition Expected to Grow to Meet Demand for More-than-Moore Devices and Applications By Serena Brischetto Atomic Layer Deposition (ALD) players are poised to seize a new growth opportunity after the chip shortage pushed manufacturers to announce fab capacity expansions worldwide. Driven by the wafer production volume increase, ALD solutions are now expected to grow and enter the MtM devices market. Read More